阅读说明：本技术 可变光圈的制作方法 (Method for manufacturing iris diaphragm ) 是由 陈嘉伟 韦怡 周彦汝 于 2019-11-04 设计创作，主要内容包括：本申请公开了一种可变光圈的制作方法,可变光圈的制作方法包括制作气压室以形成第一结构,第一结构包括隔绝气压室与外界的弹性薄膜；在弹性薄膜上设置储液腔以形成第二结构,储液腔与气压室位于弹性薄膜的相背的两侧；在第二结构上制造第一通道及第二通道,第一通道连通气压室与外界,第二通道连通储液腔及外界。本公开提供的可变光圈的制作方法是基于通过气体压力驱动光流体实现可变光圈的方案,可以解决制造这种可变光圈的技术难题。(The application discloses a manufacturing method of an iris diaphragm, which comprises the steps of manufacturing an air pressure chamber to form a first structure, wherein the first structure comprises an elastic film for isolating the air pressure chamber from the outside; a liquid storage cavity is arranged on the elastic film to form a second structure, and the liquid storage cavity and the air pressure chamber are positioned on two opposite sides of the elastic film; and manufacturing a first channel and a second channel on the second structure, wherein the first channel is communicated with the air pressure chamber and the outside, and the second channel is communicated with the liquid storage cavity and the outside. The manufacturing method of the variable aperture provided by the disclosure is based on the scheme that the variable aperture is realized by driving the optical fluid through gas pressure, and can solve the technical problem of manufacturing the variable aperture.)

1. A method of manufacturing an iris diaphragm, comprising:

manufacturing an air pressure chamber to form a first structure, wherein the first structure comprises an elastic film for isolating the air pressure chamber from the outside;

a liquid storage cavity is arranged on the elastic film to form a second structure, and the liquid storage cavity and the air pressure chamber are positioned on two opposite sides of the elastic film; and

and manufacturing a first channel and a second channel on the second structure, wherein the first channel is communicated with the air pressure chamber and the outside, and the second channel is communicated with the liquid storage cavity and the outside.

2. The method of claim 1, wherein the step of forming the first structure by forming the air chamber comprises:

providing a first substrate;

fabricating a mold core on the first substrate;

fabricating a plenum wall on the first substrate covering the mold core; and

and removing the mold core and the first substrate, wherein the air pressure chamber wall forms the air pressure chamber.

3. The method of claim 2, wherein the step of fabricating a mandrel on the first substrate comprises:

coating photoresist on the first substrate;

etching an air pressure chamber area on the photoresist by an ultraviolet exposure technology; and

and removing the photoresist outside the air pressure chamber area to form the mold core.

4. The method of claim 2, wherein the step of fabricating a plenum wall on the first substrate covering the core comprises:

spin-coating a liquid material on the core, the liquid material being capable of covering the core; and

and curing the liquid material after the spin coating is finished to form the air pressure chamber wall.

5. The method of claim 3, wherein the step of removing the core and the first substrate comprises:

removing the photoresist in the die core; and

and removing the first substrate.

6. The method of manufacturing an iris diaphragm according to claim 2, wherein the step of manufacturing an air pressure chamber to form the first structure further comprises:

providing a second substrate;

fabricating the elastic film on the second substrate; and

combining the air pressure chamber wall and the elastic film to obtain the first structure.

7. The method of claim 6, wherein the step of providing a reservoir on the elastic film to form a second structure comprises:

removing the second substrate;

one side of the elastic film, which is far away from the air pressure chamber, is provided with a hollow liquid storage cavity side wall; and

the liquid storage cavity side wall is provided with a liquid storage cavity top wall to form the second structure, and the liquid storage cavity side wall, the liquid storage cavity top wall and the elastic film jointly form the liquid storage cavity.

