阅读说明：本技术 用于校准超声键合机的方法
(Method for calibrating an ultrasonic bonder
) 是由 F·伊科克
M·查恩塔
S·托费恩科 于 2019-07-30 设计创作，主要内容包括：本公开涉及用于校准超声键合机的方法。第一键合机包括第一超声换能器。第二键合机包括第二超声换能器和电源。该方法包括：由第一机械阻尼抑制第一超声换能器；向第一超声换能器提供第一校准电力,第一校准电力引起第一超声换能器在被第一机械阻尼抑制时以第一校准幅度振荡；向第二超声换能器提供第二校准电力,其中第二校准电力被配置为引起第二超声换能器在被与第一机械阻尼相同的第二机械阻尼抑制时以与第一校准幅度相同的第二校准幅度振荡。第二键合机被适配为：基于第一校准电力的第一电参数和第二校准电力的第二电参数来修改第二控制信号以生成经修改的第二控制信号；将经修改的第二控制信号提供给电源以引起第二电源生成第二电力。(The present disclosure relates to a method for calibrating an ultrasonic bonder. The first bonder includes a first ultrasonic transducer. The second bonder includes a second ultrasonic transducer and a power source. The method comprises the following steps: dampening the first ultrasonic transducer by a first mechanical damping; providing a first calibration power to the first ultrasonic transducer, the first calibration power causing the first ultrasonic transducer to oscillate at a first calibration amplitude when dampened by the first mechanical damping; providing second calibration power to the second ultrasound transducer, wherein the second calibration power is configured to cause the second ultrasound transducer to oscillate at a second calibration amplitude that is the same as the first calibration amplitude when dampened by a second mechanical damping that is the same as the first mechanical damping. The second bonder is adapted to: modifying the second control signal based on the first electrical parameter of the first calibration power and the second electrical parameter of the second calibration power to generate a modified second control signal; the modified second control signal is provided to the power supply to cause the second power supply to generate the second power.)
1. A method for calibrating a second bonder (2) based on a calibrated first bonder (1), the first bonder (1) comprising a first ultrasonic transducer (113), the second bonder (2) comprising a second ultrasonic transducer (213) and a power supply (215), the method comprising:
-damping the first ultrasonic transducer (113) by a first mechanical damping;
providing a first calibration power (P) to the first ultrasonic transducer (113)
cal1(t)，V
cal1(t)), the first calibration power (P)
cal1(t)，V
cal1(t)) causes the first ultrasonic transducer (113) to be damped by the first mechanical damping at a first calibration amplitude (A)
cal1) Oscillating;
providing a second calibration power (P) to the second ultrasonic transducer (213)
cal2(t)，V
cal2(t)), wherein the second calibration power (P)
cal2(t)，V
cal2(t)) is configured to cause the second ultrasonic transducer (213) to be equally damped as the first mechanical dampingIs inhibited by a first calibrated amplitude (a) with respect to the first mechanical damping
cal1) The same second calibration amplitude (A)
cal2) Oscillating; and
-adapting the second bonder (2) to:
based on the first calibration power (P)
cal1(t)，V
cal1(t)) and the second calibration power (P)
cal2(t)，V
cal2(t)) modifying the second control signal (C)
2，C
2X) In order to generate a modified second control signal (C)
2'，C
2X')；
Modifying the modified second control signal (C)
2'，C
2X') is provided to the power source (215) to cause the power source (215) to generate a second power (P)
2(t)，V
2(t)); and
applying the second power (P)
2(t)，V
2(t)) is provided to the second ultrasonic transducer (213).
2. The method of claim 1, wherein:
(a) the first electrical parameter is the first calibration power (P)
cal1(t)，V
cal1(t)) electric power (P)
cal1(t)) average value of<P
cal1(t)>) And the second electrical parameter is the second calibration power (P)
cal2(t)，V
cal1(t)) electric power (P)
cal2(t)) average value of<P
cal2(t)>) (ii) a Or
(b) The first electrical parameter is the first calibration power (P)
cal1(t)，V
cal1(t)) a first voltage (V)
cal1(t)) average value of<V
cal1(t)>) And the second electrical parameter is the second calibration power (P)
cal2(t)，V
cal1(t)) of a second voltage (V)
cal2(t)) average value of<V
cal2(t)>) (ii) a Or
(c) The first electrical parameter is the first calibration power (P)
cal1(t)，V
cal1(t)) a first voltage (V)
cal1(t)) a first amplitude (V)
cal10) And saidThe second electrical parameter is the second calibration power (P)
cal2(t)，V
cal2(t)) of a second voltage (V)
cal2(t)) a second amplitude (V)
cal20)。
3. Method according to any of the preceding claims, wherein the first calibration power (P) is based on
cal1(t)，V
cal1(t)) and the second calibration power (P)
cal2(t)，V
cal2(t)) to modify the second control signal (C)
2，C
2X) In order to generate said modified second control signal (C)
2'，C
2X') includes: based on the first calibration power (P)
cal1(t)，V
cal1(t)) the first electrical parameter and the second calibration electrical power (P)
cal2(t)，V
cal2(t)) to modify the second control signal (C) by a difference between the second electrical parameters of the second control signal (C) and the second electrical parameter (t) of the second control signal (C) of the second control signal (T) of the second control signal (C) of the second control
2，C
2X)。
4. Method according to claim 3, wherein the second bonder (2) is adapted to generate the modified second control signal (C)
2'，C
2X') such that the difference between the two is equal to said first calibration power (P)
cal1(t)，V
cal1(t)) the first electrical parameter and the second calibration electrical power (P)
cal2(t)，V
cal2(t)) the difference between the second electrical parameters:
-if said second control signal (C) is present
2，C
2X) Instead of said modified second control signal (C)
2'，C
2X') is supplied to the power supply (215), unmodified second electrical power (P) output by the power supply (215) to the second ultrasonic transducer (213)
2unmod(t)，P
2unmodX(t)) an electrical parameter, and
-said second electric power (P)
2(t)，V
2(t)) an electrical parameter.
5. The method of any preceding claim, wherein:
adapting the second bonder (2) to provide the second ultrasonic transducer (213) with the second power (P)
2(t)，V
2(t)) comprises:
adapting the second bonder (2) to provide a second alternating voltage (V) to the second ultrasonic transducer (213)
2(t)) and a second alternating current (I)
2(t)), the second alternating current (I)
2(t)) and the second alternating voltage (V)
2(t)) in phase.
6. The method of claim 5, wherein:
the second alternating voltage (V)
2(t)) and the second alternating current (I)
2(t)) comprises a zero crossing at a common time instant.
7. The method of any preceding claim, wherein:
the first bonder (1) comprises a first tool tip (112) remote from the first ultrasonic transducer (113);
the second bonder (2) comprises a second tool tip (212) remote from the second ultrasonic transducer (213);
the first ultrasound transducer (113) that suppresses oscillations comprises: the first ultrasonic transducer (113) mechanically damping oscillations at the first tool tip (112); and
the second ultrasonic transducer (213) that suppresses oscillations comprises: the second ultrasonic transducer (213) mechanically damping oscillations at the second tool tip (212).
8. The method of claim 7, wherein:
the first ultrasonic transducer (113) to dampen oscillations at the first tool tip (112) and the second ultrasonic transducer (213) to dampen oscillations at the second tool tip (212) comprise one of:
using a first pressure (F)
1) Pressing the first tool tip (112) against a first resilient pad and using the first pressure(F
1) The same second pressure (F)
2) Pressing the second tool tip (212) against the first resilient pad or a second resilient pad of the same construction as the first resilient pad;
using a first pressure (F)
1) Pressing the first tool tip (112) against a first semiconductor chip and using the first pressure (F)
1) The same second pressure (F)
2) Pressing the second tool tip (212) against the first semiconductor chip or a second semiconductor chip of the same configuration as the first semiconductor chip;
clamping the first tool tip (112) using a first clamp and clamping the second tool tip (212) using the first clamp or a second clamp configured the same as the first clamp; and
immersing the first tool tip (112) in a first fluid, and immersing the second tool tip (212) in the first fluid or a second fluid that is the same as the first fluid.
