阅读说明：本技术 一种测温处理方法、装置及热成像设备 (Temperature measurement processing method and device and thermal imaging equipment ) 是由 凌振萍 于 2018-07-27 设计创作，主要内容包括：本发明提供一种测温处理方法、装置及热成像设备,该测温处理方法,应用于图像设备,包括：确定从可见光图像映射至热成像图像的映射关系,所述可见光图像为所述设备通过可见光通道采集的,所述热成像图像为所述设备通过热成像通道采集的；按照所述映射关系将可见光图像中被选中的目标对象的选中特征从所述可见光图像中映射至热成像图像；依据指定偏移参数调整已映射至热成像图像的选中特征在所述热成像图像中的位置,以使所述选中特征选中所述热成像图像中的所述目标对象；对所述热成像图像中所述选中特征选中的目标对象进行测温。防止误选中外形相似的对象。(The invention provides a temperature measurement processing method, a temperature measurement processing device and thermal imaging equipment, wherein the temperature measurement processing method is applied to image equipment and comprises the following steps: determining a mapping relationship from a visible light image to a thermography image, the visible light image being acquired by the device through a visible light channel, the thermography image being acquired by the device through a thermography channel; mapping the selected characteristics of the selected target object in the visible light image to the thermal imaging image from the visible light image according to the mapping relation; adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to a specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature; and measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image. And objects with similar shapes in the Chinese language are prevented from being selected by mistake.)

1. A temperature measurement processing method is applied to an image device, and comprises the following steps:

determining a mapping relationship from a visible light image to a thermography image, the visible light image being acquired by the device through a visible light channel, the thermography image being acquired by the device through a thermography channel;

mapping the selected characteristics of the selected target object in the visible light image to the thermal imaging image from the visible light image according to the mapping relation;

adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to a specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature;

and measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

2. The temperature measurement processing method of claim 1, wherein the mapping relationship comprises at least: mapping the visible light image to a specified coordinate mapping relation of the thermal imaging image, and specifying a scaling parameter;

the mapping of the selected features of the selected target object in the visible light image from the visible light image to the thermography image according to the mapping relationship comprises:

scaling the visible light image according to a designated scaling parameter so that a scaled target object in the visible light image has the same size as a target object in the thermal imaging image selected by the selected feature which is mapped into the thermal imaging image and subjected to position adjustment;

mapping the selected features of the scaled target object in the visible light image to the thermal imaging image according to the specified coordinate mapping relationship.

3. The thermometry process of claim 1, wherein the specified offset parameter is a preconfigured offset parameter or a sum of a preconfigured offset parameter and a trained specified fine tuning offset.

4. The thermometric processing method of claim 1, wherein the field of view of the visible light channel is greater than the field of view of the thermal imaging channel.

5. The temperature measurement processing method according to claim 1, further comprising:

and displaying the measured temperature data of the target object in the visible light image.

6. A temperature measurement processing apparatus applied to an image device includes:

a mapping relationship determining module, configured to determine a mapping relationship from a visible light image to a thermal imaging image, where the visible light image is acquired by the device through a visible light channel, and the thermal imaging image is acquired by the device through a thermal imaging channel;

the selected feature mapping module is used for mapping the selected features of the selected target objects in the visible light image to the thermal imaging image from the visible light image according to the mapping relation;

the position offset adjusting module is used for adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to the specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature;

and the target object temperature measurement module is used for measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

7. A thermal imaging apparatus comprising: the infrared focal plane detector comprises an uncooled infrared focal plane detector, a visible light sensor, a first lens set, a second lens set, at least one processor and a memory, wherein the first lens set is assembled on the uncooled infrared focal plane detector, the second lens set is assembled on the visible light sensor,

the uncooled infrared focal plane detector is used for collecting thermal imaging images; the visible light sensor is used for collecting a visible light image;

the memory is stored with a mapping relation table of mapping relation from the visible light image to the thermal imaging image and a program which can be called by the processor;

when the processor executes the program, the following steps are realized:

reading the mapping relation in the mapping relation table in the memory;

mapping the selected characteristics of the selected target object in the visible light image to the thermal imaging image from the visible light image according to the mapping relation;

adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to a specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature;

and measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

Technical Field

The invention relates to the technical field of temperature measurement, in particular to a temperature measurement processing method and device and thermal imaging equipment.

