阅读说明：本技术 镜头封装模组及其制作方法 (Lens packaging module and manufacturing method thereof ) 是由 李怡志 于 2020-04-21 设计创作，主要内容包括：一种镜头封装模组的制作方法,包括：提供一电路板,所述电路板具有一第一光通道；在所述电路板上贴装至少一表面接着元件,且电连接所述表面接着元件与所述电路板；将带有所述表面接着元件的所述电路板置于一模具中并注胶,以在所述电路板上形成一包覆所述表面接着元件的封胶体层,所述封胶体层包括一第二光通道,所述第二光通道正对所述第一光通道；对形成封胶体层后的所述电路板进行表面处理；及提供一滤光元件,并将所述滤光元件固定在所述第二光通道内且面向所述第一光通道。本发明还涉及一种镜头封装模组。本发明提供的镜头封装模组及其制作方法能够改善注胶过程对芯片的污染、毁损且能够降低成本。(A method for manufacturing a lens packaging module comprises the following steps: providing a circuit board, wherein the circuit board is provided with a first optical channel; mounting at least one surface-mounted element on the circuit board, and electrically connecting the surface-mounted element and the circuit board; placing the circuit board with the surface-mounted element in a mold and injecting glue to form a glue sealing layer which covers the surface-mounted element on the circuit board, wherein the glue sealing layer comprises a second optical channel, and the second optical channel is opposite to the first optical channel; performing surface treatment on the circuit board after the colloid layer is formed; and providing a filter element, and fixing the filter element in the second light channel and facing the first light channel. The invention also relates to a lens packaging module. The lens packaging module and the manufacturing method thereof can improve the pollution and damage of the glue injection process to the chip and can reduce the cost.)

1. A lens package module, comprising:

a circuit board, the circuit board having a first optical channel;

at least one surface-mounted component, which is located on the circuit board and electrically connected with the circuit board;

the adhesive sealing body layer is formed on the circuit board and covers the surface bonding element; the glue sealing layer comprises a second optical channel, and the second optical channel is opposite to the first optical channel; and

a light filtering element; the filter element is fixed in the second light channel and faces the first light channel.

2. The lens package module as claimed in claim 1, wherein the circuit board further includes at least one receiving groove, the surface mount component is received in the receiving groove and electrically connected to the circuit board, and the encapsulant layer is filled between an inner wall of the receiving groove and the surface mount component.

3. The lens package module as claimed in claim 1 or 2, wherein the encapsulant layer further includes a step portion formed by extending from an inner wall of the second optical channel to a center of the second optical channel.

4. The lens packaging module as claimed in claim 1 or 2, wherein the encapsulant layer further covers an inner wall of the first optical channel.

5. The lens package module as claimed in claim 3, wherein the filter element is fixed on the stepped portion.

6. The lens packaging module according to claim 1 or 2, wherein the filter element is formed on the circuit board.

7. The lens package module as claimed in claim 1 or 2, wherein the lens package module further comprises a photosensitive/luminescent element and a lens assembly, the circuit board further comprises a recess communicating with the first light channel, the photosensitive/luminescent element is fixed in the recess, faces the filter element and is electrically connected to the circuit board; the lens component is formed on the glue sealing layer and faces the light filtering element.

8. A method for manufacturing a lens packaging module comprises the following steps:

providing a circuit board, wherein the circuit board is provided with a first optical channel;

mounting at least one surface-mounted element on the circuit board, and electrically connecting the surface-mounted element and the circuit board;

placing the circuit board with the surface-mounted element in a mold and injecting glue to form a glue sealing layer which covers the surface-mounted element on the circuit board, wherein the glue sealing layer comprises a second optical channel, and the second optical channel is opposite to the first optical channel;

performing surface treatment on the circuit board after the colloid layer is formed; and

and providing a filter element, and fixing the filter element in the second light channel and facing the first light channel.

9. The method as claimed in claim 8, wherein the circuit board further comprises at least one receiving cavity, the surface mount component is received in the receiving cavity and electrically connected to the circuit board, and the encapsulant layer is filled between an inner wall of the receiving cavity and the surface mount component.

10. The method of claim 8, wherein the encapsulant layer further comprises a step portion formed by extending from an inner wall of the second optical channel to a center of the second optical channel.

Technical Field

The invention relates to a lens packaging module and a manufacturing method thereof.

Background

In the assembly process of a camera and an image identification module, dust fall and glue pollution on a photosensitive/luminous element and a filter assembly are the main defects affecting the product quality and are the largest production yield loss factors, the defects are usually detected only after the lens and the refractor are adhered, and due to irreversible factors of the manufacturing process, scrapping is often the only way for processing the defective products.