9. The method of claim 8, wherein the first resilient pad comprises a hardness greater than 60 shore a or greater than 16 shore D at a temperature of 23 ℃.
10. The method of any of claims 1 to 6, wherein the first ultrasound transducer (113) that suppresses oscillations comprises:
pressing a first damping element (400) directly against the first ultrasonic transducer (113) or against the first bonding tool (111) at the same first distance (d1) from a first tool tip (112) of the first bonding machine (1) as from the first ultrasonic transducer (113); and
pressing the first damping element (400) or a second damping element (400) identical to the first damping element (400) directly against the second ultrasonic transducer (213) or against the second bonding tool (211) at a second distance (d2) from a second tool tip (212) of the second bonding machine (2) identical to the second ultrasonic transducer (213).
11. The method according to any of the preceding claims, comprising:
-adapting the second bonder (2) to:
-storing the first and second electrical parameters or a parameter or function depending on the first and second electrical parameters in a memory of the second bonding machine (2); and
modifying the second control signal (C) based on the stored parameter or based on a stored function based on the stored first and second electrical parameters
2，C
2X)。
12. The method of any preceding claim, wherein:
providing the first calibration power (P) to the first ultrasonic transducer (113)
cal1(t)，V
cal1(t)) comprises: a first calibration voltage (V)
cal1(t)) is applied to the first ultrasonic transducer (113), the first calibration voltage (V;) is
cal1(t)) inducing a first calibration current (I) through the first ultrasonic transducer (113)
cal1(t))；
Providing the second calibration power (P) to the second ultrasonic transducer (213)
cal2(t)，V
cal2(t)) comprises: the second calibration voltage (V)
cal2(t)) is applied to the second ultrasonic transducer (213), the second calibration voltage (V)
cal2(t)) inducing a second calibration current (I) by the second ultrasonic transducer (213)
cal2(t))；
The first calibration voltage (V)
cal1(t)) and the first calibration current (I)
cal1(t)) are in-phase and comprise a common zero crossing; and
second calibration voltage (V)
cal2(t)) and a second calibration current (I)
cal2(t)) are in phase and comprise a common zero crossing.
13. The method of claim 12, wherein
The first calibration voltage(V
cal1(t)) comprises a first fundamental frequency (f) in the range of 20kHz to 120kHz
cal1) (ii) a And
the second calibration voltage (V)
cal2(t)) comprises a second fundamental frequency (f) in the range of 20kHz to 120kHz
cal2)。
14. The method of any one of the preceding claims, wherein
The first calibration power (P)
cal1(t)，V
cal1(t)) based on the first calibration control signal (C)
cal1) Is generated;
the second calibration power (P)
cal2(t)，V
cal2(t)) is based on the first calibration control signal (C)
cal1) The same second calibration control signal (C)
cal2) And is generated.
15. The method of claim 14, wherein the second control signal (C)
2，C
2X) Is different from the second calibration control signal (C)
cal2)。
Technical Field
The present disclosure relates generally to ultrasonic bonding techniques.
Background
Ultrasonic bonding techniques are widely used to mechanically join two bonding partners. Thus, the bonding tool oscillating at ultrasonic frequency mechanically presses the second bonding partner against the first bonding partner with pressure. For example, the first bonding partner may be a semiconductor chip or an electronic circuit board and the second bonding partner may be a bonding wire. However, the quality of the bond between the two bonding partners may depend on many parameters, such as the technical design of the bonding partners, the technical design of the bonding tool, the oscillation frequency of the bonding tool, the pressure, etc. For example, bonding different types (e.g., different materials, different diameters/cross-sections) of bond wires to a particular type of semiconductor chip may require different production parameters (e.g., oscillation frequency, pressure) in order to achieve reliable bonding. Thus, each particular combination of a first type of bonding partner and a second type of bonding partner may require a significant amount of experimentation (e.g., a test sequence of varying pressure and oscillation frequency) in order to find the appropriate production parameters.
However, using one or more control signals found to provide suitable bonding results to link bonding partners of a particular combination of a first type of bonding partner and a second type of bonding partner using a first bonder may not be suitable for linking bonding partners of the same type using different bonders. In other words, optimizing the quality of the same joint produced with different bonders may require repeating the above-described extensive experiments for each bonder used. Thus, improved solutions are needed.
Disclosure of Invention
One aspect relates to a method for calibrating a second bonder based on a calibrated first bonder. The first bonder includes a first ultrasonic transducer and the second bonder includes a second ultrasonic transducer and a power source. The method comprises the following steps: dampening the first ultrasonic transducer by a first mechanical damping; providing a first calibration power to the first ultrasonic transducer, the first calibration power causing the first ultrasonic transducer to oscillate at a first calibration amplitude when dampened by the first mechanical damping; providing second calibration power to the second ultrasound transducer, wherein the second calibration power is configured to oscillate at a second calibration amplitude that is the same as the first calibration amplitude when dampened by a second mechanical damping that is the same as the first mechanical damping. The second bonder is adapted to modify the second control signal based on a first electrical parameter of the first calibration power and a second electrical parameter of the second calibration power so as to generate a modified second control signal; providing the modified second control signal to the power supply to cause the power supply to generate a second power (electrical power); and providing the second power to the second ultrasonic transducer.
The invention may be better understood with reference to the following description and accompanying drawings. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. In the present specification and claims, some elements are designated as "first element", "second element", "third element", and the like. It should be noted that names such as "first," second, "" third, "etc. are not intended to be enumerated, but are merely used to identify individual" elements. That is, for example, the presence of the "third element" does not require the presence of the "first element" and the "second element".
Drawings
Fig. 1 shows the normal operation of a first bonder;
fig. 2 shows a first transducer voltage and a first transducer current output by a power supply of a first bonding machine directly to an ultrasonic transducer of the first bonding machine;
fig. 3 shows the normal operation of the second bonder;
fig. 4 shows a second transducer voltage and a second transducer current output by the power supply of the second bonding machine directly to the ultrasonic transducer of the second bonding machine;
fig. 5 shows a calibration operation of the first bonder of fig. 1;
fig. 6 shows a first calibration voltage and a resulting first alternating current applied directly to a first ultrasonic transducer of the first bonder of fig. 1;
fig. 7 shows a calibration operation of the second bonder of fig. 3;
fig. 8 shows a second calibration voltage and a resulting second alternating current applied directly to a second ultrasonic transducer of the second bonder of fig. 3;
fig. 9(a) shows the behaviour of the calibrated second bonder of fig. 3 when a modified second control signal is provided to the input of the power supply of the ultrasonic transducer of the second bonder;
fig. 9(b) shows the behavior of the second bonder of fig. 3 when an unmodified second control signal, instead of the modified second control signal, is provided to an input of a power supply of an ultrasonic transducer of the second bonder;
FIG. 10 illustrates an example in which an ultrasonic transducer mechanically coupled to the oscillation of the bonding tool is indirectly damped using a clamp that clamps the tool tip of the bonding tool;
FIG. 11 illustrates an example in which an ultrasonic transducer mechanically coupled to the oscillation of the bonding tool is indirectly damped by immersing the tool tip of the bonding tool in a fluid;
FIG. 12 illustrates an example in which an ultrasonic transducer that directly dampens oscillations mechanically coupled to a bonding tool is used with an elastic pad that affects the transducer;
fig. 13 illustrates a partial method for calibrating a second bonder based on a calibrated first bonder; and
fig. 14 illustrates a method for bonding a first type of bonding partner to a second type of bonding partner using statistical process control.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings. The drawings show specific examples of the invention that can be practiced. It should be understood that the features and principles described with respect to the various examples may be combined with each other, unless specifically noted otherwise.
