阅读说明：本技术 贴片式svg功率元件的散热结构 (Heat radiation structure of patch type SVG power component ) 是由 管志平 丁俞岚 于 2019-10-31 设计创作，主要内容包括：本发明公开了贴片式SVG功率元件的散热结构,包括线路板,所述线路板的顶端开设有贴片孔,所述贴片孔的顶端安装有上导热铜板,所述上导热铜板的底端连接有下导热铜板,本发明结构科学合理,使用安全方便,SVG功率元件运行时产生热量会通过上导热铜板和下导热铜板传输至散热片上,对热量进行散发,推动散热座在滑动杆上移动,并旋动限位旋钮,将限位杆塞入对应的限位槽内,可通过散热座对SVG功率元件进行散热,散热效果好,通过将转动板翻转至线路板上,并通过固定杆和固定座对转动板的位置进行固定,可通过转动板一端安装的防尘罩对SVG功率元件进行防护,结合防尘罩上安装的防尘网可对SVG功率元件进行防尘保护。(The invention discloses a heat dissipation structure of a surface mounted SVG power component, which comprises a circuit board, wherein the top end of the circuit board is provided with a surface mounted hole, the invention has scientific and reasonable structure, safe and convenient use, heat generated by the SVG power element during operation can be transmitted to the radiating fin through the upper heat-conducting copper plate and the lower heat-conducting copper plate, the heat is dissipated, the heat dissipation seat is pushed to move on the sliding rod, the limit knob is rotated to plug the limit rod into the corresponding limit groove, the SVG power element can be radiated by the radiating seat, the radiating effect is good, the rotating plate is overturned to the circuit board, and the position of the rotating plate is fixed by the fixed rod and the fixed seat, the dust cover of accessible rotor plate one end installation protects SVG power component, and the dust screen that combines the installation on the dust cover can carry out dustproof protection to SVG power component.)

1. SMD SVG power component's heat radiation structure, including circuit board (1), its characterized in that: the top end of the circuit board (1) is provided with a patch hole (2), the top end of the patch hole (2) is provided with an upper heat-conducting copper plate (8), the bottom end of the upper heat-conducting copper plate (8) is connected with a lower heat-conducting copper plate (9), the top end of the upper heat-conducting copper plate (8) is connected with an SVG power element (3), and the bottom end of the lower heat-conducting copper plate (9) is connected with a radiating fin (4);

a dustproof protection mechanism (5) is arranged at a position, corresponding to one side of the patch hole (2), of the top end of the circuit board (1), and the dustproof protection mechanism (5) comprises a fixed seat (501), a rotating plate (502), a dustproof cover (503), a fixed rod (504), a dustproof net (505) and a lifting hole (506);

the top of circuit board (1) corresponds paster hole (2) one side position department fixedly connected with fixing base (501), the top of circuit board (1) corresponds paster hole (2) opposite side position department fixedly connected with rotor plate (502), the one end of rotor plate (502) is connected with dust cover (503), the one end of dust cover (503) is connected with dust screen (505), the top fixedly connected with dead lever (504) of rotor plate (502), it offers to carry draws hole (506) to go up the top symmetry of heat conduction copper (8).

2. The heat dissipation structure for the patch type SVG power component according to claim 1, wherein said upper heat-conducting copper plate (8) and said lower heat-conducting copper plate (9) are fixed by a fixing bolt (10), and the bottom end of the fixing bolt (10) passes through the lower heat-conducting copper plate (9) to be engaged with the heat sink (4).

3. The heat dissipation structure of the patch type SVG power device according to claim 1, wherein the fixing seat (501) is formed with a fixing groove at one end thereof, and the fixing seat (501) is a member made of elastic rubber.

4. The heat dissipation structure of the patch type SVG power component according to claim 1, wherein a heat dissipation mechanism (6) is symmetrically installed on the top end of said upper heat-conducting copper plate (8), said heat dissipation mechanism (6) comprising a sliding rod (601), a heat dissipation base (602), a limiting groove (603), a limiting rod (604) and a limiting knob (605);

go up the even symmetry in top of heat conduction copper (8) and install slide bar (601), the top sliding connection of slide bar (601) has heat-radiating seat (602), the top both sides of heat-radiating seat (602) are run through the embedding and are installed gag lever post (604), go up the top of heat conduction copper (8) and correspond gag lever post (604) position department and evenly seted up spacing groove (603).

5. The heat dissipation structure of the patch type SVG power component of claim 4, wherein one end of said heat dissipation base (602) is connected with a rubber protection pad, and the top end of said limiting rod (604) is connected with a limiting knob (605).

6. The heat dissipation structure for the patch-type SVG power component according to claim 1, wherein moisture absorption and deodorization mechanisms (7) are symmetrically installed on the inner wall of the dust cover (503), and the moisture absorption and deodorization mechanisms (7) comprise moisture absorption bins (701), air vents (702), desiccant bags (703) and activated carbon bags (704);

moisture absorption bins (701) are symmetrically installed on the inner wall of the dust cover (503), air holes (702) are uniformly formed in the top end of the moisture absorption bin (701), a drying agent bag (703) is connected to the inner wall of one end of the moisture absorption bin (701), and an active carbon bag (704) is connected to the inner wall of the other end of the moisture absorption bin (701).

Technical Field

The invention relates to the technical field of component heat dissipation structures, in particular to a heat dissipation structure of a surface mount type SVG power component.

Background

SVG is static dynamic reactive power compensation device, adopt high-power high-speed switch power electronic device IGBT to realize reactive compensation and harmonic suppression function, for modes such as traditional phase modifier, capacitor reactor, traditional SVC that uses thyristor control reactor TCR as main representative, SVG has incomparable advantage, it is the equipment that electric energy quality handles the field and has the highest technical level, at present, the region of installing large-scale power equipment all can be equipped with reactive power compensation device, therefore the demand of SVG can be bigger and bigger.