The ceramic substrate is the most common substrate material for the current camera and image recognition module based on its high strength, high thermal conductivity, high thermal cycle performance, high insulation, and low thermal expansion coefficient, but because it is easy to be cracked by pressure and cut, a single substrate is usually adopted in the module process, and a plurality of substrates are placed in a matrix carrier disc for packaging, which results in high packaging cost.

Disclosure of Invention

In view of the above, the present invention provides a lens package module capable of reducing the cost and improving the pollution and damage of the chip during the glue injection process.

It is also necessary to provide a method for manufacturing the lens package module.

A lens package module includes: a circuit board, the circuit board having a first optical channel; at least one surface-mounted component, which is located on the circuit board and electrically connected with the circuit board; the adhesive sealing body layer is formed on the circuit board and covers the surface bonding element; the glue sealing layer comprises a second optical channel, and the second optical channel is opposite to the first optical channel; and a filter element; the filter element is fixed in the second light channel and faces the first light channel.

Furthermore, the circuit board further comprises at least one accommodating groove, the surface bonding element is accommodated in the accommodating groove and is electrically connected with the circuit board, and the sealant layer is filled between the inner wall of the accommodating groove and the surface bonding element.

Furthermore, the glue sealing layer further comprises a step part, and the step part is formed by extending from the inner wall of the second optical channel to the center of the second optical channel.

Further, the glue sealing layer also covers the inner wall of the first optical channel.

Further, the filter element is fixed to the stepped portion.

Further, the filter element is formed on the circuit board.

Furthermore, the lens packaging module also comprises a photosensitive/luminous element and a lens component, wherein the photosensitive/luminous element is fixed in the groove, faces the filter element and is electrically connected with the circuit board; the lens component is formed on the glue sealing layer and faces the light filtering element.

A method for manufacturing a lens packaging module comprises the following steps: providing a circuit board, wherein the circuit board is provided with a first optical channel; mounting at least one surface-mounted element on the circuit board, and electrically connecting the surface-mounted element and the circuit board; placing the circuit board with the surface-mounted element in a mold and injecting glue to form a glue sealing layer which covers the surface-mounted element on the circuit board, wherein the glue sealing layer comprises a second optical channel, and the second optical channel is opposite to the first optical channel; performing surface treatment on the circuit board after the colloid layer is formed; and providing a filter element, and fixing the filter element in the second light channel and facing the first light channel.

Furthermore, the circuit board further comprises at least one accommodating groove, the surface bonding element is accommodated in the accommodating groove and is electrically connected with the circuit board, and the sealant layer is filled between the inner wall of the accommodating groove and the surface bonding element.

Furthermore, the glue sealing layer further comprises a step part, and the step part is formed by extending from the inner wall of the second optical channel to the center of the second optical channel.

The invention provides a lens packaging module and a manufacturing method thereof, 1) a surface-mounted element is packaged on a circuit board by a method of sealing and injection molding, and then a filter element is placed after surface treatment, so that the pollution and damage of the glue injection process to the filter element can be improved, the purpose of protecting a passive component (the surface-mounted element) is achieved, and the damage of the surface-mounted element in the process of placing the filter element or dispensing is avoided; 2) the circuit board with the optical channel and the groove replaces a ceramic substrate in the prior art, so that the packaging cost can be reduced.

Drawings

Fig. 1 is a cross-sectional view of a circuit board according to a preferred embodiment of the invention.

Fig. 2 is a cross-sectional view of the circuit board of fig. 1 after at least one surface mount component is mounted thereon.

Fig. 3 is a cross-sectional view of the circuit board shown in fig. 2 after a glue-sealing layer covering the surface-mount device is formed thereon.

FIG. 4 is a cross-sectional view of a photo/luminescent device formed on the circuit board shown in FIG. 3 by flip-chip technology.

Fig. 5 is a cross-sectional view of a filter element fixed in the encapsulant layer shown in fig. 4.

Fig. 6 is a cross-sectional view of a lens assembly fixed in the encapsulant layer shown in fig. 5 to form a lens package module.

Fig. 7 is a cross-sectional view of a lens package module according to a second embodiment of the invention.

Fig. 8 is a cross-sectional view of a lens package module according to a third embodiment of the invention.

Description of the main elements

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

In order to further explain the technical means and effects of the present invention for achieving the predetermined objects, the following detailed description will be made on the specific embodiments, structures, features and effects of the lens package module and the manufacturing method thereof according to the present invention with reference to fig. 1-8 and the preferred embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-6, the present invention provides a method for manufacturing a lens package module 100, comprising the steps of:

referring to fig. 1, a circuit board 10 is provided.

