Aqueous treatment agent, method for producing aqueous treatment agent, and method for using aqueous treatment agent

文档序号:1549102 发布日期:2020-01-17 浏览:17次 中文

阅读说明:本技术 水性处理剂、水性处理剂的制造方法以及水性处理剂的使用方法 (Aqueous treatment agent, method for producing aqueous treatment agent, and method for using aqueous treatment agent ) 是由 松野竹己 北川胜治 花园操 下泽忆良 于 2019-01-07 设计创作,主要内容包括:本发明提供具有良好的环境安全性、水性溶液稳定性、且对各种成型品等得到良好的表面改性的水性处理剂等。所述水性处理剂是含有含酰亚胺基的化合物、含氟树脂的水性分散液和胺化合物的水性处理剂等,所述含酰亚胺基的化合物来自将聚酰亚胺成型品部分水解而成的含酰亚胺基的化合物,相对于含酰亚胺基的化合物中所含的含酰亚胺基的化合物100重量份,使含氟树脂的水性分散液中所含的氟树脂的配合量以固体成分换算计为0.1~10000重量份的范围内的值。(The invention provides an aqueous treating agent which has good environmental safety and aqueous solution stability and can obtain good surface modification for various molded products and the like. The aqueous treating agent is an aqueous treating agent containing an imide group-containing compound obtained by partially hydrolyzing a polyimide molded product, an aqueous dispersion of a fluorine-containing resin, and an amine compound, and the amount of the fluororesin contained in the aqueous dispersion of the fluorine-containing resin is in the range of 0.1 to 10000 parts by weight in terms of solid content, relative to 100 parts by weight of the imide group-containing compound contained in the imide group-containing compound.)

1. An aqueous treating agent comprising an imide group-containing compound obtained by partially hydrolyzing a polyimide molded product, an aqueous dispersion of a fluorine-containing resin, and an amine compound, wherein the amount of the fluororesin contained in the aqueous dispersion of the fluorine-containing resin is in the range of 0.1 to 10000 parts by weight in terms of solid content per 100 parts by weight of the imide group-containing compound, and the amount of the amine compound is in the range of 0.1 to 30 parts by weight per 100 parts by weight of the imide group-containing compound.

2. The aqueous treatment agent according to claim 1, wherein the boiling point of the amine compound is set to a value in the range of 50 to 350 ℃.

3. The aqueous treatment agent according to claim 1 or 2, wherein the aqueous dispersion of the fluorine-containing resin contains the fluororesin particles, and the average particle diameter of the fluororesin particles is set to a value in the range of 0.01 to 10 μm.

4. The aqueous treatment agent according to any one of claims 1 to 3, wherein the aqueous dispersion of the fluorine-containing resin contains a surfactant, and the amount of the surfactant added is in the range of 0.01 to 10% by weight based on the total amount of the aqueous dispersion of the fluorine-containing resin.

5. The aqueous treating agent according to any one of claims 1 to 4, wherein the imide group-containing compound is characterized by having an infrared spectrum obtained by infrared spectroscopic measurement of the imide group-containing compound at a wave number of 1375cm-1Has an absorption peak at a wave number of 1600cm from an imide group-1Has an absorption peak derived from an amide group at a wave number of 1413cm-1Has an absorption peak from the carboxyl group.

6. The aqueous treating agent according to any one of claims 1 to 5, wherein the imide group-containing compound contains at least one of an orthoformate compound, a phytic acid compound, a dacromet compound, and EDTA as a viscosity stabilizer, and the amount of the viscosity stabilizer is set to a value within a range of 0.01 to 20 wt% relative to the total amount of the imide group-containing compounds.

7. A method for producing an aqueous treating agent, which is characterized by comprising an aqueous dispersion of a fluororesin and an imide group-containing compound obtained by partially hydrolyzing a polyimide molded article, the method comprising the following steps (1) to (3):

(1) a step of preparing an imide group-containing compound as a1 st solution by mixing an aqueous solvent at a value in the range of 0.1 to 30 parts by weight based on 100 parts by weight of the imide group-containing compound,

(2) a step of preparing an aqueous dispersion of a fluorine-containing resin as a2 nd solution,

(3) and a step of mixing the imide group-containing compound in the 1 st solution and the fluororesin in the 2 nd solution so that the amount of the fluororesin is in the range of 0.1 to 10000 parts by weight in terms of solid content, based on 100 parts by weight of the imide group-containing compound in the 1 st solution, to prepare an aqueous treating agent.

8. A method for using an aqueous treatment agent, which is characterized by comprising an aqueous dispersion of a fluororesin and an imide group-containing compound obtained by partially hydrolyzing a polyimide molded article, the method comprising the following steps (1 ') to (3'):

(1') a step of preparing an aqueous treating agent comprising an imide group-containing compound obtained by partially hydrolyzing a polyimide molded product and an aqueous dispersion of a fluorine-containing resin, wherein the amount of the fluorine-containing resin contained in the aqueous dispersion of the fluorine-containing resin is in the range of 0.1 to 10000 parts by weight in terms of solid content per 100 parts by weight of the imide group-containing compound,

(2') laminating the aqueous treating agent on the surface of the material to be treated,

(3') heating the aqueous treating agent laminated on the surface of the material to be treated at a temperature of 200 ℃ or higher to form a surface-treated film.

Technical Field

The present invention relates to a method for producing an aqueous treatment agent, a method for using an aqueous treatment agent, and an aqueous treatment agent. In particular, the present invention relates to an aqueous treatment agent which is excellent in environmental safety and solution stability and has excellent adhesion to various materials to be treated, an efficient method for producing such an aqueous treatment agent, and a method for using such an aqueous treatment agent.

Background

Conventionally, polyimide molded articles represented by polyimide films are insoluble in various solvents because of their excellent chemical resistance, and are difficult to melt and reuse like thermoplastic plastics such as polystyrene because of their high melting points. Therefore, it has been found that, although the disposal of polyimide molded articles and the like is expensive, most of them are disposed of in landfills or incinerated, and thus there is a problem that they are poor in recyclability and environmental properties.

Therefore, various methods have been proposed for recycling polyimide resins and the like by chemically hydrolyzing polyimide molded articles to be discarded. For example, it has been proposed to completely hydrolyze an aromatic polyimide molded article in the presence of a base having a predetermined concentration under a predetermined temperature condition to obtain an aromatic tetracarboxylic dianhydride and an aromatic diamine as raw materials (see patent document 1).

Further, the applicant has proposed a low-temperature curable imide group-containing compound which can be cured at a low temperature and has excellent solubility and adhesion by using an imide group-containing compound having a specific structure in which a polyimide molded article is recycled, partially hydrolyzed, and has a predetermined absorption peak in an infrared spectrum obtained by infrared spectroscopic measurement (see patent document 2).

Further, the applicant has proposed an imide group-containing compound composition which can suppress an increase in viscosity even in a solution state by containing an imide group-containing compound having a specific structure which is partially hydrolyzed by recycling a polyimide molded product and has a predetermined infrared absorption peak, a solvent, and a viscosity stabilizer (see patent document 3).

Disclosure of Invention

However, the main object of the method for regenerating a polyimide molded article of patent document 1 is to hydrolyze the polyimide molded article substantially completely, precipitate an aromatic tetracarboxylic dianhydride and an aromatic diamine, and separate and recover them to obtain a polyimide raw material and a residual metal material. Therefore, only the production of a regenerated polyimide resin is considered for the recovered polyimide raw material and the like, and no consideration is given to the primer treatment of a fluororesin or the like for an aqueous dispersion liquid or the like containing a fluororesin.

Patent documents 2 and 3 disclose that N-methylpyrrolidone is used as a solvent, and various resins containing a fluororesin or the like can be usually blended with an imide group-containing compound having a specific structure. However, it is not considered at all that the surface of the polyimide resin molded article can be modified by blending the fluorine-containing aqueous dispersion with the imide group-containing compound having a specific structure at a specific ratio to constitute a circuit board for high frequency signals. Further, there is no consideration given to the use of a primer treatment in place of a surface treatment such as a conventional chromium treatment to provide a fluororesin-coated molded article such as a frying pan. That is, there has been no finding that when an aqueous treatment agent is constituted by mixing an aqueous dispersion of an imide group-containing compound and a fluorine-containing resin at a specific ratio, the aqueous treatment agent is excellent in environmental safety, aqueous solution stability, and the like, and that when used, the imide group-containing compound and the fluorine-containing resin are appropriately phase-separated, and exhibits good adhesion to polyimide resins and the like, iron, and the like.

The present inventors have made extensive studies and, as a result, have found that excellent environmental safety and aqueous solution stability are obtained by utilizing a phase separation phenomenon between an imide group-containing compound having a specific structure and a fluororesin contained in an aqueous dispersion of a predetermined fluororesin, and that excellent adhesion and primer treatability can be exhibited to various resin molded articles such as polyimide resin molded articles and fluororesin molded articles, metals and the like, and have completed the present invention. That is, according to the present invention, it is an object to provide an aqueous treatment agent which is derived from an imide group-containing compound, an aqueous dispersion of a fluorine-containing resin, and an amine compound, is excellent in environmental safety and aqueous solution stability, is easy to handle, and can exhibit excellent adhesion to various resin molded articles, metals, and the like, an efficient production method thereof, and a use method thereof.

According to the present invention, there is provided an aqueous treating agent comprising an imide group-containing compound obtained by partially hydrolyzing a polyimide molded product, wherein the amount of a fluororesin contained in an aqueous dispersion of a fluororesin is in the range of 0.1 to 10000 parts by weight in terms of solid content per 100 parts by weight of the imide group-containing compound, and the amount of an amine compound is in the range of 0.1 to 30 parts by weight per 100 parts by weight of the imide group-containing compound.

