Method and device for processing high-polymer copper plate
阅读说明:本技术 一种高分子铜板加工方法及其加工装置 (Method and device for processing high-polymer copper plate ) 是由 韩建 梁国正 王志龙 于 2019-10-08 设计创作,主要内容包括:一种高分子铜板的加工方法,其具体加工步骤如下:步骤一:通过人工或机器将整板进行裁切,裁切板的长度为430mm,宽度为125,厚度为1~2.5mm;步骤二:在裁切板的一侧面涂设墙纸胶,然后通过铺粉装置在墙纸胶上侧面铺设第一层铜粉,再通过铺粉装置在第一层铜粉上铺设第二层铜粉;所述第一层铜粉采用粒径为100~120目的铜粉,所述第二层铜粉采用粒径为80~100目的铜粉;步骤三:将镀好铜粉的裁切板放进烧结炉进行烧结;步骤四:通过在烧结好的裁切板上的第二层铜粉上铺上聚四氟乙烯,然后通过辊压机进行将聚四氟乙烯辊压进铜粉的间隙内;步骤五:将辊压好的铜板放入烘干炉进行烘干,烘干时间为20~25min;步骤六:将烘干后的铜板进行初轧辊。(A processing method of a polymer copper plate comprises the following specific processing steps: the method comprises the following steps: cutting the whole plate manually or mechanically, wherein the length of the cut plate is 430mm, the width of the cut plate is 125 mm, and the thickness of the cut plate is 1-2.5 mm; step two: coating wallpaper glue on one side surface of the cutting plate, then paving a first layer of copper powder on the side surface of the wallpaper glue through a powder paving device, and then paving a second layer of copper powder on the first layer of copper powder through the powder paving device; the first layer of copper powder is copper powder with the particle size of 100-120 meshes, and the second layer of copper powder is copper powder with the particle size of 80-100 meshes; step three: placing the copper powder plated cutting board into a sintering furnace for sintering; step four: the polytetrafluoroethylene is laid on the second layer of copper powder on the sintered cutting plate, and then the polytetrafluoroethylene is rolled into gaps of the copper powder through a rolling machine; step five: putting the rolled copper plate into a drying furnace for drying for 20-25 min; step six: and (5) carrying out primary rolling on the dried copper plate.)
1. The processing method of the polymer copper plate is characterized by comprising the following specific processing steps of:
the method comprises the following steps: cutting the whole plate manually or mechanically, wherein the length of the cut plate is 430mm, the width of the cut plate is 125 mm, and the thickness of the cut plate is 1-2.5 mm;
step two: coating wallpaper glue on one side surface of the cutting plate, then paving a first layer of copper powder on the side surface of the wallpaper glue through a powder paving device, and then paving a second layer of copper powder on the first layer of copper powder through the powder paving device; the first layer of copper powder is copper powder with the particle size of 100-120 meshes, and the second layer of copper powder is copper powder with the particle size of 80-100 meshes;
step three: placing the copper powder plated cutting board into a sintering furnace for sintering;
step four: the polytetrafluoroethylene is laid on the second layer of copper powder on the sintered cutting plate, and then the polytetrafluoroethylene is rolled into gaps of the copper powder through a rolling machine;
step five: putting the rolled copper plate into a drying furnace for drying for 20-25 min;
step six: carrying out primary rolling on the dried copper plate;
step seven: putting the copper plate after the primary rolling into a curing furnace, wherein the curing time is 10-12 h;
step eight: carrying out finishing rolling on the solidified copper plate;
step nine: and leveling the copper plate after finish rolling through a leveling machine.
2. The method for processing a polymer copper plate according to claim 1, wherein: the first layer of copper powder is hollow rectangular and is laid at the edge position of the upper side face of the cutting plate, and the second layer of copper powder is laid in the first layer of copper powder.
3. The method for processing a polymer copper plate according to claim 1, wherein: and in the third step, the middle part of the sintering furnace is coated with a circulating cavity, and the circulating cavity is filled with liquid for cooling the sintered copper plate.
4. The method for processing a polymer copper plate according to claim 1, wherein: and the primary roller and the finishing roller in the sixth step and the eighth step are both completed by a roller press in the fourth step.
