阅读说明：本技术 光模块 (Optical module ) 是由 陈龙 孙雨舟 王冬寒 李伟龙 于登群 于 2016-02-05 设计创作，主要内容包括：本申请揭示了一种光模块,所述光模块包括壳体、设于所述壳体内的印刷电路板、光发射元件、光接收元件、以及与所述光发射元件和所述光接收元件对应设置的光纤端口,所述印刷电路板相对于所述光纤端口的另一端设置有金手指,所述印刷电路板上安装有固定件,所述光发射元件设置于所述固定件上,所述固定件与所述壳体导热连接。(The application discloses optical module, the optical module includes the casing, locates printed circuit board, light emission element, light receiving element in the casing and with light emission element with the optical fiber port that light receiving element corresponds the setting, printed circuit board for the other end of optical fiber port is provided with the golden finger, the last mounting of installing of printed circuit board, light emission element set up in on the mounting, the mounting with the casing heat conduction is connected.)

1. The utility model provides an optical module, its characterized in that, optical module includes the casing, locates printed circuit board, light-emitting component, light receiving element in the casing and with the light-emitting component with the optical fiber port that light receiving element corresponds the setting, the optical signal transmission that the light-emitting component sent extremely the optical fiber port, light receiving element receives and comes from the optical signal that the optical fiber port transmitted, printed circuit board for the other end of optical fiber port is provided with the golden finger, the last mounting that installs of printed circuit board, light-emitting component set up in on the mounting, the mounting with casing heat conduction is connected.

2. The optical module as claimed in claim 1, wherein the light emitting element is mounted at an end surface near an end of the printed circuit board opposite to the gold finger.

3. The light module of claim 2, wherein the light emitting element is electrically connected to the printed circuit board by a metal wire.

4. A light module as claimed in claim 3, characterized in that the light-emitting element is adhesively fixed to the mount.

5. The optical module of claim 1, further comprising a coupling lens disposed on the fixing member, wherein the coupling lens is adhesively fixed on the fixing member.

6. The optical module according to any one of claims 1 to 5, wherein the fixing member includes a parallel mounting portion arranged in parallel with the printed circuit board and a vertical mounting portion perpendicular to the printed circuit board, the parallel mounting portion is attached to and fixed to a surface portion of the printed circuit board, and the vertical mounting portion is spaced from a side edge of the printed circuit board.

7. The optical module of claim 6, further comprising an optical fiber pin, wherein the fixing member is provided with a pin interface for plugging with the optical fiber pin, and the optical fiber pin is optically connected to the optical fiber port.

8. The optical module of claim 7, wherein the fiber stub and the fiber port are connected by an optical fiber.

9. The light module of claim 1, wherein the light receiving element is disposed on the printed circuit board.

10. The optical module of claim 9, wherein the light receiving element and the fiber port are connected by an optical fiber.

11. An optical module is characterized by comprising a shell, a printed circuit board, a light emitting element, a light receiving element and an optical fiber port, wherein the printed circuit board, the light emitting element and the light receiving element are arranged in the shell, the optical fiber port is arranged corresponding to the light emitting element and the light receiving element, an optical signal emitted by the light emitting element is transmitted to the optical fiber port, the light receiving element receives the optical signal transmitted by the optical fiber port, the printed circuit board is provided with a golden finger relative to the other end of the optical fiber port, a fixing piece is arranged on the printed circuit board, the light emitting element is arranged on the fixing piece, and the optical fiber port is connected with the light emitting element through an optical fiber.

12. The optical module of claim 11, wherein the fixing member is provided with a pin interface, and the optical fiber port is connected to the pin interface through an optical fiber.

13. The optical module of claim 12, wherein the fixture is in thermally conductive connection with the housing.

14. The light module as claimed in claim 12, wherein the light emitting element is adhesively secured to the fixture.

15. The optical module of claim 14, wherein the fixing member includes a parallel mounting portion disposed parallel to the printed circuit board and a vertical mounting portion perpendicular to the printed circuit board, the parallel mounting portion is attached to a surface portion of the printed circuit board, and the vertical mounting portion is spaced from a side edge of the printed circuit board.

16. The optical module of claim 11, further comprising a coupling lens disposed on the fixing member, wherein the coupling lens is adhesively fixed on the fixing member.

17. The light module according to any one of claims 11 to 16, wherein the light receiving element is provided on the printed circuit board.

18. The optical module of claim 17, wherein the light receiving element and the fiber port are connected by an optical fiber.