By thus mixing the imide group-containing compound, the aqueous dispersion of the fluorine-containing resin, and the amine compound in a predetermined ratio in terms of solid content, good aqueous liquid stability and environmental safety can be obtained. More specifically, for example, under storage conditions of room temperature to 40 ℃ for 3 months, the viscosity increases to 3 times or less the initial viscosity without particularly causing precipitation. In addition, the water content is basically high, which corresponds to a non-hazardous substance in the fire-fighting law. Further, by applying an aqueous treating agent to a substrate or the like and then performing a predetermined heating treatment, a surface-treated film (including a primer layer and the like, hereinafter, the same applies) obtained by causing a critical phase separation between an imide group-containing compound contained in the imide group-containing compound and a fluorine-containing resin or the like contained in an aqueous dispersion of a fluorine-containing resin can exhibit good adhesion to various resin molded articles such as polyimide resin molded articles and fluorine resin molded articles, metals and the like. In the present invention, a composition obtained by adding a predetermined amount of an amine compound to the imide group-containing compound in this manner is sometimes referred to as an aqueous imide group-containing compound. That is, although an imide group-containing compound may show poor solubility before a predetermined amount of the amine compound is added, the compound is remarkably water-soluble when a predetermined amount of the amine compound is added, and thus, it is referred to as an aqueous imide group-containing compound.

In addition, in the case of constituting the aqueous treatment agent of the present invention, it is preferable that the boiling point (atmospheric pressure, the same applies hereinafter) of the amine compound is a value in the range of 50 to 350 ℃. By blending an amine compound having a predetermined boiling point in this manner, the aqueous treatment agent can be sufficiently dispersed when heated under predetermined conditions, and the predetermined surface-treated film obtained can have good heat resistance, electrical properties, and the like.

In addition, when the aqueous treatment agent of the present invention is constituted, it is preferable that the aqueous dispersion of the fluorine-containing resin contains fluorine resin particles, and the average particle size of the fluorine resin particles is set to a value within a range of 0.01 to 10 μm.

By setting the average particle diameter (median diameter, D50) of the fluororesin particles to a value within the predetermined range in this way, the stability of the aqueous solution of the obtained aqueous treatment agent can be further improved, the phase separation from the imide group-containing compound becomes more critical and easier, and the adhesion to various objects to be treated and the like can be further improved.

In the case of constituting the aqueous treatment agent of the present invention, it is preferable that the aqueous dispersion of a fluororesin contains a surfactant, and the amount of the surfactant added is in the range of 0.01 to 10% by weight relative to the total amount of the aqueous dispersion of a fluororesin.

By blending the surfactant in a predetermined amount in this manner, an aqueous treatment agent which can achieve more favorable stability of an aqueous solution and more favorable surface coatability and the like with respect to various objects to be treated can be obtained.

In addition, in the case of constituting the aqueous treating agent of the present invention, it is preferable that the imide group-containing compound has an infrared spectrum of 1375cm in wave number in an infrared spectrum obtained by measuring an infrared spectrum of the imide group-containing compound-1Has an absorption peak at a wave number of 1600cm from an imide group-1Has an absorption peak from the amide group and a wave number of 1413cm-1Has an absorption peak from the carboxyl group.

Such an imide group-containing compound is excellent in solubility in a water-soluble solvent (water, alcohol, etc.), and can be heated at a relatively low temperature to cause a curing reaction to proceed reliably in a short time, thereby producing a typical polyimide resin. In addition, if the compound containing an imide group is used, it can be widely blended with an aqueous dispersion of a fluorine-containing resin, and can be further subjected to a critical phase separation with a fluororesin.

In addition, in the case of constituting the aqueous treatment agent of the present invention, it is preferable that the imide group-containing compound contains at least one of an orthoformate compound, a phytic acid compound, a dacromet compound, and EDTA as a viscosity stabilizer, and the amount of the viscosity stabilizer is set to a value within a range of 0.01 to 20 wt% relative to the total amount of the imide group-containing compounds.

By blending a specific amount of the viscosity stabilizer in this manner, an increase in viscosity of the aqueous treatment agent during storage can be effectively suppressed. Therefore, the aqueous solution stability of the obtained aqueous treatment agent can be further improved, and the adhesion to various objects to be treated, metals, and the like, the surface coatability, and the like can be more reliably and stably exhibited.

Another aspect of the present invention is a method for producing an aqueous treating agent, the method comprising the steps (1) to (3) described below, wherein the method comprises partially hydrolyzing a polyimide molded article to obtain an imide group-containing compound, an aqueous dispersion of a fluorine-containing resin, and an amine compound.

(1) A step of preparing a solution (which may be referred to as an amine solution) of an imide group-containing compound as a1 st solution, the imide group-containing compound being mixed such that the aqueous solvent has a value in the range of 0.1 to 30 parts by weight in terms of solid content per 100 parts by weight of the imide group-containing compound, and the amine compound has a value in the range of 0.1 to 30 parts by weight per 100 parts by weight of the imide group-containing compound;

(2) preparing an aqueous dispersion of a fluororesin as a2 nd solution;

(3) and a step of mixing the 1 st solution and the 2 nd solution so that the amount of the fluororesin contained in the 2 nd solution is in the range of 0.1 to 10000 parts by weight in terms of solid content, based on 100 parts by weight of the imide group-containing compound contained in the 1 st solution, to obtain an aqueous treating agent.

By thus mixing the amine solution of the imide group-containing compound and the aqueous dispersion of the fluorine-containing resin in a predetermined ratio in terms of solid content, an aqueous treatment agent having excellent environmental safety and aqueous solution stability can be obtained. Further, by applying an aqueous treating agent to a substrate or the like and then performing a predetermined heat treatment, the imide group-containing compound contained in the imide group-containing compound and the fluorine-containing resin contained in the aqueous dispersion of the fluorine-containing resin can be phase-separated at critical points to form a surface-treated film that exhibits good adhesion to various resin molded articles, metals, and the like. The amine compound may partially react with the imide group-containing compound depending on the boiling point thereof and remain, but most of the amine compound may be scattered by the predetermined heat treatment.

Another aspect of the present invention is a method for using an aqueous treatment agent, the method comprising the steps (1 ') to (3') below, wherein the method comprises the step of partially hydrolyzing a polyimide molded article to obtain an imide group-containing compound, the step of using an aqueous dispersion of a fluororesin, and the step of using an aqueous treatment agent.

(1') preparing an aqueous treating agent comprising an imide group-containing compound obtained by partially hydrolyzing a polyimide molded product, an aqueous dispersion of a fluorine-containing resin, and an amine compound, wherein the amount of the fluorine-containing resin contained in the aqueous dispersion of the fluorine-containing resin is in the range of 0.1 to 10000 parts by weight in terms of solid content per 100 parts by weight of the imide group-containing compound, and the amount of the amine compound is in the range of 0.1 to 30 parts by weight per 100 parts by weight of the imide group-containing compound;

(2') laminating an aqueous treatment agent on the surface of the material to be treated;

(3') heating the aqueous treatment agent laminated on the surface of the material to be treated at a temperature of 200 ℃ or higher to form a surface-treated film.

In this manner, by blending the compound containing an imide group, the aqueous dispersion of the fluororesin, and the amine compound in the step (1') so as to be in a predetermined ratio in terms of solid content, an aqueous treatment agent having excellent environmental safety and aqueous solution stability can be obtained. In addition, a predetermined surface treatment film (including a primer treatment layer and the like) can be formed by laminating (applying) the aqueous treatment agent to the material to be treated in the step (2 ') and then performing a predetermined heat treatment in the step (3'). That is, the imide group-containing compound is phase-separated from the fluorine-based resin or the like in a critical manner, and not only a polyimide resin molded article or a fluorine-based resin molded article, as typified by a predetermined water repellency and stain resistance, can be obtained, but also excellent adhesion to various resin molded articles, metals, and the like can be exhibited.

Drawings

Fig. 1(a) to (d) are views for explaining a configuration example of a polyimide resin molded article or the like surface-treated with an aqueous treating agent.

FIG. 2 is a FT-IR chart of an exemplary imide group-containing compound before curing.

FIG. 3 is a FT-IR chart of an example of a cured imide group-containing compound.

Fig. 4(a) to (b) are FT-IR graphs of the aqueous treatment agent (another imide group-containing compound is 100%) before and after curing, respectively.

Fig. 5(a) to (b) are FT-IR graphs of the aqueous treatment agent (further imide group-containing compound/fluororesin: 9/1 by weight) before and after curing, respectively.

Fig. 6(a) to (b) are FT-IR graphs of the aqueous treatment agent (further imide group-containing compound/fluororesin: 7/3 by weight) before and after curing, respectively.

Fig. 7(a) to (b) are FT-IR graphs of the aqueous treatment agent (further imide group-containing compound/fluororesin: 5/5 by weight) before and after curing, respectively.

Fig. 8(a) to (b) are FT-IR graphs of the aqueous treatment agent (other imide group-containing compound/fluororesin: 3/7 by weight) before and after curing, respectively.

Fig. 9(a) to (b) are FT-IR graphs of the aqueous treatment agent (fluororesin: 100% by weight) before and after curing, respectively.

Fig. 10 is a diagram for explaining the influence of the blending ratio of the fluororesin and the imide group-containing compound contained in the aqueous treating agent on the surface tension of the surface-modified film obtained from the aqueous treating agent.

FIGS. 11(a) to (d) are views for explaining a method of using the aqueous treatment agent.

Detailed Description

[ embodiment 1]

Embodiment 1 is an aqueous treating agent containing an imide group-containing compound obtained by partially hydrolyzing a polyimide molded product, an aqueous dispersion of a fluorine-containing resin, and an amine compound, wherein the amount of the fluorine resin contained in the aqueous dispersion of the fluorine-containing resin is in the range of 0.1 to 10000 parts by weight in terms of solid content per 100 parts by weight of the imide group-containing compound, and the amount of the amine compound is in the range of 0.1 to 30 parts by weight per 100 parts by weight of the imide group-containing compound. Hereinafter, the aqueous treatment agent of embodiment 1 will be specifically described for each constituent element. Further, referring to fig. 1(a) to (d), a configuration example of a polyimide resin molded article obtained by surface treatment using the aqueous treatment agent of embodiment 1(a single surface-treated film 10, a polyimide film 10 'for a single-sided high-frequency circuit, a polyimide film 10' for a double-sided high-frequency circuit, and a single-sided high-frequency circuit board 14) will be also specifically described.

