阅读说明：本技术 一种mems衰减器测试装置 (MEMS attenuator testing arrangement ) 是由 刘长春 赵建波 许晓龙 王金龙 文春华 郑文峰 于 2019-11-05 设计创作，主要内容包括：本公开提供了一种MEMS衰减器测试装置,包括第一腔体,位于第二腔体和第三腔体；连接器,连机器包括第一连接器和第二连接器,第一连接器和第二连接器分别包括内导体,第一连接器旋入第一腔体中,第二连接器旋入第二腔体中；微带片,第一微带片固定在第二腔体和第三腔体上；第二微带片和第三微带片固定在第一腔体上；第三微带片与第一微带片、MEMS器件通过金丝键合方式相连；第一微带片与内导体相连；第二微带片包括若干控制电路模块,若干控制电路模块的下端通过金丝键合的方式与相应待检测MEMS器件相连,若干控制电路模块上端通过金丝键合的方式分别连接有相应的控制线。具有通用性,可测试其他MEMS器件,部件可重复使用,防止射频泄漏的优点。(The present disclosure provides a MEMS attenuator testing device, including a first cavity, located in a second cavity and a third cavity; the connector comprises a first connector and a second connector, the first connector and the second connector respectively comprise inner conductors, the first connector is screwed into the first cavity, and the second connector is screwed into the second cavity; the first microstrip piece is fixed on the second cavity and the third cavity; the second microstrip piece and the third microstrip piece are fixed on the first cavity; the third microstrip piece is connected with the first microstrip piece and the MEMS device in a gold wire bonding mode; the first microstrip sheet is connected with the inner conductor; the second microstrip piece comprises a plurality of control circuit modules, the lower ends of the control circuit modules are connected with the corresponding MEMS device to be detected in a gold wire bonding mode, and the upper ends of the control circuit modules are respectively connected with corresponding control lines in the gold wire bonding mode. The method has the advantages of universality, capability of testing other MEMS devices, reusability of parts and prevention of radio frequency leakage.)

1. A MEMS attenuator testing apparatus, comprising:

the cavity comprises a first cavity positioned in the middle, a second cavity positioned on the left side and a third cavity positioned on the right side, and the first cavity, the second cavity and the third cavity are connected in series through long screws;

the connector comprises a first connector and a second connector, the first connector and the second connector respectively comprise inner conductors, the first connector is screwed into the first cavity, and the second connector is screwed into the second cavity;

the microstrip sheet comprises a first microstrip sheet, a second microstrip sheet and a third microstrip sheet;

the first microstrip piece is fixed on the second cavity and the third cavity; the second microstrip piece and the third microstrip piece are fixed on the first cavity; the third microstrip piece is connected with the first microstrip piece and the MEMS device in a gold wire bonding mode; the first microstrip sheet is connected with the inner conductor;

the second microstrip piece comprises a plurality of control circuit modules, the lower ends of the control circuit modules are connected with the corresponding MEMS device to be detected in a gold wire bonding mode, and the upper ends of the control circuit modules are respectively connected with corresponding control lines in the gold wire bonding mode.

2. The MEMS attenuator testing device of claim 1, wherein the first microstrip sheet is secured to the second cavity and the third cavity by conductive adhesive.

3. The MEMS attenuator testing device of claim 1, wherein a conductive rubber strip is disposed between the first cavity and the second cavity, and a conductive rubber strip is disposed between the first cavity and the third cavity.

4. The MEMS attenuator testing device of claim 1, wherein the second and third microstrip sheets are secured to the first cavity by a conductive adhesive.

5. The MEMS attenuator testing device of claim 1, wherein a MEMS device is disposed on the first cavity.

6. The MEMS attenuator testing device of claim 1, wherein the first, second and third cavities are each provided with a groove, and a conductive rubber strip is provided in the groove.

7. The MEMS attenuator testing device of claim 1, wherein the first microstrip piece, the second microstrip piece and the third microstrip piece are all grounded, and the upper surfaces of the first microstrip piece and the third microstrip piece are provided with gold strips.

8. The MEMS attenuator testing device of claim 1, wherein the second cavity and the third cavity are respectively provided with a connector mounting hole.

9. The MEMS attenuator testing device of claim 1, wherein the first, second and third cavities are respectively provided with long screw mounting holes.

10. The MEMS attenuator testing device of claim 1, wherein the first, second and third cavities are respectively provided with a cover plate at the upper end.

Technical Field

The disclosure belongs to the field of mechanical manufacturing and testing equipment, and particularly relates to a MEMS attenuator testing device.

Background

The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.

