阅读说明：本技术 一种真空玻璃及其制造方法 (Vacuum glass and manufacturing method thereof ) 是由 刘江 王群华 吉顺青 于 2019-11-22 设计创作，主要内容包括：本发明公开了一种真空玻璃,涉及真空玻璃领域,包括：第一衬底、第二衬底、焊料和透明网状支撑层；所述透明网状支撑层位于所述第一衬底和所述第二衬底之间并覆盖所述第一衬底,所述焊料位于所述第一衬底表面的外周,将所述第一衬底和所述第二衬底连接；所述透明网状支撑层具有网孔,所述网孔中为真空。本发明的技术效果在于：超薄真空玻璃无抽气口,简洁美观,制造过程低成本,稳定高效。真空玻璃透明度高,可以广泛应用于汽车玻璃和家电玻璃,具有很好的绝热,隔音,保温等功能。(The invention discloses vacuum glass, which relates to the field of vacuum glass and comprises the following components: the device comprises a first substrate, a second substrate, solder and a transparent reticular support layer; the transparent reticular support layer is positioned between the first substrate and the second substrate and covers the first substrate, and the solder is positioned on the periphery of the surface of the first substrate and connects the first substrate and the second substrate; the transparent reticular support layer is provided with meshes, and vacuum is formed in the meshes. The invention has the technical effects that: the ultrathin vacuum glass has no extraction opening, is simple and beautiful, has low cost in the manufacturing process, and is stable and efficient. The vacuum glass has high transparency, can be widely applied to automobile glass and household appliance glass, and has the functions of good heat insulation, sound insulation, heat preservation and the like.)

1. A vacuum glass, comprising: the device comprises a first substrate, a second substrate, solder and a transparent reticular support layer;

the transparent reticular support layer is positioned between the first substrate and the second substrate and covers the first substrate, and the solder is positioned on the periphery of the surface of the first substrate and connects the first substrate and the second substrate; the transparent reticular support layer is provided with meshes, and vacuum is formed in the meshes.

2. The vacuum glass of claim 1, wherein the transparent mesh support layer is made of one or more of the following materials: transparent three-dimensional gloss oil, nano glass powder ink, nano reticular nickel-chromium, nano reticular silicon-aluminum and nano reticular zinc-tin.

3. The vacuum glass manufacturing method according to claim 1, wherein the solder is selected from one or more of the following elemental oxides: lithium, sodium, potassium, zinc, boron, aluminum, silicon, phosphorus, tin, bismuth; alternatively, the first and second electrodes may be,

a mixture of said oxide with one or more of the following: high polymer, high temperature ink paste, high polymer, low melting sintering oil, prepolymer or elastomer.

4. The vacuum glass of claim 1, wherein the area of the mesh accounts for 45% to 85% of the area of the first substrate.

5. The vacuum glass of claim 1, wherein the transparent mesh support layer has a thickness of 0.5 to 1000 microns.

6. The vacuum glass of claim 1, wherein the first substrate has a thickness of 0.01 to 3 mm and the second substrate has a thickness of greater than 3 mm.

7. The vacuum glass of claim 1, wherein the first substrate and the second substrate have a thickness of 0.01 to 3 millimeters.

8. The vacuum glass of claim 7, further comprising: and the third substrate is connected with the second substrate through a film, and the film is selected from one or more of PVB, PMMA, PU and EVA.

9. The vacuum glass of claim 7, further comprising: the spacer is arranged on the periphery of the second substrate and the periphery of the fourth substrate, the fourth substrate and the second substrate are connected, a hollow layer is arranged between the fourth substrate and the second substrate, and inert gas is arranged inside the hollow layer.

10. The vacuum glass of any of claims 1 to 9, wherein the first substrate and the second substrate are curved glass.

11. A method of making vacuum glass, comprising:

forming a transparent mesh support layer on a first substrate;

coating organic glue on the periphery of the first substrate;

bonding solder to the periphery of the first substrate through the organic glue;

heating and pre-sintering the organic glue, the first substrate, the solder and the transparent mesh support layer:

aligning and pressing the first substrate and the second substrate;

an ion source exhaust to bombard the first and second substrates with inert gas ions under vacuum;

and sintering the solder by vacuum heating to connect the first substrate and the second substrate.