19. The optical module as claimed in claim 18, wherein the light emitting element is mounted at an end surface near an end of the printed circuit board opposite to the gold finger.

Technical Field

The application belongs to the technical field of optical communication, and particularly relates to an optical module.

Background

The optical module consists of photoelectronic device, functional circuit, optical port, etc. The optoelectronic device comprises a transmitting part and a receiving part. In brief, the optical module has a main function of realizing photoelectric conversion, converts an electrical signal into an optical signal at a transmitting end, and converts the optical signal into the electrical signal at a receiving end after the optical signal is transmitted through an optical fiber, thereby realizing information transmission.

In the currently-used optical module, a light emitting element and a light receiving element are included in the same plane space, and referring to fig. 1, which illustrates a structure of a QSFP + optical module in the prior art as an example, the QSFP + optical module includes a housing 1, and an optical fiber connector 2, a light emitting component 3, a light receiving component 4 and a printed circuit board 5 which are located in the housing 1, where the light emitting component 3 and the light receiving component 4 are optically coupled with the optical fiber connector 2 and electrically connected with the printed circuit board 5. The light emitting component 3 and the light receiving component 4 respectively comprise a light emitting element and a light receiving element, the light emitting element and the light receiving element are arranged in the shell 1 in a left-right arrangement mode, optical signals are transmitted to the optical fiber end from the light emitting component and the optical fiber connector, the optical signals at the optical fiber end are transmitted from the optical fiber end and received by the light receiving component, and therefore the transmission and the reception of the optical signals are achieved.

Disclosure of Invention

An embodiment of the present application provides an optical module, the optical module includes printed circuit board, light emitting element, light receiving element and the optical fiber port that corresponds the setting with light emitting element and light receiving element, printed circuit board includes relative first surface and the second surface that sets up, light receiving element installs on printed circuit board's second surface, light emitting element install in on printed circuit board's the first surface or be close to printed circuit board's terminal surface department.

In one embodiment, the first surface and the second surface of the printed circuit board are respectively provided with a first signal connecting line and a second signal connecting line, the light emitting element is electrically connected with the first surface of the printed circuit board through the first signal connecting line, and the light receiving element is electrically connected with the second surface of the printed circuit board through the second signal connecting line.

In one embodiment, the optical signal emitted from the light emitting element is transmitted to an optical fiber port through an optical fiber, and the optical fiber port transmits the optical signal from the outside to the light receiving element through the optical fiber.

Another embodiment of this application still provides an optical module, the optical module includes printed circuit board, light-emitting subassembly, light-receiving subassembly and corresponds the optical fiber port who sets up with light-emitting subassembly and light-receiving subassembly, light-emitting subassembly includes light-emitting component, light-receiving subassembly includes light-receiving component, printed circuit board includes relative first surface and the second surface that sets up, light-receiving subassembly is whole or partly to be installed on printed circuit board's second surface, light-emitting subassembly is whole or partly install in on printed circuit board's the first surface or be close to printed circuit board's terminal surface department.

In one embodiment, the first surface and the second surface of the printed circuit board are respectively provided with a first signal connecting line and a second signal connecting line, the light emitting element is electrically connected with the first surface of the printed circuit board through the first signal connecting line, and the light receiving element is electrically connected with the second surface of the printed circuit board through the second signal connecting line.

In one embodiment, the optical transmission assembly further comprises a first coupling lens located in an optical path between the optical transmission element and the optical fiber port, and an optical fiber pin and a pin interface which are installed in a matched mode.

In one embodiment, the printed circuit board is fixedly provided with a fixing member, the first coupling lens and the pin interface are fixedly arranged on the fixing member, and the optical fiber pin and the pin interface are installed in a pluggable manner.

In one embodiment, the light emitting assembly includes a laser, the laser is disposed on the fixing member and is close to the end surface of the printed circuit board, and the laser and the printed circuit board are electrically connected through a metal wire.

In an embodiment, the optical module further includes a housing, and the fixing member is thermally connected to the housing.

In one embodiment, the light receiving assembly further comprises a second coupling lens located in the optical path between the light receiving element and the optical fiber port, and the second coupling lens and the optical fiber interface are fixedly mounted above the second surface of the printed circuit board.