5. A processing device used in a polymer copper plate processing method is characterized in that: the processing device comprises a cutting machine and a powder spreading device; the cutting machine comprises a first rack (1), and a bottom plate (2) is fixed on the first rack (1); a portal frame (3) is fixed in the middle of the bottom plate (2), a groove is formed in the lower side surface of the portal frame (3), a cutting knife (4) is arranged in the groove, a cutting groove is formed in the middle of the bottom plate (2), and the cutting groove is matched with the cutting knife (4); the bottom plate (2) is also provided with a plate fixed-length component and a material pushing component, and the plate fixed-length component and the material pushing component are respectively positioned on two sides of the portal frame (3); the plate fixed-length assembly comprises a lead screw fixed on the lower side surface of the bottom plate (2), one end of the lead screw is connected with an output shaft of a fixed-length motor through a coupler, and the fixed-length motor is fixed on the lower side surface of the bottom plate (2); the bottom plate is sleeved with a fixed length frame (5), and the lower end of the fixed length frame (5) is fixed on a sliding nut of the screw rod; the inner side surface of the upper end of the fixed length frame (5) is matched with a plate, two vertical sliding plates (6) are further fixed on the bottom plate (2), the sliding plates (6) are located on one side of the portal frame (3), two limiting grooves are formed in the fixed length frame (5), and the limiting grooves are matched with the sliding plates (6); the opposite side surfaces of the bottom plate (2) are fixedly provided with slide rails, slide blocks are arranged on the slide rails in a sliding manner, and two sides of the inner wall of the fixed long frame are respectively fixed on the slide blocks; the material pushing assembly comprises two mounting blocks (7) fixed on a base plate (2), a material pushing cylinder (8) is fixed on each mounting block (7), an output shaft of the material pushing cylinder (8) extends towards the inner side, a material pushing plate (9) which is of an L-shaped structure is fixed on the output shaft of the material pushing cylinder (8), a limiting plate (10) is further fixed on the base plate (2), and the limiting plate (10) is located between the material pushing plate (9) and a portal frame (3).
6. The apparatus for processing polymer copper plate according to claim 5, wherein: the powder spreading device comprises a second rack (11) and a third rack (12), a first driving roller and a first driven roller are respectively fixed at two ends of the second rack (11), a first crawler belt (13) is sleeved on the first driving roller and the first driven roller, and a plurality of first parting strips (14) are uniformly fixed on the first crawler belt (13); a first rotating wheel is sleeved at the outer end of the axis of the first driving roller, a first driving motor is fixed at the outer side of the second rack (11), a first driving wheel is sleeved on an output shaft of the first driving motor, a first belt is sleeved on the first driving wheel and the first rotating wheel, the first rotating wheel and the first driving wheel are arranged in a first protective cover (15), and the first protective cover is fixed at the outer side of the second rack (11); a fixing frame (16) is fixed on the upper side of the second rack (11), a first feed hopper (17) is fixed on the fixing frame (16), dispersing blocks (18) are arranged in the fixing frame (16), and the dispersing blocks (18) are positioned on the lower side of a discharge port of the first feed hopper (17); a second driving roller and a second driven roller are respectively fixed at two ends of the third rack (12), a second crawler belt (19) is sleeved on the second driving roller and the second driven roller, and a plurality of second parting beads (20) are uniformly fixed on the second crawler belt (19); a second rotating wheel is sleeved at the outer end of the axis of the second driving roller, a second driving motor is fixed at the outer side of the third rack (12), a second driving wheel is sleeved on an output shaft of the second driving motor, a second belt is sleeved on the second driving wheel and the second rotating wheel, the second rotating wheel and the second driving wheel are arranged in a second protective cover (21), and the second protective cover (21) is fixed at the outer side of the third rack (12); a fixed block (22) is fixed on the third rack (12), a blanking hole is formed in the fixed block (22), and the upper side of the blanking hole is matched with a discharge hole of a second feed hopper (23); a material blocking groove is formed in the side face of the fixed block (22), the material blocking groove penetrates through the material discharging hole, a baffle plate (24) is arranged in the material blocking groove, and a handle plate extending to the upper side is arranged at the outer side end of the baffle plate (24); a first copper powder collecting box (25) and a second copper powder collecting box (26) are respectively fixed in the second rack (11) and the third rack (12); the first driving roller and the first driven roller are arranged in the first copper powder collecting box (25), and the second driving roller and the second driven roller are arranged in the second copper powder collecting box (26).
