阅读说明：本技术 电力变换装置 (Power conversion device ) 是由 阿部圭太 于 2017-06-15 设计创作，主要内容包括：实现电力变换装置的小型化。具备外壳(30)、功率模块(4)、平滑电容器(5)以及强电连接部(8)。功率模块(4)收容于外壳(30)。平滑电容器(5)通过电容器固定螺栓(54)被固定于外壳(30),用于抑制电压变动。在强电连接部(8)中,功率模块(4)与平滑电容器(5)电连接。在将通过电容器固定螺栓(54)将平滑电容器(5)固定于外壳(30)的位置设为电容器固定点(9C)时,电容器固定点(9C)配置于避开平滑电容器(5)的角落部(5a)的位置。使功率模块(4)与平滑电容器(5)在强电连接部(8)处接近。(The miniaturization of the power conversion device is realized. The power module is provided with a housing (30), a power module (4), a smoothing capacitor (5), and a strong electric connection unit (8). The power module (4) is housed in the case (30). The smoothing capacitor (5) is fixed to the case (30) by a capacitor fixing bolt (54) and suppresses voltage variation. In the high-voltage connection part (8), the power module (4) is electrically connected to the smoothing capacitor (5). When the position where the smoothing capacitor (5) is fixed to the case (30) by the capacitor fixing bolt (54) is set as a capacitor fixing point (9C), the capacitor fixing point (9C) is arranged at a position avoiding a corner portion (5a) of the smoothing capacitor (5). The power module (4) and the smoothing capacitor (5) are brought close to each other at a high-voltage connection portion (8).)

1. A power conversion device is characterized by comprising:

a housing;

a semiconductor module housed in the case;

a smoothing capacitor fixed to the case by a fixing bolt for suppressing voltage variation; and

a strong electric connection portion electrically connecting the semiconductor module and the smoothing capacitor,

wherein, when a position where the smoothing capacitor is fixed to the case by the fixing bolt is set as a capacitor fixing point, the capacitor fixing point is disposed at a position avoiding a corner portion of the smoothing capacitor,

the semiconductor module and the smoothing capacitor are brought close to each other at the high-voltage connection portion.

2. The power conversion device according to claim 1,

the smoothing capacitor is provided with a bus bar,

in the strong electrical connection portion, the bus bar is electrically connected with the semiconductor module by a fastening bolt,

the bus bar fastening point is used for both electrical connection and capacitor fixation when a position where the bus bar is fastened to the semiconductor module by the fastening bolt is used as a bus bar fastening point,

the bus bar fastening point is set as the capacitor fixing point.

3. The power conversion device according to claim 2,

the smoothing capacitor is in a square shape,

the capacitor fixing points are provided at the outer peripheral positions of the respective sides of the smoothing capacitor,

one or both of 2 of the capacitor fixing points arranged on a diagonal line are set as the bus bar fastening points.

4. The power conversion device according to any one of claims 1 to 3,

the smoothing capacitor is provided with a bus bar,

the semiconductor module has a terminal for fastening with the bus bar,

when a surface for fastening the terminal and the bus bar is a bus bar fastening surface and a surface for leading out the bus bar from the smoothing capacitor is a lead-out surface, a height position of the bus bar fastening surface is the same as a height position of the lead-out surface or a position near the height position of the lead-out surface.

5. The power conversion device according to any one of claims 2 to 4,

when a surface from which the bus bar is drawn out from the smoothing capacitor is set as a drawing surface,

the bus bar has a first bent portion extending upward from the lead-out surface in a vertical direction and bent in a horizontal direction at a midway point,

the bus bar has a second bent portion extending horizontally from the first bent portion and bent vertically downward midway,

the bus bar has a third bent portion extending in a vertical direction from the second bent portion and bent halfway in a horizontal direction on a side opposite to the first bent portion,

the bus bar extends from the third bent portion in a horizontal direction to a terminal that the semiconductor module has.

Technical Field

The present disclosure relates to a power conversion device.

Background

Conventionally, in a power converter, a semiconductor module and a capacitor are disposed at adjacent positions. The capacitor is square and fixed to the case of the power conversion device by bolts. Bolts are fastened to 4 corner portions of the capacitor (see, for example, patent document 1).

Disclosure of Invention

Problems to be solved by the invention

However, in the conventional power converter, since the 4 corner portions of the capacitor are capacitor fixing points to be fixed by bolts, a space for a tool must be provided between the semiconductor module and the capacitor. Therefore, there is a problem that the size of the power conversion device is increased and the size thereof is increased.

The present disclosure has been made in view of the above problems, and an object thereof is to achieve downsizing of a power conversion device.

Means for solving the problems

In order to achieve the above object, a power conversion device according to the present disclosure includes a case, a semiconductor module, a smoothing capacitor, and a high-power connection unit.

The semiconductor module is accommodated in the housing.

The smoothing capacitor is fixed to the case by a fixing bolt for suppressing voltage variation.

In the high-voltage connection portion, the semiconductor module is electrically connected to the smoothing capacitor.

When the capacitor fixing point is a position where the smoothing capacitor is fixed to the case by the fixing bolt, the capacitor fixing point is disposed at a position avoiding the corner portion of the smoothing capacitor.

The semiconductor module and the smoothing capacitor are brought close to each other at the high-voltage connection portion.

ADVANTAGEOUS EFFECTS OF INVENTION

In this way, the semiconductor module and the smoothing capacitor are brought close to each other at the high-voltage connection portion, whereby the power conversion device can be downsized.

Drawings

Fig. 1 is a circuit diagram of a drive system of an electric vehicle to which an inverter device of embodiment 1 is applied.

Fig. 2 is a plan view of the inverter device in embodiment 1.

Fig. 3 is a perspective view of the smoothing capacitor in embodiment 1.

Fig. 4 is a schematic cross-sectional view illustrating connection between a power module and a smoothing capacitor in embodiments 1 to 2, and is a schematic cross-sectional view of the II-II line in fig. 2, the III-III line in fig. 7, or the IV-IV line in fig. 7.

Fig. 5 is a plan view of an inverter device according to a conventional example.

Fig. 6 is a circuit diagram of a drive system of an extended range electric vehicle to which the inverter device of embodiment 2 is applied.

Fig. 7 is a plan view of an inverter device in embodiment 2.

Detailed Description

Next, a preferred embodiment of the power conversion device according to the present invention will be described based on embodiment 1 and embodiment 2 shown in the drawings.