The MEMS technology is a system in which microelectronics and a machine are integrated by fusing the microelectronics and the precision machining technologies to each other. In the microwave aspect, the MEMS device has the advantages of low cost, microminiaturization, easy integration with other circuits and the like, is an important way for realizing the miniaturization of instruments, and has important significance for the development of measuring instruments and test systems. The indexes of the MEMS device are more, and different test methods and test conditions can influence the test result.

In the existing testing device, two connectors are respectively fixed at two ends of a testing base; the two microstrip sheets are welded on the test base and are respectively welded with the inner conductor of the connector; the MEMS device is fixed on the base and is connected with the two microstrip pieces in a gold wire bonding mode; the control lines are soldered directly to the control interface of the MEMS device.

The existing MEMS device testing device is usually a special testing device, other MEMS devices cannot be tested, and parts of the testing device cannot be reused; in addition, the testing device is not closed generally, and radio frequency leakage exists when the radio frequency index of the MEMS device is tested. Therefore, a testing device for MEMS attenuator is urgently needed.

Disclosure of Invention

The present disclosure provides a MEMS attenuator testing apparatus to solve the above problems, and the present disclosure is directed to solve the technical problems that the existing MEMS device testing apparatus is usually a special testing apparatus, cannot test other MEMS devices, cannot reuse components of the testing apparatus, and has radio frequency leakage when testing the radio frequency index of the MEMS device.

According to some embodiments, the following technical scheme is adopted in the disclosure:

the utility model provides a MEMS attenuator testing arrangement, includes the cavity, the cavity is including the first cavity that is located the middle part, is located left second cavity and is located the third cavity on right side, first cavity, second cavity and third cavity are in the same place through long screw series connection.

The connector, even the machine includes first connector and second connector, first connector and second connector include the inner conductor respectively, first connector screw in is in the first cavity, the second connector screw in is in the second cavity.

The microstrip sheet comprises a first microstrip sheet, a second microstrip sheet and a third microstrip sheet.

The first microstrip piece is fixed on the second cavity and the third cavity; the second microstrip piece and the third microstrip piece are fixed on the first cavity; the third microstrip piece is connected with the first microstrip piece and the MEMS device in a gold wire bonding mode; the first microstrip patch is connected to the inner conductor.

The second microstrip piece comprises a plurality of control circuit modules, the lower ends of the control circuit modules are connected with the corresponding MEMS device to be detected in a gold wire bonding mode, and the upper ends of the control circuit modules are respectively connected with corresponding control lines in the gold wire bonding mode.

In addition, the MEMS attenuator testing device according to the embodiment of the present disclosure may also have the following additional technical features:

preferably, the first microstrip sheet is fixed on the second cavity and the third cavity through conductive adhesive.

Preferably, a conductive rubber strip is arranged between the first cavity and the second cavity and between the first cavity and the third cavity.

Preferably, the second microstrip sheet is fixed on the first cavity through a conductive adhesive.

Preferably, a MEMS device is placed on the first cavity.

Preferably, the first cavity, the second cavity and the third cavity are respectively provided with a groove, and a conductive rubber strip is arranged in the groove.

Preferably, the first microstrip piece, the second microstrip piece and the third microstrip piece are all grounded, and the upper surfaces of the first microstrip piece and the third microstrip piece are provided with gold bands.

Preferably, the second cavity and the third cavity are respectively provided with a connector mounting hole.

Preferably, the first cavity, the second cavity and the third cavity are respectively provided with a long screw mounting hole.

Preferably, the upper ends of the first cavity, the second cavity and the third cavity are respectively provided with a cover plate.

Compared with the prior art, the beneficial effect of this disclosure is:

according to the invention, the testing cavity is divided into the first cavity, the second cavity and the third cavity, after the MEMS device is fixed on the first cavity, the first cavity fixed with different MEMS devices is replaced, and the same testing device can be used for testing the radio frequency indexes of a plurality of MEMS devices; each microstrip sheet is fixed on the cavity by using H20E conductive adhesive, so that the grounding reliability is ensured; conductive rubber strips are added between the cavities, and a cover plate is arranged on the cavities to prevent radio frequency leakage; and the second microstrip piece is used for transition, so that the control and the test of MEMS devices such as an MEMS switch, an MEMS fixed attenuator and an MEMS step attenuator can be realized. The test device has the technical effects of reusable parts, cost reduction and universality.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and are not to limit the disclosure.

FIG. 1 is a schematic structural diagram of a MEMS attenuator testing device of the present disclosure;

FIG. 2 is a schematic view of a screw fixing structure of the MEMS attenuator testing device of the present disclosure;

FIG. 3 is a schematic diagram of a coaxial microstrip transition of the MEMS attenuator testing apparatus of the present disclosure;

FIG. 4 is a schematic view of a microstrip sheet structure of the MEMS attenuator testing apparatus of the present disclosure;

FIG. 5 is a schematic view of gold wire bonding of the MEMS attenuator testing apparatus of the present disclosure;

FIG. 6 is a schematic view of a control microstrip sheet of the MEMS attenuator testing apparatus of the present disclosure;

FIG. 7 is a testing apparatus replacement MEMS attenuator schematic of the MEMS attenuator testing apparatus of the present disclosure.