Compared with the prior art, in the technical scheme of the application,

the light emitting element and the light receiving element are arranged on two sides of the printed circuit board, so that signal crosstalk between the light emitting element and the light receiving element is effectively reduced, and the performance of the optical module is improved;

the light emitting element and the light receiving element are positioned on two sides of the printed circuit board, and a shielding part is not needed, so that the problem of space shortage caused by the shielding part is avoided.

An embodiment of the application still provides an optical module, the optical module includes the casing, locates printed circuit board, light-emitting component, light-receiving component in the casing and with light-emitting component with the optical fiber port that light-receiving component corresponds the setting, the light signal transmission of light-emitting component transmission extremely the optical fiber port, light-receiving component receives and comes from the light signal of optical fiber port transmission, printed circuit board for the other end of optical fiber port is provided with the golden finger, the last mounting that installs of printed circuit board, light-emitting component set up in on the mounting, the mounting with casing heat conduction is connected.

In one embodiment, the light emitting element is mounted at an end surface close to an end of the printed circuit board opposite to the gold finger.

In one embodiment, the light emitting element is electrically connected to the printed circuit board through a metal wire.

In one embodiment, the light emitting element is adhesively fixed to the fixing member.

In an embodiment, the optical module further includes a coupling lens disposed on the fixing member, and the coupling lens is adhesively fixed on the fixing member.

In one embodiment, the fixing member includes a parallel mounting portion arranged in parallel with the printed circuit board and a vertical mounting portion perpendicular to the printed circuit board, the parallel mounting portion is attached to and fixed with a surface portion of the printed circuit board, and the vertical mounting portion has a distance from a side edge of the printed circuit board.

In an embodiment, the optical module further includes an optical fiber pin, the fixing member is provided with a pin interface inserted into the optical fiber pin, and the optical fiber pin is connected to the optical path of the optical fiber port.

In one embodiment, the optical fiber pin and the optical fiber port are connected through an optical fiber.

In one embodiment, the light receiving element is disposed on the printed circuit board.

In one embodiment, the light receiving element and the optical fiber port are connected by an optical fiber.

An embodiment of the application still provides an optical module, including the casing, locate printed circuit board, light emission component, light receiving element in the casing and with light emission component with the optical fiber port that light receiving element corresponds the setting, the light signal transmission of light emission component transmission extremely the optical fiber port, light receiving element receives and comes from the light signal of optical fiber port transmission, printed circuit board for the other end of optical fiber port is provided with the golden finger, the last mounting that installs of printed circuit board, light emission component set up in on the mounting, the optical fiber port with realize the connection of light signal through optic fibre between the light emission component.

In one embodiment, the fixing member is provided with a pin interface, and the optical fiber port is connected with the pin interface through an optical fiber.

In one embodiment, the fixing member is thermally connected to the housing.

In one embodiment, the light emitting element is adhesively fixed to the fixing member.

In one embodiment, the fixing member includes a parallel mounting portion arranged in parallel with the printed circuit board and a vertical mounting portion perpendicular to the printed circuit board, the parallel mounting portion is attached to and fixed with a surface portion of the printed circuit board, and the vertical mounting portion has a distance from a side edge of the printed circuit board.

In an embodiment, the optical module further includes a coupling lens disposed on the fixing member, and the coupling lens is adhesively fixed on the fixing member.

In one embodiment, the light receiving element is disposed on the printed circuit board.

In one embodiment, the light receiving element and the optical fiber port are connected by an optical fiber.

In one embodiment, the light emitting element is mounted at an end surface close to an end of the printed circuit board opposite to the gold finger.

Drawings

Fig. 1 is a schematic plan view of a light module in the prior art;

FIG. 2 is a schematic side view of a light module according to a first embodiment of the present disclosure;

FIG. 3 is a schematic side view of a light module according to a second embodiment of the present disclosure;

FIG. 4 is a schematic side view of a light module according to a third embodiment of the present disclosure;

fig. 5 is a schematic side view of a light module according to a fourth embodiment of the present application.

Detailed Description

The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present application.

In the various illustrations of the present application, certain dimensions of structures or portions are exaggerated relative to other structures or portions for ease of illustration and, thus, are provided only to illustrate the basic structure of the subject matter of the present application.

Terms such as "upper," "above," "lower," "below," and the like, used herein to denote relative spatial positions, are used for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

When an element or layer is referred to as being "on," or "connected" to another element or layer, it can be directly on, connected to, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present.