The circuit board 10 includes a first surface 101 and a second surface 102 opposite to the first surface 101.

The circuit board 10 further includes a first optical channel 12 and a groove 13, and the first optical channel 12 is communicated with the groove 13. The first light channel 12 is formed by being recessed from the first surface 101 toward the second surface 102. The groove 13 is formed by being recessed from the second surface 102 toward the first surface 101.

The circuit board 10 further includes a substrate 11 and at least one conductive trace layer 14 embedded in the substrate 11. The conductive trace layer 14 includes at least one first pad 141, at least one second pad 142, and at least one third pad 143. The first pad 141 is exposed from the first surface 101, the second pad 142 is exposed from the groove 13, and the third pad 143 is exposed from the second surface 102.

Referring to fig. 2, at least one surface mount device 20 is mounted on the first surface 101 of the circuit board 10, and the surface mount device 20 is electrically connected to the circuit board 10.

Third, referring to fig. 3, an encapsulant layer 30 is formed on the circuit board 10 to cover the surface mount device 20, and the circuit board 10 with the encapsulant layer 30 is subjected to surface treatment.

The encapsulant layer 30 includes a second optical channel 31, and the second optical channel 31 faces the first optical channel 12. In the present embodiment, the size of the second optical channel 31 is larger than the size of the first optical channel 12.

In this embodiment, the encapsulant layer 30 further includes a step portion 32, and the step portion 32 is formed by extending from an inner wall of the second optical channel 31 to a center of the second optical channel 31.

In the present embodiment, the distance between the surface bonding element 20 and the side edge of the circuit board 10 is greater than or equal to 50um, the size is mainly the gap for placing the passive element (surface bonding element 20) in the mounting process, and the setting of the size needs to consider the following points: the tolerances of the passive components, the tolerances of the openings of the substrate, the optical recognition accuracy and the mechanical accuracy of the mounted passive components (surface mount components 20).

The surface treatment is to remove mold wax, dust, and the like on the surface of the circuit board 10 with the glue sealing layer 30, so as to improve pollution and damage of the glue injection process to the optical filter element.

In this embodiment, the surface treatment is plasma cleaning.

Fourthly, referring to fig. 4, a light sensing/emitting device 40 is provided, and the light sensing/emitting device 40 is fixed in the groove 13 and electrically connected to the circuit board 10.

In the present embodiment, the light sensing/emitting device 40 is fixed in the recess 13 by a flip chip method.

In the present embodiment, the light sensing/emitting device 40 is electrically connected to the second pad 142 through at least one conductive bump 50.

In this embodiment, the surface of the light sensing/emitting element 40 away from the second pad 142 is lower than the second surface 102.

In a fifth step, please refer to fig. 5, a filter element 60 is provided, and the filter element 60 is fixed in the second light channel 31 and faces the first light channel 12.

In the present embodiment, the filter element 60 is fixed to the step portion 32.

Sixthly, referring to fig. 6, a lens assembly 70 is provided, and the lens assembly 70 is fixed on the surface of the encapsulant layer 30 away from the first surface 101.

Wherein the lens assembly 70 faces the filter element 60.

The lens assembly 70 may be a lens module or a voice coil motor.

Referring to fig. 6, the first embodiment of the invention further provides a lens package module 100, where the lens package module 100 includes a circuit board 10, at least one surface mount element 20, a sealant layer 30, a light sensing/emitting element 40, a filter element 60, and a lens assembly 70. The surface mount element 20 is formed on the circuit board 10, the encapsulant layer 30 is formed on the circuit board 10 and covers the surface mount element 20, the photosensitive/luminescent element 40 is embedded in the circuit board 10, the filter element 60 is fixed in the encapsulant layer 30 and opposite to the photosensitive/luminescent element 40, and the lens component 70 is located on the encapsulant layer 30 and faces the filter element 60.

The circuit board 10 includes a first surface 101 and a second surface 102 opposite to the first surface 101.

The circuit board 10 further includes a first optical channel 12 and a groove 13, and the first optical channel 12 is communicated with the groove 13. The first light channel 12 is formed by being recessed from the first surface 101 toward the second surface 102. The groove 13 is formed by being recessed from the second surface 102 toward the first surface 101.

The circuit board 10 further includes a substrate 11 and at least one conductive trace layer 14 embedded in the substrate 11. The conductive trace layer 14 includes at least one first pad 141, at least one second pad 142, and at least one third pad 143. The first pad 141 is exposed from the first surface 101, the second pad 142 is exposed from the groove 13, and the third pad 143 is exposed from the second surface 102.