1. Compound containing imide group (aqueous compound containing imide group)

(1) Polyimide molded article

When a compound containing a predetermined imide group is produced by partial hydrolysis, a polyimide molded product (recycled product) obtained by treating conventional industrial waste or the like is widely used as a raw material. Therefore, preferable polyimide molded articles include, for example, polyimide films, polyimide coating films, polyimide resists, polyimide electric component cases, polyimide electronic component materials, polyimide containers, polyimide mechanical components, polyimide automobile components, and the like.

Furthermore, even in a composite laminate such as a circuit board or a TAB tape in which a metal circuit pattern is formed on the surface of a polyimide film, the metal circuit pattern can be removed and used as a polyimide molded product which is a raw material in the production of the compound containing an imide group of the present invention. Further, in order to obtain the compound containing an imide group suitable for the present invention by hydrolysis immediately after production, it is preferable not to contain a polyimide film or a polyimide resin to be produced, but to use an unused polyimide molded product (non-recycled product) from the viewpoint that recycling treatment can be omitted and the quality and reactivity can be more stabilized.

(2) Partial hydrolysate

The predetermined imide group-containing compound is a partial hydrolysate of a polyimide molded product having a predetermined structure, as shown in fig. 2, which shows an example of an infrared spectrum before curing, and fig. 3, which shows an example of an infrared spectrum after curing. Specifically, an imide group-containing compound obtained by partially hydrolyzing a polyimide molded article having a predetermined size in the presence of water and a basic compound at a temperature of, for example, 50 to 100 ℃, that is, an imide group-containing compound having a predetermined structure represented by the following formula (1) is used. Therefore, by having at least an imide group, an amide group, a carboxyl group, a carbonyl group, and the like in a molecule or the like composed of carbon atoms, an imide group-containing compound which can be cured at a relatively low temperature, exhibits good solubility in various organic solvents, and exhibits good adhesion to various substrates can be formed.

[ chemical formula 1]

Figure BDA0002262099050000081

(in the formula (1), the symbol X is an alkali metal (lithium/Li, sodium/Na, potassium/K, rubidium/Rb, or cesium/Ce), the subscripts n and l are symbols representing the amount (moles) of the polyamic acid structure present on both sides of the polyimide structure, and usually have values in the range of 0.1 to 0.8, and the subscript m is a symbol representing the amount (moles) of the polyimide structure, and usually has a value in the range of 0.2 to 0.9.)

Further, it is presumed that the terminal of the molecule of the compound containing an imide group has a predetermined structure represented by the following formula (2). That is, it is assumed that the polyamic acid structure shown by the symbol a, the mixture of the polyamic acid and the basic soap structure shown by the symbol B, and the basic soap structure shown by the symbol C form a molecular terminal structure, either singly or in combination. Therefore, by forming such molecular terminals, an imide group-containing compound which can be cured at a lower temperature and is more excellent in solubility in various organic solvents and adhesion can be formed.

[ chemical formula 2]

Figure BDA0002262099050000082

The compound containing an imide group does not necessarily contain an imide group, an amide group, and a carboxyl group at the same time in one molecule composed of carbon atoms, and may be a mixture of a polyimide having an imide group represented by the following formula (3) -1, a polyamic acid having an amide group represented by the following formula (3) -2, and a carboxylic acid compound having a carboxyl group represented by the following formula (3) -3.

[ chemical formula 3]

Figure BDA0002262099050000091

Further, the predetermined imide group-containing compound is characterized in that it has a wavenumber of 1375cm in an infrared spectrum obtained by infrared spectroscopic measurement-1Or an absorption peak derived from an imide group in the vicinity thereof. This is because the imide group-containing compound which can be cured at a lower temperature can be formed by having the imide group in the molecule, and further, when the imide resin is converted into a polyimide resin by a thermal curing treatment to have a high molecular weight, predetermined heat resistance can be exhibited.

The amount of imide groups (peak height) in the predetermined imide group-containing compound may be an index indicating the degree of partial hydrolysis, and it has been found that the amount of imide groups (peak height) in the infrared spectrum of a polyimide obtained by thermal curing is preferably in the range of 10 to 50, more preferably in the range of 15 to 45, and still more preferably in the range of 20 to 40, when the amount is 100. Further, the prescribed imide group-containing compound was found to have a wave number of 1770cm-1Or a peak derived from an imide group in the vicinity thereof, and therefore, the above-mentioned peak can be used together with the above-mentioned peak as a reference for the presence or absence of an imide group。

Further, the predetermined imide group-containing compound is characterized in that it has a wavenumber of 1600cm-1Or has an absorption peak derived from the amide group in the vicinity thereof. The reason for this is because an imide group-containing compound which can be cured at a lower temperature can be formed by having an amide group in the molecule.

Further, the predetermined imide group-containing compound is characterized in that it has a wave number of 1413cm-1Or has an absorption peak derived from a carboxyl group in the vicinity thereof. This is because an imide group-containing compound having good solubility and adhesion can be formed by having a carboxyl group in the molecule. Further, the predetermined imide group-containing compound is preferably used at a wave number of 1710cm-1Or an absorption peak derived from a carbonyl group in the vicinity thereof. This is because the imide group-containing compound having a carbonyl group in the molecule can be formed to have a better solubility.

(3) Ratio of S1/S2

In addition, in the infrared spectrogram of the predetermined compound containing the imide group, the wave number from the benzene ring is 1500cm-1The height of the absorption peak (peak D) at (A) was S1, and the wave number from the imide group was 1375cm-1The reason why it is preferable that the ratio of S1/S2 is in the range of 2 to 10 when the height of the absorption peak (peak a) of (a) is S2 is because by specifying the existence ratio of imide groups in this way, an imide group-containing compound which can be cured at a lower temperature can be formed and can be used as an index indicating the degree of partial hydrolysis. Therefore, the ratio of S1/S2 is more preferably in the range of 3 to 8, and the ratio of S1/S2 is more preferably in the range of 5 to 7.

(4) Ratio of S1/S3

In addition, in the infrared spectrogram of the predetermined compound containing the imide group, the wave number from the benzene ring is 1500cm-1The height of the absorption peak (peak D) was S1, and the wave number derived from the amide group was 1600cm-1When the height of the absorption peak (peak B) of (2) is S3, the ratio of S1/S3 is preferably in the range of 2 to 20.

The reason for this is that by defining the presence ratio of the amide group in this way, an imide group-containing compound having more excellent solubility in water and an organic solvent and adhesion to a treatment object can be formed, and the imide group-containing compound can be used as an index indicating the degree of partial hydrolysis. Therefore, the ratio of S1/S3 is more preferably in the range of 5 to 15, and the ratio of S1/S3 is more preferably in the range of 7 to 12.

(5) Ratio of S1/S4

In addition, in the infrared spectrogram of the predetermined compound containing the imide group, the wave number from the benzene ring is 1500cm-1When the height of the absorption peak (peak D) at this point is S1 and the height of the absorption peak (peak C) at a wave number of 1413cm-1 derived from the carboxyl group is S4, the ratio of S1/S4 is preferably in the range of 8 to 30. The reason for this is that by specifying the presence ratio of the carboxyl group in this way, an imide group-containing compound having further excellent solubility in a predetermined organic solvent and adhesion can be formed, and this can be used as an index indicating the degree of partial hydrolysis. Therefore, the ratio of S1/S4 is more preferably in the range of 10 to 25, and the ratio of S1/S4 is more preferably in the range of 13 to 20.

(6) Weight average molecular weight

Further, the weight average molecular weight of the predetermined imide group-containing compound is preferably set to a value within the range of 1000 to 100000. The reason for this is that a predetermined low-temperature curability is obtained and a good solubility in an organic solvent is obtained by such a weight average molecular weight. Therefore, the weight average molecular weight of the imide group-containing compound is more preferably set to a value within a range of 3000 to 60000, and still more preferably to a value within a range of 5000 to 30000. The weight average molecular weight of the imide group-containing compound can be measured as a polystyrene equivalent molecular weight by gel permeation chromatography.

(7) Particles

The imide group-containing compound may be used as it is after hydrolysis, and is preferably dissolved in an aqueous solvent (water or the like) to prepare a granular form and have an average particle diameter in the range of 0.1 to 500. mu.m. This is because the imide group-containing compound having such a structure can be formed to have good handling properties and storage properties and to have excellent solubility in water and a predetermined solvent. Therefore, the average particle diameter (median diameter, D50) of the particles of the imide group-containing compound is more preferably set to a value within a range of 5 to 100 μm, and still more preferably within a range of 10 to 50 μm. The average particle diameter of the particles of the imide group-containing compound may be determined in accordance with JIS Z8901: the measurement is performed by a micrometer, a laser particle size measuring apparatus, an image analyzing apparatus, or the like 2006.

(8) Properties of Compound containing an imide group, and the like

The imide group-containing compound is preferably an aqueous solvent containing water and an alcohol as a solvent, and the amount of the aqueous solvent to be added is usually in the range of 0.01 to 25 wt% with respect to the total amount of the imide group-containing compound. This is because, if such an imide group-containing compound is in the state of an aqueous solution of an imide group-containing compound, not only the treatment becomes easy, but also a more uniform aqueous treatment agent can be formed by blending the compound with an aqueous dispersion of a fluorine-containing resin in a precise ratio. In addition, from the viewpoint of being able to dissolve the imide group-containing compound in a shorter time, the aqueous solvent is preferably an aqueous solvent in which a part or all of the amine compound is dissolved in water, alcohol, or the like (the concentration of the amine compound is, for example, 0.1 to 10% by weight).

2. Aqueous dispersion of fluorine-containing resin

(1) Kind of fluororesin

The kind of the fluororesin contained in the aqueous dispersion of the fluorine-containing resin is not particularly limited, and is preferably at least one of Polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDE), polyhexafluoropropylene (HFP), perfluoropropylvinyl ether (PPVE), Chlorotrifluoroethylene (CTFE), a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether (PFA), and the like. Among these fluororesins, a resin containing Polytetrafluoroethylene (PTFE) as a main component is preferred in view of being relatively inexpensive, having excellent mixing dispersibility with the imide group-containing compound, being incorporated in a small amount, i.e., being easily phase-separated, and having a large surface modification effect. Further, a fluororesin in which an amino group, a carboxyl group, a hydroxyl group, or the like is introduced into the molecule of the fluororesin as a main agent is also preferable.