Referring to fig. 2, an optical module 100 according to a first embodiment of the present application is described, which includes a printed circuit board 120, a light emitting element 110, a light receiving element 130, and an optical fiber port 140. The light emitting element 110 may be an optical signal emitting element such as a laser, and the light receiving element 130 may be an optical signal receiving element such as a photodetector. The optical fiber port 140 transmits an optical signal emitted from the light emitting element 110 to the optical fiber, and the optical fiber port 140 transmits an optical signal from the outside to the light receiving element 130 through the optical fiber.

In the present embodiment, the optical fiber port 140 is a bidirectional optical fiber port, which is disposed corresponding to the light emitting element 110 and the light receiving element 130, and can be used for receiving the optical signal emitted from the light emitting element 110 and sending the optical signal to the light receiving element 130. In other embodiments, the optical fiber port can be provided as several unidirectional optical fiber ports, including a receiving optical fiber port for receiving optical signals and a transmitting optical fiber port for transmitting optical signals.

The printed circuit board 120 includes a first surface 1201 and a second surface 1202 disposed opposite to each other, and the light emitting element 110 and the light receiving element 130 are mounted on the first surface 1201 and the second surface 1202 of the printed circuit board, respectively. Specifically, the light emitting element 110 and the light receiving element 130 may be mounted on the surface of the printed circuit board 120 by means of adhesive fixing.

First and second signal connection lines (not shown) are respectively disposed on the first and second surfaces 1201 and 1202 of the printed circuit board 120, and may be gold wires, and the light emitting element 110 and the light receiving element 130 are electrically connected to the printed circuit board 120 through the first and second signal connection lines, respectively, for transmitting electrical signals. In addition, a gold finger tip may be provided on the other end of the printed circuit board 120 opposite the fiber port 140 for electrical connection with other devices.

Further, the optical module in this embodiment may further include a housing (not shown), the printed circuit board is fixedly mounted inside the housing, the optical fiber port is fixedly mounted on one side of the housing, and the printed circuit board, the light receiving element, the light emitting element and the optical fiber port are accommodated in the housing to be packaged into one optical module.

In addition, in order to improve the heat dissipation performance of the optical module, the light emitting element and the light receiving element may be mounted in close contact with the housing, and one or more heat dissipation structures may be disposed in the housing and thermally connected to the housing.

In this embodiment, the optical signal transmitted by the light emitting element is transmitted to the optical fiber port, the light receiving element receives the optical signal transmitted from the optical fiber port, and the light emitting element and the light receiving element are disposed on two sides of the printed circuit board, so that signal crosstalk between the light emitting element and the light receiving element is effectively reduced, performance of the optical module is improved, and a problem of space shortage caused by the fact that the light emitting element and the light receiving element are located in the same space and adopt shielding parts is avoided.

Referring to fig. 3, an optical module 200 according to a second embodiment of the present application is described, which includes a printed circuit board 220, an optical transmitter module 210, an optical receiver module 230, and an optical fiber port 240.

Specifically, the optical transmission assembly 210 includes an optical transmission element 211, a first coupling lens 212, an optical fiber stub 213, and a stub interface 214. The light emitting device 211 may be an optical signal emitting device such as a laser, and the first coupling lens 212, the optical fiber stub 213 and the stub interface 214 are located in an optical path between the light emitting device 211 and the optical fiber port 240.

The light receiving assembly 230 includes a light receiving element (not shown) at the bottom of the second coupling lens 232, and a fiber interface 233. The light receiving element may be a light signal receiving element such as a photodetector, and the second coupling lens 232 and the optical fiber interface 233 are located in the optical path between the light receiving element and the optical fiber port 240.

In this embodiment, the optical fiber port 240 is a bidirectional optical fiber port, which is disposed corresponding to the light emitting device 211 and the light receiving device, and can be used for transmitting the optical signal emitted from the light emitting device 211, and also can be used for receiving the optical signal transmitted from the outside and then transmitting the optical signal to the light receiving device. In other embodiments, the optical fiber port can be provided as several unidirectional optical fiber ports, including a receiving optical fiber port for receiving optical signals and a transmitting optical fiber port for transmitting optical signals.

The printed circuit board 220 includes a first surface 2201 and a second surface 2202 disposed opposite to each other, and the light emitting element 211 and the light receiving element are mounted on the first surface 2201 and the second surface 2202 of the printed circuit board, respectively. Specifically, the light emitting element 211 and the light receiving element may be mounted on the surface of the printed circuit board 120 by means of adhesive fixing.

