阅读说明：本技术 切断多层基板的方法以及切断装置 (Method and apparatus for cutting multilayer substrate ) 是由 上野勉 于 2019-06-24 设计创作，主要内容包括：本发明涉及切断多层基板的方法以及切断装置,其在具有粘接层的多层基板的使用激光照射的切断中,抑制因激光照射产生的热而熔化的粘接层向外部喷出。将包括第一PET层(L2)、PI层(L1)、第二PET层(L3)、第一粘接层(L4)、第二粘接层(L5)的柔性OLED(多层基板)切断的方法包括第一激光切断步骤、第二激光切断步骤、滚轮切断步骤。在第一激光切断步骤中,通过激光(L)的照射在第一PET层以及第一粘接层形成第一槽(G1)。在第二激光切断步骤中,在第一激光切断步骤后,通过激光的照射以与第一槽对应的方式在第二PET层以及第二粘接层形成第二槽(G2)。在滚轮切断步骤中,一边使刻划轮(SW)通过第一槽或第二槽,一边在PI层形成切断线(SL)。(The present invention relates to a method and apparatus for cutting a multilayer substrate having an adhesive layer, which can prevent the adhesive layer melted by heat generated by laser irradiation from being ejected to the outside in cutting of the multilayer substrate by laser irradiation. The method for cutting the flexible OLED (multilayer substrate) including the first PET layer (L2), the PI layer (L1), the second PET layer (L3), the first adhesive layer (L4), and the second adhesive layer (L5) includes a first laser cutting step, a second laser cutting step, and a roller cutting step. In the first laser cutting step, a first groove (G1) is formed in the first PET layer and the first adhesive layer by irradiation with a laser beam (L). In the second laser cutting step, after the first laser cutting step, a second groove is formed in the second PET layer and the second adhesive layer so as to correspond to the first groove by irradiation with laser light (G2). In the roller cutting step, a cutting line (SL) is formed in the PI layer while passing the Scribing Wheel (SW) through the first groove or the second groove.)

1. A method of cutting a multilayer substrate including a first PET layer, a PI layer, a second PET layer, a first adhesive layer adhering the first PET layer to the PI layer, and a second adhesive layer adhering the second PET layer to the PI layer, wherein,

the method for cutting off the multilayer substrate comprises the following steps:

a first laser cutting step of forming a first groove in the first PET layer and the first adhesive layer by laser irradiation;

a second laser cutting step of forming a second groove in the second PET layer and the second adhesive layer so as to correspond to the first groove by laser irradiation after the first laser cutting step; and

and a roller cutting step of forming a cut portion in the PI layer while passing a roller cutting mechanism through the first groove or the second groove after the second laser cutting step.

2. The method of cutting a multilayer substrate according to claim 1,

in the first groove or the second groove, at least in the roller cutting step, the opening angle of the groove through which the roller cutting mechanism passes is in the range of 45-100 degrees.

3. The method of cutting a multilayer substrate according to claim 1 or 2,

in the first groove or the second groove, the width of the groove through which the roller cutting mechanism passes at least in the roller cutting step is in the range of 40 to 200 μm.

4. A multilayer substrate cutting device, which is a device for cutting a multilayer substrate including a first PET layer, a PI layer, a second PET layer, a first adhesive layer adhering the first PET layer to the PI layer, and a second adhesive layer adhering the second PET layer to the PI layer, wherein,

the multilayer substrate cutting device includes:

a laser cutting mechanism that forms a first groove in the first PET layer and the first adhesive layer by laser irradiation, and forms a second groove in the second PET layer and the second adhesive layer so as to correspond to the first groove; and

and a roller cutting mechanism that forms a cutting portion in the PI layer while passing through the first groove or the second groove after the first groove and the second groove are formed.

Technical Field

The present invention relates to a method and an apparatus for cutting a multilayer substrate such as a flexible OLED (organic LED).

Background

As a method of cutting a multilayer substrate such as an OLED substrate, a method of forming a cutting line along a desired line by irradiating laser light from one surface has been known (for example, see patent document 1).

In the multilayer substrate described above, different materials are often used in the respective layers. In this case, it is necessary to form the cutting lines using different light sources for the respective layers of the multilayer substrate, and the device structure for cutting the multilayer substrate becomes complicated.