(2) Amount of fluororesin 1

The amount of the fluororesin in the aqueous dispersion of a fluororesin, that is, the amount of the fluororesin in the aqueous dispersion of a fluororesin, is in the range of 0.1 to 10000 parts by weight per 100 parts by weight of the imide group-containing compound contained in the imide group-containing compound, calculated as solid matter. This is because, if the amount of the aqueous dispersion of the fluorine-containing resin (fluororesin) to be blended is too small, the effect of blending may not be exhibited, and water repellency or the like due to the aqueous treatment agent may not be exhibited. Therefore, when a polyimide film is used as a treatment object, not only the water repellency of the surface of the polyimide film is not improved, but also the high-frequency characteristics and the like due to the decrease in the dielectric constant are not improved in some cases. On the other hand, if the amount of the aqueous dispersion of the fluorine-containing resin is too large, the mechanical strength of the treated article may be reduced, or the heat resistance and low-temperature curability may be insufficient. Therefore, the amount of the fluororesin contained in the aqueous dispersion of a fluororesin is usually more preferably in the range of 1 to 5000 parts by weight, and still more preferably in the range of 10 to 500 parts by weight, in terms of solid content, per 100 parts by weight of the imide group-containing compound contained in the imide group-containing compound.

(3) Amount of fluororesin 2

Further, depending on the application, for example, if surface modification of a polyimide film or the like is mainly considered in the case of a high-frequency circuit board or the like using a polyimide film as a treatment object, the amount of the aqueous dispersion of the fluorine-containing resin to be blended may be made small. For example, it was found that a polyimide film having a surface-modified film of 23mN/m was obtained by merely forming a surface-modified film by adding 5 parts by weight of a fluororesin to 100 parts by weight of an imide group-containing compound and a polyimide film having a surface tension of 45 mN/m. Therefore, when surface modification of a polyimide film or the like is mainly considered, the amount of the fluororesin contained in the aqueous dispersion of the fluororesin is more preferably in the range of 0.1 to 80 parts by weight, more preferably in the range of 1 to 50 parts by weight, and most preferably in the range of 3 to 30 parts by weight, in terms of solid content, relative to 100 parts by weight of the imide group-containing compound contained in the imide group-containing compound.

Further, for example, when a primer treatment of iron, aluminum, or the like, which is a fluororesin-coated substrate such as a frying pan or a hot plate, is considered as an application, it is preferable that the amount of the aqueous dispersion of the fluororesin is relatively large in view of particularly good adhesion to the fluororesin coating. Therefore, in consideration of the primer treatment of iron or the like, the amount of the fluororesin contained in the aqueous dispersion of the fluororesin is more preferably in the range of more than 80 parts by weight and 10000 parts by weight or less in terms of solid content, more preferably in the range of 150 to 5000 parts by weight, and most preferably in the range of 200 to 1000 parts by weight, relative to 100 parts by weight of the imide group-containing compound contained in the imide group-containing compound.

(4) Average molecular weight of fluororesin

The average molecular weight (weight average molecular weight, the same applies hereinafter) of the fluororesin contained in the aqueous dispersion of the fluororesin is preferably 60 ten thousand or more. This is because if the average molecular weight (weight average molecular weight) of the fluororesin is less than 60 ten thousand, crystallization may be difficult when the fluororesin is heated and melted and cooled, and a glossy and transparent surface-treated film may not be obtained or the adhesion force to the base surface-treated film and the mechanical strength may be excessively reduced. Therefore, the average molecular weight of the fluororesin is preferably in the range of 80 to 200 ten thousand, more preferably in the range of 100 to 150 ten thousand.

Among them, even in the case where the average molecular weight of the fluororesin is less than 60 ten thousand, for example, even in the case where 10 to 55 ten thousand, there are cases where: the compound having an imide group can be mixed well, or an aqueous treatment agent having gloss and transparency can be obtained by a heating method or the like.

(5) Average particle diameter of fluororesin

The average particle diameter (median diameter, D50) of the fluororesin particles contained in the aqueous dispersion of the fluororesin is preferably set to a value within the range of 0.01 to 10 μm. The reason for this is that the stability of the aqueous solution in the aqueous treatment agent can be further improved by setting the average particle diameter of the fluororesin particles to a value within a predetermined range. Further, the reason is that the composition exhibits more excellent surface coatability and surface modification properties to various materials to be treated, and further, exhibits excellent adhesion.

More specifically, if the average particle diameter of the fluororesin particles is 0.01 μm, the surface coatability and surface modification properties of the fluororesin particles on various materials to be treated may be reduced, or it may be difficult to obtain good adhesion to various materials to be treated. On the other hand, if the average particle diameter of the fluororesin particles exceeds 10 μm, not only the stability of the aqueous dispersion of the fluororesin may be lowered, but also the stability of the aqueous solution of the aqueous treatment agent may be lowered, and white turbidity may occur or particles of the fluororesin and the like may be deposited. Therefore, the average particle diameter (median diameter, D50) of the fluororesin particles is more preferably in the range of 0.05 to 8 μm, and still more preferably in the range of 0.1 to 5 μm. The average particle diameter (D50) of the fluororesin particles may be determined in accordance with JIS Z8901: 2006, the particles are measured from the microscopic photograph using an image analyzer or the like, or measured using a particle measuring device using a laser.

(6) Surface active agent

It is preferable to add a surfactant to the aqueous dispersion of the fluorine-containing resin. That is, as the kind of the surfactant, there are an anionic surfactant, a cationic surfactant, a nonionic surfactant and the like, and specific examples thereof include an ammonium salt surfactant, an amine salt surfactant, a fluorine surfactant, a silicone surfactant, a polymer surfactant and the like. Particularly, if the surfactant is a nonionic surfactant, the fluororesin particles can be effectively prevented from aggregating by blending a small amount of the surfactant, and good stability of the aqueous solution can be obtained.

The amount of the surfactant to be added also depends on the aqueous dispersion of the fluorine-containing resin with respect to the imide group-containing compound, and is preferably in the range of 0.01 to 20 parts by weight in terms of solid content with respect to the total amount of the aqueous treating agent. This is because if the amount of the surfactant to be blended is too small, the aqueous solution stability of the aqueous dispersion of the fluorine-containing resin may be excessively lowered. On the other hand, if the amount of the surfactant to be blended is too large, the curing potential may be lowered or the heat resistance and mechanical properties may be insufficient. Therefore, the amount of the surfactant to be added is more preferably in the range of 0.1 to 10 parts by weight, and still more preferably in the range of 0.5 to 5 parts by weight in terms of solid content, based on the total amount of the aqueous treatment agent.

(7) Viscosity of aqueous dispersion of fluorine-containing resin

The viscosity of the aqueous dispersion of the fluorine-containing resin is preferably set to a value within a range of 10 to 50000 mPasec (measurement temperature: 25 ℃ C., solid content: 60% by weight, the same applies hereinafter). This is because handling becomes easy by limiting the viscosity of the aqueous dispersion of the fluorine-containing resin to a predetermined range. In addition, the coating composition has excellent storage stability and improved coating properties, and can be blended with other blending components, for example, a thermoplastic resin component, a thermosetting resin component, a photocurable resin component, a metal material, a ceramic material, and the like, uniformly and rapidly. Therefore, the viscosity of the aqueous dispersion of the fluorine-containing resin is more preferably set to a value within a range of 20 to 10000 mPasec, and still more preferably 30 to 5000 mPasec.

(8) Solvent for aqueous dispersion of fluorine-containing resin

The solvent used in the aqueous dispersion of the fluororesin is preferably water in principle. This is because if water is used, it is easily and quickly scattered and can be effectively prevented from remaining if it is heated at a temperature of at least 100 ℃ or higher, and further 150 ℃ or higher. The aqueous dispersion of the fluorine-containing resin may be white turbid, but is more preferably transparent from the viewpoint of good handling properties, and has a visible light transmittance of, for example, 90% or more.

3. Amine compound

(1) Class 1

The kind of the amine compound is preferably determined in consideration of handling properties, boiling point, and the like. Thus, for example, there may be mentioned at least one of diethylamine (boiling point: 55.5 ℃ C.), triethylamine (boiling point: 89.5 ℃ C.), propylamine (boiling point: 49 ℃ C.), dipropylamine (boiling point: 117 ℃ C.), tripropylamine (boiling point: 156 ℃ C.), ethylpropylamine (boiling point: 83 ℃ C.), butylamine (78 ℃ C.), tributylamine (boiling point: 216 ℃ C.), ethylbutylamine (boiling point: 125 ℃ C.), pentylamine (boiling point: 103 ℃ C.), hexylamine (boiling point: 131 ℃ C.), and the like, which are amine compounds having a linear alkyl group.

Further, an amine compound having a branched alkyl group is also preferable, and specific examples thereof include at least one of isopropylamine (boiling point: 34 ℃ C.), diisopropylamine (boiling point: 84 ℃ C.), triisopropylamine (boiling point: 47 ℃ C.), ethylisopropylamine, isobutylamine (boiling point: 69 ℃ C.), diisobutylamine, tert-butylamine (boiling point: 46 ℃ C.), di-sec-butylamine (boiling point: 135 ℃ C.), dimethylaminoethanol (boiling point: 134 ℃ C.), triisobutylamine (boiling point: 192 ℃ C.), and the like.

Further, an amine compound having an alicyclic structure is preferably used because it is less likely to be discolored when heat-treated. Examples thereof include cyclohexylamine (boiling point: 134 ℃ C.), dicyclohexylamine (boiling point: 169 ℃ C.), and the like.

Examples of the ethanolamine having a hydroxyalkyl group include diethanolamine (boiling point: 280 ℃), triethanolamine (boiling point: 335 ℃), N-methylethanolamine (boiling point: 160 ℃), propanolamine (boiling point: 160 ℃), isopropanolamine (boiling point: 159 ℃), diisopropanolamine (boiling point: 84 ℃), tripropanolamine (190 ℃), triisopropanolamine (boiling point: 190 ℃).