8. The method of claim 6, wherein the step of providing a reservoir on the elastic film to form a second structure comprises:

removing the second substrate; and

and arranging a liquid storage cavity wall on one side of the elastic film, which is far away from the air pressure chamber, so as to form the second structure, wherein a blind hole is formed in the liquid storage cavity wall, the opening of the blind hole faces the elastic film, and the liquid storage cavity is formed by the liquid storage cavity wall and the elastic film together.

9. The method of claim 7, wherein the step of fabricating a first channel and a second channel on the second structure comprises:

penetrating the top wall of the reservoir chamber to create the second channel; and

the first channel is made by penetrating the top wall of the liquid storage cavity, the side wall of the liquid storage cavity and the elastic film.

10. The method of manufacturing an iris diaphragm according to claim 1, further comprising:

and injecting a light absorption solution into the liquid storage cavity, wherein the liquid storage cavity is filled with the light absorption solution.

Technical Field

The present disclosure relates to the field of optical devices, and more particularly, to a method for manufacturing an iris diaphragm.

Background

The light fluid can be driven by gas pressure to realize the iris diaphragm, specifically, the iris diaphragm is provided with an air pressure chamber and a liquid storage cavity, the elastic film of the air pressure chamber is deformed by changing the air pressure of the air pressure chamber, liquid in the liquid storage cavity is driven to deform, the elastic film is contacted with the top of the liquid storage cavity, and the contact area is the iris diaphragm. At present, the application of the iris diaphragm is more and more extensive, and how to manufacture the iris diaphragm becomes a technical problem to be solved.

Disclosure of Invention

The embodiment of the application provides a manufacturing method of an iris diaphragm.

The method for manufacturing the iris diaphragm according to the embodiment of the present application includes:

manufacturing an air pressure chamber to form a first structure, wherein the first structure comprises an elastic film for isolating the air pressure chamber from the outside; a liquid storage cavity is arranged on the elastic film to form a second structure, and the liquid storage cavity and the air pressure chamber are positioned on two opposite sides of the elastic film; and manufacturing a first channel and a second channel on the second structure, wherein the first channel is communicated with the air pressure chamber and the outside, and the second channel is communicated with the liquid storage cavity and the outside.

In some embodiments, the step of fabricating the plenum to form the first structure comprises: providing a first substrate; fabricating a mold core on the first substrate; fabricating a plenum wall on the first substrate covering the mold core; and removing the mold core and the first substrate, wherein the air pressure chamber wall forms the air pressure chamber.

In certain embodiments, the step of fabricating a mold core on the first substrate comprises:

coating photoresist on the first substrate; etching an air pressure chamber area on the photoresist by an ultraviolet exposure technology; and removing the photoresist outside the air pressure chamber area to form the mold core.

In certain embodiments, the step of fabricating a plenum wall on the first substrate covering the mold core comprises:

spin-coating a liquid material on the core, the liquid material being capable of covering the core; and curing the liquid material after the spin coating is finished to form the air pressure chamber wall.

In some embodiments, the step of removing the mandrel and the first substrate comprises:

removing the photoresist in the die core; and removing the first substrate.

In some embodiments, the step of fabricating the plenum to form the first structure further comprises:

providing a second substrate; fabricating the elastic film on the second substrate; and combining the air pressure chamber wall and the elastic film to obtain the first structure.

In some embodiments, the step of providing a reservoir on the elastic membrane to form a second structure comprises:

removing the second substrate; one side of the elastic film, which is far away from the air pressure chamber, is provided with a hollow liquid storage cavity side wall; and a liquid storage cavity top wall is arranged on the liquid storage cavity side wall to form the second structure, and the liquid storage cavity side wall, the liquid storage cavity top wall and the elastic film jointly form the liquid storage cavity.

In some embodiments, the step of providing a reservoir on the elastic membrane to form a second structure comprises:

removing the second substrate; and arranging a liquid storage cavity wall on one side of the elastic film, which is far away from the air pressure chamber, so as to form the second structure, wherein a blind hole is formed in the liquid storage cavity wall, the opening of the blind hole faces the elastic film, and the liquid storage cavity is formed by the liquid storage cavity wall and the elastic film together.

