阅读说明：本技术 信号采集传感器阵列、电子设备及垫子 (Signal acquisition sensor array, electronic equipment and cushion ) 是由 焦旭 于 2019-10-14 设计创作，主要内容包括：本申请的一个实施例公开了一种信号采集传感器阵列、电子设备及床垫,所述传感器阵列包括：连接层,至少两种传感器单元,信号采集电路,以及用于将各所述传感器单元与所述信号采集电路进行电连接的信号线,每种所述传感器单元进一步包括：第一阻震基材；传感器元件,其与所述第一阻震基材一一对应且设置于所述第一阻震基材与所述连接层之间；其中,所述至少两种传感器单元在所述连接层上间隔排列成阵列状。本申请方案可以使得信号幅度差异很大的不同生理信号均被传感器阵列准确地检测到。(One embodiment of the present application discloses a signal acquisition sensor array, electronic equipment and mattress, the sensor array includes: a connection layer, at least two types of sensor units, a signal acquisition circuit, and a signal line for electrically connecting each of the sensor units with the signal acquisition circuit, each of the sensor units further comprising: a first shock-resistant base material; the sensor elements correspond to the first vibration-damping base materials one by one and are arranged between the first vibration-damping base materials and the connecting layer; wherein the at least two sensor units are arranged in an array at intervals on the connection layer. The scheme of the application can enable different physiological signals with greatly different signal amplitudes to be accurately detected by the sensor array.)

1. A signal acquisition sensor array, comprising: a connection layer, at least two types of sensor units, a signal acquisition circuit, and a signal line for electrically connecting each of the sensor units with the signal acquisition circuit, each of the sensor units further comprising:

a first shock-resistant base material;

the sensor elements correspond to the first vibration-damping base materials one by one and are arranged between the first vibration-damping base materials and the connecting layer;

wherein the at least two sensor units are arranged in an array at intervals on the connection layer.

2. The signal acquisition sensor array of claim 1 wherein a plurality of said sensor units share a single signal acquisition circuit.

3. The signal acquisition sensor array of claim 1 wherein the product of the seismic characteristic of the first seismic substrate included in one sensor unit, the sensitivity of the included sensor element, and the sensitivity of the corresponding signal acquisition circuit is more than 2 times the product of the seismic characteristic of the first seismic substrate included in another sensor unit, the sensitivity of the included sensor element, and the sensitivity of the corresponding signal acquisition circuit.

4. The signal acquisition sensor array of claim 3, wherein the signal acquisition sensor array comprises three sensor units, the product of the seismic characteristic of the first seismic substrate comprised in the first sensor unit, the sensitivity of the comprised sensor element, and the sensitivity of the corresponding signal acquisition circuit being more than 2 times and less than 20 times the product of the seismic characteristic of the first seismic substrate comprised in the second sensor unit, the sensitivity of the comprised sensor element, and the sensitivity of the corresponding signal acquisition circuit; the product of the damping characteristic of the first damping base material included in the second sensor unit, the sensitivity of the included sensor element and the sensitivity of the corresponding signal acquisition circuit is more than 5 times and less than 10 times of the product of the damping characteristic of the first damping base material included in the third sensor unit, the sensitivity of the included sensor element and the sensitivity of the corresponding signal acquisition circuit.

5. The signal acquisition sensor array of claim 3 wherein different types of sensor units correspond to the same signal acquisition circuit.

6. The signal acquisition sensor array of any one of claims 1-5 wherein the first shock absorbing substrate is made of a sponge having a pore character number of 15PPI to 60 PPI.

7. The signal acquisition sensor array of any one of claims 1-5 wherein the connecting layer also serves as a second seismic resistant substrate, or each sensor unit further comprises a second seismic resistant substrate independently disposed between the connecting layer and the sensor element.

8. The signal acquisition sensor array of claim 7 wherein, in the event that the first seismic substrate included in the at least two sensor units has different seismic characteristics, the second seismic substrate has a seismic characteristic between the maximum and minimum of the seismic characteristics of the at least two first seismic substrates.

9. The signal acquisition sensor array of claim 7 wherein the second shock absorbing substrate is made of sponge having a pore size number of 25PPI to 50 PPI.

10. The signal acquisition sensor array as in any one of claims 1-5, further comprising: the length of the signal line is larger than the maximum extension length of the connecting layer between the two end connecting points of the signal line in the extension direction of the signal line.

11. The signal acquisition sensor array as in any one of claims 1-5, wherein the signal acquisition circuit has a sampling frequency of not less than 40 Hz.

12. The signal acquisition sensor array as in any one of claims 1-5, wherein the sampling frequency of the signal acquisition circuit is different for different sensor units.

13. An electronic device comprising a processor and a signal acquisition sensor array according to any one of claims 1 to 12.

14. A mat comprising a mat body and a signal acquisition sensor array according to any one of claims 1 to 12.

Technical Field

The present application relates to the field of information technology, and in particular, to a signal acquisition sensor array, an electronic device, and a mat.