(2) Class 2

Further, from the viewpoint of not deteriorating heat resistance and the like, benzylamine having an aromatic ring can be preferably used. Thus, for example, N-dimethylbenzylamine (boiling point: 180 ℃ C.), phenylamine (═ aniline, boiling point: 180 ℃ C.), diphenylamine (boiling point: 302 ℃ C.), triphenylamine (boiling point: 347 ℃ C.), N-dimethylaniline (boiling point: 194 ℃ C.), and the like can be given. Further, N-dimethyl-p-toluidine having a nitrogen-containing aromatic ring (boiling point: 211 ℃ C.), 2-aminopyridine (boiling point: 204 ℃ C.), 4-aminopyridine (boiling point: 273 ℃ C.), 4-dimethyl-p-toluidineAminopyridine, tetrahydro-1, 4-Oxazine (═ morpholine, boiling point: 129 ℃), pyridine (boiling point: 115 ℃), hexahydropyridine (═ piperidine, boiling point: 106 ℃), pyrrolidine (boiling point: 87 ℃ C.), and the like. In particular, morpholine is preferably used because it does not lower heat resistance and is less likely to change color when subjected to heat treatment.

(3) Class 3

Further, the diamine compound may have 2 amino groups in the molecular structure. The diamine compound may be an aromatic compound or an aliphatic compound, but may be an aromatic compound. Examples of such diamine compounds include p-phenylenediamine, m-phenylenediamine, 4 '-diaminodiphenylmethane, 4' -diaminodiphenylethane, 4 '-diaminodiphenylether, 4' -diaminodiphenylsulfide, 4 '-diaminodiphenylsulfone, 1, 5-diaminonaphthalene, 3, 3-dimethyl-4, 4' -diaminobiphenyl, 5-amino-1- (4 '-aminophenyl) -1, 3, 3-trimethylindane, 6-amino-1- (4' -aminophenyl) -1, 3, 3-trimethylindane, 4 '-diaminobenzanilide, 3, 5-diamino-3' -trifluoromethylbenzanilide, 3, 5-diamino-4 '-trifluoromethylbenzanilide, 3, 4' -diaminodiphenylether, 2, 7-diaminofluorene, and mixtures thereof, 2, 2-bis (4-aminophenyl) hexafluoropropane, 4 '-methylene-bis (2-chloroaniline), 2', 5,5 '-tetrachloro-4, 4' -diaminobiphenyl, 2 '-dichloro-4, 4' -diamino-5, 5 '-dimethoxybiphenyl, 3' -dimethoxy-4, 4 '-diaminobiphenyl, 4' -diamino-2, 2 '-bis (trifluoromethyl) biphenyl, 2-bis [ 4- (4-aminophenoxy) phenyl ] propane, 2-bis [ 4- (4-aminophenoxy) phenyl ] hexafluoropropane, 1, 4-bis (4-aminophenoxy) benzene, 4' -bis (4-aminophenoxy) -biphenyl, 1,3 '-bis (4-aminophenoxy) benzene, 9-bis (4-aminophenyl) fluorene, 4' - (p-phenyleneisopropyl) dianiline, 4 '-bis (4-aminophenoxy) biphenyl, 4' -bis (4-aminophenoxy) biphenyl, and mixtures thereof, 4,4 ' - (m-phenyleneisopropyl) dianiline, 2 ' -bis [ 4- (4-amino-2-trifluoromethylphenoxy) phenyl ] hexafluoropropane, 4 ' -bis [ 4- (4-amino-2-trifluoromethyl) phenoxy ] -octafluorobiphenyl, and the like.

(4) Class 4

Also preferred are aromatic diamines having 2 amino groups bonded to the aromatic ring and hetero atoms other than the nitrogen atom of the amino group, such as diaminotetraphenylthiophene. Further, aliphatic diamines such as 1, 1-m-xylylenediamine, 1, 3-propylenediamine, tetramethylenediamine, pentamethylenediamine, octamethylenediamine, nonamethylenediamine, 4-diaminoheptamethylenediamine, 1, 4-diaminocyclohexane, isophoronediamine, tetrahydrodicyclopentadiene methylenediamine (tetrahydrodicyclopentadiene methylenediamine), hexahydro-4, 7-methyleneindanyl methylenediamine, tricyclo [6,2,1,02.7] -undecene dimethyldiamine, 4' -methylenebis (cyclohexylamine), and alicyclic diamines are preferable.

(5) Class 5

In short, the type of the amine compound is preferably determined in consideration of the use and purpose of the aqueous treatment agent to be blended, odor, and the like. For example, when the ratio of the amount of the compound containing an imide group to the amount of the fluororesin is large, for example, 1 to 10, the compound can be sufficiently reacted even under heating at a relatively low temperature, and therefore, an amine compound having a low boiling point, for example, a boiling point of 150 ℃. On the other hand, when the ratio of the amount of the imide group-containing compound to the amount of the fluororesin is small, for example, when the ratio is 0.1 or more and less than 1, the fluororesin needs to be heated under a high-temperature heating condition, and therefore, it is preferable to use an amine compound having a high boiling point, for example, a boiling point exceeding 150 ℃.

(6) Boiling point

The boiling point (atmospheric pressure) of the amine compound is preferably 50 to 350 ℃. This is because if the boiling point of the amine compound is less than 50 ℃, the amine compound is likely to evaporate even at room temperature, which may make handling difficult or may cause a problem in terms of environmental safety. On the other hand, if the boiling point of the amine compound exceeds 350 ℃, the amine compound may remain in the surface-treated film even when subjected to heat treatment, and the adhesion and mechanical strength may be reduced. Therefore, the boiling point of the amine compound is more preferably in the range of 60 to 300 ℃, and still more preferably in the range of 70 to 200 ℃.

(7) Compounding amount

The amount of the amine compound to be blended is preferably in the range of 0.1 to 30 parts by weight in terms of solid content per 100 parts by weight of the imide group-containing compound contained in the imide group-containing compound. This is because if the amount of the amine compound to be added is less than 0.1 part by weight, the effect of adding the compound to the aqueous treating agent is not exhibited, and good stability of the aqueous solution between the compound containing an imide group and the aqueous dispersion of the fluorine-containing resin may not be obtained. On the other hand, if the amount of the amine compound is more than 30 parts by weight, the corrosiveness and the residual property may be improved, the odor may be increased, or the aqueous treatment agent may be easily discolored into a dark brown color with time. Therefore, the amount of the amine compound to be added is more preferably in the range of 1 to 20 parts by weight, and still more preferably in the range of 3 to 10 parts by weight, in terms of solid content, per 100 parts by weight of the imide group-containing compound contained in the imide group-containing compound.

4. Viscosity stabilizer

(1) Species of

Further, the imide group-containing compound may contain an unavoidable metal ion and may be in a pseudo-crosslinked state derived from a predetermined carboxyl group or hydroxyl group. In such a case, a predetermined viscosity stabilizer may be added, or at least one of an orthoformate compound (trimethyl orthoformate, triethyl orthoformate, etc.), a phytic acid compound, a dacromet compound, EDTA, etc. may be added before the pseudo-crosslinked state is achieved to prevent the pseudo-crosslinked state. Therefore, by blending a predetermined viscosity stabilizer, it is possible to capture and chelate metal ions which are believed to be a cause of pseudo-crosslinking of carboxyl groups and hydroxyl groups, and to make the imide group-containing compound which is in a pseudo-crosslinked state and whose viscosity cannot be measured, low in viscosity (100 to 100000mPsec, measurement temperature 20 ℃) and easy to filter, or easy to apply.

(2) Compounding amount

Therefore, the amount of the predetermined viscosity stabilizer to be blended is preferably in the range of 0.01 to 10 parts by weight, more preferably in the range of 0.1 to 7 parts by weight, and still more preferably in the range of 0.5 to 5 parts by weight, based on 100 parts by weight of the imide group-containing compound (before pseudo-crosslinked state).

5. Solvent(s)

(1) Class 1

The solvent (including the dispersion) of the aqueous treatment agent is preferably water or water containing 0.1 to 10% by weight of an amine compound. This is because if the solvent is such water, it can be easily and quickly dispersed and effectively prevented from remaining in the surface-treated film if it is heated at a temperature of at least 100 ℃ or higher, and further 150 ℃ or higher after the application of the aqueous treatment agent.

(2) Class 2

On the other hand, depending on the use of the aqueous treatment agent, it is also preferable to add a predetermined amount of an organic solvent. Examples of such an organic solvent include N-methyl-2-pyrrolidone (NMP), N-dimethylformamide, N-dimethylacetamide, methyl diglyme, methyl triglyme, and diglyme

Figure BDA0002262099050000181

At least one of alkane, tetrahydrofuran, cyclohexanone, cyclopentanone, gamma-butyrolactone, toluene, ethyl acetate, butyl acetate, cellosolve, Methyl Ethyl Ketone (MEK), anisole, and the like.

In particular, if the solvent is a mixture of N-methylpyrrolidone and at least one of methanol, isopropyl alcohol, butanol, ethyl acetate, butyl acetate, propylene glycol monomethyl ether, toluene, xylene, methyl ethyl ketone, cyclohexanone, dimethylacetamide, N-dimethylformamide, and water (the weight ratio of NMP to the other solvent is 80/20 or the like), the compound containing an imide group can be uniformly and firmly contained without swelling the resin coating of the enamel wire used for the motor coil, and thus the solvent is a good solvent.

(3) Compounding amount

The amount of the solvent (mainly water) to be added to the aqueous treatment agent is preferably within a range of 40 to 99 wt% relative to the total amount (100 wt%). This is because the processing becomes easy by adjusting the amount of the solvent to be blended to a predetermined range. The reason is that coating and drying are easy, and other compounding ingredients, for example, a thermoplastic resin component, a thermosetting resin component, a photocurable resin component, a metal material, a ceramic material, and the like can be blended uniformly and quickly.

More specifically, if the amount of the solvent is less than 40% by weight, the solubility of the imide group-containing compound and the dispersibility of the fluororesin may become insufficient, and the handling property may be significantly reduced. On the other hand, if the amount of the solvent is more than 99% by weight, the viscosity may be excessively lowered, and it may be difficult to form a uniform surface-treated film having a predetermined film thickness or precipitates may be easily generated. Therefore, the amount of the solvent to be blended is more preferably 50 to 90 wt%, and still more preferably 60 to 80 wt% based on the total amount of the aqueous treatment agent.