In some embodiments, the step of fabricating a first via and a second via on the second structure comprises:

penetrating the top wall of the reservoir chamber to create the second channel; and penetrating the top wall of the liquid storage cavity, the side wall of the liquid storage cavity and the elastic film to manufacture the first channel.

In some embodiments, the method of making the iris diaphragm further comprises:

and injecting a light absorption solution into the liquid storage cavity, wherein the liquid storage cavity is filled with the light absorption solution.

The manufacturing method of the iris diaphragm, provided by the application, is based on the scheme that the optical fluid is driven by the gas pressure to realize the iris diaphragm, can solve the technical problem of manufacturing the iris diaphragm, and is simple in process flow by firstly manufacturing the gas pressure chamber, then manufacturing the liquid storage cavity 21 and finally manufacturing the first channel and the second channel.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic flow chart of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 2 is a schematic view of a scene of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 3 is a schematic flow chart of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 4 is a schematic view of a scene of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 5 is a schematic flow chart illustrating a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 6 is a schematic flow chart of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 7 is a schematic flow chart illustrating a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 8 is a schematic flow chart illustrating a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 9 is a schematic view of a scene of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 10 is a schematic flow chart illustrating a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 11 is a schematic view of a scene of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 12 is a schematic flow chart illustrating a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 13 is a schematic view of a scene of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 14 is a schematic flow chart illustrating a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 15 is a schematic flow chart illustrating a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 16 is a schematic flow chart illustrating a method of manufacturing an iris diaphragm according to an embodiment of the present application;

fig. 17 is a schematic view of a scene of a method of manufacturing an iris diaphragm according to an embodiment of the present application;

FIG. 18 is a schematic diagram of a scene of an embodiment of an iris diaphragm of an embodiment of the present application;

fig. 19 is a schematic view of a scene of one state of the variable aperture stop according to the embodiment of the present application.

Description of the main element symbols:

the variable aperture 100, the first structure 10, the air pressure chamber 11, the air pressure chamber wall 12, the elastic film 13, the first substrate 14, the second substrate 15, the air pressure chamber structure 16, the mold core 17, the second structure 20, the liquid storage cavity 21, the liquid storage cavity wall 22, the liquid storage cavity side wall 23, the liquid storage cavity top wall 24, the blind hole 25, the first channel 30, the second channel 40, the light absorbing solution 50 and the aperture 60.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 to 2, a method for manufacturing an iris diaphragm 100 according to an embodiment of the present disclosure is used to manufacture the iris diaphragm 100, and the iris diaphragm 100 may be used in an electronic device (e.g., a mobile phone, a camera, a tablet computer, a smart watch, a head display device, etc.) to take a picture or take a video.

The method of manufacturing the iris diaphragm 100 includes the steps of:

s10: manufacturing an air pressure chamber 11 to form a first structure 10, wherein the first structure 10 comprises an elastic film 13 for isolating the air pressure chamber 11 from the outside;

s20: a liquid storage cavity 21 is formed in the elastic film 13 to form a second structure 20, and the liquid storage cavity 21 and the air pressure chamber 11 are located on two opposite sides of the elastic film 13; and

s30: a first passage 30 and a second passage 40 are formed in the second structure 20, the first passage 30 communicates the air pressure chamber 11 with the outside, and the second passage 40 communicates the liquid storage chamber 21 with the outside.

The method for manufacturing the iris diaphragm 100 according to the embodiment of the present application is based on a scheme of driving optical fluid by gas pressure to realize the iris diaphragm, and is simple in process flow by first manufacturing the pressure chamber 11, then manufacturing the liquid storage chamber 21, and finally manufacturing the first channel 30 and the second channel 40.