7. The apparatus for processing polymer copper plate according to claim 7, wherein: the cross section of the dispersing block (18) is of a triangular structure, and the area of the lower side surface of the dispersing block (18) is smaller than that of the upper side surface of the cutting plate; two fixing shafts (27) extending outwards are respectively fixed on the left inclined surface and the right inclined surface of the dispersing block (18), and the extending ends of the fixing shafts (27) are fixed in the fixing frame (16).
8. The apparatus for processing polymer copper plate according to claim 7, wherein: the first copper powder collecting box (25) and the second copper powder collecting box (26) are both in a hopper shape, and a first charging barrel (28) and a second charging barrel (29) are respectively arranged on the lower sides of discharge holes of the first copper powder collecting box and the second copper powder collecting box.
9. The apparatus for processing polymer copper plate according to claim 6, wherein: a step plate (30) is fixed on the right side of the fixing frame (16), a material baffle plate (31) is arranged on the step plate (30), and the upper side of the left end of the material baffle plate (31) is matched with a discharge hole of the first feed hopper (17); the step plate (30) is further fixed with at least one material blocking cylinder (32), and an output shaft of the material blocking cylinder (32) is fixed with the right end face of the material blocking plate (30).
Technical Field
The invention relates to the field of machining, in particular to a method and a device for machining a polymer copper plate.
Background
At present, in the existing copper plate processing method, copper powder is respectively paved on two surfaces of a plate and then the plate is placed into a sintering furnace for sintering, and the copper plate is broken in the using process; at present, in the copper plate processing method, cutting is carried out through a cutting machine, but the size is manually measured, so that the processing of the plate is slow, and the size is different; before the copper plate is sintered, powder is paved manually, so that the copper plate is slow in forming speed and copper powder is easy to waste; in current copper course of working, be through laying wallpaper glue on the cutting board, then lay the copper powder on wallpaper glue and sinter, in sintering process, high temperature makes wallpaper glue melt for the copper powder causes the phenomenon of collapsing at the border position of cutting board, makes the edge undercut of copper after the shaping.
The present invention is an improvement to solve the above problems.
Disclosure of Invention
The invention aims to provide a method and a device for processing a polymer copper plate, thereby solving the defects.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a processing method of a polymer copper plate comprises the following specific processing steps:
the method comprises the following steps: cutting the whole plate manually or mechanically, wherein the length of the cut plate is 430mm, the width of the cut plate is 125 mm, and the thickness of the cut plate is 1-2.5 mm;
step two: coating wallpaper glue on one side surface of the cutting plate, then paving a first layer of copper powder on the side surface of the wallpaper glue through a powder paving device, and then paving a second layer of copper powder on the first layer of copper powder through the powder paving device; the first layer of copper powder is copper powder with the particle size of 100-120 meshes, and the second layer of copper powder is copper powder with the particle size of 80-100 meshes;
step three: placing the copper powder plated cutting board into a sintering furnace for sintering;
step four: the polytetrafluoroethylene is laid on the second layer of copper powder on the sintered cutting plate, and then the polytetrafluoroethylene is rolled into gaps of the copper powder through a rolling machine;
step five: putting the rolled copper plate into a drying furnace for drying for 20-25 min;
step six: carrying out primary rolling on the dried copper plate;
step seven: putting the copper plate after the primary rolling into a curing furnace, wherein the curing time is 10-12 h;
step eight: carrying out finishing rolling on the solidified copper plate;
step nine: and leveling the copper plate after finish rolling through a leveling machine.
Furthermore, the first layer of copper powder is hollow rectangular and is laid at the edge position of the upper side face of the cutting plate, and the second layer of copper powder is laid in the first layer of copper powder.
Furthermore, a circulation cavity is coated in the middle of the sintering furnace in the third step, and liquid for cooling the sintered copper plate is arranged in the circulation cavity.
Further, the primary rolling roller and the finishing rolling roller in the sixth step and the eighth step are both completed by a rolling machine in the fourth step.
A device for processing a polymer copper plate.