Background

In an image device integrating a visible light imaging channel and a thermal imaging channel, a temperature measurement configuration and a temperature display function are usually realized through the thermal imaging channel, and the configuration and the realization of the temperature measurement function are realized through the thermal imaging configuration and the display.

Since the resolution of the thermal image is low, typically 384 × 288(384 × 288 represents the image pixels of the thermal infrared imager, 384 pixels in the horizontal direction and 288 pixels in the vertical direction) or 640 × 512, when an object with a shape comparable to the temperature is captured in the thermal image, it is clear that the object is different and the human eye cannot distinguish the object from the thermal image, and the image lacks details, and the image based on the pseudo-color mode cannot distinguish the object. For example, if the switch and the transformer are captured in the thermal imaging image, and if the shape of the switch and the shape of the transformer are similar in the image and the temperatures of the switch and the transformer are similar in the image, it is impossible to distinguish which switch and which transformer are in the thermal imaging image.

Therefore, the current dual-channel thermal imaging device has the following technical problems: due to the lack of detail in the thermal imaging image, objects in the image are difficult to distinguish, and when a target object is selected for temperature measurement, objects with similar shapes in the image are often selected by mistake.

Disclosure of Invention

In view of the above, the present invention provides a temperature measurement processing method, a temperature measurement processing apparatus, and a thermal imaging device, which prevent the object with similar appearance from being mistakenly selected.

The first aspect of the present invention provides a temperature measurement processing method applied to an image device, including:

determining a mapping relationship from a visible light image to a thermography image, the visible light image being acquired by the device through a visible light channel, the thermography image being acquired by the device through a thermography channel;

mapping the selected characteristics of the selected target object in the visible light image to the thermal imaging image from the visible light image according to the mapping relation;

adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to a specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature;

and measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

According to an embodiment of the present invention, the mapping relationship includes at least: mapping the visible light image to a specified coordinate mapping relation of the thermal imaging image, and specifying a scaling parameter;

the mapping of the selected features of the selected target object in the visible light image from the visible light image to the thermography image according to the mapping relationship comprises:

scaling the visible light image according to a designated scaling parameter so that a scaled target object in the visible light image has the same size as a target object in the thermal imaging image selected by the selected feature which is mapped into the thermal imaging image and subjected to position adjustment;

mapping the selected features of the scaled target object in the visible light image to the thermal imaging image according to the specified coordinate mapping relationship.

According to an embodiment of the invention, the specified offset parameter is a preconfigured offset parameter or a sum of a preconfigured offset parameter and a trained specified fine tuning offset.

According to one embodiment of the invention, the field angle of the visible light channel is larger than the field angle of the thermal imaging channel.

According to an embodiment of the invention, the method further comprises:

and displaying the measured temperature data of the target object in the visible light image.

The second aspect of the present invention provides a temperature measurement processing apparatus applied to an image device, including:

a mapping relationship determining module, configured to determine a mapping relationship from a visible light image to a thermal imaging image, where the visible light image is acquired by the device through a visible light channel, and the thermal imaging image is acquired by the device through a thermal imaging channel;

the selected feature mapping module is used for mapping the selected features of the selected target objects in the visible light image to the thermal imaging image from the visible light image according to the mapping relation;

the position offset adjusting module is used for adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to the specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature;

and the target object temperature measurement module is used for measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

A third aspect of the present invention provides a thermal imaging apparatus comprising: the infrared focal plane detector comprises an uncooled infrared focal plane detector, a visible light sensor, a first lens set, a second lens set, at least one processor and a memory, wherein the first lens set is assembled on the uncooled infrared focal plane detector, the second lens set is assembled on the visible light sensor,

the uncooled infrared focal plane detector is used for collecting thermal imaging images; the visible light sensor is used for collecting a visible light image;

the memory is stored with a mapping relation table of mapping relation from the visible light image to the thermal imaging image and a program which can be called by the processor;

when the processor executes the program, the following steps are realized:

reading the mapping relation in the mapping relation table in the memory;

mapping the selected characteristics of the selected target object in the visible light image to the thermal imaging image from the visible light image according to the mapping relation;

adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to a specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature;

and measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

The embodiment of the invention has the following beneficial effects: the method comprises the steps of mapping selected features of a selected target object in a visible light image into a thermal imaging image through a mapping relation, adjusting the position of the selected features mapped in the thermal imaging image according to specified offset parameters, enabling the selected features to select a corresponding target object in the thermal imaging image, measuring temperature of the target object in the thermal imaging image, and not needing to directly select the target object from the thermal imaging image.