12. The method of claim 11, wherein after forming the transparent mesh support layer, grooves are formed in the first substrate by a laser process prior to applying the organic glue, the organic glue adhering the solder material within the grooves.

13. The vacuum glass manufacturing method according to claim 11, wherein the solder is sintered at 350 to 450 ℃ to connect the first substrate and the second substrate.

14. The vacuum glass manufacturing method according to claim 11, wherein the organic paste is pre-sintered by heating at a temperature of 150 to 250 ℃ at 1 to 10 pa.

15. The vacuum glass manufacturing method of claim 14, wherein the heating pre-sintering uses a multi-layer radiation mirror panel.

Technical Field

The invention relates to the field of vacuum glass, in particular to vacuum glass and a manufacturing method thereof.

Background

In the current patent application of domestic and foreign vacuum glass, the basic structure is mostly that a plurality of support columns are arranged between two glass plates, the periphery of the two glass plates is sealed by a sealing material, an air suction opening is preset on the glass plates, and the air in the gap between the two glass plates is pumped out through the air suction opening, so that the air suction opening is sealed after the gap is in a vacuum state, thereby forming the vacuum glass. However, in the case of the ultra-thin vacuum glass, the low thickness (less than 3 mm) of the ultra-thin glass may cause breakage of the ultra-thin glass due to the concentration of the receiving area during the vacuum packaging using the above method. The extraction opening of the glass also has the problems of low efficiency, poor vacuum degree and poor sealing effect due to vacuum formation during air extraction, and is easy to leak and not attractive. For the support column of the vacuum glass, opaque materials such as metal, ceramic and the like are generally adopted, and the high transparency of the vacuum glass is influenced.

Disclosure of Invention

In view of the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is to provide a vacuum glass and a manufacturing method thereof, which can realize vacuum packaging of ultra-thin glass with a thickness less than 3 mm.

In order to achieve the above object, the present invention provides a vacuum glass comprising: the device comprises a first substrate, a second substrate, solder and a transparent reticular support layer;

the transparent reticular support layer is positioned between the first substrate and the second substrate and covers the first substrate, and the solder is positioned on the periphery of the surface of the first substrate and connects the first substrate and the second substrate; the transparent reticular support layer is provided with meshes, and vacuum is formed in the meshes.

Further, the material of the transparent reticular support layer is one or more of the following materials: transparent three-dimensional gloss oil, nano glass powder ink, nano reticular nickel-chromium, nano reticular silicon-aluminum and nano reticular zinc-tin.

Further, the solder is an all-inorganic or inorganic-metal slurry mixed type, and is selected from one or more of the following oxides of simple substances: lithium, sodium, potassium, zinc, boron, aluminum, silicon, phosphorus, tin, bismuth; alternatively, the first and second electrodes may be,

a mixture of said oxide with one or more of the following: high polymer, high temperature ink paste, high polymer, low melting sintering oil, prepolymer or elastomer.

Further, the area of the mesh accounts for 45% to 85% of the area of the first substrate.

Further, the thickness of the transparent mesh support layer is 0.5 to 1000 micrometers.

Further, the thickness of the first substrate is 0.01 to 3 mm, and the thickness of the second substrate is greater than 3 mm.

Further, the thickness of the first substrate and the second substrate is 0.01 to 3 mm.

Further, still include: and the third substrate is connected with the second substrate through a film, and the film is selected from one or more of PVB, PMMA, PU and EVA.

Further, still include: the spacer is arranged on the periphery of the second substrate and the periphery of the fourth substrate, the fourth substrate and the second substrate are connected, a hollow layer is arranged between the fourth substrate and the second substrate, and inert gas is arranged inside the hollow layer.

Further, the first substrate and the second substrate are curved glass.

The invention also provides a manufacturing method of the vacuum glass, which comprises the following steps:

forming a transparent mesh support layer on a first substrate;

coating organic glue on the periphery of the first substrate;

bonding solder to the periphery of the first substrate through the organic glue;

heating and pre-sintering the organic glue, the first substrate, the solder and the transparent mesh support layer;

aligning and pressing the first substrate and the second substrate;

an ion source exhaust to bombard the first and second substrates with inert gas ions under vacuum;

and sintering the solder by vacuum heating to connect the first substrate and the second substrate.