In addition, when a circuit is formed in one resin layer of a multilayer substrate, as in the case of an OLED substrate, the resin layer may be carbonized when the resin layer is cut with laser light. When graphite formed by carbonization of the resin layer extends across the wiring, the graphite having conductivity may short-circuit the circuit.

Therefore, a method of forming a cutting line by using a scribing wheel for a part of layers (particularly, layers on which a circuit is formed) in cutting a multilayer substrate is considered.

For example, in an OLED having a structure in which a Polyimide (PI) layer having a light-emitting layer is formed and polyethylene terephthalate (PET) layers are bonded to both surfaces of the polyimide layer through an adhesive layer, a groove is formed by removing one of the PET layers and the adhesive layer by laser irradiation, and a scribe wheel is passed through the groove to form a cut line in the PI layer.

Disclosure of Invention

Problems to be solved by the invention

The purpose of the present invention is to suppress the adhesive layer from being ejected to the outside by the heat of laser irradiation in cutting a multilayer substrate such as an OLED having the adhesive layer by laser irradiation.

Means for solving the problems

Hereinafter, a plurality of embodiments will be described as means for solving the problem. These modes can be arbitrarily combined as needed.

A method of cutting a multilayer substrate such as a flexible OLED according to one aspect of the present invention is a method of cutting a multilayer substrate including a first PET layer, a PI layer, a second PET layer, a first adhesive layer, and a second adhesive layer. The first adhesive layer adheres the first PET layer to the PI layer. A second adhesive layer adheres the second PET layer to the PI layer. The method for cutting a multilayer substrate includes the following steps.

◎ is a first laser cutting step of forming a first groove in the first PET layer and the first adhesive layer by laser irradiation.

◎ a second laser cutting step of forming a second groove in the second PET layer and the second adhesive layer so as to correspond to the first groove by laser irradiation after the first laser cutting step.

◎ a roller cutting step of forming a cutting part in the PI layer after the second laser cutting step while passing the roller cutting mechanism through the first groove or the second groove.

In the cutting method, the first groove is formed in the first PET layer and the second adhesive layer by laser irradiation, the second groove is formed in the second PET layer and the second adhesive layer, and then the cutting section is formed in the PI layer by the roller cutting mechanism. Since the cut portion is not formed in the PI layer after one of the first groove and the second groove is formed, the adhesive layer melted in the process of forming the other of the first groove and the second groove by laser irradiation can be prevented from being ejected to the outside through the cut portion, for example. That is, the PI layer serves as a "cap", and thus, the melted adhesive layer can be prevented from being ejected to the outside.

In the first groove or the second groove, an opening angle of the groove through which the roller cutting mechanism passes at least in the roller cutting step may be in a range of 45 to 100 degrees.

Thus, the first groove or the second groove through which the roller cutting mechanism passes functions as a "guide", and the cut portion formed by the roller cutting mechanism can be prevented from largely deviating from the original line.

In the first groove or the second groove, the width of the groove through which the roller cutting mechanism passes at least in the roller cutting step may be in the range of 40 to 200 μm.

Thus, the first groove or the second groove through which the roller cutting mechanism passes functions as a "guide", and the cut portion formed by the roller cutting mechanism can be prevented from largely deviating from the original line.

A multilayer substrate cutting apparatus according to another aspect of the present invention is an apparatus for cutting a multilayer substrate including a first PET layer, a PI layer, a second PET layer, a first adhesive layer for bonding the first PET layer to the PI layer, and a second adhesive layer for bonding the second PET layer to the PI layer. The cutting device includes a laser cutting mechanism and a roller cutting mechanism.

The laser cutting mechanism forms a first groove in the first PET layer and the first adhesive layer by laser irradiation, and forms a second groove in the second PET layer and the second adhesive layer so as to correspond to the first groove.

The roller cutting mechanism forms the first groove and the second groove, and then forms a cutting part on the PI layer while passing through the first groove or the second groove.

In the cutting device described above, the laser cutting mechanism forms the first groove in the first PET layer and the second adhesive layer, and the roller cutting mechanism forms the cutting portion in the PI layer after the second groove is formed in the second PET layer and the second adhesive layer. Since the cut portion is not formed in the PI layer after one of the first groove and the second groove is formed, the adhesive layer melted in the process of forming the other of the first groove and the second groove by laser irradiation can be prevented from being ejected to the outside through the cut portion, for example. That is, the PI layer serves as a "cap", and thus, the melted adhesive layer can be prevented from being ejected to the outside.