6. Viscosity of aqueous treating agent

The viscosity of the aqueous treatment agent is preferably set to a value generally within a range of 10 to 50000 mPasec (measurement temperature: 25 ℃ C., solid content concentration: 20 to 60% by weight, the same applies hereinafter). The reason for this is that by limiting the viscosity of the aqueous treatment agent to a predetermined range, not only handling is easy, but also good storage stability can be obtained. Further, the coating property is improved, and other compounding components, for example, a thermoplastic resin component, a thermosetting resin component, a photocurable resin component, a metal material, a ceramic material, and the like can be blended uniformly and quickly. Therefore, the viscosity of the aqueous treatment agent is preferably set to a value within a range of 50 to 10000 mPasec, more preferably 100 to 5000 mPasec.

7. Additive agent

In addition, in order to improve the stability of the aqueous solution in the aqueous treatment agent, to improve the dispersibility of the imide group-containing compound, to improve the wettability to the material to be treated to be coated, or to further adjust the surface smoothness of the resulting coating film, it is preferable to blend a predetermined surfactant different from the above-mentioned viscosity stabilizer. When the surfactant is blended, the blending amount thereof is preferably in the range of 0.005 to 10% by weight based on the total amount (100% by weight) of the aqueous treatment agent. This is because if the amount of the surfactant is less than 0.005 wt%, the addition effect may not be exhibited, and if the amount of the surfactant exceeds 10 wt%, the heat resistance and mechanical strength of the polyimide resin film obtained may be lowered. Therefore, depending on the type of the surfactant, the amount of the surfactant is preferably in the range of 0.01 to 5% by weight, more preferably 0.05 to 1% by weight, based on the total amount of the aqueous treatment agent.

Further, it is also preferable to blend at least one known additive selected from inorganic fillers, organic fillers, inorganic fibers, organic fibers, conductive materials, electrically insulating materials, metal ion trapping agents, light-weighting agents, thickeners, fillers, abrasives, colorants, antioxidants, hydrolysis inhibitors, ultraviolet absorbers, and the like. When at least one of these known additives is blended, the blending amount thereof is preferably in the range of usually 0.1 to 50% by weight, more preferably 0.5 to 30% by weight, and still more preferably 1 to 10% by weight, based on the total amount (100% by weight) of the aqueous treatment agent.

8. Low temperature curing and use

(1) One-time heating

The low-temperature curability of the aqueous treatment agent is, for example, cured by heating at 120 ℃ for 60 minutes at one time to obtain a predetermined resin (mainly composed of a polyamideimide resin) having a 10 wt.% reduction temperature of 200 ℃ or higher as measured by a thermobalance according to JIS K7120. That is, the reason is that when the polyamide imide resin having a predetermined structure is obtained from the compound containing an imide group contained in the aqueous treating agent by heating at such a low temperature for one time, the 10% weight loss temperature exceeds 200 ℃. In addition, since the imide group-containing compound is phase-separated from the fluorine-based resin in a critical manner mainly in the primary heating, it can be said that the polyimide resin molded article and the fluorine resin molded article can exhibit more excellent adhesion to various resin molded articles such as a polyimide resin molded article and a fluorine resin molded article, metals, and the like after the secondary heating described later.

(2) Second heating

After laminating the aqueous treatment agent on the object to be treated, it is usually preferable to perform secondary heating (additional heating) under heating conditions of 200 ℃ for 60 minutes or more. That is, it is preferable to heat the resin once at 120 ℃ for 60 minutes and then heat the resin twice at 200 ℃ for 60 minutes (this is sometimes referred to as Step Cure). The reason for this is that a surface-treated film having a 10 wt% reduction temperature of 250 ℃ or higher as measured by a thermobalance according to JIS K7120 can be formed. Therefore, by such stepwise curing by additional heating, the polyimide resin having a predetermined structure is obtained, and further, the fluororesin is sufficiently dissolved to be crystalline, and the 10% weight loss temperature exceeds 250 ℃.

FIGS. 4(a) to (b) are FT-IR graphs (1) of the aqueous treatment agent (PI resin: 100%) before curing (natural drying for 60 minutes) and after curing (natural drying for 60 minutes + curing at 60 to 360 ℃ C. for 100 minutes in total). FIGS. 5(a) to (b) are FT-IR graphs (2) of the aqueous treating agent (imide group-containing compound/fluororesin: 9/1) before curing (natural drying for 60 minutes) and after curing (natural drying for 60 minutes + curing at an elevated temperature of 60 to 360 ℃ for 100 minutes in total). FIGS. 6(a) to (b) are FT-IR graphs (3) of the aqueous treating agent (imide group-containing compound/fluororesin: 7/3) before curing (natural drying for 60 minutes) and after curing (natural drying for 60 minutes + curing at an elevated temperature of 60 to 360 ℃ for 100 minutes in total).

FIGS. 7(a) to (b) are FT-IR diagrams (4) of the aqueous treating agent (imide group-containing compound/fluororesin: 5/5) before curing (natural drying for 60 minutes) and after curing (natural drying for 60 minutes + curing at an elevated temperature of 60 to 360 ℃ for 100 minutes in total). FIGS. 8(a) to (b) are FT-IR graphs (5) of the aqueous treating agent (imide group-containing compound/fluororesin: 5/5) before curing (natural drying for 60 minutes) and after curing (natural drying for 60 minutes + curing at an elevated temperature of 60 to 360 ℃ for 100 minutes in total). FIGS. 9(a) to (b) are FT-IR charts (6) of the aqueous treating agent (fluororesin: 100%) before curing (natural drying for 60 minutes) and after curing (natural drying for 60 minutes + curing at 60 to 360 ℃ C. for 100 minutes in total).

Therefore, from the FT-IR patterns before and after these heat treatments, it can be understood that the imide group-containing compound undergoes the curing reaction by the heat treatment, and the height of the peak (the wave number derived from the benzene ring: 1500 cm)-1Height of absorption peak at (c): s1 wavenumber 1375cm from imide group-1Height of absorption peak of (2): s2 wave number 1600cm from amide group-1Height of absorption peak of (2): s3 wavenumber 1413cm from carboxyl group-1Height of absorption peak of (2): s4) are changed, respectively. On the other hand, it is understood that the fluororesin is slightly changed in the height of the predetermined peak by the heat treatment, but the degree of change is very small when compared with the change in the peak height of the imide group-containing compound.

(3) Heating by raising the temperature

Further, there are some similar portions to the stepwise curing, and for example, it is preferable to raise the temperature from room temperature to 200 ℃ or higher, more preferably 250 ℃ or higher, and still more preferably about 300 to 380 ℃ at a temperature raising rate of 1 ℃/min to 20 ℃/min, and to heat-treat not only the imide group-containing compound but also the fluororesin while raising the temperature of the laminated aqueous treating agent. This is because, in the case of gradual curing, the heating furnace is often changed once, and the temperature is returned to near room temperature and then heated again, but in the case of temperature-increasing heating, the temperature is continuously increased to a predetermined temperature without returning to near room temperature. Therefore, the imide group-containing compound is sufficiently reacted by heating at elevated temperature to be a polyimide compound obtained by thermosetting, while the fluororesin can be sufficiently dissolved and crystallized (in some cases, amorphous), and a glossy and highly transparent surface-treated film can be obtained.

In addition, if the temperature-raising heating method is employed, the imide group-containing compound contained in the aqueous treating agent and the fluororesin are phase-separated at critical intervals, and the imide group-containing compound-enriched layer of the surface-treated film thus formed can exhibit more favorable adhesion to various resin molded articles, metals, and the like. On the other hand, the fluororesin-enriched layer of the surface-treated film formed simultaneously by phase separation can exhibit good water repellency, peelability, or good adhesion to the fluororesin.

Here, referring to fig. 10, the phase separation state of the surface treatment film will be described more specifically. That is, the abscissa of fig. 10 represents the compounding ratio (-) of the imide group-containing compound and the fluororesin contained in the aqueous treating agent, and the ordinate represents the value of the surface tension (mN/m) of the surface-treated film.

As shown in the characteristic curve shown in fig. 10, when the compounding ratio of the fluororesin/the imide group-containing compound in the solid component matrix is in the range of about 90/10 to 10/90, the compound is similar to the value of 22mN/m, which is the value of the surface tension of the fluororesin monomer, and no significant difference is observed. That is, as shown in fig. 1(a) and the like, it is strongly presumed that when one surface of the surface-treated film 10 obtained by phase separation is set as the front surface side and the other surface is set as the back surface side, the concentrated layer 10a of the fluororesin is formed on the front surface side, and on the other hand, the concentrated layer 10b of the polyimide resin, which is a cured product of the imide group-containing compound, is formed on the back surface side (opposite side) of the surface-treated film 10.

On the other hand, as the blending ratio of the fluororesin/the imide group-containing compound in the solid component matrix exceeds 10/90, the value of the surface tension rapidly increases as the transition temperature reaches 5/95 and approaches 0/100, and becomes approximately the same value as 44mN/m, which is the value of the surface tension of the polyimide resin monomer. That is, it is strongly presumed that if the compounding ratio exceeds 10/90 and approaches 0/100, the content of the polyimide resin is substantially large, and therefore there is almost no phase separation between the fluororesin and the polyimide resin, or although there is a slight phase separation, the amount of the polyimide resin present is large, and therefore, the value of the surface tension of the polyimide resin monomer is exhibited.

(4) Detailed description of the invention

The use of the aqueous treatment agent of the present invention is not particularly limited, and the aqueous treatment agent may be used as an aqueous treatment agent for various resin films, resin molded articles, metal films, metal molded articles, ceramic films, ceramic molded articles, or paper or wood. That is, depending on the blending ratio of the fluororesin/the polyimide resin, the phase separation from the polyimide resin contained in the aqueous treating agent can form a concentrated layer of the fluororesin having excellent adhesion to various substrates, heat resistance, mechanical properties, ultraviolet absorptivity, and the like, on the front surface side of the surface-treated film, while forming a concentrated layer of the fluororesin having a low blending ratio of the fluororesin on the back surface side of the surface-treated film. Further, the boundary between the concentrated layer of the fluororesin and the concentrated layer of the polyimide resin is not clear, and it is presumed that the layers are strongly bonded.