Fig. 1 schematically shows a first bonder 1. The first bonder 1 comprises a first bonding tool 111, a (e.g. piezo-electric or magneto-elastic) toolRetracted) first ultrasonic transducer 113, first pressing device 114, first support 119 and first drive unit 100. The first driving unit 100 includes a first control unit 110, a first power source 115, a first power correction unit 117, and a first pressing device driver 118. Under the control of the first control unit 110, the first power supply 115 generates first power supply power P directly supplied to the first ultrasonic transducer 113
1(t) of (d). To cause the first power supply 115 to generate a first supply power P
1(t), the first control unit 110 generates and outputs a first control signal C
1And the first power supply 115 is based on the first control signal C
1Generating a first power supply power P
1(t)。
According to the illustrated embodiment, the first control signal C
1May be provided to the first power correction unit 117, the first power correction unit 117 based on the first control signal C
1Generating a modified first control signal C provided to the first power supply 115 as a first power supply input signal
1'. The first power correction unit 117 is optional and may enable calibration of the first bonder 1. The first power supply 115 generates a first power supply power P based on the first power supply input signal
1(t), i.e., in the illustrated embodiment, based on the modified first control signal C provided to the input of the first power supply 115
1'. Thus, the first power supply 115 is also based on the first control signal C
1Generating a first power supply power P
1(t) of (d). That is, the first power supply power P
1(t) may be based on the first control signal C
1But is changed.
As described above, the first power correction unit 117 is optional. According to an embodiment (not shown), the first power correction unit 117 may be omitted and the first control signal C may be applied
1The input of the first power supply 115 is provided directly as a first power supply input signal. Also, in this embodiment, the first power supply 115 is based on the first control signal C
1Generating a first power supply power P
1(t)。
First electric power P
1(t) causing the first ultrasonic transducer 113 to be in the first transverse direction x
1At a first ultrasonic frequency f
1And (6) oscillating.In fig. 1, a double arrow schematically shows the direction of oscillation, and a broken line schematically shows the oscillation region of the oscillating first ultrasonic transducer 113. The first ultrasonic transducer 113 is mechanically coupled to the first bonding tool 111 such that the first bonding tool 111 is forced to oscillate at the frequency of oscillation of the first ultrasonic transducer 113 (i.e., the first ultrasonic frequency f)
1) And (6) oscillating. Fig. 1, in which the first ultrasonic transducer 113 is depicted in its neutral oscillation position, also shows that the first ultrasonic transducer 113 is in a first lateral direction x
1First oscillation amplitude A of
1。
During normal operation of the first bonder 1, i.e. when the first bonder 1 forms a bonded connection between the first bonding partner 301 and the second bonding partner 302, the first bonding partner 301 is (directly or indirectly) placed on the first surface 119t of the first support 119 and fixed (e.g. clamped, sucked, adhered, etc.) to the first surface 119t of the first support 119. The second bonding partner 302 (i.e., at least a portion of the second bonding partner 302) is then placed, for example, between the first tool tip 112 of the first bonding tool 111 and the first bonding partner 301, and the first pressure F is applied by the first tool tip 112 using the first pressure F
1Pressing against the first bonding partner 301. Thus, the second bonding partner 302 is in physical contact with the first bonding partner 301. According to the provided example and without limitation thereto, the first bonding partner 301 may be a semiconductor chip and the second bonding partner 302 may be a bonding wire. Alternatively, the first bonding partner 301 may be pre-mounted (e.g., soldered or sintered or adhered) on a carrier 303 (e.g., a metal plate, a circuit board, a metallized ceramic substrate, or any other type of carrier) prior to placement on the surface 119t of the support 119, and then placed on the first surface 119t with the carrier 303 such that the carrier 303 is disposed between the first surface 119t and the first bonding partner 301.
While applying the first pressure F
1In this case, the first ultrasonic transducer 113 starts to operate at the first ultrasonic frequency f
1In a first transverse direction x
1Up and forces the first bonding tool 111, in particular the first tool tip 112, also at the first ultrasonic frequency f
1In a first transverse directionx
1And (4) oscillating upwards. Thus, energy is transferred into the interface region between the first and second bonding partners 301, 302 and a tight bond is formed between the first and second bonding partners 301, 302. If the first and second bonding partners 101, 102 are electrically conductive, an electrical connection can also be formed between the first and second bonding partners 101, 102.
To drive the first pressing device 114, the first control unit 110 may provide a first pressing device control signal S to the first pressing device 114
1(t) in order to cause the first pressing means 114 to provide the desired first pressing force F
1. That is, the first pressure F
1Based on the first pressing device control signal S applied to the first bonding tool 111 by the first pressing device 114
1(t) is generated and delivered by the first bonding tool 111 to be spaced apart from the first ultrasonic transducer by a first distance d
111 First tool tip 112. First pressure F
1Direction z of
1(also may be referred to as a first pressing direction or a first vertical direction z)
1) May be perpendicular or substantially perpendicular to the first transverse direction x
1. During the bonding process, a first pressure F
1May be varied or alternatively kept constant. Additionally or alternatively, the first oscillation frequency f is during the bonding process
1May be varied or alternatively kept constant.
The first drive unit 100 is used to drive at least the first ultrasonic transducer 113 and optionally also the first pressing means 114. For driving the first ultrasonic transducer 113, the first control unit 110 may be designed to be based on a first control signal C
1Generating (e.g., setting and/or adjusting) first power source power P output by first power source 115
1(t), and in order to control the first pressing means 114, the first control unit 110 may be designed to adjust (e.g. set and/or regulate) the pressure F generated by the first pressing means driver 118 and the first pressing means 114 downstream thereof
1。
First electric power P
1(t) is the first transducer voltage V output by the first power supply 115 directly to the first ultrasonic transducer 113
1(t) and first transductionDevice current I
1(t) produced. A first voltage V
1(t) and a first current I
1(t) may also be referred to as first transducer voltage V, respectively
1(t) and a first transducer current I
1(t) of (d). That is, the first electric power P
1(t) can be according to P
1(t)＝V
1(t)·I
1(t) is calculated. FIG. 2 shows the first transducer voltage V
1(t) and a first transducer current I
1Examples of (t). According to an example, the first voltage V may be controlled
1(t) to have a desired signal shape (e.g. sinusoidal shape or any other, e.g. periodic shape), and a first current I
1(t) may be automatically adjusted according to the electrical properties of the first ultrasonic transducer 113.
Optionally, the first power source 115 may include a first (alternating) current I induced
1(t) and a first (AC) transducer voltage V
1(t) a first control loop 116, e.g., a Phase Locked Loop (PLL), that is in phase. Further alternatively, the first control loop 116 may cause the first (AC) transducer voltage V
1(t) and a first (AC) transducer current I
1(t) has zero crossings at the same or substantially the same time instant, so that (in steady state, i.e. when taken as the first ultrasonic frequency f)
1First oscillation period T of the reciprocal of (a)
1Constant) no or substantially no reactive power occurs.
From a sinusoidal first transducer voltage V
1(t) As can be seen, the first electric power P
1(t) at least at a first transducer voltage V
1(t) is equal to zero at the zero crossing. Thus, for a sinusoidal first transducer voltage V
1(t) (or any other first transducer voltage V periodically taking zero volts)
1(t)), the resulting first electric power P
1(t) at a first ultrasonic frequency f
1Periodically, the high repetition frequency of at least two times is zero. Those skilled in the art will appreciate that for an actual bonding process, wherein a bonding connection is formed between the first bonding partner 301 and the second bonding partner 302, the first electrical power is averaged<P
1>Can be compared with the first electric power P
1The (permanently changed) instantaneous value of (t) is more informative. On the other hand, it may be desirable toVarying the average first electrical power during the bonding process<P
1>. Therefore, consider the first electric power P
1(t) average first electric power<P
1>(abbreviated as "average first electric power" in the specification and claims<P
1>") may be useful. Average first electric power<P
1>＝<P
1(V
1，I
1)>It can be calculated as follows:
where t is time, n
1Is a positive integer (i.e., n)
1≥1)，t
1Is the point in time at which the average calculation starts, T
1Is the first oscillation period (first ultrasonic frequency f)
1Inverse of, i.e. T
1＝1/f
1). To calculate an average first electric power<P
1>N can be selected
1Has a low value. E.g. n
1May be selected from, but is not limited to, the range of 1 to 10 or 4 to 10. It should be noted that when the bonding connection is formed between the second bonding partner 302 and the first bonding partner 301, the average first electrical power is averaged over the course of the relevant bonding process<P
1>And a first ultrasonic frequency f
1(and thus the first period of oscillation T
1) May change over time. It should also be noted that the first transducer voltage V
1(t) and a first transducer current I
1(t) may or may not be sinusoidal.