Drawings

FIG. 1 is a schematic flow chart of a thermometry process provided in an exemplary embodiment;

FIG. 2 is a block diagram of a thermometry processing apparatus according to an exemplary embodiment;

FIG. 3 is a schematic diagram illustrating a relationship between a visible horizontal viewing angle and a thermal imaging horizontal viewing angle provided by an exemplary embodiment;

FIG. 4 is a schematic flow chart illustrating a method for thermometry according to another exemplary embodiment;

FIG. 5 is a block diagram of a thermometry processing apparatus according to another exemplary embodiment;

fig. 6 is a block diagram of a thermal imaging apparatus according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present invention. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

In this embodiment of the present invention, an execution main body of the temperature measurement processing method may be an image device, some used parameters are preset, and may be stored in the image device, for example, stored in a nonvolatile memory of the image device, and may be called when used. It will be appreciated that the determination of these parameters is likewise inventively labor intensive.

The preconfigured offset parameter may be determined by:

after the training object which is scaled according to the designated scaling parameter in the visible light image is mapped to the thermal imaging image through the designated coordinate mapping relation, the position of the training object which is mapped to the thermal imaging image is adjusted, so that the positions of the training object which is mapped in the thermal imaging image and the existing training object in the thermal imaging image are overlapped, and the position adjustment amount is determined as the preconfigured offset parameter.

The specified fine tuning offset may be determined by:

the method comprises the steps of mapping a training object which is scaled according to a designated scaling parameter in a visible light image to a thermal imaging image through a designated coordinate mapping relation, adjusting the position of the training object which is mapped to the thermal imaging image according to a preset offset parameter, then finely adjusting the current position offset of the training object which is mapped to the thermal imaging image so as to enable the positions of the training object which is mapped to the thermal imaging image to be coincident with the position of the training object which is mapped to the thermal imaging image, and determining the current position fine adjustment amount as the designated fine adjustment offset.

Specifying a scaling parameter may be determined by:

and comparing the sizes of the training object in the visible light image and the training object existing in the thermal imaging image, adjusting the scaling of the visible light image to enable the sizes of the training object in the visible light image and the training object existing in the thermal imaging image to be the same, and determining the scaling adjustment amount as the specified scaling parameter.

The preconfigured offset parameter and the specified scaling parameter may be configured together at the time of factory shipment, and specifically, the preconfigured offset parameter and the specified scaling parameter are configured as follows:

firstly, arranging image equipment at a position where the distance from an object for configuration is the optimal observation distance;

then, images are respectively collected through a visible light channel and a thermal imaging image channel of the image equipment, and the obtained visible light image and the thermal imaging image contain imaging objects of objects for configuration, which are referred to as training objects for short;

secondly, comparing the sizes of the training objects in the visible light image and the existing training objects in the thermal imaging image, scaling the visible light image until the sizes of the training objects in the visible light image and the training objects in the thermal imaging image are the same, wherein the sizes of the training objects are the same, namely the number of pixels contained in the training objects is consistent, and determining the corresponding scaling amount as a specified scaling parameter; it can be understood that the determination of the designated scaling parameter can be completed by using a plurality of frames of visible light images and corresponding thermal imaging images acquired in real time, and certainly can also be determined by using one frame of visible light image and corresponding thermal imaging image;

after the appointed scaling parameter is determined, scaling the visible light image according to the appointed scaling, and mapping the training object scaled according to the appointed scaling parameter in the visible light image to the thermal imaging image through an appointed coordinate mapping relation; the designated coordinate mapping relation is also pre-configured, is a predicted coordinate mapping relation from the zoomed visible light image to the thermal imaging image, and a training object mapped in the thermal imaging image may have a deviation with an existing training object;

and then, comparing the positions of the training object which is scaled and mapped to the thermal imaging image with the positions of the existing training objects in the thermal imaging image, adjusting the positions of the training object mapped in the thermal imaging image and the positions of the existing training objects in the thermal imaging image to be overlapped, and determining the position adjustment amount as a pre-configured offset parameter. It is understood that adjusting the positional offset may also be accomplished using multiple frames of visible light images and thermographic images acquired in real time.