Description of reference numerals:

in fig. 1-7, a first cavity 1; a second chamber 2; a third cavity 3; a first connector 4; a second connector 5; a first microstrip sheet 6; a second microstrip patch 7; a conductive rubber strip 8; a third microstrip patch 9; a control circuit module 10; a MEMS device 11; an inner conductor 12; a long screw 13; long screw mounting holes 14; a gold band 15; gold wire bonding points 16; connector mounting holes 17.

The specific implementation mode is as follows:

the present disclosure is further described with reference to the following drawings and examples.

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

In the present disclosure, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only relational terms determined for convenience in describing structural relationships of the parts or elements of the present disclosure, and do not refer to any parts or elements of the present disclosure, and are not to be construed as limiting the present disclosure.

In the present disclosure, terms such as "fixedly connected", "connected", and the like are to be understood in a broad sense, and mean either a fixed connection or an integrally connected or detachable connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present disclosure can be determined on a case-by-case basis by persons skilled in the relevant art or technicians, and are not to be construed as limitations of the present disclosure.

As shown in fig. 1-7, an MEMS attenuator testing device includes a cavity, the cavity includes a first cavity 1 located in the middle, a second cavity 2 located on the left side and a third cavity 3 located on the right side, the first cavity 1, the second cavity 2 and the third cavity 3 are connected in series through a long screw 13; the connector comprises a first connector 4 and a second connector 5, the first connector 4 and the second connector 5 respectively comprise an inner conductor 12, the first connector 4 is screwed into the first cavity 1, and the second connector 5 is screwed into the second cavity 2; the microstrip sheet comprises a first microstrip sheet 6, a second microstrip sheet 7 and a third microstrip sheet 9; the first microstrip sheet 6 is fixed on the second cavity 2 and the third cavity 3; the second microstrip piece 7 and the third microstrip piece 9 are fixed on the first cavity 1; the third microstrip piece 9 is connected with the first microstrip piece 6 and the MEMS device 11 in a gold wire bonding mode; the first microstrip patch 6 is connected with the inner conductor 12; the second microstrip piece 7 comprises a plurality of control circuit modules 10, the lower ends of the control circuit modules 10 are connected with the corresponding MEMS devices 11 to be detected in a gold wire bonding mode, and the upper ends of the control circuit modules 10 are connected with corresponding control lines respectively in a gold wire bonding mode.

The first microstrip sheet 6 is fixed on the second cavity 2 and the third cavity 3 by conductive adhesive. Between first cavity 1 and second cavity 2, all be equipped with conductive rubber strip 8 between first cavity 1 and the third cavity 3. The second microstrip patch 7 is fixed on the first cavity 1 by conductive adhesive. A MEMS device 11 is placed on the first cavity 1. The first cavity 1, the second cavity 2 and the third cavity 3 are respectively provided with a groove, and a conductive rubber strip 8 is arranged in the groove. The first microstrip piece 6, the second microstrip piece 7 and the third microstrip piece 9 are all grounded, and the upper surfaces of the first microstrip piece 6 and the third microstrip piece 9 are provided with gold bands 15. The second cavity 2 and the third cavity 3 are respectively provided with a connector mounting hole 17. The first cavity 1, the second cavity 2 and the third cavity 3 are respectively provided with a long screw mounting hole 14. The upper ends of the first cavity 1, the second cavity 2 and the third cavity 3 are respectively provided with a cover plate. The gold belt 15 between the first micro-strip sheet 6 and the second micro-strip sheet 7 is gold-wire bonded and has a gold-wire bonding point 16, and the gold-wire bonding point 16 is convenient for realizing separation when the first cavity 1 is replaced and can ensure the accuracy of signal transmission at the same time.

This patent has set up first cavity 1, second cavity 2, third cavity 3, and establish ties three cavity through long screw 13, wherein be equipped with long screw mounting hole 14 on the cavity, first cavity 1 can realize changing, when the assembly, fix MEMS device 11 on first cavity 1, be fixed with different MEMS device 11's first cavity 1 through changing, can realize using the same radio frequency index that detects a plurality of MEMS devices 11 of decorative test, realize testing parts's reuse.