Fig. 3 schematically shows the second bonding machine 2 when a bonding connection is formed between the first bonding partner 301 'and the second bonding partner 302'. With regard to the bonded connection to be formed, the first bonding partner 301 'as a whole or at least at its region to be bonded to the second bonding partner 302' may have the same properties as the first bonding partner 301 described with reference to fig. 1, and the second bonding partner 302 'as a whole or at least at its region to be bonded to the first bonding partner 301' may have the same properties as the second bonding partner 302 described with reference to fig. 1. As used herein, "the same property" may include "structurally the same", "constructively the same", "identical", "substantially the same", and the like.
The configuration and functional principle of the second bonding machine 2 may be the same as those of the first bonding machine 1 described with reference to fig. 1, except for the fact that the second power correction unit 217 is not omitted. Therefore, the description of the construction and functional principles of the first bonder 1 applies analogously to the second bonder 2. In order to distinguish between components (100, 111.. 119, 119t) of the first bonder 1 or associated with the first bonder 1 and components (200, 211.... 219, 219t) of the second bonder 2 or associated with the second bonder 2, a particular component of the first bonder 1 or associated with the first bonder 1 is denoted as "first" component and is identified using a three digit reference numeral with a leading "1", and a component of the second bonder 2 or associated with the second bonder 2 corresponding to the particular component is denoted as "second" component and is identified using the same reference numeral as the particular component, but wherein the leading "1" is replaced by a leading "2". That is, the first element of the first bonder 1, identified by reference numeral 1xy in fig. 1, corresponds to the second element of the second bonder 2, identified by reference numeral 2xy in fig. 3. In other words, the description of the constructive and functional principle of the second bonding machine 2 can be derived from the description of the constructive and functional principle of the first bonding machine 1 by replacing each "first element 1 xy" of the first bonding machine 1 or associated with the first bonding machine 1 with a corresponding "second element 2 xy" of the second bonding machine 2 or associated with the second bonding machine 2. Furthermore, the elements, signals, factors, etc. associated with the first bonder 1 will be replaced by corresponding elements, signal factors, etc. associated with the second bonder 2 according to the following table:
finally, equation (1) will be replaced with equation (2):
second electric power P
2(t) is the second transducer voltage V output by the second power supply 215 directly to the second ultrasonic transducer 213
2(t) and a second transducer current I
2(t) produced. Thus, the second voltage V
2(t) and a second current I
2(t) may also be referred to as second transducer voltages V, respectively
2(t) and a second transducer current I
2(t) of (d). That is, the second electric power P
2(t) can be according to P
2(t)＝V
2(t)·I
2(t) is calculated. FIG. 4 shows the second transducer voltage V
2(t) and a second transducer current I
2Examples of (t). According to an example, the second voltage V may be controlled
2(t) to have (e.g. for each second ultrasonic frequency f)
1) A desired signal shape (e.g. a sinusoidal shape or any other, e.g. periodic shape), and a second current I
2(t) may be automatically adjusted according to the electrical properties of the second ultrasonic transducer 213.
As initially mentioned, finding suitable production parameters for a particular combination of a first type of bonding partner and a second type of bonding partner may require extensive experimentation. In the example of fig. 1 and 3, the first bonding partner 301, 301 'represents a "first type bonding partner", and the second bonding partner 302, 302' represents a "second type bonding partner". It should be noted that any two first type of binding partners may have "the same properties" in the above sense, and any two second type of binding partners may have "the same properties" in the above sense. If suitable production parameters for bonding the second type of bonding partner 302 to the first type of bonding partner 301 using the first bonder 1 have been found (which typically requires a lot of experimentation), it is desirable to transfer the found suitable production parameters to the second bonder 2 when bonding the second type of bonding partner 302 '(i.e. the same type of bonding partner as the second bonding partner 302 of fig. 1) to the first type of bonding partner 301' (i.e. the same type of bonding partner as the first bonding partner 301 of fig. 1) using the second bonder 2.
At first sight, thisIt seems easy to do so, including simply adopting a second bonder 2 of the same configuration as the first bonder 1, and using corresponding control signals (e.g. V) with the second control unit 210 of the second bonder 2 as used by the first control unit 110 of the first bonder 1 for driving the first ultrasonic transducer 113 and the first pressing device 114
1(t)、I
1(t)、S
1(t)) the same control signal (e.g., V)
2(t)、I
2(t)、S
2(t))) to drive the second ultrasonic transducer 213 and the second pressing means 214. However, it has turned out that this method may still lead to an undesirable change in the quality of the resulting bonded connection.
The inventors of the present invention found that the mentioned undesired varying quality may be due to the extension of the first ultrasonic transducer 113 and the second ultrasonic transducer 213, which are assumed to be identical. That is, even when the first control signal C is used
1As a first power supply input signal of the first power supply 115 (i.e., when the first power correction unit 117 is omitted or when C
1'＝C
1Time) and using the first control signal C
1The same second control signal C
2As a second power supply input signal to the second power supply 215 (i.e., when the second power correction unit 217 is omitted or when C is present
2'＝C
2Time), the first ultrasonic transducer 113 and the second ultrasonic transducer 213 may behave significantly differently. Therefore, a simple method for calibrating the second bonder 2 based on a fully tested first bonder 1 is needed.
According to one aspect, a significant improvement over the described unsatisfactory method may be achieved by employing the second correction parameter k
2To achieve the second correction parameter k
2The amplitude of oscillation of the first ultrasonic transducer 113, which has been found to provide a suitable bonding result when bonding the first bonding partner 301 (i.e. the first type of bonding partner) to the second bonding partner 302 (i.e. the second type of bonding partner) using the first bonding machine 1, is also facilitated to be employed as a function of the amplitude of oscillation when bonding the first bonding partner 301 '(i.e. the first type of bonding partner) to the second bonding partner 302' (i.e. the second type of bonding partner) using the second bonding machine 2The amplitude of oscillation of the second ultrasonic transducer 213. This is based on a second correction parameter k determined by comparing the operation of the first bonding machine 1 and the operation of the second bonding machine 2 under the same conditions
2Calibrating the second bonder. Therefore, the first bonder 1 may also be referred to as "host". To perform the calibration, the transducers 113, 213 are (mechanically) damped with the same damping (i.e. damped identically). In other words, the ultrasonic transducers 113, 213 are damped such that they experience the same mechanical damping. For example, the ultrasonic transducers 113, 213 may be equally (mechanically) damped using the same damping device 400 or a damping device 400 of the same construction. This will be explained in further detail below.
Fig. 5 shows the first bonder 1 of fig. 1 operating in a calibration setting, wherein the first ultrasonic transducer 113 is damped by a first mechanical (calibration) damping. In the example of fig. 5, the damping device 400 is provided on the surface 119t of the first support 119. The first tool tip 112 utilizes the calibration force F via the first pressing means 114 and e.g. by control of the first control unit 110 or any other suitable control unit
cal(i.e., F)
1(t)＝F
cal) Pressing against the damping device 400. Calibration force F
calMay be constant (e.g., controlled to a predetermined value by the first control unit 110 or any other suitable control unit). At the same time, the first ultrasonic transducer 113 is controlled, for example by the first control unit 110 or any other suitable control unit, the first ultrasonic transducer 113 being operated so as to be at a first ultrasonic calibration frequency f
cal1In a first transverse direction x
1And (4) oscillating upwards. First ultrasonic calibration frequency f
cal1And may be, but is not limited to, a frequency of 20kHz to 120 kHz.