Further, after the transparent reticular supporting layer is formed, before the organic adhesive is coated, a groove is formed on the first substrate through a laser process, and the organic adhesive bonds the solder in the groove.

Further, the solder is sintered at 350 to 450 ℃ to connect the first substrate and the second substrate.

Further, the organic glue is pre-sintered by heating at 1 to 10Pa, the sintering temperature being 150 to 250 ℃.

Further, a multilayer radiation mirror panel was used in the heat pre-sintering.

The invention has the technical effects that: the ultrathin vacuum glass has no extraction opening, is simple and beautiful, has low cost in the manufacturing process, and is stable and efficient. The vacuum glass has high transparency, can be widely applied to automobile glass and household appliance glass, and has the functions of good heat insulation, sound insulation, heat preservation and the like.

The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, the features and the effects of the present invention.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:

FIG. 1 is a schematic cross-sectional view of a structure according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of another embodiment of the present invention;

fig. 3 is a schematic structural cross-sectional view according to another embodiment of the present invention.

Description of reference numerals: 100-a first substrate; 200-a second substrate; 101-a transparent mesh support layer; 102-solder; 103-mesh; 300-film; 400-a third substrate; 500-spacing bars; 600-hollow layer; 700-fourth substrate.

Detailed Description

The technical contents of the preferred embodiments of the present invention will be more clearly and easily understood by referring to the drawings attached to the specification. The present invention may be embodied in many different forms of embodiments and the scope of the invention is not limited to the embodiments set forth herein.

In the drawings, structurally identical elements are represented by like reference numerals, and structurally or functionally similar elements are represented by like reference numerals throughout the several views. The size and thickness of each component shown in the drawings are arbitrarily illustrated, and the present invention is not limited to the size and thickness of each component. The thickness of the components may be exaggerated where appropriate in the figures to improve clarity.

As shown in fig. 1, the present invention provides a vacuum glass comprising: a first substrate 100, a second substrate 200, a transparent mesh support layer 101, and solder 102. The transparent mesh support layer 101 is positioned between the first substrate 100 and the second substrate 200 and covers the first substrate 100, the solder 102 is positioned on the periphery of the surface between the first substrate 100 and the second substrate 200 and connects the first substrate 100 and the second substrate 200, the transparent mesh support layer 101 has a plurality of mesh holes 103, and the mesh holes 103 are vacuum-filled.

The first substrate 100 and the second substrate 200 may be made of common glass or coated Low-emissivity glass (Low-E glass), or may be made of tempered glass. The shape of the glass itself may be a plane rectangle, a circle, an arc or a curved glass, etc., and is not limited herein. The first substrate 100 and the second substrate 200 may be the same size, or the second substrate 200 may be larger in size than the first substrate 100, as needed.

The transparent mesh support layer 101 is orderly distributed between the first substrate 100 and the second substrate 200 in the form of a lattice array and covers the first substrate 100. The height of the transparent mesh support layer 101 is 0.5 to 1000 micrometers. Due to the existence of the dot matrix, after the first substrate 100 is contacted with the transparent mesh support layer 101, the transparent mesh support layer 101 and the first substrate 100 form a plurality of meshes 103, the meshes 103 communicate the first substrate 100 and the second substrate 200, and the inside is vacuum.

Further, the mesh 103 is a through via hole that connects the first substrate 100 and the second substrate 200 to each other. The total surface area of the mesh openings 103 occupies 45% to 85%, preferably 75% to 80%, of the surface area of the first substrate 100. In addition, the transparent mesh-shaped supporting layer 101 can be distributed in an irregular array, and the total surface area of the meshes 103 only needs to occupy 45 to 85 percent of the surface area of the first substrate 100, which is based on the comprehensive consideration of the surface contact area of the transparent mesh-shaped supporting layer 101 and the first substrate 100, if the surface contact area is large, the meshes are too few, and the advantages of sound insulation and heat insulation of the vacuum glass cannot be achieved; if the surface contact area is too small, the mesh is too large and too large to support the substrate. The transparent mesh support layer 101 material may be selected from: transparent three-dimensional gloss oil, nano glass powder ink, nano reticular nickel-chromium, nano reticular silicon-aluminum, nano reticular zinc-tin and the like. The material has good optical transmittance and small optical diffraction angle, and is suitable for being used as a transparent supporting layer.

