阅读说明：本技术 一种fpc多层板传压结构及fpc多层板压制方法 (FPC multilayer board pressure transmission structure and FPC multilayer board pressing method ) 是由 徐景浩 胡可 黄志刚 林均秀 于 2019-11-27 设计创作，主要内容包括：本发明公开了一种多层板传压结构及多层板压制方法,旨在提供一种可以解决多层板传压靠近板边区域压不实的问题,使得多层板生产可以顺利进行的多层板传压结构及多层板压制方法。本发明包括上压机热盘、下压机热盘,上铁板、下铁板、上高温缓冲层、下高温缓冲层、第一镜面钢板、第二镜面钢板、第三镜面钢板、第一离型膜、第二离型膜、第三离型膜、第四离型膜,第一离型膜和第二离型膜之间以及第三离型膜和第四离型膜之间均设置有工装,工装呈平板状,工装内设有与多层板相适配的放置孔。本发明应用于多层板传压制作的技术领域。(The invention discloses a multilayer board pressure transmission structure and a multilayer board pressing method, and aims to provide the multilayer board pressure transmission structure and the multilayer board pressing method which can solve the problem that the area of the multilayer board pressure transmission close to the board edge is not pressed firmly, so that the multilayer board can be produced smoothly. The hot plate pressing machine comprises an upper press hot plate, a lower press hot plate, an upper iron plate, a lower iron plate, an upper high-temperature buffer layer, a lower high-temperature buffer layer, a first mirror surface steel plate, a second mirror surface steel plate, a third mirror surface steel plate, a first release film, a second release film, a third release film and a fourth release film, wherein tools are arranged between the first release film and the second release film and between the third release film and the fourth release film, the tools are in a flat plate shape, and placing holes matched with the multilayer plates are formed in the tools. The invention is applied to the technical field of pressure transmission manufacturing of the multilayer board.)

1. A FPC multilayer board pressure transmission structure comprises an upper press hot plate (F1), a lower press hot plate (F2), an upper iron plate (A1), a lower iron plate (A2), an upper high-temperature buffer layer (B1), a lower high-temperature buffer layer (B2), a first mirror steel plate (C1), a second mirror steel plate (C2), a third mirror steel plate (C3), a first release film (D1), a second release film (D2), a third release film (D3) and a fourth release film (D4); go up press hot plate (F1) and be located under press hot plate (F2) directly over, go up press hot plate (F1) inboard from top to bottom and have set gradually last iron plate (A1), go up high temperature buffer layer (B1) first mirror surface steel sheet (C1), first from type membrane (D1), press hot plate (F2) is inboard from bottom to top has set gradually down iron plate (A2), lower high temperature buffer layer (B2), third mirror surface steel sheet (C3), fourth from type membrane (D4), second mirror surface steel sheet (C2) is located first from type membrane (D1) and between fourth release membrane (D4), second mirror surface steel sheet (C2) upper and lower two sides are provided with respectively second from type membrane (D2) with third from type membrane (D3), its characterized in that: first from type membrane (D1) with the second is from between type membrane (D2) and the third is from type membrane (D3) with the fourth is from all being provided with frock (H) between type membrane (D4), frock (H) are flat, be equipped with in frock (H) with placing hole (I) of FPC multiply wood (E) looks adaptation.

2. The FPC multilayer board pressure transmission structure of claim 1, wherein: the tool (H) is a frame body, and the placing hole (I) is located in the frame body.

3. The FPC multi-layer board pressure transmission structure according to claim 2, wherein: the frame, the first mirror steel plate (C1), the second mirror steel plate (C2), and the third mirror steel plate (C3) have the same length and width.

4. The FPC multilayer board pressure transmission structure of claim 3, wherein: the thickness of the tool (H) is the same as that of the FPC multilayer board (E).

5. A FPC multilayer board pressing method using an FPC multilayer board pressure transmitting structure according to claim 1, characterized in that: the FPC multilayer board pressing method comprises the following steps:

a. placing one or more FPC multilayer boards (E) to be pressed into the placing hole (I) of the tool (H), and filling a suspended area except the FPC multilayer boards (E) by the tool (H);

b. and driving the upper press hot plate (F1) and/or the lower press hot plate (F2) to press the FPC multilayer (E).

Technical Field

The invention relates to a pressure transmission manufacturing technology of a Flexible Printed Circuit (FPC) multilayer board, in particular to a pressure transmission structure of the FPC multilayer board and a pressing method of the FPC multilayer board.

Background

When the FPC multilayer board is subjected to pressure transmission and typesetting, due to the fact that the number of typesetting layers is large and the FPC multilayer board is influenced by factors such as the precision of a swing board, the upper position and the lower position of a frame between layers of a product are not completely on the same vertical line, and therefore the problem of pressure loss of a staggered area is caused, the edge of the product is not pressed tightly during pressure transmission, and the product is poor. As shown in fig. 1, fig. 1 is a schematic diagram of a conventional pressing stack, F1 and F2 are press hot plates, a1 and a2 are thick iron plates, B1 and B2 are high-temperature buffer materials, C1, C2 and C3 are mirror steel plates, D1, D2, D3 and D4 are three-in-one release films, E is a multilayer board, and G1 and G2 are no-voltage areas, so that the pressure applied to the FPC in the G1 and G2 areas is reduced, which affects the filling of the FPC adhesive film, and causes the product edge to be not pressed during voltage transmission, and finally causes the product to be defective.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a FPC multilayer board pressure transmission structure and a FPC multilayer board pressing method, which can solve the problem that the pressure transmission of an FPC multilayer board is not tight in the area close to the board edge, so that the production of the FPC multilayer board can be smoothly carried out.

