阅读说明：本技术 模块化耳机系统 (Modular headset system ) 是由 D·W·弗里曼 F·斯特劳斯 M·A·塔佩纳 于 2020-03-10 设计创作，主要内容包括：提供了一种模块化耳机系统,该模块化耳机系统可以为佩戴者提供听力保护以及音乐和节目的高质量声音传送的可配置选择。在一个实施例中,模块化耳机包括头带和安装到头带的听筒。听筒包括罐,该罐包括扬声器,该罐固定到头带。可拆卸可更换音乐耳杯能够可拆卸地安装到罐以覆盖扬声器。可拆卸可更换听力保护/声音放大(HP/amp)耳杯能够可拆卸地安装到罐以覆盖扬声器。(A modular headset system is provided that can provide a wearer with configurable options for hearing protection and high quality sound delivery of music and programming. In one embodiment, a modular headset includes a headband and an earpiece mounted to the headband. The earpiece includes a canister that includes a speaker, the canister being secured to the headband. A removable replaceable music ear cup can be removably mounted to the jar to cover the speaker. A removable replaceable hearing protection/sound amplification (HP/amp) ear cup can be removably mounted to the jar to cover the speaker.)

1. A modular headphone system for providing hearing protection and configurable options for high quality sound delivery of music and programming to a wearer, the system comprising:

a headband; and

an earpiece mounted to the headband, the earpiece comprising:

a canister including a speaker, the canister secured to the headband;

a removable replaceable musical ear cup removably mountable to the jar to cover the speaker; and

a removable replaceable hearing protection/sound amplification (HP/amp) ear cup removably mountable to the jar to cover the speaker.

2. The modular headset system of claim 1, wherein the canister comprises a canister body comprising:

a circumferentially extending sidewall surrounding the speaker; and

a circumferentially extending open area defined between the speaker and the sidewall.

3. The modular headset system of claim 2, wherein the HP/amp ear cup comprises:

a sound absorbing element within the circumferentially extending open area; and

a sound absorbing layer covering the sound absorbing element and the speaker.

4. The modular headphone system of claim 2, wherein each of the music ear cup and the HP/amp ear cup comprises:

a bottom structure having a circumferentially extending outer portion defining an open area aligned with the speaker;

a cushion structure mounted to the base structure, the cushion structure defining an ear-receiving open area aligned with the open area of the base structure.

5. The modular headset system of claim 4, wherein the cushion structure comprises:

a resilient circumferentially extending pad structure having an inner circumferentially extending surface, an outer circumferentially extending surface, and an end face connecting the inner and outer circumferentially extending surfaces; and

a body cover covering the inner and outer circumferentially extending surfaces and the end face.

6. The modular headset system of claim 5, wherein the cushion structure is made of polyurethane memory sponge and the body cover is made of polyurethane synthetic leather.

7. The modular headphone system of claim 5, wherein the cushion structure further comprises a sound-transmissive cover covering the open area of the bottom structure.

8. The modular headset system of claim 4, wherein the HP/amp ear cup comprises:

a sound absorbing element within the circumferentially extending open area; and

a sound absorbing layer covering the sound absorbing element and the speaker.

9. The modular headphone system of claim 8, wherein the sound absorbing element is made of one or more of polyurethane foam, cotton, melamine, or a composite material.

10. The modular headphone system of claim 8, wherein the sound absorbing element has a thickness of 5mm to 15 mm.

11. The modular headphone system of claim 8, wherein the sound layer is made of one or more of polyurethane foam, cotton, melamine, or composite material, and the sound absorbing layer has a thickness of 2mm to 4 mm.

12. The modular headphone system of claim 1, wherein amplification circuitry in the HP/amp ear cup stops sound amplification in response to a pulsing sound.

13. The modular headphone system of claim 12, wherein amplification circuitry in the HP/amp ear cup ceases sound amplification in response to a pulsed sound exceeding an adjustable threshold.

14. The modular headphone system of claim 12, wherein amplification circuitry in the HP/amp ear cup ceases sound amplification in response to pulsed sound exceeding an 82dB level.