In step S10, the shape of the air pressure chamber 11 may be a cylinder, a stack of two cylinders with unequal radii, or a cuboid, which is not limited herein. The elastic membrane 13 is deformed under the action of air pressure and extends into the liquid storage cavity 21,

in step S20, the liquid storage chamber 21 and the air pressure chamber 11 are blocked by the elastic film 13, and no air or fluid permeates between the air pressure chamber 11 and the liquid storage chamber 21.

In step S30, the first channel 30 may be used for gas to flow into or out of the pneumatic chamber, and the second channel 40 may be used for fluid to flow into or out of the liquid storage chamber 21. .

Referring to fig. 3 and 4, in some embodiments, the step S10 of fabricating the air chamber 11 to form the first structure 10 includes:

step S11: providing a first substrate 14;

step S12: manufacturing a mold core 17 on the first substrate 14;

step S13: making a gas pressure chamber wall 12 on a first substrate 14 covering a mold core 17; and

step S14: the mold core 17 and the first substrate 14 are removed and the air chamber wall 12 forms the air chamber 11.

Specifically, the first substrate 14 may be a silicon wafer, or the like, which is not limited herein, and the first substrate 14 is a silicon wafer for explanation, and it is understood that the first substrate 14 may be other substrates.

Referring to fig. 5, in some embodiments, step S12 includes step S121, step S122, and step S123.

Step S121: applying a photoresist on the first substrate 14;

step S122: etching an air pressure chamber area 16 on the photoresist by an ultraviolet exposure technology; and

step S123: removing the photoresist outside the plenum region 16;

the photoresist may be SU-8, BN308, BN303, BP212, AZ9620, etc., without limitation. The photoresist outside the air pressure chamber region 16 may be removed by cleaning with a chemical solution, an optical method, or the like, and the specific removal method is not limited herein. The air pressure chamber area 16 is carved by the ultraviolet exposure technology, the ultraviolet exposure technology is mature, the manufacturing process is simple, the cost is low, and meanwhile, the manufacturing precision is high.

Referring to fig. 6, in some embodiments, step S13 includes:

step S131: spin-coating a liquid material on the mold core 17, the spin-coating liquid material being capable of covering the mold core 17; and

step S132: and curing the liquid material after the spin coating to form the air pressure chamber wall 12 after curing.

Specifically, the liquid material may be an organic material such as Polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), and the like, which is not limited herein. The curing method may be natural drying, radiation curing, and the like, which is not limited herein. Firstly, a liquid material is spin-coated on the mold core 17, and then the spin-coated liquid material is cured, so that the formed air pressure chamber wall 12 can be more attached to the mold core 17 and the first substrate 14. In step S131, covering means that the liquid material is spin-coated on both sides and on the core 17 so that the core 17 is completely wrapped by the liquid material.

Referring to fig. 7, in some embodiments, step S14 includes:

s141: removing the photoresist in the mold core 17; and

s142: the first substrate 14 is removed.

Specifically, the photoresist in the mold core 17 may be removed by a chemical solution, an optical method, a photoresist remover, and the like, and the specific embodiment is not limited herein. After the photoresist in the mold core 17 is removed, the air pressure chamber 11 is formed. The mold core 17 is manufactured first, and then the photoresist on the mold core 17 is removed, so that the mold core 17 is used as a base, the manufacturing of the air pressure chamber wall 12 is facilitated, and the formation of the air pressure chamber 11 is facilitated.

Referring to fig. 8 and 9, in some aspects, the step S10 further includes:

s15: providing a second substrate 15;

s16: manufacturing an elastic film 13 on a second substrate 15; and

s17: the first structure 10 is obtained by combining the gas chamber wall 12 with the elastic membrane 13.

Specifically, the second substrate 15 may be a silicon wafer, or the like, and is not limited herein, and the second substrate 15 is a silicon wafer in the embodiment of the present application. In step S16, the elastic film 13 is manufactured on the second substrate 15 by spin-coating a thin liquid material on the second substrate 15 and then curing the spin-coated liquid material to form a film. The liquid material needs to have relatively strong light transmittance and elasticity after being cured, and the liquid material may be an organic material such as polydimethylsiloxane, polymethyl methacrylate, and the like, and the specific material is not limited herein.

