阅读说明：本技术 拍摄装置 (Image capturing apparatus ) 是由 盐田昌弘 田口滋也 饭塚邦彦 芦田伸之 于 2019-07-04 设计创作，主要内容包括：拍摄装置(100)具有以矩阵状配置的多个像素(110),该像素(110)具有对在传感器元件(111)中已积蓄的电荷的输出进行控制的开关元件(112),同一列的像素被划分为区块(120),区块具有对输出进行控制的区块开关元件(122)。(An imaging device (100) is provided with a plurality of pixels (110) arranged in a matrix, wherein the pixels (110) are provided with switching elements (112) for controlling the output of charges stored in sensor elements (111), the pixels in the same column are divided into blocks (120), and the blocks are provided with block switching elements (122) for controlling the output.)

1. A camera device is characterized by comprising:

a plurality of pixels arranged in a matrix, each pixel including a sensor element for accumulating charges corresponding to an amount of radiation and a switching element for controlling an output of the charges accumulated in the sensor element,

the pixels belonging to the same column are divided into blocks composed of a plurality of pixels,

the block is provided with a block switching element for controlling the output of the electric charge outputted from the switching element in the block.

2. The camera according to claim 1,

there is also a row selection circuit for sequentially selecting the pixels of each row,

the block switching elements in the block are controlled to:

the block switching element is turned on during a period in which a column to which the pixel in the block belongs is selected;

the block switching element is turned off during a period in which a column other than the column to which the pixel belongs in the block is selected.

3. The camera according to claim 1,

the block is provided with a block output line for outputting electric charges from each switching element in the block.

4. The camera according to claim 3,

the pixels in the block are arranged with the block output line interposed therebetween.

5. The camera according to claim 2,

the block is provided with a block output line for outputting electric charges from each switching element in the block.

6. The camera according to claim 5,

the pixels in the block are arranged with the block output line interposed therebetween.

7. The photographing apparatus according to any one of claims 1 to 6,

there is also a readout circuit that converts the amount of electric charge output from the block switching elements into an electric signal.

Technical Field

The present invention relates to an imaging apparatus, and more particularly to an X-ray imaging apparatus using a flat panel detector.

Background

As the sensor element that outputs an electric signal corresponding to the amount of incident radiation, particularly X-rays, a direct conversion type that directly converts X-rays into an electric signal or an indirect conversion type that converts X-rays into light with a scintillator and further into an electric signal with a photoelectric conversion element is used. As disclosed in patent document 1, a panel for X-ray image capturing has been developed in which a plurality of pixels using such X-ray sensor elements are arranged in a two-dimensional matrix on a substrate.

In this panel, the gate terminal of the tft (thin film transistor) as a switching element in each pixel is commonly connected to a row selection line (gate drive line) for each row of the two-dimensional matrix. The respective row select lines are connected to the line output terminals of the gate drivers. The drain terminals of the TFTs in the respective pixels are commonly connected to an output line (data signal line) for each column of the two-dimensional matrix. Each output line is connected to each line input terminal of the multiplexer via a Read circuit which is an integration circuit including a Read-out Amplifier (Read-out Amplifier), a capacitor for a time constant, and a switch for reset.

Disclosure of Invention

Technical problem to be solved by the invention

In such an imaging device, in order to increase the size of the applicable region and improve the performance, it is desired to increase the definition and the size, and a large increase in the number of pixels is required. For example, in the case of a pixel having 1000 × 1000 pixels, 1000 switching elements are connected in parallel with 1 readout circuit. Therefore, the capacitance due to the switching element on the output line side (input side of the readout circuit) as viewed from the readout circuit also increases greatly. Such a capacitance of the output line is one of factors that deteriorate the performance of the X-ray image panel, and is related to thermal noise of the output line. Accordingly, the thermal noise of the output line increases as the number of pixels increases, and the performance (SN ratio) of the X-ray image panel deteriorates, which is a problem when the panel is increased in size.

An object of one embodiment of the present invention is to provide an imaging device capable of suppressing noise in an image.

Means for solving the problems

(1) One embodiment of the present invention is an imaging apparatus including a plurality of pixels arranged in a matrix, each of the plurality of pixels including a sensor element that accumulates charges corresponding to an amount of radiation, and a switching element that controls an output of the charges accumulated in the sensor element, wherein the pixels belonging to a same column are divided into blocks each including a plurality of pixels, and a block switching element that controls an output of the charges output from the switching element in each of the blocks is provided in each of the blocks.