The solder 102 is used for sealing the first substrate 100 and the second substrate 200, and ensures airtightness between the first substrate 100 and the second substrate 200, and may be an all-inorganic or inorganic-metal paste mixed type, and is selected from one or more of the following oxides of simple substances: lithium, sodium, potassium, zinc, boron, aluminum, silicon, phosphorus, tin, bismuth. Lithium oxide (Li) is preferable₂O), sodium oxide (Na)₂O), potassium oxide (K)₂O), zinc oxide (ZnO), boron oxide (B)₂O₃) Aluminum oxide (Al)₂O₃) Silicon dioxide (SiO)₂) Phosphorus pentoxide (P)₂O₅) Tin oxide (SnO), bismuth oxide (Bi)₂O₃). The melting point of solder 102 is regulated to be around 300 to 450 ℃. In addition, the solder 102 can be a high polymer, a high temperature ink paste, a high polymer, a low melting sintering oil, a prepolymer, or an elastomer. One preferred solder formulation is: ZnO: 40 to 45g, B₂O₃：30～35g，SnO：60～65g，SiO₂: 50-65 g, vinyl alcohol: 25-35 g, sodium tripolyphosphate: 18-20 g of epoxy acrylate: 11-15 g, polymer dispersant: 5-10 g of alkenyl succinate: 6-10 g, polyacrylamide: 3-5 g, sodium dodecyl benzene sulfonate: 2-4 g, sintering accelerant: 3-5 g, inorganic additive: 6-8 g. The solder 102 is set to be 3 to 10 mm wide and 1 to 3 mm high.

Further, the first substrate 100 and the second substrate 200 are both made of ultra-thin glass, and have a thickness of 0.01 to 3 mm, 0.01 to 0.1 mm, and 1.1 mm. At this time, an ultra-thin vacuum glass device is formed.

Further, the thickness of the first substrate 100 is 0.01 to 3 mm, and may also be 0.01 to 0.1 mm, and the thickness of the second substrate 200 is greater than 3 mm, which is the thickness of a conventional glass substrate. If the second substrate is made of toughened glass, the thickness of the second substrate is more than 3 mm, and then the building glass capable of sound and heat insulation is formed.

Further, as shown in fig. 2, the method further includes: a third substrate 400, wherein the third substrate 400 is connected with the second substrate 200 in a covering manner through a film 300, and the film is selected from one or more of polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), Polyurethane (PU), and ethylene-vinyl acetate copolymer (EVA). In this case, the first substrate 100 and the second substrate 200 are generally equal in size and thickness, and thus the third substrate 400 may be connected to the first substrate 100 by covering with the prepreg 300. At the moment, the windshield or the window glass and the like used by the automobile are formed, the heat and sound insulation performance of the automobile glass is improved, the thickness of the automobile glass is not excessively increased, and the automobile glass can still adapt to the industrial standard of the automobile glass.

Further, as shown in fig. 3, the method further includes: the fourth substrate 700 and the spacer 500, the spacer 500 connects the fourth substrate 700 and the second substrate 200, and a hollow layer is included between the fourth substrate 700 and the second substrate 200, and an inert gas, preferably argon, is filled in the hollow layer. At the moment, the hollow glass is formed, and the ultrathin vacuum glass is further combined on the basis of the heat insulation of the original hollow glass, so that the heat insulation and sound insulation performance is further improved.

The invention also provides a manufacturing method of the vacuum glass, which comprises the following steps:

s101, a transparent mesh support layer 101 is formed on the first substrate 100.

An inorganic transparent reticular support layer 101 with lattice or irregular shape array distribution or irregular distribution is formed on the surface of the cleaned first substrate 100 through the processes of screen printing, transfer printing, coating, dispensing, laser coating and the like, and vacuum exhaust is carried out through presintering. The material of the transparent mesh support layer 101 may be: transparent three-dimensional gloss oil, nano glass powder ink, nano reticular nickel-chromium, nano reticular silicon-aluminum, nano reticular zinc-tin, or other high-temperature-resistant nano materials.