Operating the first ultrasonic transducer 113 to calibrate the frequency f at the first ultrasonic frequency
cal1In a first transverse direction x
1The up-oscillation may include: the first control unit 110 (or another suitable control unit) causes the first power source 115 to provide the first calibration power P directly to the first ultrasonic transducer 113
cal1(t) as first power supply power P
1(t), and thus provides the average first calibration power directly to the first ultrasonic transducer 113<P
cal1(t)>As average first supply power<P
1(t)>. First calibration power P
cal1(t) and averaging the first calibration power accordingly<P
cal1>Is based on the first calibration control signal C
cal1Generated, first calibration control signal C
cal1Causing the first ultrasonic transducer 113 to be damped by the first mechanical damping at a first calibration amplitude a
cal1And (6) oscillating. To this end, the first calibration control signal C
cal1The first power supply 115 may be provided directly as the first power supply input signal, e.g. when the first power correction unit 117 is omitted, or indirectly, e.g. via the first power correction unit 117 and the modified first calibration control signal C
cal1Supplied to the first power supply 115', a modified first calibration control signal C
cal1' is performed by the first power correction unit 117 based on the first calibration control signal C
cal1Generated and provided to the first power supply 115 as a first power supply input signal.
The first calibration power P
cal1(t) as first power supply power P
1(t) directly providing to the first ultrasonic transducer 113 includes: will (AC) the first calibration voltage V
cal1(t) and (AC) a first calibration current I
cal1(t) directly to the first ultrasonic transducer 113, such that P
1(t)＝V
cal1(t)·I
cal1(t) of (d). Averaging the first calibration power<P
cal1(V
cal1(t)·I
cal1(t))>(also referred to simply as<P
cal1>) Can be passed according to equation (1)<P
cal1>＝<P1(V
cal1，I
cal1)>To calculate.
FIG. 6 shows the first calibration voltage V as a function of time t
cal1(t) and (AC) a first calibration current I
cal1(t) of (d). A first calibration voltage V
cal1(t) and a first calibration current I
cal1(T) period T
1Is the first ultrasonic calibration frequency f
cal1Reciprocal of (i.e., T)
1＝1/f
cal1). As described above, the first power source 115 may include a first AC current I
1(t) with a first alternating voltage V
1(t) a first control loop 116 (see fig. 1 and 5) that is in phase, e.g., a Phase Locked Loop (PLL). Due to the fact thatIn this way, the first control loop 116 also causes an (alternating) first calibration current I
cal1(t) and (AC) a first calibration voltage V
cal1(t) are in phase, as shown in FIG. 6. As described above, the first control loop 116 may optionally cause the first (AC) transducer voltage V
1(t) and a first (AC) transducer current I
1(t) have zero crossings at the same or substantially the same time instants. Thus, the first control loop 116 may optionally cause a first (alternating current) calibration voltage V
cal1(t) and a first (alternating) calibration current I
cal1(t) have zero crossings at the same or substantially the same time instant, which is also shown in fig. 6.
Similarly, as shown in fig. 7, the second bonder 2 of fig. 3 may operate in a calibration setting, wherein the second ultrasonic transducer 213 is damped by a second mechanical (calibration) damping which is the same as the first mechanical (calibration) damping of the first ultrasonic transducer 113. In the example of fig. 6, the damping device 400 used in the calibration setting of the first bonder 1 or the same configuration of the damping device 400 is arranged on the surface 219t of the second support 219. The second tool tip 212 utilizes the calibration force F used in the calibration setup of the first bonding machine 1 via the second pressing device 214 and e.g. by control of the second control unit 210 or any other suitable control unit
calSame calibration force F
cal(i.e., F)
2(t)＝F
cal) Pressing against the damping device 400. Thus, the calibration force F used in the calibration setup of the second bonder 2
calOr may be constant (e.g., controlled to a predetermined value F by the second control unit 210 or any other suitable control unit)
cal). At the same time, the second ultrasonic transducer 213 is controlled, for example by the second control unit 210 or any other suitable control unit, the second ultrasonic transducer 213 being operated so as to calibrate the frequency f at the second ultrasonic calibration frequency
cal2In a second transverse direction x
2And (4) oscillating upwards. Second ultrasonic calibration frequency f
cal2And may be, but is not limited to, a frequency of 20kHz to 120 kHz. Optionally, a second ultrasonic calibration frequency f
cal2The frequency f can be calibrated with the first ultrasound
cal1The same is true.
Operating the second ultrasonic transducer 213 to calibrate with the second ultrasoundFrequency f
cal2In a second transverse direction x
2The up-oscillation may include: the second control unit 210 (or another suitable control unit) causes the second power source 215 to provide the second calibration power P directly to the second ultrasonic transducer 213
cal2(t) as second power supply power P
2(t), and thus provides the average second calibration power directly to the second ultrasonic transducer 213<P
cal2(t)>As average secondary power supply power<P
2(t)>. Second calibration power P
cal2(t) and averaging the second calibration power accordingly<P
cal2>Is based on the second calibration control signal C
cal2Generated, second calibration control signal C
cal2Causing the second ultrasonic transducer 213 to be damped by the second mechanical damping with a second calibrated amplitude A
cal2And (6) oscillating. To this end, the second calibration control signal C
cal2The second power supply 215 may be provided directly as the second power supply input signal, e.g. when the second power correction unit 217 is omitted, or indirectly, e.g. via the second power correction unit 217 and the modified second calibration control signal C
cal2' supplied to the second power supply 215, the modified second calibration control signal C
cal2' is based on the second calibration control signal C by the second power correction unit 217
cal2Generated and provided to the second power supply 215 as a second power supply input signal.
Second calibration power P
cal2(t) as second power supply power P
2(t) directly providing to the second ultrasonic transducer 213 includes: will (AC) second calibration voltage V
cal2(t) and (AC) second calibration current I
cal2(t) directly to the second ultrasonic transducer 213, such that P
2(t)＝V
cal2(t)·I
cal2(t) of (d). Averaging the second calibration power<P
cal2(V
cal2(t)·I
cal2(t))>(also referred to simply as<P
cal2>) Can be passed according to equation (2)<P
cal2>＝<P
2(V
cal2(t)，I
cal2(t))>To calculate.
FIG. 8 shows the second calibration voltage V as a function of time t
cal2(t) and (AC) second calibration current I
cal2(t) of (d). First, theTwo calibration voltages V
cal2(t) and a second calibration current I
cal2(T) period T
2Is the second ultrasonic calibration frequency f
cal2Reciprocal of (i.e., T)
2＝1/f
cal2). As described above, the second power source 215 may include a current source that induces the second alternating current I
2(t) and a second alternating voltage V
2(t) a second control loop 216 (see fig. 3 and 6) that is in phase, e.g., a Phase Locked Loop (PLL). Thus, the second control loop 216 also causes a (alternating) second calibration current I
cal2(t) and (AC) a second calibration voltage V
cal2(t) are in phase, as shown in FIG. 8. As described above, the second control loop 216 may optionally cause the second (AC) transducer voltage V
2(t) and a second (AC) transducer current I
2(t) have zero crossings at the same or substantially the same time instants. Thus, the second control loop 216 may optionally cause a second (alternating current) calibration voltage V
cal2(t) and a second (alternating) calibration current I
cal2(t) have zero crossings at the same or substantially the same time instant, as also shown in fig. 8.