The processing device comprises a cutting machine and a powder spreading device; the cutting machine comprises a first rack, and a bottom plate is fixed on the first rack; a portal frame is fixed in the middle of the bottom plate, a groove is formed in the lower side surface of the portal frame, a cutting knife is arranged in the groove, a cutting groove is formed in the middle of the bottom plate, and the cutting groove is matched with the cutting knife; the bottom plate is also provided with a plate fixed-length component and a material pushing component, and the plate fixed-length component and the material pushing component are respectively positioned on two sides of the portal frame; the plate fixed-length assembly comprises a lead screw fixed on the lower side surface of the bottom plate, one end of the lead screw is connected with an output shaft of a fixed-length motor through a coupler, and the fixed-length motor is fixed on the lower side surface of the bottom plate; the bottom plate is sleeved with a fixed length frame, and the lower end of the fixed length frame is fixed on a sliding nut of the screw rod; the inner side surface of the upper end of the fixed length frame is matched with a plate, two vertical sliding plates are further fixed on the bottom plate, the sliding plates are located on one side of the portal frame, two limiting grooves are formed in the fixed length frame, and the limiting grooves are matched with the sliding plates; the sliding rail is fixed on the opposite side surface of the bottom plate, a sliding block is arranged on the sliding rail in a sliding manner, and two sides of the inner wall of the fixed long frame are respectively fixed on the sliding block; the pushing assembly comprises two mounting blocks fixed on the bottom plate, a pushing cylinder is fixed on each mounting block, an output shaft of the pushing cylinder extends towards the inner side, a pushing plate in an L-shaped structure is fixed on the output shaft of the pushing cylinder, a limiting plate is further fixed on the bottom plate, and the limiting plate is located between the pushing plate and the portal frame.
Further, the powder spreading device comprises a second rack and a third rack, a first driving roller and a first driven roller are respectively fixed at two ends of the second rack, a first crawler belt is sleeved on the first driving roller and the first driven roller, and a plurality of first parting strips are uniformly fixed on the first crawler belt; a first rotating wheel is sleeved at the outer end of the axis of the first driving roller, a first driving motor is fixed at the outer side of the second rack, a first driving wheel is sleeved on an output shaft of the first driving motor, a first belt is sleeved on the first driving wheel and the first rotating wheel, the first rotating wheel and the first driving wheel are arranged in a first protective cover, and the first protective cover is fixed at the outer side of the second rack; a fixing frame is fixed on the upper side of the second rack, a first feed hopper is fixed on the fixing frame, and dispersing blocks are arranged in the fixing frame and positioned on the lower side of a discharge port of the first feed hopper; a second driving roller and a second driven roller are respectively fixed at two ends of the third rack, a second crawler belt is sleeved on the second driving roller and the second driven roller, and a plurality of second parting strips are uniformly fixed on the second crawler belt; a second rotating wheel is sleeved at the outer end of the axis of the second driving roller, a second driving motor is fixed at the outer side of the third rack, a second driving wheel is sleeved on an output shaft of the second driving motor, a second belt is sleeved on the second driving wheel and the second rotating wheel, the second rotating wheel and the second driving wheel are arranged in a second protective cover, and the second protective cover is fixed at the outer side of the third rack; a fixed block is fixed on the third rack, a blanking hole is formed in the fixed block, and the upper side of the blanking hole is matched with a discharge hole of the second feed hopper; a material blocking groove is formed in the side face of the fixed block and penetrates through the material discharging hole, a baffle is arranged in the material blocking groove, and a handle plate extending towards the upper side is arranged at the outer side end of the baffle; a first copper powder collecting box and a second copper powder collecting box are respectively fixed in the second rack and the third rack; the first driving roller and the first driven roller are arranged in the first copper powder collecting box, and the second driving roller and the second driven roller are arranged in the second copper powder collecting box.
Furthermore, the cross section of the dispersing block is in a triangular structure, and the area of the lower side surface of the dispersing block is smaller than that of the upper side surface of the cutting plate; two fixing shafts extending outwards are fixed on the left inclined surface and the right inclined surface of the dispersing block respectively, and the extending ends of the fixing shafts are fixed in the fixing frame.
Furthermore, the first copper powder collecting box and the second copper powder collecting box are both hopper-shaped, and a first charging barrel and a second charging barrel are respectively arranged on the lower sides of the discharge ports of the first copper powder collecting box and the second copper powder collecting box.