Therefore, the fluororesin-enriched layer of such a surface-treated film is suitable for at least one of a heat-resistant aqueous treatment agent, a water-repellent aqueous treatment agent, an ultraviolet-resistant aqueous treatment agent, a high-dielectric-constant aqueous treatment agent, an electrical-insulation aqueous treatment agent, and a decorative agent. The surface-treated film-enriched polyimide resin layer can be used as a material for producing a polyimide film having excellent heat resistance, etc., a heat-resistant electric component case, a heat-resistant electronic component molded article, a heat-resistant circuit board, a heat-resistant container, a heat-resistant mechanical component, a heat-resistant automobile component, an ultraviolet-absorbing molded article, an ultraviolet-absorbing film, etc.

Here, referring again to fig. 1(a) to (d), a configuration example of the surface-treated film 10 derived from the aqueous treating agent and the polyimide resin molded article using the same (the surface-treated film 10, the polyimide film 10' for the single-sided high-frequency circuit, the polyimide film 10 "for the double-sided high-frequency circuit, and the single-sided high-frequency circuit substrate 14) will be specifically described. That is, the surface-treated film 10 shown in fig. 1(a) is shown to be formed into a fluororesin-enriched layer 10a and a polyimide resin-enriched layer 10b by applying the aqueous treating agent of the present invention to a release member or the like and then performing a heat treatment at a predetermined temperature to cause phase separation between the imide group-containing compound and the fluororesin. Therefore, the surface treatment film 10 having a two-layer structure can be removed from the release member and used for various applications. Therefore, in the drawing, the surface treatment film 10 can be obtained which has the concentrated layer 10a of the low dielectric constant fluororesin on the surface side and the concentrated layer 10b of the polyimide resin excellent in heat resistance, mechanical strength, adhesion, ultraviolet resistance, and the like on the lower layer side.

Fig. 1(b) shows a polyimide film 10' for a single-sided high-frequency circuit, for example, which is a composite polyimide resin molded article obtained by forming a surface treatment film 10 having a two-layer structure on one surface of a polyimide film 10 c. In this way, in the case of the polyimide film 10' for a single-sided high-frequency circuit comprising the polyimide film 10c and the surface treatment film 10, a predetermined metal conductor or the like can be firmly laminated as a composite polyimide film laminate having a surface tension adjusted to a predetermined range and a concentrated layer 10a of a low dielectric constant fluororesin on the surface side. Therefore, the polyimide film 10' for the single-sided high-frequency circuit formed of the surface-treated film 10 can be used to form a low-dielectric-constant high-frequency circuit board, a heat-resistant circuit board, or other electrical insulating substrate (including an electrical insulating film).

Fig. 1(c) shows an example of a polyimide film 10 ″ for a double-sided high-frequency circuit, in which a1 st surface-treated film including a fluororesin-enriched layer 10a and a polyimide resin-enriched layer 10b and a2 nd surface-treated film including a fluororesin-enriched layer 10a 'and a polyimide resin-enriched layer 10 b' are formed on both surfaces thereof by applying an aqueous treatment agent to both surfaces of the polyimide film 10c and then performing a heat treatment at a predetermined temperature. Thus, a polyimide film 10 ″ for a double-sided high-frequency circuit having fluororesin-enriched layers 10a and 10 a' with a low dielectric constant on both sides of the polyimide film 10c can be obtained. Therefore, if conductor layers are formed on the surfaces of the 1 st surface-treated film and the 2 nd surface-treated film, respectively, and then predetermined circuits are formed by photolithography or the like, a low-dielectric-constant double-sided high-frequency circuit board, a double-sided heat-resistant circuit board, or the like can be configured.

Fig. 1(d) shows a single-sided high-frequency circuit board having a polyimide film 10c on which a surface-treated film 10 comprising a fluororesin-rich layer 10a and a polyimide resin-rich layer 10b is formed by applying the aqueous treating agent of the present invention to one side as a primer treatment and further performing a heat treatment at a predetermined temperature, and further having a predetermined functional film (metal layer) 12 and another primer layer 12a thereon. By providing the surface-treated film 10 as a primer layer on one side of the polyimide film 10c in this manner, strong adhesion can be obtained between the other primer layer 12a formed above the surface-treated film 10 and the predetermined functional film (metal layer) 12. Therefore, the predetermined functional film 12 can be formed firmly with, for example, a metal layer, a conductive film, a charging treatment film, an electrical insulating film, a gas barrier film, a release layer (fluorine resin layer), a decorative layer, and the like, depending on the application.

The aqueous treatment agent of the present invention is characterized by having excellent ultraviolet absorbability even without newly blending an ultraviolet absorber or the like. Therefore, for example, it has been found that even a thin film coating having a thickness of about 8 to 20 μm can cut off 99% or more, preferably 99.9% or more of ultraviolet rays having a wavelength of 300 to 400 nm. That is, the aqueous treatment agent of the present invention and the ultraviolet absorbing layer obtained therefrom are extremely excellent in ultraviolet absorptivity and weather resistance even when they are thin films, and therefore, they can be preferably used as an ultraviolet absorbing film comprising a release member, an adhesive, a polyester substrate, and an ultraviolet absorbing layer formed from the aqueous treatment agent of the present invention.

[ 2 nd embodiment ]

Embodiment 2 is a method for producing an aqueous treating agent, which is characterized by comprising a compound containing an imide group obtained by partially hydrolyzing a polyimide molded product, an aqueous dispersion of a fluorine-containing resin, and an amine compound, and by comprising the following steps (1) to (3).

(1) A step of preparing a solution of an imide group-containing compound as a1 st solution, the imide group-containing compound being mixed such that the aqueous solvent has a value in the range of 0.1 to 30 parts by weight in terms of solid content with respect to 100 parts by weight of the imide group-containing compound, and the amine compound has a value in the range of 0.1 to 30 parts by weight with respect to 100 parts by weight of the imide group-containing compound;

(2) preparing an aqueous dispersion of a fluororesin as a2 nd solution;

(3) and a step of mixing the 1 st solution and the 2 nd solution so that the amount of the fluororesin contained in the 2 nd solution is in the range of 0.1 to 10000 parts by weight in terms of solid content, based on 100 parts by weight of the imide group-containing compound contained in the 1 st solution, to obtain an aqueous treating agent.

The following describes the method for producing the aqueous treating agent of embodiment 2 in order along steps (1) to (3).

1. Step (1)

The step (1) includes a preparatory step of cutting the polyimide molded article into a predetermined size. Therefore, it is preferable to cut or classify a polyimide molded product, which is an industrial waste, using a cutting device, a crushing device, a classifying device, or the like, and to adjust the maximum width and the average particle diameter thereof in advance. That is, it is preferable to cut or classify a polyimide molded product, which is industrial waste, using a cutter, a knife, a chopper, a shredder, a ball mill, a pulverizing device, a sieve, a punching metal, a cyclone, or the like so as to partially hydrolyze the polyimide more uniformly and rapidly, and to adjust the maximum width and the average particle diameter thereof in advance.

More specifically, when the polyimide molded article is adjusted to be long, the average width is preferably 10mm or less, more preferably 1 to 5 mm. When the polyimide molded article is prepared in a granular form, the average particle diameter is preferably 10mm or less, more preferably 1 to 5 mm. In order to further make the maximum width and the average particle diameter uniform, it is preferable to put the resin into a pulverizer equipped with a punching metal, a sieve, or the like while cooling the resin with dry ice or the like, and pulverize the resin into a flake-like or granular polyimide pulverized product.

Next, the step of partially hydrolyzing the polyimide molded product having a predetermined size in the presence of at least water and a basic compound at a temperature of 40 to 100 ℃, preferably 50 to 80 ℃ to obtain a crude imide group-containing compound. Therefore, it is preferable to hydrolyze the polyimide molded product in the presence of at least water and a basic compound at a predetermined temperature, for example, at normal pressure for 1 to 48 hours. The basic compound is a compound that generates hydroxide ions, and examples thereof include sodium hydroxide, potassium hydroxide, calcium hydroxide, and sodium hydrogen carbonate.

As described above, by confirming the presence or absence of an absorption peak derived from an imide group, an absorption peak derived from an amide group, an absorption peak derived from a carboxyl group, and the like, the peak heights of the peaks, the relative height ratio to an absorption peak derived from a benzene ring, and the like in an infrared spectrum obtained by infrared spectroscopic measurement are numerical values within predetermined ranges, it can be confirmed whether or not a polyimide molded product is partially hydrolyzed to obtain a desired crude imide group-containing compound.

Next, the crude imide group-containing compound was purified to prepare an infrared spectrum having a wave number of 1375cm in an infrared spectrum obtained by infrared spectroscopic measurement-1Has an absorption peak at a wave number of 1600cm from an imide group-1Has an absorption peak derived from an amide group and has a wavenumber of 1413cm-1And (b) treating the imide group-containing compound having an absorption peak derived from a carboxyl group. Therefore, it is preferable that the imide group-containing compound having a predetermined absorption peak is neutralized by, for example, acid treatment (hydrochloric acid, nitric acid, sulfuric acid, phosphoric acid, organic acid treatment, etc.), and the washing step is repeated, for example, 5 times, to purify the crude imide group-containing compound to obtain an imide group-containing compound (in the form of particles) from which impurities have been removed.

In order to effectively avoid the influence of the acid component and the alkali component remaining in the crude imide group-containing compound, for example, the influence on heat resistance, metal corrosion, and the like, it is more preferable to use phosphoric acid as a weak acid in the acid treatment, and to use potassium hydroxide in the alkali treatment. In addition, after the crude imide group-containing compound is purified and dried, the imide group-containing compound is preferably classified into a predetermined particle size by using a sieve in order to make the particle size uniform.

Whether or not the crude imide group-containing compound is sufficiently purified can be confirmed by quantitatively determining that the content of an element (or an element ion) such as chlorine, sulfur, phosphorus, aluminum, or magnesium is a predetermined amount or less by using an ion chromatograph or X-ray photoelectron spectroscopy (XPS). More specifically, the purification degree of the crude imide group-containing compound can be confirmed by, for example, quantifying the chloride ion content to 100ppm or less, more preferably 10ppm or less, and still more preferably 1ppm or less by ion chromatography elemental analysis.