(2) Further, an imaging device according to an embodiment of the present invention has, in addition to the configuration of the above (1), a row selection circuit that sequentially selects the pixels in each row, and the block switching elements in the block are controlled such that: in a period in which a row to which a pixel in the block belongs is selected, the pixel is turned on; the block is turned off while the columns other than the column to which the pixels belong are selected.

(3) In addition to the configuration of (1) or (2), the imaging device according to an embodiment of the present invention is configured such that a block output line that outputs charges from each switching element in the block is provided in the block.

(4) In addition to the configuration of (3), an imaging device according to an embodiment of the present invention is configured such that pixels in the block are arranged with the block output line interposed therebetween.

(5) Further, an imaging device according to an embodiment of the present invention has a readout circuit that converts the amount of electric charge output from the block switching element into an electric signal, in addition to any one of the configurations (1) to (4) described above.

Effects of the invention

According to one aspect of the present invention, an imaging apparatus capable of suppressing noise of an image can be realized.

Drawings

Fig. 1 is a diagram showing a circuit configuration of an imaging device according to a first embodiment of the present invention.

Fig. 2 is a schematic diagram showing the arrangement of pixels in the imaging device according to the first embodiment of the present invention.

Fig. 3 is a timing chart showing the operation of the imaging apparatus according to the first embodiment of the present invention.

Fig. 4 is a schematic diagram showing the arrangement of pixels in an imaging device according to a second embodiment of the present invention.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the materials, shapes, relative arrangements, processing methods, and the like of the structures described in the embodiments are merely examples, and the scope of the present invention should not be construed as being limited thereto. The drawings are schematic, and the scale and shape of the dimensions are different from those of reality. In the drawings, the same or corresponding components are sometimes denoted by the same reference numerals.

[ first embodiment ]

A first embodiment of the present invention will be described with reference to fig. 1 to 3.

(construction of the image pickup apparatus 100)

Fig. 1 is a diagram showing a circuit configuration of an imaging device 100 according to the present embodiment. As shown in the drawing, the imaging apparatus 100 includes a plurality of pixels 110 arranged in a matrix, and each pixel 110 includes a sensor element 111 and a switching element 112. The switching element 112 is a switch for controlling an output from the pixel 110 to the outside, and a source terminal thereof is connected to one terminal of the sensor element 111. In this embodiment, a known switching element such as an FET including a TFT may be used as the switching element 112.

The gate terminals of the switching elements 112 of the pixels 110 in the same row are connected to 1 output terminal, which is an output terminal of the first gate driver of the row selection circuit 130, through a common row selection line 131. In this way, in the present application, the pixels 110 connected to the common row selection line 131 are pixels in the same row. In the present embodiment, the number of rows may be 1000.

The pixels 110 in the same column are divided into blocks 120 composed of a plurality of pixels. The respective blocks 120 have block output lines 121 and block switching elements 122. The block output line 121 is connected to the drain terminal of the switching element 112 of each pixel 110 in the block. The block switching element 122 is a switch for controlling an output from the block 120 to the outside, and a source terminal is connected to an end of the block output line 121.

In the present embodiment, the block switching element 122 is formed of a TFT, but a known switching element such as an FET may be used. In the present embodiment, each block 120 has 100 pixels 110, and thus the number of columns (block columns) formed by the blocks 120 is 10.

The gate terminals of the block switching elements 122 of the blocks 120 belonging to the same block column are connected to 1 output terminal, which is the output terminal of the second gate driver of the block selection circuit 140, through a common block selection line 141.

The drain terminals of the block switching elements 122 of the blocks 120 in the same column are connected to the input terminals of the readout circuits 150 provided for each column via a common output line 151. The outputs of the respective readout circuits 150 are input to a multiplexer 160. In this way, in the present application, the pixels 110 connected to the common output line 151 are pixels in the same column. In this embodiment, the number of columns may be 1000. The readout circuit 150 may use a known readout circuit for accumulating electric charges, and may be, for example, an integration circuit having the same configuration as that described in patent document 1.

Fig. 2 is a diagram schematically showing the arrangement of pixels in the imaging apparatus 100 according to the present embodiment. In the figure, the pixel 110 is schematically represented by a four-sided frame, and the switching element 112 is schematically represented by a circuit symbol. Note that Gn is a reference numeral of the row selection line 131 in the nth row, and BGn is a reference numeral of the block selection line 141 in the nth block row.

In the present embodiment, a row selection line 131 is provided for each row in the geometric configuration of the pixels 110. In addition, an output line 151 is provided for each column in the geometric configuration of the pixels 110. Therefore, in the present embodiment having a circuit configuration of 1000 rows and 1000 columns, the pixels are also arranged geometrically in 1000 rows and 1000 columns.