Of course, when performing the size comparison and scaling, the image region obtained by intercepting the training object which may also be the visible light image and the existing training object in the thermal imaging image (abbreviated as screenshot, the intercepted image region may be determined by selecting a plurality of feature point connecting lines on the training object), and the scaling of the visible light image may be determined according to the number of pixels in the two screenshots, so that after the visible light image is scaled, the number of pixels in the two screenshots is the same, that is, the number of pixels included in the training objects of the two screenshots is the same.

If the same training objects occupy the same number of pixels, when the training objects of the visible light image are mapped to the thermal imaging image, the pre-configured offset parameters can be determined by comparing whether the training objects are overlapped and adjusting the offset in the horizontal and vertical directions so that the two training objects are aligned.

The image device is set at a position where the distance from the object for arrangement is the optimum observation distance. The optimal observation distance can be the common observation distance of the image equipment, and the problem that each preset point needs to be registered is solved by using the pre-configured offset parameter and the specified scaling parameter under the common observation distance, so that the operation time is saved, and the efficiency is improved.

It will be appreciated that the images acquired during the configuration of the pre-configured offset parameter and the specified scaling parameter are acquired at different times than the images during the thermometry process.

Under the condition of different object distances, the mapping relation of the visible light image to the corresponding thermal imaging image has offset, so that the fine adjustment of the actual offset is required on the basis of the preconfigured offset parameter.

The specified fine tuning offset may be trained and determined when the image device is placed at a preset point for performing temperature measurement on the target object, and at this time, a pre-configured offset parameter and a specified scaling parameter are preset, specifically, a training process of the fine tuning offset is specified as follows:

aiming at a target object, acquiring a visible light image and a corresponding thermal imaging image by an image device, wherein the visible light image and the corresponding thermal imaging image comprise training objects obtained by respectively imaging the target object, and the position relation (object distance) of the image device relative to the target object can be used when the image device carries out temperature measurement processing, and the target object can be replaced by other objects;

secondly, scaling the visible light image according to a designated scaling ratio, and mapping the training object scaled according to designated scaling ratio parameters in the visible light image to the thermal imaging image through a designated coordinate mapping relation;

then, adjusting the position of the training object mapped to the thermal imaging image according to the pre-configured offset parameter, completing coarse adjustment of the position offset, and needing to fine-adjust the current position offset of the training object mapped to the thermal imaging image;

then, after the position deviation of the training object mapped into the thermal imaging image is roughly adjusted, the positions of the training object mapped into the thermal imaging image and the existing training object in the thermal imaging image are compared, the training object mapped into the thermal imaging image is adjusted to be overlapped with the existing position of the training object in the thermal imaging image, and the current position fine adjustment amount is determined as the specified fine adjustment deviation amount.

Under the scene of different object distances, the current offset is considered when the coordinate mapping relation is determined, and the problem that the registration parameters can not be accurately registered due to different offset under different object distances is solved. Because the data of the current offset can be stored, the current offset can be called in the subsequent temperature measurement process of the same preset point scene, and the step of determining the current offset does not need to be repeated.

It can be understood that the images acquired during the training process with the specified fine tuning offset are acquired at different times than the images acquired during the thermometry process, or the images acquired during the configuration process with the preconfigured offset parameter and the specified scaling parameter.

The pre-configured offset parameter and the designated fine tuning offset can be respectively stored in the image equipment, and when the temperature measurement processing is required subsequently, the pre-configured offset parameter and the designated fine tuning offset are called to be superposed and then are used as the designated offset parameter; or, the pre-configured offset parameter and the specified fine tuning offset may be superimposed first and then stored in the image device as the specified offset parameter, and then directly called and used subsequently.

The offset may include a horizontal offset and/or a vertical offset of the image. The superposition or summation of the preconfigured offset parameter and the specified fine tuning offset is directional, being a vector summation, e.g. with positive and negative directions in the horizontal direction and positive and negative directions in the vertical direction.

