Ultrathin uniform temperature plate and manufacturing method thereof
阅读说明：本技术 一种超薄均温板及其制造方法 (Ultrathin uniform temperature plate and manufacturing method thereof ) 是由 罗合云 梁平平 李学华 于 2019-10-16 设计创作，主要内容包括：本发明公开了一种超薄均温板,包括盖板和基板,盖板和基板相对结合形成腔室,基板位于腔室内的基材表面通过点胶固定有毛细结构,所述腔室内封装有冷媒。本发明所采用工艺方法中的毛细结构网线固定方式相比较传统点焊工艺,加工难度大大降低,操作更快捷、便利,从而可大大提升生产效率,均温板毛细结构采用胶水固定方式,不会破坏网、线的毛细结构,从而可提升均热板的热传导效率。(The invention discloses an ultrathin uniform temperature plate which comprises a cover plate and a base plate, wherein the cover plate and the base plate are oppositely combined to form a cavity, a capillary structure is fixed on the surface of a base material of the base plate in the cavity through glue dispensing, and a refrigerant is sealed in the cavity. Compared with the traditional spot welding process, the capillary structure mesh wire fixing mode in the process method has the advantages that the processing difficulty is greatly reduced, the operation is quicker and more convenient, the production efficiency can be greatly improved, the capillary structure of the uniform heating plate adopts the glue fixing mode, the capillary structure of the mesh wire and the capillary structure of the uniform heating plate cannot be damaged, and the heat conduction efficiency of the uniform heating plate can be improved.)
1. The ultrathin uniform temperature plate comprises a cover plate and a base plate, wherein the cover plate and the base plate are combined oppositely to form a cavity, a capillary structure is fixed on the surface of a base material of the base plate in the cavity through glue dispensing, and a refrigerant is packaged in the cavity.
2. The method of claim 1, further comprising inorganic glue, organic glue, water, and refrigerant.
3. The method for manufacturing an ultra-thin temperature-uniforming plate according to any one of claims 1-2, wherein the base material is one of copper material, aluminum material, stainless steel, titanium material or an alloy thereof.
4. The method of manufacturing ultra-thin vapor chamber as claimed in any one of claims 1-2, wherein the capillary structure is 3D woven metal wire, 2D woven metal mesh, foamed metal or metal powder; the metal material used by the capillary structure is copper, nickel, zinc and silver; the capillary structure can be formed by adopting the technologies of etching, laser, machining, wire drawing, sintering, printing, 3D printing and the like.
5. A manufacturing method of an ultrathin uniform temperature plate comprises the following steps:
dispensing, namely dispensing the glue on the base material according to a set path;
bonding and fixing, namely fixing the capillary structure on the substrate according to the glue direction and firmly pressing, and fixing the capillary structure on the substrate through glue spreading;
sintering, namely placing the base material with the capillary structure after fixation on a sintering jig for high-temperature sintering;
combining, namely covering the upper surface of the sintered substrate fixed with the capillary structure with a cover plate, and packaging the edge of the sintered substrate;
injecting refrigerant, degassing, and packaging.
6. The method for manufacturing an ultrathin uniform temperature plate as claimed in claim 5, wherein the dispensing step adopts manual dispensing or automatic dispensing machine, and the automatic dispensing machine is a dispensing robot.
7. The method for manufacturing ultra-thin uniform temperature plate as claimed in claim 5, inorganic glue, organic glue, water, and refrigerant medium.
8. The method for manufacturing an ultra-thin temperature-uniforming plate according to claim 5, wherein the base material is one of copper material, aluminum material, stainless steel, titanium material or alloy thereof.
9. The method for manufacturing the ultra-thin vapor chamber as claimed in claim 5, wherein the capillary structure is 3D braided metal wire, 2D braided metal mesh, foam metal or metal powder; the metal material used by the capillary structure is copper, nickel, zinc and silver; the capillary structure can be formed by adopting the technologies of etching, laser, machining, wire drawing, sintering, printing, 3D printing and the like.
Technical Field
The invention belongs to the field of heat pipe temperature-equalizing plates, and particularly relates to a manufacturing process of an ultrathin temperature-equalizing plate.
Background
With the advance of science and technology, the current electronic products are developed towards high functionality, high efficiency, and light weight, especially, 5G is the future development trend in the field of consumer electronics, and the power consumption of the chip is much higher than that of a 4G chip while the computing power of the chip is significantly improved, so that the demand of the consumer electronics for heat dissipation in the future will be more intense. The power consumption of the chip is increased, so that the heat generated in a unit area is greatly increased, and how to quickly disperse the heat of the chip is always a difficult point and bottleneck in the industry. Therefore, the super heat conductive material and the heat dissipation material for rapidly conducting the heat of the chip need to be continuously improved to solve the problem of heat dissipation of the chip, so as to promote the continuous development of technology.