Furthermore, a step plate is fixed on the right side of the fixing frame, a material baffle plate is arranged on the step plate, and the upper side of the left end of the material baffle plate is matched with a discharge hole of the first feed hopper; at least one material blocking cylinder is further fixed on the step plate, and an output shaft of the material blocking cylinder is fixed with the end face of the right side of the material blocking plate.
The invention has the advantages that:
the invention discloses a processing method and a processing device of a polymer copper plate, wherein copper powder and a polymer material are respectively arranged on two side surfaces of a plate, then the copper powder, the polymer material and the plate are tightly connected in a sintering and multiple rolling mode, and the toughness and the strength of the polymer copper plate are improved in the further processing process through the arrangement of the copper powder and the polymer material; the cutting machine used in the method is positioned in advance through the lead screw, so that the distance between the fixed length frame and the cutting knife is consistent, and the plate is matched with the material pushing assembly for use, so that the cutting position can be well positioned only by abutting two ends of the plate against the inner sides of the fixed length frame and the material pushing plate, and the sizes of the cut plates are consistent, further processing of the polymer copper plate is facilitated, and the rejection rate caused by size problems is reduced; according to the powder spreading device used in the method, the cut plate is placed on the partition plate, so that copper powder is uniformly spread on the plate through the lower side of the feed hopper, and the copper powder falling on the crawler falls into the copper powder collecting box and then falls into the charging bucket, so that the copper powder which is not spread on the plate is circulated, and the copper powder is not wasted; through the use of this shop's powder device for lay two-layer particle size different copper powder layer on the wall paper glue, when sintering, the fusing point temperature of the less copper powder of particle size is transferred to the sintering temperature, and the great copper powder of particle size can not be by the hot melt on the cutting board like this, thereby has prevented the phenomenon that the copper powder edge collapses.
Drawings
Fig. 1 is a schematic structural view of a cutting machine in a method for processing a polymer copper plate according to the present invention;
fig. 2 is a schematic structural diagram of a powder laying device in the method.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the invention is further described with reference to the figures and the specific embodiments.
As shown in fig. 1 to fig. 2, the processing method of the polymer copper plate provided by the present invention specifically includes the following processing steps:
the method comprises the following steps: cutting the whole plate manually or mechanically, wherein the length of the cut plate is 430mm, the width of the cut plate is 125 mm, and the thickness of the cut plate is 1-2.5 mm;
step two: manually coating wallpaper glue on one side surface of the cutting plate, then paving a first layer of copper powder on the side surface of the wallpaper glue through a powder paving device, and then paving a second layer of copper powder on the first layer of copper powder through the powder paving device; the first layer of copper powder is copper powder with the particle size of 100-120 meshes, and the second layer of copper powder is copper powder with the particle size of 80-100 meshes;
step three: placing the copper powder plated cutting board into a sintering furnace for sintering;
step four: the polytetrafluoroethylene is laid on the second layer of copper powder on the sintered cutting plate, and then the polytetrafluoroethylene is rolled into gaps of the copper powder through a rolling machine;
step five: putting the rolled copper plate into a drying furnace for drying for 20-25 min;
step six: carrying out primary rolling on the dried copper plate;
step seven: putting the copper plate after the primary rolling into a curing furnace, wherein the curing time is 10-12 h;
step eight: carrying out finishing rolling on the solidified copper plate;
step nine: and leveling the copper plate after finish rolling through a leveling machine.
The invention is further provided with: and in the third step, the middle part of the sintering furnace is coated with a circulating cavity, and the circulating cavity is filled with liquid for cooling the sintered copper plate. By adopting the technical scheme, the sintered copper plate is cooled by the temperature of the cooling liquid in the circulating cavity.
The invention is further provided with: and the primary roller and the finishing roller in the sixth step and the eighth step are both completed by a roller press in the fourth step. By adopting the technical scheme, the roller press is the existing mature equipment, and the details are not repeated; sintering furnace, drying furnace, curing furnace and the levelling machine in this scheme all adopt existing equipment, no longer give unnecessary details here.
A polymer copper plate processing device comprises a cutting machine and a powder spreading device; the cutting machine comprises a first rack 1, and a
The invention is further provided with: the powder spreading device comprises a
The invention is further provided with: the cross section of the dispersing
The invention is further provided with: the first copper
The invention is further provided with: a
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the scope of the present invention.
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