In step S16, the elastic film 13 is manufactured on the second substrate 15, or the elastic film 13 may be directly disposed on the second substrate 15. The elastic film 13 is required to have good light transmittance and elasticity, and the elastic film 13 may be a PDMS (polydimethylsiloxane) silicone film, a PMMA (polymethyl methacrylate) film, or the like. In the present embodiment, the elastic film 13 is a PDMS film. Particularly, the PDMS film has the advantages of good elasticity, low Young modulus, chemical stability, thermal stability, low-temperature flexibility (-60-200 ℃ for maintaining excellent performance), full transparency, biocompatibility and the like.

In step S17, the pressure chamber wall 12 and the elastic film 13 may be bonded together by an adhesive, the pressure chamber wall 12 and the elastic film 13 may be bonded together by irradiating ultraviolet light, or the pressure chamber wall 12 and the elastic film 13 may be bonded together by a chemical means. The specific bonding method between the air chamber wall 12 and the elastic film 13 is not limited herein, and the air chamber wall 12 and the elastic film 13 can be bonded.

Referring to fig. 10 and 11, in some embodiments, step S20 includes:

step S21: removing the second substrate 15;

step S22: a hollow liquid storage cavity side wall 23 is arranged on one side of the elastic film 13 far away from the air pressure chamber 11; and

step S23: a reservoir top wall 24 is provided on the reservoir side wall 23 to form the second structure 20.

Specifically, in step S22, the reservoir side wall 22 is disposed on the side away from the air pressure chamber 11, i.e., the reservoir side wall 22 and the air pressure chamber 11 are respectively disposed on both sides of the elastic film 13. In step S23, the reservoir top wall 24 is disposed on the reservoir side wall 23, and the reservoir side wall 23, the reservoir top wall 24 and the elastic film 13 together form the reservoir 21 because the reservoir side wall 23 is hollow. Reservoir chamber 21 is used to store liquid. Therefore, the side wall 23 and the top wall 24 of the liquid storage cavity both need to have hydrophobicity, so as to prevent liquid from permeating into the side wall 23 and the top wall 24 of the liquid storage cavity. The liquid storage cavity side wall 23 has a supporting effect on the liquid storage cavity top wall 24, and meanwhile, the liquid storage cavity side wall 23 and the liquid storage cavity top wall 24 have a restraining effect on liquid in the liquid storage cavity 21. The material of the side wall 23 and the top wall 24 may be Polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), or the like. Polydimethylsiloxane and polymethyl methacrylate are inert materials and have certain hydrophobicity.

Referring to fig. 12 and 13, in some embodiments, step S20 includes:

s21: removing the second substrate 15; and

s24: a liquid storage chamber wall 22 is provided on the side of the elastic membrane 13 remote from the air chamber 11 to form the second structure 20.

Specifically, the liquid storage cavity wall 22 is disposed on a side of the elastic film 13 away from the air pressure chamber 11, and the liquid storage cavity wall 22 and the air pressure chamber 11 are respectively disposed on two sides of the elastic film 13. The liquid storage cavity wall 22 is formed with a blind hole 25, and the opening direction of the blind hole 25 faces the elastic film 13. The reservoir wall 22 and the elastic film 13 together form a reservoir 21. In the present embodiment, the blind hole 25 is opened toward the elastic membrane 13, and the elastic membrane 13 is connected with the liquid storage cavity wall 22, so that the blind hole 25 forms the liquid storage cavity 21. Liquid can be stored in liquid storage chamber 21. The liquid storage chamber wall 21 needs to have hydrophobicity so that the liquid inside the liquid storage chamber 21 does not penetrate into the liquid storage chamber wall 22. The material of the liquid storage chamber wall 21 may be Polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), or the like. The liquid storage cavity wall 21 has a restriction effect on the liquid in the liquid storage cavity 21.