Wherein the surface mount component 20 is on the first surface 101 of the circuit board 10 and electrically connected with the circuit board 10.

The encapsulant layer 30 is disposed on the first surface 101 and covers the surface mount device 20.

The encapsulant layer 30 includes a second optical channel 31, and the second optical channel 31 faces the first optical channel 12. In the present embodiment, the size of the second optical channel 31 is larger than the size of the first optical channel 12.

In this embodiment, the encapsulant layer 30 further includes a step portion 32, and the step portion 32 is formed by extending from an inner wall of the second optical channel 31 to a center of the second optical channel 31.

In the present embodiment, the distance d between the surface mount component 20 and the side edge of the circuit board 10 is greater than or equal to 50um, and the main purpose of d is to provide a passive component (the surface mount component 20) in the mounting process, and the points to be considered for d are: the tolerance of the passive element, the tolerance of the substrate opening, the identification precision and the mechanical precision of the passive element and the like.

Wherein, the light sensing/emitting element 40 is fixed in the groove 13 and electrically connected with the circuit board 10.

In the present embodiment, the light sensing/emitting device 40 is electrically connected to the second pad 142 through at least one conductive bump 50.

In this embodiment, the surface of the light sensing/emitting element 40 away from the second pad 142 is lower than the second surface 102.

Wherein the filter element 60 is fixed within the second light channel 31 and faces the first light channel 12.

In the present embodiment, the filter element 60 is fixed to the step portion 32.

In the present embodiment, the filter element 60 is fixed on the step portion 32 by an adhesive layer 61.

In the present embodiment, the filter element 60 is an infrared filter for filtering infrared light.

Wherein, the lens assembly 70 is fixed on the surface of the encapsulant layer 30 away from the first surface 101.

Wherein the lens assembly 70 faces the filter element 60.

The lens assembly 70 may be a lens module or a voice coil motor.

Referring to fig. 7, a lens package module 200 according to a second embodiment of the present invention is provided, wherein the lens package module 200 is similar to the lens package module 100 in structure except that: the circuit board 10 further includes at least one receiving groove 15, the receiving groove 15 is formed by recessing from the first surface 101 to the second surface 102, the surface mount component 20 is received in the receiving groove 15 and electrically connected to the circuit board 10, and the encapsulant layer 30 is filled between an inner wall of the receiving groove 15 and the surface mount component 20 and covers the surface mount component 20. In this embodiment, no step portion is formed in the second optical channel 31 of the encapsulant layer 30, and the filter element 60 is accommodated in the second optical channel 31 and located on the first surface 101 of the circuit board 10.

In the second embodiment, a manufacturing method of the lens package module 200 is also provided, which is similar to the manufacturing method of the lens package module 100, and only differs therefrom: in the first step, the circuit board 10 is provided further comprising at least one receiving slot 15. In the second step, the surface mount component 20 is received in the receiving cavity 15, and the surface mount component 20 is soldered and infrared reflowed on the exposed surface of the surface mount component 20 to electrically connect the surface mount component 20 and the circuit board 10. In the third step, the encapsulant layer 30 is filled between the inner wall of the receiving groove 15 and the surface mount component 20 and covers the surface mount component 20.

Referring to fig. 8, a third embodiment of the invention provides a lens package module 300, wherein the lens package module 300 is similar to the lens package module 100 in structure except that: the encapsulant layer 30 also covers the inner wall of the first optical channel 12.

The invention provides a lens packaging module and a manufacturing method thereof, 1) a surface-mounted element is packaged on a circuit board by a method of sealing and injection molding, and then a filter element is placed after surface treatment, so that the pollution and damage of the glue injection process to the filter element can be improved, the purpose of protecting a passive component (the surface-mounted element) is achieved, and the damage of the surface-mounted element in the process of placing the filter element or dispensing is avoided; 2) the circuit board with the optical channel and the groove replaces a ceramic substrate in the prior art, so that the packaging cost can be reduced; 3) forming an accommodating groove on the circuit board, encapsulating the surface-attached element in the accommodating groove, and accommodating and fixing the photosensitive/luminous element in the groove on the circuit board, so that the total height of the lens encapsulation module can be reduced, the height difference between the photosensitive/luminous element and the filter element can be reduced, the light refraction can be reduced, and the afterimage in imaging can be improved; 4) the glue sealing layer also covers the inner wall of the first optical channel, so that optical interference can be reduced, and imaging quality is improved; 5) the sealing colloid layer replaces a bracket used for supporting the lens and the filtering element in the prior art, so that a reserved dispensing interval between the base and the surface bonding element and the filtering element can be eliminated, and the area of a packaging assembly of the lens packaging module is reduced.

Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.