Calibrating the second bonder 2 based on the first bonder 1 may be performed based on a comparison measurement, wherein both the first ultrasonic transducer 113 and the second ultrasonic transducer 213 are mechanically damped identically and oscillate in a steady state. Has a first electrical parameter and powers the first ultrasonic transducer 113 to have it at a first calibrated amplitude a as described above
cal1The oscillating first calibration power signal is provided directly to the first ultrasonic transducer 113 and has the second electrical parameter and powers the second ultrasonic transducer 213 to cause it to be at the second calibration amplitude a as described above
cal2The oscillated second calibration power is directly supplied to the second ultrasonic transducer 213. Thus, the second electrical parameter is adjusted (e.g., by adjusting the second calibration power signal) such that the second calibration amplitude A
cal2With a first calibration amplitude A
cal1The same is true. The first electrical parameter and the second electrical parameter are used to calibrate the second bonder 2 based on the first bonder 1. For this purpose, the first and second electrical parameters or functions dependent on and/or representative of the first and second electrical parameters may be stored in a memory of the second bonding machine 2, for example at the second powerIn the memory of the correction unit 217. The stored first and second electrical parameters or the stored parameters or functions depending on and/or representing the first and second electrical parameters may then be used to modify one, more than one or each second control signal C based on the stored parameters or based on the stored functions based on the stored first and second electrical parameters
2。
The first electrical parameter and the second electrical parameter may be selected to be the same type of signal. According to a first example, the first electrical parameter may represent an average first electrical power according to equation (1)<P
cal1>＝<P
1(V
cal1(t)，I
cal1(t))>And the second electrical parameter may represent an average second electrical power according to equation (2)<P
cal2>＝<P2(V
cal2(t)，I
cal2(t))>. According to a second example, the first electrical parameter may represent a first calibration voltage V
cal1Amplitude V of (t)
cal10(see fig. 6), and the second electrical parameter may represent the second calibration voltage V
cal2Amplitude V of (t)
cal20(see fig. 8). Thus, the first calibration voltage V
cal1(t) and a second calibration voltage V
cal2(t) may have the same basic form (e.g., sinusoidal) such that V
cal2(t)＝C·V
cal1(t+Δt
12) Where C is a constant and where Δ t
12Is a constant that may also take on the value zero.
As used herein, the parameter q2 represents the parameter q1 when the parameter q1 can be derived from the parameter q 2. For example, a sinusoidal voltage V
SINAmplitude V of (t)
SIN0Can pass through
According to sinusoidal voltage V
SINRMS (root mean square) value V of (t)
RMSTo calculate. That is, the amplitude V
SIN0Can be derived from the RMS value V
RMSAnd (6) exporting. Therefore, the RMS value V
RMSRepresenting the magnitude V
SIN0. Since the parameter q1 can be derived from q1 itself, q1 is also considered to be a "parameter representing q 1".
Will now be based on the aboveA first example of a possible calibration procedure of a second bonding machine 2 based on a first bonding machine 1 is explained, wherein the first electrical parameter represents an average first electrical power according to equation (1)<P
cal1>＝<P
1(V
cal1(t)，I
cal1(t))>And the second electrical parameter represents an average second electrical power according to equation (2)<P
cal2>＝<P
2(V
cal2(t)，I
cal2(t))>. As shown in fig. 6 and 8, V
cal1(t) and V
cal2(t) may be a sinusoidal voltage.
(AC) first calibration voltage V
cal1(t) directly to the first ultrasonic transducer 113 and inducing a (alternating) first calibration current I by the first ultrasonic transducer 113
cal1(t), for example a sinusoidal current. As a result, the first ultrasonic transducer 113 is in the first transverse direction x as described above
1And (4) oscillating upwards. In a steady state, the first ultrasonic transducer 113 is in a first lateral direction x
1Has a first calibration amplitude A
cal1(fig. 5) and receiving the calibration signal with the average first calibration power<P
cal1(t)>First calibration power P
cal1(t) of (d). Similarly, a (alternating) second calibration voltage V
cal2(t) directly to the second ultrasonic transducer 213 and inducing a (alternating) second calibration current I by the second ultrasonic transducer 213
cal2(t), for example a sinusoidal current. As a result, the second ultrasonic transducer 213 is in the second transverse direction x as described above
2And (4) oscillating upwards. In a steady state, the second ultrasonic transducer 213 is in the second transverse direction x
2Has a second calibration amplitude A
cal2(FIG. 7) and receives the signal with the average second calibration power<P
cal2(t)>Second calibration power P
cal2(t) of (d). Thereby, the average second calibration power is adjusted<P
cal2(t)>So that a (steady state) second calibration amplitude A
cal2And a (steady state) first calibration amplitude A
cal1The same is true.
For example, the average second calibration power is adjusted appropriately<P
cal2(t)>The second calibration voltage V may be adjusted (regulated) (e.g., sinusoidal)
cal2Amplitude V of (t)
cal20(see fig. 8). Usually, for adjusting the average appropriatelySecond calibration power<P
cal2(t)>Are known in the art and are therefore not further described herein.
A second example of a possible calibration procedure of the second bonding machine 2 based on the first bonding machine 1 will now be explained based on the above example, where the first electrical parameter represents a (e.g. sinusoidal) first calibration voltage V
cal1Amplitude V of (t)
cal10(see fig. 6) and the second electrical parameter represents (e.g., sinusoidally) the second calibration voltage V
cal2Amplitude V of (t)
cal(see fig. 8).
(AC) first calibration voltage V
cal1(t) directly to the first ultrasonic transducer 113 and inducing a (alternating) first calibration current I by the first ultrasonic transducer 113
cal1(t), for example a sinusoidal current. As a result, the first ultrasonic transducer 113 is in the first transverse direction x as described above
1And (4) oscillating upwards. In a steady state, the first ultrasonic transducer 113 is in a first lateral direction x
1Has a first calibration amplitude A
cal1(FIG. 5). Similarly, a (alternating) second calibration voltage V
cal2(t) directly to the second ultrasonic transducer 213 and inducing a (alternating) second calibration current I by the second ultrasonic transducer 213
cal2(t), for example a sinusoidal current. As a result, the second ultrasonic transducer 213 is in the second transverse direction x as described above
2And (4) oscillating upwards. In a steady state, the second ultrasonic transducer 213 is in the second transverse direction x
2Has a second calibration amplitude A
cal2(FIG. 7). Thereby, the second calibration voltage V is adjusted
cal2(t) such that the (steady state) second calibration amplitude A
cal2And a (steady state) first calibration amplitude A
cal1The same is true.
For example, the second calibration voltage V is appropriately adjusted
cal2(t) the second calibration voltage V may be adjusted (regulated) (e.g., sinusoidal)
cal2Amplitude V of (t)
cal20(see fig. 8). In general, for adjusting the second calibration voltage V appropriately
cal2The methods of (t) are known in the art and, therefore, are not further described herein.
In summary, the knowledge resulting from the calibration process is: for the first ultrasoundThe energy device 113 and the second ultrasonic transducer 213 are the same specific mechanical damping, with the first calibration power P
cal1(t) powering the first ultrasonic transducer 113 and utilizing the second calibration power P
cal2(t) powering the second ultrasonic transducer 213 results in the same calibrated amplitude, A, of the ultrasonic transducers 113, 213
cal1＝A
cal2. (rough) calibration of the second bonder 2, in particular for calibrating the control signal C
cal2A different second control signal C
2May be based on the first calibration power P
cal1(t) a first electrical parameter and a second calibration power P
cal2(t) a second electrical parameter.
Substantially calibrating the second bonder 2 may include: adapting the second bonder 2 such that the second bonder 2 modifies the second control signal C based on a first electrical parameter of the first calibration power Pcal1 and a second electrical parameter of the second calibration power Pcal2
2In order to generate a modified second control signal C
2', such that the second bonder 2 will modify the second control signal C
2' is supplied to the second power source 215 so as to cause the second power source 215 to generate the second power source power P
2(t) and causing the second bonder 2 to apply the second power supply power P
2(t) to the second ultrasonic transducer 213.