Effects of the invention

When the groove is formed in the PET layer of the multilayer substrate by laser irradiation, the adhesive layer melted by heat generated by the laser irradiation can be prevented from being ejected to the outside.

Drawings

Fig. 1 is a view showing a cross-sectional structure of an OLED substrate.

Fig. 2 is a diagram showing the overall structure of the cutting apparatus.

Fig. 3 is a diagram schematically showing a cutting operation of the OLED substrate.

Fig. 4 is a diagram showing the definition of the opening angle and the groove width.

Description of the reference numerals

1 a cutting device; 3, a laser device; 5 scribing wheel cutting device; an SW scribing wheel; 7 a mechanical drive system; 11 a base; 13 a processing table; 15 moving the device; 9 a control unit; l laser; a P1OLED substrate; a layer of L1 PI; l2 first PET layer; l3 second PET layer; l4 first adhesive layer; l5 second adhesive layer; g1 first groove; g2 second groove; an SL cut line; w groove width; theta opening angle.

Detailed Description

1. First embodiment

(1) Structure of flexible OLED

Hereinafter, a method for cutting a multilayer substrate according to an embodiment of the present invention will be described. In the present embodiment, a flexible OLED (hereinafter referred to as an OLED substrate P1) is used as an example of a multilayer substrate to be cut.

Therefore, first, the structure of OLED substrate P1 will be described with reference to fig. 1. Fig. 1 is a view showing a cross-sectional structure of an OLED substrate.

As shown in fig. 1, the OLED substrate P1 has a three-layer structure having a PI layer L1, a first PET layer L2, and a second PET layer L3.

The PI layer L1 is a substrate made of Polyimide (PI), and an OLED (organic LED) is formed on one surface. Specifically, for example, a light-emitting layer, a driving element (for example, a TFT (thin film transistor)) for controlling light emission of the light-emitting layer, and a wiring of an OLED are formed.

The first PET layer L2 and the second PET layer L3 are films made of polyethylene terephthalate (PET), and protect the OLED formed on the surface of the PI layer L1.

The first PET layer L2 was bonded to one surface of the PI layer L1 via a first adhesive layer L4. The first adhesive layer L4 is formed of, for example, an acrylic or urethane adhesive.

On the other hand, the second PET layer L3 is bonded to the other surface of the PI layer L1 by a second adhesive layer L5. The second adhesive layer L5 is formed of, for example, an acrylic or urethane adhesive.

Of the first PET layer L2 and the second PET layer L3, the PET layer on the side where the groove into which the scribing wheel SW (described later) is inserted is formed is the back side of the OLED substrate P1, and the PET layer on the opposite side of the back side is the light emitting surface side of the OLED substrate P1.

(2) Cutting device

Next, the structure of the cutting apparatus 1 of the present embodiment will be described with reference to fig. 2. Fig. 2 is a diagram showing the overall structure of the cutting apparatus. The cutting apparatus 1 is an apparatus for cutting the OLED substrate P1 having the above-described structure using laser irradiation and a scribing wheel.

The cutting device 1 includes a laser device 3 (an example of a laser cutting mechanism), a scribing wheel cutting device 5, a mechanical drive system 7, and a control unit 9.

The laser device 3 is a device for irradiating the OLED substrate P1 with laser light L. The laser device 3 includes a laser oscillator that outputs a laser beam L, and a transmission optical system (both not shown) that transmits the laser beam L to a mechanical drive system 7 described later. Although not shown, the transmission optical system includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. The transfer optical system includes, for example, an X-axis direction moving mechanism (not shown) for moving a laser irradiation head (not shown) incorporating a laser oscillator and other optical systems in the X-axis direction. The laser oscillator of the laser device 3 is, for example, CO ₂A laser.

The scribing wheel cutting device 5 is a device for cutting the substrate by rolling a scribing wheel SW (an example of a roller cutting mechanism). In the present embodiment, the scribing wheel cutting device 5 is used to form a cutting line (an example of a cutting portion) in the PI layer L1 of the OLED substrate P1.

The scribing wheel SW is a disk-shaped member having a V-shaped outer peripheral portion. The outer peripheral portion of the scribing wheel SW becomes a blade for forming a cutting line in the PI layer L1. The scribing wheel SW has a diameter of, for example, 5 to 15mm, and the apex angle of the V-shaped blade tip is set to 20 to 50 degrees.

