阅读说明：本技术 一种或多种涂料组合物 (One or more coating compositions ) 是由 吴冠霆 J·沃基尔 D·卡斯蒂罗 于 2017-07-13 设计创作，主要内容包括：在一些实例中，本文描述了用于电子设备的散热涂料组合物，其能够包括：沉积在电子设备表面上的透明涂料层，其中所述涂料层包含：热吸收剂，其选自二氧化硅气凝胶、碳纳米管、碳纳米管气凝胶、石墨烯、石墨烯气凝胶及其组合，透明树脂，其选自聚丙烯酸类树脂、聚碳酸酯树脂、环状烯烃树脂、环氧树脂、聚氨酯树脂、硅酮树脂、氰基丙烯酸酯树脂、聚酯树脂以及其组合，和溶剂；以及热扩散层，其至少部分地沉积在透明涂料层的顶部，或沉积在与透明涂料层相邻的电子设备表面上，其中所述热扩散层包含：金属或非金属颗粒，其选自铜、铝、石墨、碳纳米管、金属基石墨烯、石墨烯及其组合。(In some examples, described herein are heat-dissipating coating compositions for electronic devices that can include: a clear coating layer deposited on a surface of an electronic device, wherein the coating layer comprises: a heat absorber selected from the group consisting of silica aerogel, carbon nanotube aerogel, graphene aerogel and combinations thereof, a transparent resin selected from the group consisting of polyacrylic resin, polycarbonate resin, cyclic olefin resin, epoxy resin, polyurethane resin, silicone resin, cyanoacrylate resin, polyester resin and combinations thereof, and a solvent; and a thermal spreading layer at least partially deposited on top of the clear coating layer or on a surface of the electronic device adjacent to the clear coating layer, wherein the thermal spreading layer comprises: metal or non-metal particles selected from the group consisting of copper, aluminum, graphite, carbon nanotubes, metal-based graphene, and combinations thereof.)

1. A heat-dissipating coating composition for an electronic device, comprising:

a clear coating layer deposited on a surface of the electronic device, wherein the coating layer comprises:

a heat absorber selected from the group consisting of silica aerogel, carbon nanotube aerogel, graphene aerogel and combinations thereof,

a transparent resin selected from the group consisting of polyacrylic resins, polycarbonate resins, cyclic olefin resins, epoxy resins, polyurethane resins, silicone resins, cyanoacrylate resins, polyester resins, and combinations thereof, and

a solvent; and

a thermal diffusion layer at least partially deposited on top of the clear coating layer or on a surface of the electronic device adjacent to the clear coating layer, wherein the thermal diffusion layer comprises:

metal or non-metal particles selected from the group consisting of copper, aluminum, graphite, carbon nanotubes, metal-based graphene, and combinations thereof.

2. The heat dissipating coating composition of claim 1, wherein the clear coating layer completely coats a surface of the electronic device.

3. The heat spreading coating composition of claim 2, wherein the thickness of the clear coating layer completely coating the surface of the electronic device is from about 1 μ ι η to about 100 μ ι η.

4. The heat spreading coating composition of claim 1 wherein the heat absorber is present in the clear coating layer in an amount of from about 10 wt% to about 70 wt%, based on the total weight of the clear coating layer.

5. The heat dissipating coating composition of claim 1, wherein the clear resin is present in the clear coating layer in an amount of about 5 wt% to about 50 wt% based on the total weight of the clear coating layer.

6. The heat-dissipating coating composition of claim 1, wherein the solvent is selected from the group consisting of ketone-based solvents, ester-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, hydrocarbon-based solvents, and combinations thereof.

7. The heat spreading coating composition of claim 1, wherein the thermal spreading layer is deposited to coat 50% or less of the top of the clear coating layer.

8. The heat spreading coating composition of claim 1, wherein the thermal spreading layer is deposited to coat at least 50% of the top of the clear coating layer.

9. The heat spreading coating composition of claim 1, wherein the thermal spreading layer is deposited on the surface of the electronic device adjacent to the clear coating layer to coat 50% or less of the surface of the electronic device.

10. The heat spreading coating composition of claim 1, wherein the thickness of the heat spreading layer is from about 0.01mm to about 0.5 mm.

11. An electronic device comprising the heat-dissipating coating composition of claim 1.

12. A method of depositing a heat-dissipating coating composition on an electronic device, comprising:

depositing a clear coating layer on a surface of the electronic device, wherein the coating layer comprises:

a heat absorber selected from the group consisting of silica aerogel, carbon nanotube aerogel, graphene aerogel and combinations thereof,

a transparent resin selected from the group consisting of polyacrylic resins, polycarbonate resins, cyclic olefin resins, epoxy resins, polyurethane resins, silicone resins, cyanoacrylate resins, polyester resins, and combinations thereof, and

a solvent; and

depositing a thermal diffusion layer at least partially on top of the clear coating layer or on a surface of the electronic device adjacent to the clear coating layer, wherein the thermal diffusion layer comprises:

metal or non-metal particles selected from the group consisting of copper, aluminum, graphite, carbon nanotubes, metal-based graphene, and combinations thereof.

13. The method of depositing a heat spreading coating composition of claim 12 wherein the thickness of the clear coating layer completely coating the surface of the electronic device is from about 1 μ ι η to about 100 μ ι η.

14. The method of depositing a heat spreading coating composition according to claim 12, wherein the thickness of the heat spreading layer is from about 0.01mm to about 0.5 mm.

15. The method of depositing a heat spreading coating composition according to claim 12 wherein the heat spreading layer is deposited to coat at least 90% of the top of the clear coating layer.

Background

Electronic devices, such as desktop computers, portable computers, mobile phones, handheld devices, printing devices, and other electronic devices, tend to heat up during use.