For one, more than one or each second control signal C
2The calibrated second bonder 2 will generate a corresponding modified second control signal C
2'. Each modified second control signal C provided to an input of the second power supply 215
2' cause the second power source 215 to output the second power source power P to the second ultrasonic transducer 213
2(t) of (d). However, if the (unmodified) second control signal C
2In place of the modified second control signal C
2' provided to the input of the second power supply 215, then the (unmodified) second control signal C
2Will cause the second power source 215 to output unmodified second power source power P to the second ultrasonic transducer 213
2unmod(t) of (d). In other words, the second control signal C to be modified
2' instead of the (unmodified) second control signal C
2The input fed to the second power supply 215 causes the second power supply 215 to respond (modified)) Second power supply power P
2(t) instead of (unmodified) second power supply power P
2unmod(t) to the second ultrasonic transducer 213. Thus, for each second control signal C
2The corresponding modified second control signal C is distributed
2', corresponding (unmodified) second power supply power P
2unmod(t) and a (modified) second power supply power P for English
2(t)。
According to one embodiment, the second bonder 2 is adapted such that it is based on a first calibration power P
cal1First electrical parameter and second calibration power P
cal2To modify the second control signal C
2In order to generate a modified second control signal C
2' may be carried out by: adapting the second bonder 2 such that it is based on the first calibration power P
cal1First electrical parameter and second calibration power P
cal2To modify the second control signal C by the difference delta between the second electrical parameters
2In order to generate a modified second control signal C
2'。
For example, the second bonder 2 may be adapted to generate a modified second control signal C
2', so that the unmodified second power source power P
2unmod(t) electrical parameters and second power supply power P
2(t) the difference Δ between the electrical parameters is equal to the first calibration power P
cal1First electrical parameter and second calibration power P
cal2Is measured by the difference between the second electrical parameters of (a). Thus, the unmodified second power source power P
2unmod(t) electrical parameter, second power supply power P
2(t) electrical parameter, first calibration power P
cal1First electrical parameter and second calibration power P
cal2May be of the same parameter type, for example average power or average voltage or voltage amplitude or another parameter type.
For example, if the parameter type is average power, the unmodified second power supply power P
2unmod(t) electrical parameter, second power supply power P
2(t) electrical parameter, first calibration power P
cal1First electrical parameter and second calibration power P
cal2Respectively is P
2unmod(t)、P
2(t)、P
cal1And P
cal2The average power of (c). Alternatively, if the parameter type is voltage amplitude, the unmodified second power source power P
2unmod(t) electrical parameter, second power supply power P
2(t) electrical parameter, first calibration power P
cal1First electrical parameter and second calibration power P
cal2Is to generate electric power P separately together with the associated current
2unmod(t)、P
2(t)、P
cal1And P
cal2Voltage amplitude of the voltage of (a). Alternatively, if the parameter type is an average voltage, the unmodified second power supply power P
2unmod(t) electrical parameter, second power supply power P
2(t) electrical parameter, first calibration power P
cal1First electrical parameter and second calibration power P
cal2Is to generate electric power P separately together with the associated current
2unmod(t)、P
2(t)、P
cal1And P
cal2The average voltage of the voltages of (a).
If the electric power P is
2unmod(t)、P
2(t)、P
cal1And P
cal2Are generated from an alternating voltage and an alternating current which are proportional to each other (so that they are in phase, have zero crossings at the same time instants, and have a constant real-valued impedance of the respective first ultrasonic transducer 113 or second ultrasonic transducer 213 as a scaling factor), it is of particular interest to use the voltage amplitude or the average voltage as the type of parameter.
According to an example, the second bonder 2 may be adapted to a plurality of or each different second control signal C
2Generating a corresponding modified second control signal C
2', such that for the second control signal C
2And a corresponding modified second control signal C
2' of the corresponding unmodified second power source power P
2unmod(t) electrical parameters and second power supply power P
2(t) a difference Δ between the electrical parameter and the first calibration power P
cal1First electrical parameter and second calibration power P
cal2Are the same and equal.
For example, assume that there are multiple pairsDifferent first control signal C
1X(X) A, B, C, used as the first control signal C
1When (i.e., C)
1＝C
1XSee fig. 1), each first control signal C
1XCausing a corresponding first amplitude A of the first ultrasonic transducer 113
1＝A
1X. For example, the first control signal C
1XMay be provided by the first control unit 110 of the first bonder 1. First control signal C
1XMay also be provided as an external input signal to the first bonder 1. These first control signals C in order to define the desired bonding profile
1XMay then, for example, be provided directly to the input of the first power source 115 and cause the first power source 115 to output corresponding electrical power to the first ultrasonic transducer 113. Conversely, the corresponding electrical power output to the first ultrasonic transducer 113 may cause the first ultrasonic transducer 113 to have a corresponding first amplitude a
1＝A
1X(X.: A, B, C) was oscillated.
It is obviously advantageous if identical pairs of different first control signals C
1X(X.: A, B, C.) is used as the second control signal C for the second bonding machine 2
2X(X. A, B, C..) or (i.e., C)
2＝C
2XSee fig. 3), resulting in a corresponding first amplitude a
1XCorresponding second amplitudes A of substantially identical second ultrasonic transducers 213
2＝A
2X(X.: A, B, C). In other words, even though the first ultrasonic transducer 113 and the second ultrasonic transducer 213 may behave differently, it may be desirable to substantially calibrate the second bonder 2 such that a corresponding first amplitude a of the first ultrasonic transducer 113 is induced
1XEach first control signal C
1XIn use as the second control signal C
2XWhen it is caused to react with A
1XCorresponding second amplitude A of the same or substantially the same second ultrasonic transducer 213
2X(i.e., C)
2X＝C
1XCause A
2XAnd A
1XIdentical or substantially identical; x A, B, C.
The related calibration procedure will now be explained in more detail with reference to fig. 9. According to FIG. 9(a), each second control signal C
2X(X＝A、B、C、...) is provided to the second power correction unit 217 and is modified by the second power correction unit 217 to obtain a corresponding modified second control signal C
2X' (X. A, B, C.. multidot.), a modified second control signal C
2X' when provided to the input of the second power source 215, causes the second power source 215 to output a corresponding second power signal P to the second ultrasonic transducer 213
2X(t) of (d). In turn, each second power signal P
2X(t) causing the second ultrasonic transducer 213 to have a corresponding second amplitude A
2XAnd (6) oscillating. In fig. 9(b), the unmodified second control signal C is shown
2X(X.: A, B, C..) when provided to the input of the second power source 215 causes the second power source 215 to output a corresponding unmodified second power signal P to the second ultrasonic transducer 213
2unmodX(t)。
As described above, the first calibration power P may be identified
cal1First electrical parameter and second calibration power P
cal2Is measured by the difference between the second electrical parameters of (a). This same difference Δ is used to modify each second control signal C by the second power correction unit 217 (fig. 9(a))
2X(X) A, B, C, so that the unmodified second power source power P is supplied
2unmodX(t) electrical parameters and second power supply power P
2XThe difference Δ between the electrical parameters of (t) is equal to the difference Δ. Thus, the unmodified second power source power P
2unmodX(t) electrical parameter, second power supply power P
2X(t) electrical parameter, first calibration power P
cal1First electrical parameter and second calibration power P
cal2May be of the same parameter type, for example average power or average voltage or voltage amplitude or another parameter type.
Second power supply power P
2X(t) is for the second supply voltage V
2X(t) and a corresponding second supply current I
2XThe product of (t), i.e. P
2X(t)＝V
2X(t)·I
2X(t) (X. A, B, C). Thus, the unmodified second power source power P
2unmodX(t) is the corresponding unmodified second supply voltage V
2unmodX(t) and a corresponding unmodified second supply current I
2unmodXThe product of (t), i.e. P
2unmodX(t)＝V
2unmodX(t)·I
2unmodX(t)(X＝A、B、C、......)。
If the parameter type is average power, the second control signal C may be used
2XModified to a corresponding modified second control signal C
2X', such that<P
2unmodX(t)>-<P
2X(t)>＝<P
cal1(t)>-<P
cal2(t)>Δ ═ constant (X ═ A, B, C). For example, the average power may be calculated according to equations (1) and (2).