The mechanical drive system 7 includes a base 11, a processing table 13 on which the OLED substrate P1 is placed, and a moving device 15 that moves the processing table 13 in the horizontal direction with respect to the base 113. The moving device 15 is a well-known mechanism including a guide rail, a moving table, a motor, and the like.

The control section 9 is a computer system having a processor (e.g., CPU), a storage device (e.g., ROM, RAM, HDD, SSD, etc.), and various interfaces (e.g., a/D converter, D/a converter, communication interface, etc.). The control unit 9 executes a program stored in a storage unit (corresponding to a part or all of a storage area of the storage device) to perform various control operations.

The control unit 9 may be constituted by a single processor, or may be constituted by a plurality of independent processors for performing respective controls.

Although not shown, a sensor for detecting the size, shape, and position of OLED substrate P1, a sensor and a switch for detecting the state of each device, and an information input device are connected to control unit 9.

In the present embodiment, the control unit 9 can control the laser device 3. The control unit 9 can control the scribing wheel cutting device 5. The control unit 9 can control the moving device 15.

(3) Cutting method of OLED substrate

The cutting operation of the OLED substrate P1 by the laser beam L and the scribing wheel SW will be described with reference to fig. 3. Fig. 3 is a diagram schematically showing a cutting operation of the OLED substrate.

First, as shown in fig. 3 (a), the OLED substrate P1 was disposed on the processing table 13 such that the first PET layer L2 faced upward. Subsequently, the laser apparatus 3 irradiates laser light L toward the first PET layer L2. The laser device 3 and/or the OLED substrate P1 is moved while the laser beam L is irradiated, and the laser beam L is irradiated along a desired line. Thereby, the first PET layer L2 and the first adhesive layer L4 of the portion irradiated with the laser beam L are removed, and the first groove G1 is formed along the desired line (first laser cutting step).

After the first groove G1 is formed in the first PET layer L2 and the first adhesive layer L4, the OLED substrate P1 is inverted as shown in fig. 3 (b). Thus, the second PET layer L3 of the OLED substrate P1 faces upward.

As shown in fig. 3 (c), the surface of the second PET layer L3 is irradiated with laser light L so as to correspond to the first groove G1. Thereby, the second PET layer L3 and the second adhesive layer L5 of the portion irradiated with the laser light L are removed, and the second groove G2 is formed so as to correspond to the first groove G1 (second laser cutting step).

At this time, since the formation trace of the first groove G1 can be visually confirmed from the second PET layer L3 side, the laser light L is irradiated along the formation trace of the first groove G1. Thereby, the second groove G2 corresponding to (overlapping) the cutting line SL can be formed.

In the present embodiment, in the second laser cutting step, when the second PET layer L3 and the second adhesive layer L5 are irradiated with the laser light L, the focal point of the laser light L is narrowed as much as possible, and the position of the focal point is set on the surface of the second PET layer L3.

As a result, as shown in fig. 3 (c), the first groove G1 having a small opening angle θ and a small groove width W can be formed. Specifically, for example, the second grooves G2 having the opening angle θ in the range of 45 ° to 100 ° and/or the groove width in the range of 40 μm to 200 μm can be formed.

As shown in fig. 4 (a), the opening angle θ is defined as an angle formed by two side walls of the groove forming the PET layer. On the other hand, as shown in fig. 4 (b), the groove width W is defined as the distance between the edges of the first groove G1. Fig. 4 is a diagram showing the definition of the opening angle of the groove and the groove width.

The opening angle θ and/or the groove width W of the first groove G1 can be adjusted by adjusting the position of the focal point of the laser light L (the position in the height direction of the OLED substrate P1).

The irradiation conditions (focal positions) of the laser light L in forming the second grooves G2 may be the same as or different from the irradiation conditions (focal positions) in forming the first grooves G1.

By setting the irradiation conditions of the laser light L in forming the second groove G2 to be the same as those in forming the first groove G1, the second groove G2 having substantially the same shape as the first groove G1 (the opening angle θ and the groove width W are substantially the same as those of the first groove G1) can be formed.

Further, by setting the irradiation conditions of the laser light L to be the same, it is not necessary to further apply the irradiation conditions every time the groove is formed, and therefore the cutting efficiency of the OLED substrate P1 can be improved.