The following describes the temperature measurement processing method according to the embodiment of the present invention more specifically, but not limited thereto.

In one embodiment, referring to fig. 1, a thermometry process may include:

s100: determining a mapping relationship from a visible light image to a thermography image, the visible light image being acquired by the device through a visible light channel, the thermography image being acquired by the device through a thermography channel;

s200: mapping the selected characteristics of the selected target object in the visible light image to the thermal imaging image from the visible light image according to the mapping relation;

s300: adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to a specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature;

s400: and measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

The temperature measurement processing method can be applied to image equipment which comprises a visible light channel and a thermal imaging channel, wherein the visible light channel and the thermal imaging channel can be used for carrying out image acquisition on the same object so as to correspondingly obtain a visible light image and a thermal imaging image.

Specifically, the image device may be a thermal image device, and may include: the system comprises an uncooled infrared focal plane detector, a visible light sensor, a first lens set, a second lens set, at least one processor and a memory, wherein the first lens set is assembled on the uncooled infrared focal plane detector, the second lens set is assembled on the visible light sensor, and the uncooled infrared focal plane detector is used for collecting thermal imaging images; the visible light sensor is used for collecting a visible light image; the memory stores a mapping relation table of a mapping relation from a visible light image to a thermal imaging image and a program which can be called by the processor, and the processor realizes steps S100 to S400 when executing the program. Due to the close physical proximity of the uncooled infrared focal plane detector and the visible light sensor, generally speaking, the same object will be present in the visible light image collected by the visible light channel and the thermal image collected by the thermal image channel.

In step S100, a mapping relationship from the visible light image to the thermal imaging image is determined. The visible light image is collected by the image equipment through the visible light channel, and the thermal imaging image is collected by the image equipment through the thermal imaging channel.

In the visible light image and the thermal imaging image acquired by the image device through the visible light channel and the thermal imaging channel, the same target object exists, and it is certainly possible that the target object is displayed more clearly and completely in the visible light image and is displayed in the thermal imaging image in a blurred and incomplete manner. The visible light image and the thermal imaging image can be acquired at the same time, and of course, the visible light image and the thermal imaging image can also be acquired at different times, and preferably, when the visible light image and the thermal imaging image are acquired, the position relation between a target object corresponding to the target object and the image equipment is kept unchanged.

The determined mapping relationship may be a conversion relationship between an imaging coordinate system of the visible light image and an imaging coordinate system of the thermal imaging image, and the specific determination manner is not limited, so that the visible light image can be mapped to the thermal imaging image, that is, image features (an imaging object or selected features and the like) in the visible light image can be mapped to the thermal imaging image.

And step S200 is executed, and the selected characteristic of the selected target object in the visible light image is mapped to the thermal imaging image from the visible light image according to the mapping relation.

Since the resolution of the visible light image is higher compared to the thermographic image, the selection of the target object in the visible light image is easier and less prone to errors. The selected features for selecting the target object in the visible light image are directly configured in the visible light channel, but not directly configured in the thermal imaging channel, so that the wrong object can be prevented from being selected.

The shape of the selected feature in the image may be a frame shape, for example, when the target object is a switch object, the selected feature may select the frame of the switch object in the visible light image, and the frame shape does not need to be exactly the same as the shape of the switch, as long as the switch object can be obviously selected. Alternatively, the selected feature may be a dot shape or the like, and is not particularly limited as long as a desired target object can be selected. Selected features are configured in the visible image collected in the visible channel, but thermometry is still done in the thermal imaging channel.

The selected feature may be a marker that can select a target object in the visible light image, the selection may be performed by manual identification or image identification, and may be presented in the visible light image, the position in the visible light image after the selection is determined, and the selected feature may be mapped to the thermal imaging image according to the mapping relationship, and similarly, the mapped selected feature may also be presented in the thermal imaging image, and the machine may identify and locate the corresponding position.

Then, step S300 is executed to adjust the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to the specified offset parameter, so that the target object in the thermal imaging image is selected by the selected feature.