(operation of imaging device 100)

Next, the operation of the imaging apparatus 100 according to the present embodiment will be described with reference to the timing chart of fig. 3.

The row selection circuit 130 outputs a row selection signal to the slave row selection lines G1 to G1000. As shown in fig. 3, the on signal is output only to 1 row selection line Gn sequentially selected from the row selection lines G1 to G1000, and the off signal is output to the unselected row selection lines Gn.

In addition, the block selection circuit 140 outputs block selection signals to the slave block selection lines BG1 to BG10 as described below. An on signal is output to the block selection line 141 connected to the selected block 120, and an off signal is output to the unselected block selection line 141. The row to which any of the pixels 110 included in the selected block 120 belongs is selected by the row selection circuit 130.

For example, the block 120 of the first block column includes the pixels 110 from the first column to the first 00 column, and the block 120 of the second block column includes the pixels 110 from the first 01 column to the second 00 column. The block selection circuit 140 selects the block selection line BG1 during a period in which the row selection circuit 130 selects any one of G1 to G100, and the block selection circuit 140 selects the block selection line BG2 during a period in which the row selection circuit 130 selects any one of G101 to G200. In this way, the block selection circuit 140 selectively outputs the on signals in order from the block selection lines BG1 to BG 10.

That is, the block switching element 122 in a specific block 120 is turned on during a period in which the row of the pixel 110 in the block 120 is selected by the row selection circuit 130, and is turned off during a period in which the rows other than the row of the pixel 110 in the block 120 are selected. Thus, the pixels 110 in a specific block 120 are disconnected from the output lines 151 by the block switching elements 122 while the columns other than the column to which the pixels 110 in the block 120 belong are selected.

By controlling the switching elements 112 and the block switching elements 122 as described above, the respective pixels 110 are read out as follows.

The switching element 112 of the pixel 110 belonging to the selected row is turned on by an on signal applied to the gate. The block output line 121 of the block 120 including the sensor element 111 of the pixel 110 and the pixel 110 is turned on. The block switching elements 122 in the block 120 are turned on by an on signal applied from the block selection line 141 to the gate, and the block output line 121 and the output line 151 are turned on.

Accordingly, the electric charge accumulated in the sensor element 111 is introduced into the read circuit 150 through the switching element 112, the block output line 121, the block switching element 122, and the output line 151, converted into a predetermined electric signal corresponding to the accumulated charge amount, and input to the multiplexer 160.

When the period of row selection in the pixel 110 is completed, the switching element 112 is turned off. Thus, the sensor element 111 of the pixel 110 is not electrically connected to the output line 151 side, and charges corresponding to the amount of X-rays (radiation) irradiated are accumulated until the next selection.

In this way, the amount of X-rays irradiated to each pixel 110 in each column is sequentially selected, converted into an electric signal, and read. In this way, the pixels of each column are read out in time series, and can be acquired as two-dimensional X-ray image data in the same manner as the technique described in patent document 1.

(Effect of the photographing apparatus 100)

For comparison, X-ray image data was acquired using an imaging device (comparative example) to which the related art is applied, having a circuit configuration of 1000 rows and 1000 columns, which is of the same scale as the present embodiment. Here, the conventional technique is a technique of not dividing pixels of each column into blocks. In the imaging device of the comparative example, noise is significantly expressed, the contrast of the image is reduced, and the image quality is significantly deteriorated, as compared with the case of using the imaging device 100 of the present embodiment.

This difference is shown for the following reason. The respective switching elements and block switching elements have a gate-drain capacitance Cs. Therefore, in an imaging device to which the conventional technique is applied, the capacitance on the input side (capacitance of an output line) is viewed from the readout circuit of each column and is proportional to the number of pixels (switching elements) connected to each column. If the imaging device is an imaging device with a circuit scale of not large and a number of rows of 100, the capacitance of the output line is 100 Cs. On the other hand, if the number of columns is 1000, the capacitance of the output line becomes about 1000Cs, and the number of pixels increases greatly with the increase in the scale of the number of pixels.

The capacitance of the output line is related to the noise level when the readout circuit 150 reads out the accumulated charge amount. Therefore, in the conventional technique, the image is degraded with such a scale enlargement, and in the comparative example in which the number of rows is 1000, the noise of the image due to the capacitance Cs between the gate and the drain is about 10 times as large as that in the case of the small-scale imaging device in which the number of rows is about 100.