Referring to fig. 14, in some embodiments, step S30 includes:

s31: a second channel 40 is made through the reservoir top wall 24; and

s32: a first channel 30 is made through the reservoir top wall 24, the reservoir side wall 23 and the flexible membrane 13.

Referring to fig. 15, in some embodiments, step S30 includes:

s33: through the reservoir wall 22 to create a second channel 40; and

s34: a first channel 30 is made through the reservoir wall 22 and the flexible membrane 13.

Specifically, the first channel 30 connects the air pressure chamber 11 with the outside, the second channel 40 connects the liquid storage chamber 21 with the outside, air or other gas can enter the air pressure chamber 11 through the first channel 30, and liquid can enter the liquid storage chamber 21 through the second channel 40. In the embodiment of the present application, the steps of manufacturing the first channel 30 and the second channel 40 are not limited in sequence, and the first channel 30 and the second channel 40 may be manufactured first, or the first channel 30 may be manufactured after the second channel 40 is manufactured first, or the first channel 30 and the second channel 40 may be manufactured simultaneously.

The opening of the first channel 30 and the opening of the second channel 40 may both be located at one side of the iris diaphragm 100, so that when the iris diaphragm 100 is used, the air path communicating with the first channel and the liquid path communicating with the second channel may be provided at one side of the iris diaphragm, and need not be arranged at the other side (e.g., left and right sides) of the iris diaphragm, facilitating the arrangement of elements within the electronic device.

In some embodiments, the first passage 30 and the second passage 40 are fabricated in step S30, the second passage 40 may be fabricated through the side wall 23 of the liquid storage chamber, and the first passage 30 may be fabricated through the wall 12 of the gas pressure chamber, and the embodiments of fabricating the first passage 30 and the second passage 40 are not limited herein.

Referring to fig. 16 and 17, in some embodiments, the method for manufacturing the iris diaphragm 100 further includes step S40: a light absorbing solution 50 is injected into the reservoir 21. Light absorbing solution 50 is injected into reservoir 21 through second channel 40 until reservoir 21 is filled with light absorbing solution 50. The light absorbing solution 50 is a solution that can absorb light.

Referring to fig. 18 and 19, further, after the light absorbing solution 50 is filled in the liquid storage cavity 21, air or other gas may be injected into the air pressure chamber 11, so that the air pressure chamber 11 has a higher air pressure. As the air is injected, the elastic film 13 deforms, and as the upward deformation of the elastic film 13 increases, the light absorbing solution 50 is continuously squeezed until the upper side of the elastic film 13 touches the top of the liquid storage chamber 21, and the spherical contact areas (such as L1 and L2 in FIG. 18) of the elastic film 13 can be regarded as the diaphragm 60. As the air is injected continuously, the spherical contact area of the elastic membrane 13 becomes larger and larger, for example, in fig. 18, the spherical contact area is L1 when the elastic membrane 13 just contacts the top of the liquid storage cavity 21, and after more air is injected, the elastic membrane 13 continues to deform, and the spherical contact area is L2. The size of the diaphragm 60 also changes due to the deformation of the elastic film 13, and as shown in fig. 19, the radius of the diaphragm 60 changes from R1 to R2 from when there is no diaphragm 60 at first until the diaphragm 60 appears. When the air in the air chamber 11 is evacuated, the elastic film 13 is gradually restored and the diaphragm 60 is gradually reduced.

The variable aperture 100, which is a scheme of implementing the variable aperture by driving the optical fluid by the gas pressure, may also be manufactured by a 3D printing method, and the structure of the variable aperture 100 is directly printed by a 3D printer using an organic material such as Polydimethylsiloxane (PDMS) or polymethyl methacrylate (PMMA) as a 3D printing material.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.