The technical scheme adopted by the invention is as follows: a FPC multi-layer board pressure transmission structure comprises an upper press hot plate F1, a lower press hot plate F2, an upper iron plate A1, a lower iron plate A2, an upper high-temperature buffer layer B1, a lower high-temperature buffer layer B2, a first mirror steel plate C1, a second mirror steel plate C2, a third mirror steel plate C3, a first release film D1, a second release film D2, a third release film D3 and a fourth release film D4; the upper press hot disc F1 is located right above the lower press hot disc F2, the inner side of the upper press hot disc F1 is sequentially provided with the upper iron plate A1, the upper high-temperature buffer layer B1, the first mirror steel plate C1 and the first release film D1 from top to bottom, the inner side of the lower press hot disc F2 is sequentially provided with the lower iron plate A2, the lower high-temperature buffer layer B2, the third mirror steel plate C3 and the fourth release film D4 from bottom to top, the second mirror steel plate C2 is located between the first release film D1 and the fourth release film D4, the upper surface and the lower surface of the second mirror steel plate C2 are respectively provided with the second release film D2 and the third release film D3, the first release film D1 and the second release film D2 and the third release film D3 and the fourth release film D4 are both provided with H-shaped tooling, and the flat tooling is arranged between the flat plate, a placing hole I matched with the FPC multilayer board E is formed in the tool H.

Further, the tool H is a frame body, and the placing hole I is located in the frame body.

Further, the frame, the first mirror steel plate C1, the second mirror steel plate C2, and the third mirror steel plate C3 have the same length and width.

The thickness of the tool H is the same as that of the FPC multilayer board E.

A FPC multilayer board pressing method using the FPC multilayer board pressure transmission structure comprises the following steps:

a. one or more FPC multilayer boards E to be pressed are placed in the placing holes I of the tool H, and the tool H fills the suspended areas except the FPC multilayer boards E, so that the pressure uniformity of the table top of the whole pressing plate is improved, and the problem that the pressure transmission edges of the FPC multilayer boards are not compact is solved.

b. And driving the upper press hot plate F1 and/or the lower press hot plate F2 to press the FPC multilayer E.

The invention has the beneficial effects that: the invention adopts the design of the tool to fill the suspended area outside the swinging plate of the FPC multilayer board, thereby improving the pressure uniformity of the table top of the whole pressing plate, improving the problem of incompact pressure transmission edge of the FPC multilayer board and being capable of smoothly producing the FPC multilayer board in mass production.

Drawings

FIG. 1 is a schematic view of a conventional press stack;

FIG. 2 is a schematic view of a press stack of the present invention;

fig. 3 is a schematic structural diagram of the tool H.

Detailed Description

As shown in fig. 2 and 3, in this embodiment, the FPC multilayer board pressure transmission structure includes an upper press hot plate F1, a lower press hot plate F2, an upper iron plate a1, a lower iron plate a2, an upper high temperature buffer layer B1, a lower high temperature buffer layer B2, a first mirror steel plate C1, a second mirror steel plate C2, a third mirror steel plate C3, a first release film D1, a second release film D2, a third release film D3, and a fourth release film D4; the upper press hot disc F1 is located right above the lower press hot disc F2, the inner side of the upper press hot disc F1 is sequentially provided with the upper iron plate A1, the upper high-temperature buffer layer B1, the first mirror steel plate C1 and the first release film D1 from top to bottom, the inner side of the lower press hot disc F2 is sequentially provided with the lower iron plate A2, the lower high-temperature buffer layer B2, the third mirror steel plate C3 and the fourth release film D4 from bottom to top, the second mirror steel plate C2 is located between the first release film D1 and the fourth release film D4, the upper surface and the lower surface of the second mirror steel plate C2 are respectively provided with the second release film D2 and the third release film D3, the first release film D1 and the second release film D2 and the third release film D3 and the fourth release film D4 are both provided with H-shaped tooling, and the flat tooling is arranged between the flat plate, be equipped with in the frock H with the hole I of placing of FPC multiply wood E looks adaptation, the processing is hollowed out in the middle of the frock H pendulum plate region, and thickness and FPC uniform thickness, material are stainless steel, prevent because of passing pressure high temperature oxidation deformation.

In this embodiment, the tool H is a frame, and the placing hole I is located in the frame.

In the present embodiment, the frame, the first mirror steel plate C1, the second mirror steel plate C2, and the third mirror steel plate C3 have the same length and width.

The thickness of the tool H is the same as that of the FPC multilayer board E.

A FPC multilayer board pressing method using the FPC multilayer board pressure transmission structure comprises the following steps:

a. four pieces of FPC multi-layer boards P1, P2, P3 and P4 to be pressed are placed in the placing hole I of the tool H, and the tool H fills the suspended area except the FPC multi-layer boards, so that the pressure uniformity of the table top of the whole pressing plate is improved, and the problem that the pressure transmission edges of the FPC multi-layer boards are not compacted is solved.

b. And driving the upper press hot plate F1 and/or the lower press hot plate F2 to press the FPC multilayer E.

The mirror surface steel sheet is arranged around with frock H during biography pressure pendulum board, and the product pendulum is inboard at frock H, and because there is frock H's support during the clamp plate, first mirror surface steel sheet C1, second mirror surface steel sheet C2, third mirror surface steel sheet C3 should not warp, keeps relatively level and smooth state, and FPC surface receives pressure also becomes even.

The invention is applied to the technical field of FPC multi-layer board pressure transmission manufacturing.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.