The specified offset parameter may be invoked from the image device and indicates an offset between the object mapped to the thermographic image and a corresponding existing object in the thermographic image, so that when the selected feature in the visible light image is mapped to the thermographic image, the selected feature mapped to the thermographic image may be adjusted to the position of the target object in the selected thermographic image by adjusting the selected feature mapped to the thermographic image according to the specified offset parameter.

And then executing step S400, and measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

Because the selected feature mapped to the thermographic image has selected the target object in the thermographic image, the temperature of the target object may be measured. The temperature measurement mode may be an existing temperature measurement mode in the thermal imaging channel, and is not described herein again.

The method comprises the steps of mapping selected features of a selected target object in a visible light image into a thermal imaging image from the visible light image through a mapping relation, adjusting the positions of the selected features mapped in the thermal imaging image according to specified offset parameters, and enabling the selected features to select a corresponding target object in the thermal imaging image, so that temperature measurement can be conducted on the target object in the thermal imaging image, the target object does not need to be directly selected from the thermal imaging image, the target object is selected more easily and accurately due to the fact that the resolution of the visible light image is higher, and the problem that temperature measurement can be conducted on the selected object with the similar shape due to the fact that the target object in the thermal imaging image is fuzzy is solved.

In an embodiment, the above method flow can be executed by the temperature measurement processing apparatus 10, as shown in fig. 2, the image processing apparatus 10 mainly includes 4 modules: a mapping relation determination module 100, a selected feature mapping module 200, a position offset adjustment module 300 and a target object temperature measurement module 400. The first mapping relationship determining module 100 is configured to perform the step S100, the selected feature mapping module 200 is configured to perform the step S200, the position deviation adjusting module 300 is configured to perform the step S300, and the target object temperature measuring module 400 is configured to perform the step S400.

In one embodiment, the mapping relationship includes at least: the visible light image is mapped to the specified coordinate mapping relation of the thermal imaging image, and the scaling parameter is specified.

The mapping of the selected features of the selected target object in the visible light image from the visible light image to the thermography image according to the mapping relationship in step S200 includes the following steps:

s201: scaling the visible light image according to a designated scaling parameter so that a scaled target object in the visible light image has the same size as a target object in the thermal imaging image selected by the selected feature which is mapped into the thermal imaging image and subjected to position adjustment;

s202: mapping the selected features of the scaled target object in the visible light image to the thermal imaging image according to the specified coordinate mapping relationship.

In step S201, the designated scaling parameter is a scaling parameter for instructing the object of the visible light image to adjust to the same size as the corresponding object in the thermal imaging image, and the visible light image is scaled according to the designated scaling parameter, that is, the target object and the selected feature in the visible light image are scaled, so that the scaled target object in the visible light image and the target object in the thermal imaging image selected by the selected feature mapped to the thermal imaging image and subjected to position adjustment have the same size.

For example, the specified zoom ratio parameter indicates that the light image needs to be zoomed out by m times, and the target object and the selected feature are also zoomed out by m times. For details, reference may be made to the foregoing description for specifying the scaling parameter, and details will not be described herein.

And step S202 is executed, after the visible light image is zoomed, the selected feature of the zoomed target object is mapped to the thermal imaging image according to the specified coordinate mapping relation. And mapping the scaled selected features into the thermal imaging image, so that the size consistency of the selected features mapped to the thermal imaging image and the existing selected features in the thermal imaging image is ensured, and the situation that other objects or local parts of target objects are not selected in the thermal imaging image by the selected features is avoided.

After the mapping of step S202 is completed, the position of the selected feature in the thermographic image that has been mapped to the thermographic image may be adjusted according to the specified offset parameter. For example, if the specified offset parameter indicates that the object mapped to the thermal imaging image should be horizontally shifted to the right by n pixel points, then the selected feature mapped to the thermal imaging image is horizontally shifted to the right by n pixel points.

Optionally, the specified offset parameter is a preconfigured offset parameter or a sum of the preconfigured offset parameter and a trained specified fine tuning offset.

The pre-configured offset parameter can be configured when leaving a factory, and when the temperature measurement is performed, if the scene is consistent with the registration scene of the registration parameter, the pre-configured offset parameter can be directly adopted to adjust the position offset of the visible light image mapped to the thermal imaging image.