First and second signal connection lines (not shown) are respectively provided on the first and second surfaces 2201 and 2202 of the printed circuit board 220, and the light emitting element 211 and the light receiving element are electrically connected to the printed circuit board 220 through the first and second signal connection lines, respectively, for transmitting electrical signals. In addition, a gold finger tip may be provided on the other end of the printed circuit board 220 opposite the fiber port 240 for electrical connection with other devices.

In this embodiment, the fixing element 221 is fixedly mounted on the printed circuit board 220, the fixing element 221 is bent and includes a parallel mounting portion 2211 parallel to the printed circuit board 220 and a vertical mounting portion 2212 perpendicular to the printed circuit board 220, the parallel mounting portion 2211 of the fixing element 221 is partially attached to and fixed to the second surface 2202 of the printed circuit board 220, and the vertical mounting portion 2212 is spaced from the side of the printed circuit board 220.

The first coupling lens 212 is fixedly mounted on the parallel mounting portion 2211 between the vertical mounting portion 2212 and the printed circuit board 220, and is disposed corresponding to the light emitting element 211. The pin interface 214 is fixedly mounted on the vertical mounting portion 2212 and is opposite to the first coupling lens 212; the optical fiber stub 213 and the stub interface 214 are removably mounted to each other, and the optical fiber stub 213 is connected to the optical fiber port 240 via an optical fiber.

The second coupling lens 232 and the optical fiber interface 233 are fixedly mounted on the second surface 2202 of the printed circuit board 220 and located in the optical path between the light receiving element and the optical fiber port 240, the optical fiber interface 233 is illustrated above the printed circuit board 220 for convenience of description in fig. 3, and is directly mounted on the second surface 2202 of the printed circuit board 220 during actual mounting, and the optical fiber interface 233 and the second coupling lens 232 are mounted in an opposite insertion manner to achieve communication of the optical path.

Preferably, the first coupling lens 212, the second coupling lens 232 and the optical fiber interface 233 are all fixedly mounted on the printed circuit board 220 by means of adhesive.

In this embodiment, the optical module is an optical module for parallel transmission, a transmission optical path of the optical module is divided into a Transmission (TX) optical path and a Reception (RX) optical path, and the specific optical path principle is as follows:

and a Transmission (TX) optical path, in which the light emitting element 211 is located below the printed circuit board 220, and the connection of the electrical signals is realized through a first signal connection line, and the emitted optical signals are converged to the end surface of the optical fiber stub 213 through the first coupling lens 212 and then transmitted to the optical fiber port 240 through an optical fiber, so as to realize the emission of the optical signals.

And a Receiving (RX) optical path, where the optical receiving element is located above the printed circuit board 220, and an optical signal of the optical fiber port 240 is transmitted to the end face of the optical fiber interface 233 and then converged onto the optical receiving element through the second coupling lens 232, so as to receive the optical signal.

Further, the optical module according to the present embodiment may further include a housing (not shown), the printed circuit board is fixedly mounted inside the housing, the optical fiber port is fixedly mounted on one side of the housing, and the shape of the housing is designed according to the shapes of the printed circuit board, the fixing member, the light receiving element, the light emitting element, the optical fiber port, and the like, so as to be packaged as one optical module.

In addition, in order to improve the heat dissipation performance of the optical module, the light emitting element and the light receiving element may be mounted in close contact with the housing, and one or more heat dissipation structures may be disposed in the housing and thermally connected to the housing.

In this embodiment, the optical signal transmitted by the optical transmitter element in the optical transmitter assembly is transmitted to the optical fiber port, the optical receiver element in the optical receiver assembly receives the optical signal transmitted from the optical fiber port, and the optical transmitter element and the optical receiver element are disposed on two sides of the printed circuit board, so that signal crosstalk between the optical transmitter element and the optical receiver element is effectively reduced, performance of the optical module is improved, and the problem of space shortage caused by using a shielding member in the same space is avoided.

Referring to fig. 4, an optical module 300 according to a third embodiment of the present application is described, which includes a printed circuit board 320, an optical transmitter 310, an optical receiver 330, and a first optical fiber port 341 and a second optical fiber port 342.

Specifically, the light emitting assembly 310 includes a light emitting element 311, and a first coupling lens 312. The light emitting element 311 may be an optical signal emitting element such as a laser, and the first coupling lens 212 is located in an optical path between the light emitting element 211 and the first optical fiber port 341.