On the other hand, in the imaging device 100 according to the present embodiment, the capacitance on the input side (the capacitance of the output line) is observed from the readout circuit 150 of each column, and in a certain period, the switching element 112 of the pixel 110 in the selected block (the block switching element is turned on) and the capacitance Cs of the block switching element 122 of the unselected block 120 are connected in parallel. The capacitance of the output line is about 109Cs, which is unchanged compared with the case of a small-scale imaging device having about 100 rows. Thus, according to the imaging device 100 of the present embodiment, the image deterioration due to the scaling-up is almost eliminated, and an imaging device with a large pixel count and a large scale can be realized with a better image quality than that of the imaging device of the comparative example.

[ second embodiment ]

An imaging device according to a second embodiment of the present invention will be described. The present embodiment is different from the imaging apparatus 100 of the first embodiment in circuit configuration.

Fig. 4 is a diagram schematically showing the arrangement of pixels in the imaging device 200 according to the present embodiment. In the figure, the pixel 210 is schematically represented by a four-sided frame, and the switching element 212 is schematically represented by a circuit symbol. As in fig. 2, the sensor elements are not shown. Note that Gn is a row selection line 231 in the nth row, and BGn is a block selection line 241 in the nth block row.

Unlike the imaging apparatus 100 of the first embodiment, the imaging apparatus 200 of the present embodiment is provided with 1 output line 251 for every 2 columns in the geometric configuration of the pixels 210. In each block 220, the pixels 210 are arranged on the left and right sides with a block output line 221 interposed therebetween, and are connected to a common block output line 221. The block output line 221 is connected to the output line 251 via the block switching element 222. The output line 251 is disposed on one side (right side) of the block 220. These right and left pixels 210 belong to the same column because they are connected to the same output line 251. That is, in the present embodiment, the columns in the geometric arrangement of the pixels do not coincide with the columns defined by the circuit configuration.

In the block 220, 2 pixels 210 geometrically arranged in the same row, which are adjacent to each other on the left and right sides with a block output line 221 interposed therebetween, are connected to other row selection lines 231 (e.g., G1 and G2), respectively. Thus, the rows in the geometric configuration are not consistent with the rows defined by the circuit structure.

In this embodiment, the arrangement of pixels is geometrically 1000 rows and 1000 columns, but the circuit configuration is 2000 rows and 500 columns. Thus, 500 readout circuits are required corresponding to the number of columns. Compared to the imaging apparatus 100 of the first embodiment, the number of necessary readout circuits can be halved while being the same as the geometric arrangement of the pixels.

In the present embodiment, since the block output lines 221 and the output lines 251 are arranged as described above, only one of the block output lines 221 and the output lines 251 (except for the block 220 in the first row) is arranged between the pixels 210 adjacent to each other on the left and right. Thus, the pixels 210 can be more integrated than the imaging device 100 of the first embodiment in which both the block output line 121 and the output line 151 are arranged between the pixels 210 adjacent to each other on the left and right.

In the present embodiment, as in the first embodiment, the pixels 210 connected to the same output line 251 (pixels 210 in the same column) are divided into a plurality of blocks 220. As shown in fig. 4, the number of pixels in each block 220 may be set to 100, for example. At this time, the number of blocks per 1 column becomes 20, and the total number of block selection lines 241 becomes 20.

(operation of imaging device 200)

In the present embodiment, the operation may be performed in the same manner as the imaging apparatus 100 of the first embodiment. That is, although the total number of rows and the total number of block rows are different, signals from the pixels 210 can be sequentially read out by the operation described with reference to the timing chart of fig. 3.

(Effect of the photographing device 200)

In the imaging device 200 of the present embodiment, the readout circuit of each column observes the capacitance (capacitance of the output line) on the input side, and in a certain period, the switching element 212 of the pixel 210 in the selected block 220 (the block switching element 222 is turned on) and the capacitance Cs of the block switching element 222 in the unselected block 220 are connected in parallel. Thus, the number of lines is about 119Cs, which is still unchanged from the case of a small-scale imaging device with the number of lines being about 100. Therefore, with the imaging device 200 of the present embodiment, it is possible to realize an imaging device in which deterioration of an image due to upsizing is almost eliminated and the size of the number of pixels is large.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments are also included in the technical scope of the present invention. Further, by combining the technical methods disclosed in the respective embodiments, new technical features can be formed.

Description of the reference numerals

100. 200 shooting device

110. 210 pixel

111 sensor element

112. 212 switching element

120. 220 block

121. 221 block output line

122. 222 block switch element

130 row selection circuit

131. 231 row select line

140 block selection circuit

141. 241 block selection line

150 readout circuit

151. 251 output line

160 multiplexer