The first connector 4 and the second connector 5 can be screwed in and out of the connector mounting hole 17 to replace connectors with different working frequency ranges, such as an N-type connector, a 3.5mm connector, a 2.92mm connector, a 2.4mm connector and a 1,85mm connector, so that the test of the MEMS device 11 with frequency ranges of DC-18 GHz, DC-26.5 GHz, DC-40 GHz, DC-50 GHz and DC-67 GHz can be realized. Namely, the MEMS device 11 in the corresponding frequency band is tested by replacing connectors in different working frequency ranges through screwing in and screwing out of the connectors.

The back of the first microstrip piece 6 is coated with H2OE conductive adhesive and then fixed on the left second cavity 2 and the right third cavity 3, the first connector 4 and the second connector 5 are screwed into the left connector mounting hole 17 and the right connector mounting hole 17 respectively, the inner conductor 12 of the connector just realizes contact with the first microstrip piece 6, the inner conductor 12 and the front of the microstrip piece are welded in a gold wire welding mode, and further transmission of signals between the coaxial line and the microstrip is realized.

The substrate materials of the first microstrip piece 6 and the third microstrip piece 9 are alumina ceramics, the dielectric constant is 9.9, the front surface of the microstrip piece is provided with a strip-shaped gold strip 15 which is mainly used for transmitting microwave signals, the back surface of the microstrip piece is completely plated with gold, and the microstrip piece is grounded after being bonded with a wall body.

The second microstrip piece 7 is a control microstrip piece, the substrate material of the second microstrip piece is alumina ceramic, the dielectric constant is 9.9, the back surface of the second microstrip piece 7 is plated with gold, the second microstrip piece is fixed on the first cavity 1 by using conductive adhesive to realize grounding, the front surface of the second microstrip piece 7 is provided with a control circuit module 10 plated with gold, the lower end of the control circuit module 10 is connected with the MEMS device 11 through gold wire bonding to realize signal transmission with the MEMS device 11, the upper end of the control circuit module 10 is welded with a control wire to realize connection with a background controller through the control wire to realize control over the MEMS device 11, wherein the control circuit module 10 is provided with a plurality of control modules, the plurality of control modules respectively correspond to the corresponding MEMS devices 11, and further realize control and test over the MEMS devices 11 such as an MEMS switch, an MEMS fixed attenuator and an MEMS step attenuator. The upper ends of the first cavity 1, the second cavity 2 and the third cavity 3 are provided with cover plates, so that the leakage of radio frequency can be prevented.

This patent is through dividing into the unit with the wholeization, through changing the unit, detects different MEMS device 11, becomes the specificity and is the commonality. This patent is through corresponding relation, one-to-one detection control.

This patent is through removable connector mode, carries out the detection control of different frequency channels MEMS device 11.

The MEMS device detection device is provided with a plurality of control circuit modules 10 which are respectively used for information transmission through control lines and controlling different MEMS devices 11 to detect, so that the universality is realized.

The working principle and the using method are as follows: the first cavity 1 fixed with the MEMS device 11 to be detected is connected with the second cavity 2 and the third cavity 3 through long screws 13, then the first microstrip sheet 6 on the second cavity 2 and the third cavity 3 is respectively in gold wire bonding welding with the second microstrip sheet 7 on the first cavity 1 in a gold wire bonding mode to realize signal transmission, then the first connector 4 or the second connector 5 corresponding to the MEMS device 11 is respectively screwed into the connector mounting hole 17, the inner conductor 12 of the connector is in gold wire bonding with the first microstrip sheet 6, the detection of the corresponding MEMS device 11 is carried out through the corresponding control circuit module 10 and the corresponding control wire control, and only the first cavity 1 with the MEMS device 11 needs to be replaced and the corresponding connector needs to be replaced if other MEMS devices 11 are tested after the test is finished.

Has the advantages that: according to the invention, the testing cavity is divided into a first cavity 1, a second cavity 2 and a third cavity 3, after the MEMS device 11 is fixed on the first cavity 1, the same testing device can be used for testing the radio frequency indexes of a plurality of MEMS devices 11 by replacing the first cavity 1 fixed with different MEMS devices 11; each microstrip sheet is fixed on the cavity by using H20E conductive adhesive, so that the grounding reliability is ensured; a conductive rubber strip 8 is added between the cavities, and a cover plate is added on the cavities to prevent radio frequency leakage; the transition of the second microstrip sheet 7 can realize the control and test of MEMS devices 11 such as MEMS switches, MEMS fixed attenuators, MEMS step attenuators and the like. The test device has the technical effects of reusable parts, cost reduction and universality.

The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure, and various modifications and changes may be made to the present disclosure by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.

Although the present disclosure has been described with reference to specific embodiments, it should be understood that the scope of the present disclosure is not limited thereto, and those skilled in the art will appreciate that various modifications and changes can be made without departing from the spirit and scope of the present disclosure.