Finally, the compound containing an imide group obtained in the previous step is dissolved in a predetermined amount of an aqueous solvent to prepare a compound solution containing an imide group. In this case, NMP or the like is used alone and in a small amount as the aqueous solvent, and after a homogeneous solution (master batch) is prepared by using at least one of known stirring apparatuses, an imide group-containing compound solution can be prepared in a very short time by mixing the aqueous solvent as a diluent.

On the other hand, it was found that if an aqueous solution in which a predetermined amount of an amine compound is mixed in an aqueous solvent is used, an imide group-containing compound is easily dissolved, and therefore, an imide group-containing compound solution can be prepared in a short time. In short, it is preferable to add a predetermined amount of phytic acid, triethyl orthoformate, or the like as a viscosity stabilizer at the stage of or during the preparation of the imide group-containing compound solution.

2. Step (2)

The step (2) is a step of preparing an aqueous dispersion of a fluorine-containing resin. Specifically, the method comprises a step of preparing an aqueous dispersion of a fluororesin, wherein fluororesin particles (average particle diameter: 0.01 to 10 μm) having a solid content of 30 to 70 wt% are mixed with water directly or together with a surfactant and uniformly mixed. If the average particle diameter of the fluororesin particles is within a predetermined range, a commercially available aqueous dispersion of a fluororesin may be used.

3. Step (3)

The step (3) is a step of mixing the imide group-containing compound solution obtained in the step (1) with the aqueous dispersion of the fluororesin obtained in the step (2) to prepare an aqueous treatment agent. Specifically, the method comprises a step of preparing an aqueous treatment agent in which the amount of fluororesin contained in an aqueous dispersion of a fluorine-containing resin is in the range of 0.1 to 10000 parts by weight in terms of solid content per 100 parts by weight of an imide group-containing compound. More specifically, it is preferable to prepare the aqueous treatment agent containing the imide group-containing compound and the fluororesin by stably and uniformly stirring the mixture using at least one of known stirring apparatuses such as a propeller mixer, a planetary mixer, a ball mill, a jet mill, a vibration mill, and a three-roll mill.

4. Other inspection procedures

It is preferable to provide an inspection step for inspecting the solid content, viscosity, appearance, reactivity, and the like of the obtained aqueous treatment agent and confirm that the value is within a predetermined range.

[ embodiment 3]

Embodiment 3 is a surface treatment method using an aqueous treatment agent containing an aqueous dispersion of a fluorine-containing resin and an imide group-containing compound obtained by partially hydrolyzing a polyimide molded article, the surface treatment method including the following steps (1 ') to (3').

(1') preparing an aqueous treating agent comprising an imide group-containing compound obtained by partially hydrolyzing a polyimide molded product, an aqueous dispersion of a fluorine-containing resin, and an amine compound, wherein the amount of the fluorine-containing resin contained in the aqueous dispersion of the fluorine-containing resin is in the range of 0.1 to 10000 parts by weight in terms of solid content per 100 parts by weight of the imide group-containing compound, and the amount of the amine compound is in the range of 0.1 to 30 parts by weight per 100 parts by weight of the imide group-containing compound;

(2') laminating an aqueous treatment agent on the surface of the material to be treated;

(3') heating the aqueous treatment agent laminated on the surface of the material to be treated at a temperature of 200 ℃ or higher to form a surface-treated film.

Hereinafter, the method of using the aqueous treatment agent according to embodiment 3 will be described in order along steps (1 ') to (3') with reference to fig. 10(a) to (d).

1. Step (1')

The step (1') is a step of preparing the aqueous treatment agent, and is substantially the same as the method for producing the aqueous treatment agent of embodiment 2 described above, and therefore, a description thereof will be omitted.

2. Step (2')

The step (2 ') is a step of laminating the aqueous treatment agent obtained in the step (1') on the surface of the material to be treated 50. Here, as the material to be treated 50, typically, a polyimide resin molded article (film), a fluorine resin molded article (film), or a metal (iron, aluminum, or the like) is used. That is, the following are generally the case in the polyimide resin molded article: the chemical resistance (alkali resistance) is slightly weak, the adhesion is too high, the antifouling property is low, and the dielectric loss is slightly high. Therefore, in such a case, by applying the obtained aqueous treatment agent to a polyimide resin molded article or an iron base material and then performing a heating treatment, a surface-treated film having high chemical resistance (alkali resistance) and adjustable adhesiveness, dielectric characteristics, and the like can be formed on the surface of the polyimide resin molded article or the iron base material.

In addition, the following are common cases of fluorine-based resin molded articles: the mechanical strength is weak, the surface water repellency is too high, and the surface adhesiveness is low. Therefore, in such a case, by applying the obtained aqueous treatment agent to the surface of the fluorine-based resin molded article and then performing a heating treatment, a surface conditioning layer having strong mechanical strength and capable of adjusting adhesion, dielectric characteristics, and the like can be formed on the surface of the fluorine-based resin molded article. In addition, the following are generally the following cases in the polyester resin molded article: mechanical strength, heat resistance and ultraviolet resistance are insufficient and adhesion is low. Therefore, by applying the obtained aqueous treatment agent to the surface of a polyester resin molded article and then performing a heat treatment, the mechanical strength, heat resistance, and ultraviolet ray resistance of the polyester resin molded article can be improved, and further excellent adhesion, dielectric properties, and the like can be obtained.

Therefore, the various materials to be treated to which the obtained aqueous treatment agent is applied are not particularly limited, and for example, the aqueous treatment agent is preferably applied not only to the above-mentioned resin molded article but also to various other resin molded articles (films), metal films, metal molded articles, ceramic films, ceramic molded articles (including glass molded articles), paper, wood, and the like, and can exhibit desired surface treatment properties. The thickness of the material to be treated 50 is preferably a value in the range of 50 to 5000 μm, more preferably a value in the range of 100 to 2000 μm, and still more preferably a value in the range of 200 to 1000 μm.

5. Step (3')

Next, as shown in fig. 11(b), the step (3') is a step of laminating the aqueous treatment agent on the surface of the material to be treated 50, and then, for example, leaving it at room temperature for 1 to 24 hours, and further, performing a heat treatment at a temperature of 200 ℃. That is, the heat treatment in this manner causes the water and amine compound contained in the aqueous treating agent to be scattered, and substantially causes the imide group-containing compound and the fluororesin to be phase-separated, thereby actually forming the surface-treated film 52 having a two-layer structure. The reason is that the heat treatment as described above dissolves the fluororesin contained in the aqueous treatment agent, crystallizes the fluororesin, forms a uniform surface, and improves the water repellency and peelability of the surface.

Further, as described in embodiment 1, the second heating may be performed, and further, the temperature-raising heating treatment is preferably performed at a temperature-raising rate of 1 ℃/minute to 20 ℃/minute until the temperature is raised to 200 ℃ or higher, more preferably 250 ℃ or higher, and still more preferably 300 ℃ or higher. The thickness of the surface treatment film 52 is preferably a value in the range of 1 to 1000 μm, more preferably a value in the range of 10 to 500 μm, and still more preferably a value in the range of 20 to 300 μm.

6. Additional step (4)

Next, as shown in fig. 11(c), the additional step (4) is a step of forming a colored layer 53 as an arbitrary layer on the predetermined surface treatment film 52. That is, it is preferable to perform a step of forming the colored layer 53 including the colored material-dispersing resin layer 53b derived from a fluorine-based resin containing white titanium oxide or the like as the colorant 53 a. By forming the colored layer 53 in this manner, the decorative property is further improved, and when used as a frying pan, a hot plate, or the like, there is an advantage that the food to be cooked is clearly distinguished from the food to be cooked, and the food to be cooked itself is easily cooked. The thickness of the colored layer 53 is preferably a value in the range of 1 to 100 μm, more preferably a value in the range of 10 to 80 μm, and still more preferably a value in the range of 20 to 60 μm. In order to form the colored layer 53 more firmly on the predetermined surface-treated film 52, it is preferable that the temperature at the time of forming the predetermined surface-treated film 52 is set to a range of 170 to 200 ℃, and the colored layer 53 is formed by performing a heat treatment in a temperature range of, for example, 300 to 380 ℃ in a state where a part of the predetermined surface-treated film 52 is not dried.

7. Additional step (5)

Next, as shown in fig. 11(d), the additional step (5) is a step of forming an overcoat layer 54 made of a transparent fluorine-based resin or the like on the predetermined colored layer 53. That is, the step of forming the overcoat layer 54 composed of a fluororesin having a relatively high molecular weight and a vitreous material (silica, polysilazane film, diamond carbon, etc.) as a surface protective layer. By forming the overcoat layer 54 in this manner, the decorative properties are further improved, and when the colored layer 53 and the surface treatment film 52 are used as a frying pan, a hot plate, or the like, there is an advantage that the mechanical protection and durability of the colored layer 53 and the surface treatment film 52 are improved. The thickness of the overcoat layer 54 is preferably 1 to 1000 μm, more preferably 10 to 500 μm, and still more preferably 20 to 100 μm. In order to form the overcoat layer 54 more firmly on the predetermined surface-treated film 52 or on the colored layer 53 and the surface-treated film 52, it is preferable that the temperature at the time of forming the predetermined surface-treated film 52 or the colored layer 53 and the surface-treated film 52 is set to a range of 170 to 200 ℃, and the overcoat layer 54 is formed by heat treatment at a temperature range of, for example, 300 to 380 ℃ in a state where the predetermined surface-treated film 52 or the predetermined colored layer 53 and the surface-treated film 52 are partly undried.

8. Others

The overcoat layer 54 described above is preferably substantially transparent (visible light transmittance of, for example, 90% or more) and capable of visually recognizing the colored layer 53 as a base. When the underlying colored layer 53 is omitted, it is preferable to add a predetermined amount of at least one inorganic filler selected from alumina, silica (silica), zirconia, titanium oxide, calcium carbonate, corundum, and glass frit in order to improve the mechanical strength, heat resistance, durability, and the like of the overcoat layer 54.

39页详细技术资料下载
上一篇:一种医用注射器针头装配设备
下一篇:聚烯烃硅涂料组合物

网友询问留言

已有0条留言

还没有人留言评论。精彩留言会获得点赞!

精彩留言,会给你点赞!