The light receiving assembly 330 includes a light receiving element (not shown) at the bottom of the second coupling lens 332, and a fiber interface 333. The light receiving element may be a light signal receiving element such as a photodetector, and the second coupling lens 332 and the optical fiber interface 333 are located in the optical path between the light receiving element and the second optical fiber port 342.

The printed circuit board 320 includes a first surface 3201 and a second surface 3202 disposed opposite to each other, and the light emitting element 211 and the light receiving element are mounted on the first surface 2201 and the second surface 2202 of the printed circuit board, respectively. As in the second embodiment, a fixing member 321 is provided on the printed circuit board, and the first coupling lens is mounted on the fixing member 321 and provided near an end surface of the printed circuit board.

Different from the second embodiment, the optical module in this embodiment is provided with two ports, namely, a first optical fiber port and a second optical fiber port, the first optical fiber port is matched with the light emitting module and used for transmitting an optical signal emitted from the light emitting element, and the second optical fiber port is matched with the light receiving module and used for receiving an optical signal transmitted from the outside and then transmitting the optical signal to the light receiving element, so as to realize the optical module with a dual-fiber bidirectional structure.

In the present embodiment, a fiber port is described, which communicates with a light emitting module or a light receiving module through an optical fiber, but in other embodiments, a port in other situations may be used, and an example of the port is not described here.

Referring to fig. 3, an optical module 400 according to a fourth embodiment of the present application is described, which includes a printed circuit board 420, a light emitting module 410, a light receiving module 430, and a fiber port 440.

Specifically, the optical transmission assembly 410 includes an optical transmission element 411, a first coupling lens 412, an optical fiber stub 413 and a stub interface 414. The light emitting element 411 may be an optical signal emitting element such as a laser, and the first coupling lens 412, the optical fiber stub 413 and the stub interface 414 are located in an optical path between the light emitting element 411 and the optical fiber port 440.

The light receiving assembly 430 includes a light receiving element (not shown) located at the bottom of the second coupling lens 432, and a fiber interface 433. The light receiving element may be a light signal receiving element such as a photodetector, and the second coupling lens 432 and the optical fiber interface 433 are located in an optical path between the light receiving element and the optical fiber port 440.

Furthermore, the fixing element 421 is fixedly mounted on the printed circuit board 420, the fixing element 421 is bent and includes a parallel mounting portion 4211 parallel to the printed circuit board 420 and a vertical mounting portion 4212 perpendicular to the printed circuit board 420, the parallel mounting portion 4211 of the fixing element 421 is partially attached and fixed to the second surface 4202 of the printed circuit board 420, and a distance is provided between the vertical mounting portion 4212 and a side edge of the printed circuit board 420.

The optical module 400 in this embodiment has substantially the same structure as the optical module 200 in the second embodiment, except that the light emitting element 411 (such as a laser) in this embodiment is disposed on the fixing member 421 and close to the end surface of the printed circuit board 420, and the light emitting element 411 and the printed circuit board 420 are electrically connected by a metal wire 4111.

Further, the optical module 400 further includes a housing (not shown), and the fixing member 421 is in heat conduction connection with the housing, so that the heat emitted by the light emitting element 411 can be directly conducted to the housing through the fixing member 421 to be emitted, and the heat emitted by the light emitting element 411 cannot be conducted to the printed circuit board 420, thereby improving the heat dissipation performance of the entire optical module.

In addition, the light emitting element 311 in the optical module 300 according to the third embodiment of the present invention may also adopt the mounting manner in this embodiment, the light emitting element 311 is disposed on the fixing member 321 and disposed close to the end surface of the printed circuit board 320, the light emitting element 311 and the printed circuit board 320 are electrically connected through a metal wire, and the rest of the structure is the same as that of the third embodiment, so that the heat dissipation performance of the optical module 300 can be improved.

It should be understood that the optical module of the present application is not limited to include the optical components in the above embodiments, and in other embodiments, other optical components, such as mirrors, circulators, wavelength division multiplexing/demultiplexing devices, etc., may be added to the optical module.

The application has the following beneficial effects through the above embodiment:

the light emitting element and the light receiving element are arranged on two sides of the printed circuit board, so that signal crosstalk between the light emitting element and the light receiving element is effectively reduced, and the performance of the optical module is improved;

the light emitting element and the light receiving element are positioned on two sides of the printed circuit board, and a shielding part is not needed, so that the problem of space shortage caused by the shielding part is avoided.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above list of details is only for the concrete description of the feasible embodiments of the present application, they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.