However, in different object distance scenes, the required horizontal and vertical pixel offsets after mapping are different, so that based on different object distance scenes, the position offset of the visible light image mapped to the thermal imaging image can be adjusted by adopting the sum of the preconfigured offset parameter and the trained specified fine tuning offset, and the specified fine tuning offset indicates the required fine tuning offset after the visible light image in the current object distance scene is mapped to the thermal imaging image and the position is adjusted according to the preconfigured offset parameter, so that the target object is selected more accurately by the selected feature mapped to the thermal imaging image.

For details, reference may be made to the above-mentioned contents related to the preconfigured offset parameter, the specified fine tuning offset and the specified offset parameter, which are not described herein again.

Referring to fig. 3, since the optical axes of the visible light channel and the thermal imaging channel are not completely coincident, the uncooled infrared focal plane detector and the visible light sensor have a certain distance D in the horizontal distance, which results in a "vacuum region" between the optical axes of the visible light channel and the thermal imaging channel and at the right side of the optical axis of the thermal imaging channel, that is, the distance not observed by all of the two channels, such as distance X and distance Y in fig. 3:

Y＝D*sin(90°-b/2)*sin(90°-a/2)/sin(a/2+b/2)；

X＝D*tan(90°-b/2)*tan(90°-a/2)/(tan((90°-b/2)-tan((90°-a/2))；

wherein, a is the horizontal visual angle of the visible light channel, and b is the horizontal visual angle of the thermal imaging channel.

In order to allow the visible light field angle to cover the thermal imaging field angle, but at the same time keep the target seen by the visible light sensor as many pixels as possible, in one embodiment the field angle of the visible light channel is larger than the field angle of the thermal imaging channel. In other words, during the thermometry process, when the visible light image and the thermal imaging image are collected, the field angle of the visible light channel is adjusted to be larger than the field angle of the thermal imaging channel.

The reason why the viewing angle of the visible light channel is not adjusted to be equal to the viewing angle of the thermal imaging channel is that, according to the legend analysis of fig. 3, it is known that the optical axes of the visible light channel and the thermal imaging channel are different by a certain distance, and if the viewing angles (the vertical viewing angle and the horizontal viewing angle are related) of the visible light channel and the thermal imaging channel are set to be equal, the horizontal viewing angles of the two channels are the same in size and are staggered, so that the "vacuum area" is large, and therefore, the viewing angle of the visible light channel is adjusted to be larger than the viewing angle of the thermal imaging channel.

Since the resolution of the visible light image is 1080P (1920 × 1080 resolution is achieved in the progressive scanning), the resolution of the thermal imaging image is 384 × 288 or 640 × 512, and thus, the horizontal field angle and the vertical field angle ratio of the two are not consistent. It is sufficient to adjust the vertical field angle of the visible light channel to be larger than the thermal imaging field angle. The visible light channel is usually variable in magnification, the visual angle of visible light can be adjusted to be larger than that of thermal imaging, and the visible light image collected by the visible light channel is ensured to contain the object in the thermal imaging image collected by the thermal imaging channel.

In one embodiment, referring to fig. 4, the thermometry processing method may further comprise the steps of:

s500: and displaying the measured temperature data of the target object in the visible light image.

Step S500 may be executed after step S400, and after the target object is selected in the thermal imaging image by the selected feature mapped in the thermal imaging image, temperature measurement calculation may be performed on the target object to obtain corresponding temperature data, and the temperature data is displayed in the visible light image, so that the temperature data is displayed in the visible light image. The measured temperature data of the target object and the selected feature for selecting the target object can be displayed in the visible light image together, so that the target object selected by the temperature data and the selected feature can be correspondingly displayed in the visible light image, the temperature display is realized, and the observation by a user is facilitated.

In one embodiment, referring to fig. 5, the thermometry processing apparatus 10 may further include a temperature data display module 500, and the step S500 may be implemented by the temperature data display module 500.

The following describes the temperature measurement processing apparatus according to the embodiment of the present invention, but the present invention is not limited thereto.