Background

Along with the improvement of the life quality of people, health is more and more concerned. As a basis for health detection, some physiological signals, such as body movement, respiration, heartbeat, etc., need to be known accurately. In the prior art, there are some devices, such as an electronic bracelet, a sphygmomanometer, etc., which respectively detect the physiological signals. However, on one hand, the detected physiological signals in these prior arts are relatively single, for example, the electronic bracelet can detect body movement and heartbeat, but the performance is relatively deficient in detecting respiration; the sphygmomanometer detects a heartbeat but cannot detect a body movement. On the other hand, because the reference value of parameters such as breathing and heartbeat of a person in sitting, standing and moving states is relatively low, and the existing detection equipment is usually used for detection in the states, the referential performance of signals detected by the conventional detection equipment in the prior art is also low.

As an improvement, a proposal has been made to use a mattress with a sensor array, in which body movement, respiration, and heartbeat signals are detected using the sensor array. However, since the body movement, respiration, heartbeat signals themselves are spread widely over the same type of signal amplitude, and there may be several times or even orders of magnitude differences between the different types of signals, these signals are difficult to detect all accurately.

Disclosure of Invention

In order to solve the above problem, in a first aspect, an embodiment of the present application provides a signal acquisition sensor array, including: a connection layer, at least two types of sensor units, a signal acquisition circuit, and a signal line for electrically connecting each of the sensor units with the signal acquisition circuit, each of the sensor units further comprising: a first shock-resistant base material; the sensor elements correspond to the first vibration-damping base materials one by one and are arranged between the first vibration-damping base materials and the connecting layer; wherein the sensor elements of the at least two sensor units are arranged in an array at intervals on the connection layer.

Optionally, a plurality of said sensor units share a signal acquisition circuit.

Optionally, the product of the damping characteristic of the first damping substrate included in one sensor unit, the sensitivity of the included sensor element, and the sensitivity of the corresponding signal acquisition circuit is more than 2 times the product of the damping characteristic of the first damping substrate included in another sensor unit, the sensitivity of the included sensor element, and the sensitivity of the corresponding signal acquisition circuit.

Optionally, the signal acquisition sensor array includes three sensor units, and a product of the damping characteristic of the first damping base material included in the first sensor unit, the sensitivity of the included sensor element, and the sensitivity of the corresponding signal acquisition circuit is more than 2 times and less than 20 times a product of the damping characteristic of the first damping base material included in the second sensor unit, the sensitivity of the included sensor element, and the sensitivity of the corresponding signal acquisition circuit; the product of the damping characteristic of the first damping base material included in the second sensor unit, the sensitivity of the included sensor element and the sensitivity of the corresponding signal acquisition circuit is more than 5 times and less than 10 times of the product of the damping characteristic of the first damping base material included in the third sensor unit, the sensitivity of the included sensor element and the sensitivity of the corresponding signal acquisition circuit.

Optionally, different kinds of sensor units correspond to the same signal acquisition circuit.

Optionally, the first shock-absorbing substrate is made of sponge with the pore characteristics of 15 PPI-60 PPI.

Optionally, the connection layer doubles as a second seismic resistant substrate, or each of the sensor units further includes a second seismic resistant substrate independently disposed between the connection layer and the sensor element.

Optionally, in a case where the damping characteristics of the first damping base materials included in the at least two sensor units are different, the damping characteristic of the second damping base material is between the maximum value and the minimum value of the damping characteristics of the at least two first damping base materials.

Optionally, the second shock absorbing substrate is made of sponge with the pore characteristics of 25PPI to 50 PPI.

Optionally, the method further comprises: the length of the signal line is larger than the maximum extension length of the connecting layer between the two end connecting points of the signal line in the extension direction of the signal line.

Optionally, the sampling frequency of the signal acquisition circuit is not lower than 40 Hz.

Optionally, the sampling frequency of the signal acquisition circuit is different for different sensor units.

In a second aspect, another embodiment of the present application provides an electronic device that includes a processor and a sensor array as described above.

In a third aspect, another embodiment of the present application provides a mat comprising a mat body and a sensor array as described above.

In one or more embodiments of the present application, at least two sensor units are arranged at intervals in an array form, and the sensor elements in the sensor units are arranged in a one-to-one correspondence with the first seismic isolation base material and between the first seismic isolation base material and the connection layer, so that different signals are attenuated to different degrees after being transmitted to the sensor units, and strong coupling of force between the sensor units is released, thereby different physiological signals with large signal amplitude differences are accurately detected by the sensor array.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a top view of a signal acquisition sensor array according to one embodiment of the present application;

FIG. 2 is a cross-sectional view of a signal acquisition sensor array of one embodiment of the present application;

FIG. 3 is a top view of a signal acquisition sensor array according to another embodiment of the present application;

FIG. 4 is a cross-sectional view of a signal acquisition sensor array of yet another embodiment of the present application;

FIG. 5 is a signal processing circuit schematic of an embodiment of the present application;

FIG. 6 is a schematic view of an electronic device of an embodiment of the present application;

fig. 7 is a schematic view of a mattress according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments obtained by a person skilled in the art without any inventive step based on the examples in this application are within the scope of protection of this application.

Firstly, it should be introduced that through a great deal of experiments and data research, the inventor of the present application locks the main reason that different physiological signals with greatly different signal amplitudes are difficult to be accurately detected by the existing sensor array to the contradiction that the combination of the existing sensor element, the signal acquisition circuit and the vibration damping material is difficult to consider both the order of magnitude crossing and sufficient precision; and force coupling may exist between each sensor unit in the planar sensor array, which further causes signal propagation, so that the point-like vibration is changed into a planar signal. Based on the recognition of the reason, and in order to solve this contradiction, the inventors of the present application propose the following embodiments.