The temperature equalizing plate has the advantages of light weight, high heat conduction, high reliability, no maintenance, no noise and the like, and is a recyclable green and environment-friendly technology. Compared with the conventional copper sheet or aluminum sheet, the heat conductivity coefficient of the temperature-uniforming plate is more than 10 times, and the high heat conductivity of the temperature-uniforming plate is very suitable for heat dissipation of a concentrated heat source. At present, the manufacturing process of the ultrathin uniform temperature plate is complex, the process from feeding to a finished product needs to be carried out through 20 large and small processes, and particularly, the process of placing a copper wire net and a copper wire in a capillary structure by the ultrathin uniform temperature plate is very small in copper wire net and wire, thin and easy to bend, the copper wire net is placed in a cover plate and is difficult to fix, and the traditional process comprises the following steps: copper plate etching, copper mesh, wire spot welding, copper mesh, wire sintering, upper cover and lower cover brazing, rat tail welding, water injection, first removing, second removing, testing and packaging, the traditional VC adopts the spot welding mode and the like, the efficiency is low, in addition, the mesh and the wire need to be spot welded on the copper plate at high temperature in the spot welding process, the capillary structure is easy to damage by high-temperature welding, the capillary capacity of the capillary structure is reduced, and the heat transfer efficiency of the uniform temperature plate is greatly reduced.
Disclosure of Invention
In order to solve the technical problems, the invention provides the following technical scheme:
the ultrathin uniform temperature plate comprises a cover plate and a base plate, wherein the cover plate and the base plate are combined oppositely to form a cavity, a capillary structure is fixed on the surface of a base material of the base plate in the cavity through glue dispensing, and a refrigerant is packaged in the cavity.
A manufacturing method of an ultrathin uniform temperature plate comprises the following steps:
dispensing, namely dispensing the glue on the base material according to a set path;
bonding and fixing, namely fixing the capillary structure on the substrate according to the glue direction and firmly pressing, and fixing the capillary structure on the substrate through glue spreading;
sintering, namely placing the fixed capillary structure on a sintering jig for high-temperature sintering;
combining, namely covering the upper surface of the sintered substrate fixed with the capillary structure with a cover plate, and packaging the edge of the sintered substrate;
injecting refrigerant, degassing, and packaging.
The dispensing step adopts manual dispensing or an automatic dispensing machine, and the automatic dispensing machine is a dispensing robot.
Wherein the glue is inorganic glue, organic glue, water and refrigerant medium.
Wherein, the base material is one of copper material, aluminum material, stainless steel and titanium material or alloy thereof.
The capillary structure is a 3D braided metal wire, a 2D braided metal net, foam metal or metal powder; the metal material used by the capillary structure is copper, nickel, zinc and silver; the capillary structure can be formed by adopting the technologies of etching, laser, machining, wire drawing, sintering, printing, 3D printing and the like.
The injection coolant can adopt a mode that the surface of the upper cover is provided with a water injection hole and the working fluid is injected through the water injection hole, or a water injection port structure communicated with the inner cavity is processed and arranged on the edge of the upper cover and/or the substrate and the working fluid is injected into the cavity through the water injection port structure.
The invention has the beneficial effects that:
compared with the traditional spot welding process, the ultra-thin temperature-uniforming plate capillary structure network wire fixing mode in the process method has the advantages that the processing difficulty is greatly reduced, the operation is quicker and more convenient, the production efficiency can be greatly improved, and the efficiency is improved by 20% compared with the traditional mode; the capillary structure of the vapor chamber adopts a glue fixing mode, the capillary structures of the net and the wire cannot be damaged, and therefore the heat conduction efficiency of the vapor chamber can be improved by more than 10%.
Drawings
FIG. 1 is a schematic structural view of an ultra-thin vapor chamber capillary structure of the present invention in an unassembled state;
FIG. 2 is a schematic structural view of an ultrathin vapor chamber in a state of attachment of a capillary structure;
FIG. 3 is a flow chart of the steps of the method for manufacturing the ultra-thin vapor chamber of the present invention.
Wherein the reference numerals are as follows:
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating some embodiments of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
FIGS. 1-2 schematically illustrate an ultra-thin vapor chamber and method of assembling the same according to the present invention. FIG. 1 is a schematic structural view of an ultra-thin vapor chamber capillary structure of the present invention in an unassembled state; FIG. 2 is a schematic structural diagram of the ultrathin vapor chamber capillary structure of the present invention in a state of being attached to the surface of a substrate. As shown in fig. 1, the ultrathin uniform temperature plate comprises an
Fig. 3 shows a manufacturing method of the ultrathin uniform temperature plate, which comprises the steps of etching a copper plate to process a substrate, providing a
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "both ends", "both sides", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the elements referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the present invention.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
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