In one embodiment, referring to fig. 2, a thermometry processing apparatus 10, for use in an imaging device, the apparatus 10 may comprise:

a mapping relation determining module 100, configured to determine a mapping relation from a visible light image to a thermal imaging image, where the visible light image is acquired by the device through a visible light channel, and the thermal imaging image is acquired by the device through a thermal imaging channel;

a selected feature mapping module 200, configured to map selected features of a selected target object in a visible light image from the visible light image to a thermal imaging image according to the mapping relationship;

a position offset adjustment module 300, configured to adjust a position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to a specified offset parameter, so that the target object in the thermal imaging image is selected by the selected feature;

and the target object temperature measurement module 400 is configured to measure the temperature of the target object selected by the selected features in the thermal imaging image.

In one embodiment, the mapping relationship includes at least: mapping the visible light image to a specified coordinate mapping relation of the thermal imaging image, and specifying a scaling parameter;

the selected feature mapping module 200 includes:

the scaling unit is used for scaling the visible light image according to a designated scaling parameter so that a scaled target object in the visible light image and a target object in the thermal imaging image selected by the selected feature which is mapped into the thermal imaging image and subjected to position adjustment have the same size;

a coordinate mapping unit, configured to map the selected feature of the scaled target object in the visible light image to the thermal imaging image according to the specified coordinate mapping relationship.

In one embodiment, the specified offset parameter is a preconfigured offset parameter or a sum of a preconfigured offset parameter and a trained specified fine tuning offset.

In one embodiment, the field of view of the visible light channel is greater than the field of view of the thermal imaging channel.

In one embodiment, referring to fig. 5, the apparatus 10 may further comprise:

and a temperature data display module 500, configured to display the measured temperature data of the target object in the visible light image.

The implementation process of the functions and actions of each unit in the above device is specifically described in the implementation process of the corresponding step in the above method, and is not described herein again.

For the device embodiments, since they substantially correspond to the method embodiments, reference may be made to the partial description of the method embodiments for relevant points. The above-described embodiments of the apparatus are merely illustrative, wherein the units described as separate parts may or may not be physically separate, and the parts shown as units may or may not be physical units.

The present invention also provides a thermal imaging apparatus comprising: the infrared focal plane detector comprises an uncooled infrared focal plane detector, a visible light sensor, a first lens set, a second lens set, at least one processor and a memory, wherein the first lens set is assembled on the uncooled infrared focal plane detector, the second lens set is assembled on the visible light sensor,

the uncooled infrared focal plane detector is used for collecting thermal imaging images; the visible light sensor is used for collecting a visible light image;

the memory is stored with a mapping relation table of mapping relation from the visible light image to the thermal imaging image and a program which can be called by the processor;

when the processor executes the program, the following steps are realized:

reading the mapping relation in the mapping relation table in the memory;

mapping the selected characteristics of the selected target object in the visible light image to the thermal imaging image from the visible light image according to the mapping relation;

adjusting the position of the selected feature mapped to the thermal imaging image in the thermal imaging image according to a specified offset parameter so that the target object in the thermal imaging image is selected by the selected feature;

and measuring the temperature of the target object selected by the selected characteristics in the thermal imaging image.

The embodiment of the temperature measurement processing device can be applied to thermal imaging equipment. Taking a software implementation as an example, as a logical device, the device is formed by reading a corresponding computer program instruction in the nonvolatile memory into the memory for operation through the processor of the thermal imaging device where the device is located. From a hardware aspect, fig. 6 is a hardware structure diagram of an electronic device where a temperature measurement processing apparatus 10 is located according to an exemplary embodiment of the present invention, and besides the processor 510, the memory 530, the interface 520, and the nonvolatile memory 540 shown in fig. 6, a thermal imaging device where the apparatus 10 is located in an embodiment may further include other hardware, such as a non-refrigeration infrared focal plane detector, a visible light sensor, a first lens group, a second lens group, and the like, according to an actual function of the electronic device, which is not described again.

The present invention also provides a machine-readable storage medium, on which a program is stored, which, when executed by a processor, implements the thermometry processing method according to any one of the preceding embodiments.

The present invention may take the form of a computer program product embodied on one or more storage media including, but not limited to, disk storage, CD-ROM, optical storage, and the like, having program code embodied therein. Machine-readable storage media include both permanent and non-permanent, removable and non-removable media, and the storage of information may be accomplished by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of machine-readable storage media include, but are not limited to: phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technologies, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic tape storage or other magnetic storage devices, or any other non-transmission medium, may be used to store information that may be accessed by a computing device.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.