Referring back to fig. 3, after the second groove G2 is formed, the scribing wheel SW is passed through the second groove G2, and the scribing wheel SW is rolled while the blade edge of the scribing wheel SW is pressed into the PI layer L1 by applying a predetermined load (roller cutting step) while the scribing wheel cutting device 5 and/or the OLED substrate P1 are moved, as shown in fig. 3 (d).

As the load applied from the scribing wheel SW to the PI layer L1, for example, a load of 0.15MPa to 0.20MPa can be used.

By moving the scribing wheel cutting device 5 and/or the OLED substrate P1 and moving the scribing wheel SW along the first groove G1 while rolling, as shown in fig. 3 (d), a cutting line SL can be formed on the PI layer L1 along the first groove G1 and the second groove G2.

As described above, at least for the passage of the scribing wheel SW through the second groove G2, the opening angle θ is in the range of 45 ° to 100 ° and/or the groove width is in the range of 40 μm to 200 μm, for example.

Thus, the second groove G2 through which the scribing wheel SW passes functions as a "guide", and the cutting line SL formed by the scribing wheel SW can be prevented from largely deviating from the original line.

After the cutting line SL is formed, the first groove G1, the second groove G2, and the cutting line SL are repeatedly formed on a predetermined line of the OLED substrate P1 (for example, the cutting line of the OLED substrate P1). As a result, OLED substrate P1 is cut along the predetermined line.

In this way, in the method for cutting the OLED substrate P1 according to the present embodiment, the first groove G1 is formed in the first PET layer L2 and the first adhesive layer L4, the second groove G2 is formed in the second PET layer L3 and the second adhesive layer L5, and then the cutting line SL is formed in the PI layer by the scribing wheel SW.

Since the cutting line SL is not formed in the PI layer after one of the first groove G1 and the second groove G2 is formed, the adhesive layers (the first adhesive layer L4 and the second adhesive layer L5) melted in the process of forming the other of the first groove G1 and the second groove G2 by laser irradiation can be prevented from being discharged to the processing table 13 through the cutting line SL, for example. That is, the PI layer L1 serves as a "cover" and can prevent the melted adhesive layer from being discharged to the processing table 13.

In the cutting method described above, the melted adhesive layer (adhesive) does not blow out and adheres to the processing table 13. Therefore, the following can be suppressed: the adhesive adheres to the OLED substrate P1 and the other OLED substrate P1 being cut, so that the light-emitting surface of the OLED substrate P1 is contaminated by the adhesive adhering thereto, and/or the adhesive carbonized by heating adheres to between the wirings to cause short-circuiting between the wirings. As a result, the yield of the OLED element can be improved.

In the cutting method described above, since the ejection of the adhesive to the processing table 13 during the cutting of the OLED substrate P1 is suppressed, it is not necessary to perform processing such as recessing the portion of the processing table 13 corresponding to the cut portion of the OLED substrate P1.

2. Other embodiments

While one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, the plurality of embodiments and modifications described in the present specification can be combined as desired.

The cutting method of the OLED substrate P1 described above can also be applied to a multilayer substrate formed of a plurality of resin layers other than the OLED substrate P1. The cutting method described above can also be applied to a multilayer substrate having a layer (for example, a metal layer) other than the resin layer.

In the cutting of the PI layer L1 using the scribing wheel SW, after the second groove G2 is formed, the OLED substrate P1 is again inverted so that the first groove G1 faces upward, and the cutting line SL can be formed in the PI layer L1 while the scribing wheel SW passes through the first groove G1.

In this case, it is preferable that the opening angle θ is in the range of 45 ° to 100 ° and/or the groove width is in the range of 40 μm to 200 μm in at least the first groove G1 through which the scribing wheel SW passes.

Thus, the first groove G1 through which the scribing wheel SW passes functions as a "guide", and the cutting line SL formed by the scribing wheel SW can be prevented from largely deviating from the original line.

In the above, the OLED substrate P1 has three layers (PI layer L1, first PET layer L2, second PET layer L3), but the cutting method described above can be applied to a substrate having 2 layers and a substrate having 4 or more layers.

The configurations of the laser device 3, the scribing wheel cutting device 5, and the mechanical drive system 7 are not limited to those described in the above embodiments.

The shape of OLED substrate P1 is not particularly limited.

Industrial applicability

The invention can be widely applied to cutting off the flexible OLED.