S102, an organic glue is coated on the periphery of the first substrate 100.

The organic glue may be conventional glue in the prior art, such as silicone glue, acrylic glue, epoxy glue, hot melt glue, etc., and will not be described herein.

S103, solder 102 is attached to the outer periphery of first substrate 100 by organic glue.

Since the solder 102 itself is completely inorganic or inorganic-metal paste mixed type and has no viscosity, it is necessary to position the solder 102 on the surface of the first substrate 100 by organic glue in advance, and the melting point of the solder 102 is about 300 to 450 ℃. The width of the solder 102 is 3 to 10 mm, the height is 1 to 3 mm, and the material mainly comprises high temperature resistant ink slurry, high polymer, low melting point sintering oil, prepolymer or elastomer.

Further, before applying the organic glue to bond the solder 102 in step S102, a groove may be scribed in advance at a position on the first substrate 100 where the organic glue is to be applied, wherein the width of the groove matches the solder 102 and the depth of the groove does not exceed the thickness of the glass itself. And then, the solder 102 is bonded in the groove, so that the air tightness of the edge sealing can be ensured, and the reliability of the vacuum glass is improved.

And S104, heating the pre-sintered organic glue, the first substrate 100, the solder 102 and the transparent mesh support layer 101.

The first substrate 100 with the solder 102, the transparent mesh support layer 101 and the organic glue is heated under the conditions of low vacuum, preferably 1-10 pa, temperature of 150-250 ℃, temperature uniformity of +/-2 ℃, the organic glue starts to be gasified in the condition, and rapid air exhaust is carried out through a mechanical pump set, and the removal effect of the organic glue can reach about 85 percent in the step. At the same time, the solder 102 is sinter-fixed with the first substrate 100. The transparent mesh support layer 101 is also preliminarily pre-fixed. When heating, the multi-layer radiation mirror panel is used to concentrate the heat to the first substrate 100 after multiple reflections, so as to maintain the uniformity of the heating temperature and prevent the first substrate 100 from bursting.

And S105, aligning and pressing the first substrate and the second substrate.

And (3) carrying out high-precision alignment and lamination on the second substrate 200 and the pre-sintered first substrate 100, carrying out alignment through photoelectric control, and laminating the first substrate 100 and the second substrate 200 through a vacuum cylinder or a mechanical arm after the alignment is finished to ensure accurate alignment, wherein the position is not deviated during subsequent processing.

And S106, exhausting the ion source, and bombarding the aligned first substrate 100 and the aligned second substrate 200 by using inert gas ions under vacuum.

After the first substrate 100 and the second substrate 200 are laminated, since the organic glue is not completely removed during the pre-sintering in step S104, which affects the final vacuum degree of the vacuum glass, i.e., the product quality, the remaining organic glue needs to be removed by exhausting gas from the ion source.

Firstly, placing the first substrate 100 and the second substrate 200 after the lamination into a vacuum chamber, and vacuumizing 1 x 10^-3To 5 x 10^-3The first substrate 100 and the second substrate 200 are bombarded with ions of an inert gas, preferably argon, at a high voltage using an ion source, from which the organic glue is decomposed and carried away by the ion beam.

S107, the sintered solder 102 is vacuum-heated to connect the first substrate 100 and the second substrate 200.

And heating to 350-450 ℃ in the same vacuum cavity to melt and sinter the solder 102, sealing the first substrate 100 and the second substrate 200, and directly forming a high-vacuum-degree vacuum glass product. Because the vacuum cavity is directly heated, the first substrate 100 and the second substrate 200 are ensured to be integrally heated, the solder 102 can be well integrated with the two substrates, the vacuum maintenance and the weather resistance in the vacuum glass cavity are ensured, the substrates are not easy to break under the high-vacuum high-temperature sintering condition, and the yield is effectively improved.

Finally, the sintered product is cooled under high vacuum, so that the stress loss can be reduced, and the mechanical strength of the final product is ensured. Local cooling and stepped cooling are preferably adopted, so that the product performance can be improved.

The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.