Through search, chinese patent No. CN 101556941B discloses a heat dissipation device for a chip-type high-power element, which adopts a path of heat dissipation from a high-power element, a heat-conducting copper block, an aluminum-based heat dissipation plate with a copper bonding pad, a heat dissipation plate, and air, so as to effectively reduce the operating temperature of the high-power element, and keep the operating temperature of the high-power element within a rated range.

Disclosure of Invention

The invention provides a technical scheme which can effectively solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: the heat dissipation structure of the surface mount type SVG power element comprises a circuit board, wherein a surface mount hole is formed in the top end of the circuit board, an upper heat conduction copper plate is mounted at the top end of the surface mount hole, the bottom end of the upper heat conduction copper plate is connected with a lower heat conduction copper plate, the top end of the upper heat conduction copper plate is connected with the SVG power element, and the bottom end of the lower heat conduction copper plate is connected with a heat dissipation fin;

a dustproof protection mechanism is arranged at a position, corresponding to one side of the patch hole, of the top end of the circuit board, and comprises a fixed seat, a rotating plate, a dustproof cover, a fixed rod, a dustproof net and a lifting hole;

the utility model discloses a heat conduction copper plate, including last heat conduction copper plate, paster hole, circuit board, dust cover, dust screen, the top of circuit board corresponds paster hole one side position department fixedly connected with fixing base, the top of circuit board corresponds paster hole other side position department fixedly connected with rotor plate, the one end of rotor plate is connected with the dust cover, the one end of dust cover is connected with the dust screen, the top fixedly connected with dead lever of rotor plate, upward the top symmetry of heat conduction copper plate has seted up and has carried the drawing.

Preferably, the upper heat-conducting copper plate and the lower heat-conducting copper plate are fixed through a fixing bolt, and the bottom end of the fixing bolt penetrates through the lower heat-conducting copper plate to be connected with the radiating fins in a meshed mode.

Preferably, one end of the fixing seat is provided with a fixing groove, and the fixing seat is a member made of elastic rubber.

Preferably, the top end of the upper heat-conducting copper plate is symmetrically provided with a heat dissipation mechanism, and the heat dissipation mechanism comprises a sliding rod, a heat dissipation seat, a limiting groove, a limiting rod and a limiting knob;

go up the even symmetry in top of heat conduction copper and install the slide bar, the top sliding connection of slide bar has the radiating seat, the top both sides of radiating seat are run through the embedding and are installed the gag lever post, the top of going up the heat conduction copper corresponds gag lever post position department and has evenly seted up the spacing groove.

Preferably, one end of the heat radiating seat is connected with a rubber protective pad, and the top end of the limiting rod is connected with a limiting knob.

Preferably, the inner wall of the dust cover is symmetrically provided with moisture absorption and deodorization mechanisms, and each moisture absorption and deodorization mechanism comprises a moisture absorption bin, an air hole, a drying agent bag and an active carbon bag;

the inner wall symmetry of dust cover is installed and is inhaled the storehouse, the top in storehouse of adsorbing evenly has seted up the bleeder vent, the one end inner wall in storehouse of adsorbing has the drier package, the other end inner wall in storehouse of adsorbing is connected with the active carbon package.

Compared with the prior art, the invention has the beneficial effects that: the invention has scientific and reasonable structure and safe and convenient use:

1. the SVG power component produces the heat and can transmit to the fin through last heat conduction copper and heat conduction copper down during operation, give off the heat, and can be according to SVG power component's width size, promote the radiating seat and remove on the slide bar, and after adjusting the position, the spacing knob of rotating, fill in the gag lever post corresponding spacing inslot, thereby the accessible radiating seat dispels the heat to SVG power component, radiating effectual, and the position of quick adjustment radiating seat.

2. Through overturning the rotating plate to the circuit board, fixing the position of the rotating plate through a fixing rod and a fixing seat, protecting the SVG power element by the dust cover installed at one end of the rotating plate, and performing dust prevention protection on the SVG power element by combining the dust screen installed on the dust cover.

3. Through the bleeder vent that moisture absorption storehouse one end was seted up, combine the drier package and the active carbon package of moisture absorption storehouse inner wall connection, can dehumidify and the deodorization to dust cover inside to the protection of dampproofing deodorization of SVG power component has been increased.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.

In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the connection structure of the heat sink and the circuit board according to the present invention;

FIG. 3 is a schematic structural view of the dust protection mechanism of the present invention;

FIG. 4 is a schematic structural diagram of a heat dissipation mechanism according to the present invention;

FIG. 5 is a schematic view of the moisture absorbing and deodorizing mechanism of the present invention;

FIG. 6 is a schematic view showing a connection structure of an upper heat-conducting copper plate and a lower heat-conducting copper plate according to the present invention;

reference numbers in the figures: 1. a circuit board; 2. a patch hole; 3. an SVG power component; 4. a heat sink;

5. a dust-proof protection mechanism; 501. a fixed seat; 502. a rotating plate; 503. a dust cover; 504. fixing the rod; 505. a dust screen; 506. lifting and pulling the hole;

6. a heat dissipation mechanism; 601. a slide bar; 602. a heat dissipation base; 603. a limiting groove; 604. a limiting rod; 605. a limit knob;

7. a moisture absorption and deodorization mechanism; 701. a moisture absorption bin; 702. air holes are formed; 703. a desiccant bag; 704. an active carbon bag;

8. an upper heat conducting copper plate; 9. a lower heat conducting copper plate; 10. and (5) fixing the bolt.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.