If the parameter type is voltage amplitude, the second control signal C may be applied
2XModified to a corresponding modified second control signal C
2X', make V
2unmodX0-V
2X0＝V
cal10-V
cal20Δ ═ constant, where V
2unmodX0Is V
2unmodA(t) voltage amplitude and V
2X0Is V
2X(t) (X) is A, B, C.
If the parameter type is an average voltage, the second control signal C may be applied
2XModified to a corresponding modified second control signal C
2XSo that<V
2unmodX(t)>-<V
2X(t)>＝<V
cal1(t)>-<V
cal2(t)>Δ ═ constant (X ═ A, B, C). The average voltage may be determined accurately or approximately using any averaging method. For example, the voltage to be averaged may pass through a low pass filter that outputs the averaged voltage. Alternatively or additionally, the voltage v (t) to be averaged may be calculated based on a known shape (e.g., sinusoidal shape) and a known amplitude, for example by the following equation:
where t is time, n
3Is a positive integer (i.e., n)
3≥1)，t
3Is the point in time at which the average calculation starts, T
3Is the period of oscillation of the voltage v (t) to be averaged. The parameter n can be selected
3Has a low value. E.g. n
3May be, but is not limited to, a range from 1 to 10 or 4 to 10And (4) selecting in the enclosure.
During the above calibration procedure, the ultrasonic transducers 113, 213 are equally (mechanically) damped using the same damping device 400 or a damping device 400 of the same construction.
According to a first example, the damping device 400 may be an elastic pad having a shore hardness of more than 60 shore a (which corresponds approximately to 16 shore D), for example more than 60 shore a and less than 100 shore a (which corresponds approximately to 58 shore D) at a temperature of 23 ℃. Suitable materials include, but are not limited to, for example, ethylene-propylene-diene monomer (EPDM) rubber or cellular materials, such as acrylonitrile-butadiene rubber (NBR).
According to a second example, the damping device 400 may be a semiconductor chip, and the pressure force F
calAnd may be greater than zero.
According to a third example shown in fig. 10, the damping device 400 may be a damping clamp that clamps the respective tool tip 112, 212. Pressure F
calAnd may be zero or greater than zero.
According to a fourth example shown in fig. 11, the damping device 400 may be a fluid (e.g., a liquid) in which the respective tool tip 112, 212 is immersed and pressure F
calIs zero (i.e., no pressure).
According to a fifth example shown in fig. 12, the damping device 400 may act directly on the transducers 113, 213 and the pressure F
calAnd may be zero or greater than zero. For example, the damping means 400 may be an elastic pad which is in physical contact with the transducers 113, 213 and may have material properties such as mentioned in relation to the first example. Alternatively, the damping device 400 may directly contact the bonding tool 111, 211 mechanically coupled to the transducer 113, 213 in a region proximate to the transducer 113, 213 but distal from the respective tool tip 112, 212. That is, the damping device 400 may directly contact the bonding tool 111, 211 at a (center) distance from the respective tool tip 112, 212 that is equal to the (center) distance d1, d2 between the respective transducer 113, 213 and the tool tip 112 of the respective bonding tool 111, 211. In each of the noted alternatives, the damping device 400 may be distal to the respective tool tip 112, 212 and proximal to the respective transducer 113, 213To damp the force F in a direction parallel to the transverse direction x (i.e. the direction of oscillation of the transducer 113, 213)
400Pressing against the unit formed by the respective transducer 113, 213 and the respective bonding tool 111, 211.
In each of the examples described above, the first calibrated amplitude a of the first ultrasonic transducer 113 of the first bonder 1
cal1And a second calibrated amplitude a of the second ultrasonic transducer 213 of the second bonder 2
cal2At least one of which may be determined by laser vibrometry. For example, the laser system 500 may be employed to determine a first calibration amplitude a of the first ultrasonic transducer 113 of the first bonder 1 using a laser beam 501 (see fig. 5)
cal1. Thus, the same or a different laser system 500 may be employed to determine a second calibration amplitude a of the second ultrasonic transducer 213 of the second bonder 2 using the laser beam 501 (see fig. 6)
cal2. As shown in fig. 5 and 6, the first calibration amplitude a
cal1And a second calibration amplitude A
cal2May be determined directly at the respective ultrasonic transducer 113, 213 (i.e., the laser beam 501 is incident on the respective ultrasonic transducer 113, 213), or indirectly (e.g., when the laser beam 501 is incident on a point away from the tool tip 112, 212 mechanically coupled to the respective ultrasonic transducer 113, 213 and on the bonding tool 111, 211, proximate to the respective transducer 113, 213).
Fig. 13 shows part of a method 1000 for calibrating a second bonding machine 2 based on a calibrated first bonding machine 1 based on the example explained above. In the method 1000, a first calibration voltage V is provided by providing a first ultrasonic transducer 113 with a first calibration voltage
cal1(t) and a first calibration current I
cal1(t) to oscillate (1002) the first ultrasonic transducer 113.
A first ultrasonic transducer 113(1004) that damps the oscillation with a first damping. According to a first calibration voltage V
cal1(t) and a first calibration current I
cal1(t) to determine a first electrical parameter and to determine a first oscillation amplitude A of the oscillating and suppressed first ultrasound transducer 113
cal1(1006). By supplying a second calibration voltage V to the second ultrasonic transducer 213
cal2(t) and a second calibration current I
cal2(t) subjecting the second ultrasound toThe transducer 213 oscillates 1008. A second ultrasonic transducer 213(1010) that damps the oscillation with a second damping that is the same as the first damping. According to a second calibration voltage V
cal2(t) and a second calibration current I
cal2(t) to determine the oscillating and dampened second ultrasonic transducer 213 to oscillate with a first oscillation amplitude A
cal1Equal second oscillation amplitude A
cal2A second electrical parameter at which to oscillate (1012). Thus, the first electrical parameter and the second electrical parameter may have the same parameter type, e.g. average power or average voltage or voltage amplitude or another parameter type.
With reference to fig. 14, a method 2000 of bonding a first type bonding partner 301 'to a second type bonding partner 302' using a calibrated second bonder 2 will be explained. Initially, the second bonder 2 is calibrated based on the calibrated first bonder 1 (2002). Calibration may be performed as described above.
Subsequently, the first type bonding partner 301 'is bonded to the second type bonding partner 302' using the calibrated second bonder 2, whereby Statistical Process Control (SPC) may be performed (2004). If the SPC data is correct (i.e., the bonding result is acceptable), there is no need to recalibrate the second bonding machine 2, and the process of bonding the first type bonding partner 301 'to the second type bonding partner 302' using the calibrated second bonding machine 2 may continue ("yes" of 2006). However, if the SPC data is incorrect (i.e. the bonding result is not acceptable or acceptable but expected to become unacceptable) ("no" of 2006), the second bonding machine 2 is (re) calibrated based on the or another calibrated first bonding machine 1 (2002) and the process may repeat, and so on.
In the above-described method and modification, the first and second bonding partners have been described as forming part of an electronic circuit. However, the disclosed principles are also applicable to any other first and second bonding partners.
In the above-described example, the components of the first drive unit 100 (e.g., the first control unit 110, the first power supply 115, the first power correction unit 117, and the first pressing device driver 118) have been described as individual components. However, firstAny two or more components of the drive unit 100 may be combined to form a single unit. Furthermore, at least some components of the first drive unit 100 may be implemented at least partially in software. The same applies analogously to the components of the second drive unit 200. Further, for clarity, the average of all signals (e.g., first electrical power, second electrical power, etc.) has been described as passing through one or more complete oscillation periods (e.g., T) of the respective signals
1、T
2) And is calculated by averaging the corresponding signals. However, each of these average values may be determined by any method known in the art. Thus, one or more complete oscillation periods (e.g., T) based on the corresponding signal are not required
1、T
2) To form an average of the respective signals. For example, the average of the signal may be a moving average. Such a moving average may be derived, for example, by low-pass filtering the respective signals. It is also possible to sample the signal to be averaged at predetermined time instants and to calculate an average value based on the acquired sample values.