15. The modular headphone system of claim 12, wherein amplification circuitry in the HP/amp ear cup resumes sound amplification within 2 ms.

16. The modular headphone system of claim 12, further comprising a switch that enables a user to selectively activate the ability of the amplification circuitry in the HP/am ear cup to cease amplification upon detection of a pulsing sound.

17. An earphone system, comprising:

a headband; and

an earpiece mounted to the headband, the earpiece comprising:

a canister including a speaker, the canister secured to the headband;

a hearing protection/sound amplification (HP/amp) ear cup mounted to the jar to cover the speaker;

the jar includes the jar body, the jar body includes:

a circumferentially extending sidewall surrounding the speaker;

a circumferentially extending region defined within an interior region, the interior region being defined between the speaker and the sidewall;

the ear cup includes:

a sound absorbing element within the circumferentially extending region;

a sound absorbing layer covering the sound absorbing element and the speaker; and

an outer ear cup structure configured to engage an ear of a user, to be mounted to the canister, and to cover the sound absorbing layer.

18. The headphone system of claim 17, wherein the external ear cup structure comprises:

a bottom structure having a circumferentially extending outer portion defining an open area aligned with the speaker; and

a cushion structure mounted to the base structure, the cushion structure defining an ear-receiving open area aligned with the open area of the base structure;

the cushion structure further includes:

a resilient circumferentially extending pad structure having an inner circumferentially extending surface, an outer circumferentially extending surface, and an end face connecting the inner and outer circumferentially extending surfaces;

a body cover covering the inner and outer circumferentially extending surfaces and the end faces; and

an acoustically transparent cover covering the open area of the base structure.

Background

The subject matter discussed in this section should not be assumed to be prior art merely because of the mention in this section. Similarly, the problems mentioned in this section or related to the subject matter provided as background should not be assumed to have been previously recognized in the prior art. The subject matter in this section represents only different approaches that may themselves correspond to implementations of the claimed technology.

Headsets are used for a variety of different purposes. One of the purposes is to provide hearing protection. The most basic Hearing Protection (HP) headset is an over-the-ear headset with an ear cup that surrounds the user's ear to provide passive HP, also known as sound isolation. The passive HP earpiece may filter out ambient noise and provide some impulse noise protection. Passive HP headsets typically have no electronics.

Another object is to deliver sound directly to the user's ear, such as when listening to live and pre-recorded sound, including for example music, pre-recorded books and telephone conversations. For simplicity, these sound delivery headsets are commonly referred to as music headsets. Some music headsets include electronics that provide high quality music to the user. Over-the-ear music headsets may also filter out ambient noise and provide limited noise protection because they surround the ear.

Both the HP apparatus and the music headphone may include electronics for providing conventional noise cancellation, which is particularly effective in generating sound waveforms that are diametrically opposed to the low frequency ambient sound waveforms, thereby canceling them. However, there is currently no configurable option for an integrated headset solution that can provide hearing protection and high quality sound delivery of music and programming to the wearer.

Disclosure of Invention

A simplified summary is provided herein to help enable a basic or general understanding of various aspects of exemplary non-limiting implementations that follow in the more detailed description and the accompanying drawings. This summary is not intended, however, as an extensive or exhaustive overview. Rather, the sole purpose of this summary is to present some concepts related to some exemplary non-limiting implementations in a simplified form as a prelude to the more detailed description of various implementations that follows.

A modular headset system that can provide a wearer with configurable options for hearing protection and high quality sound delivery of music and programming. In one embodiment, a modular headset includes a headband and an earpiece mounted to the headband. The earpiece includes a canister that includes a speaker, the canister being secured to the headband. A removable replaceable music ear cup can be removably mounted to the jar to cover the speaker. A removable replaceable hearing protection/sound amplification (HP/amp) ear cup can be removably mounted to the jar to cover the speaker.

The tank comprises a tank body. In an embodiment, the canister includes a circumferentially extending sidewall surrounding the speaker and a circumferentially extending open area defined between the speaker and the sidewall. In one exemplary embodiment, the HP/amp ear cup includes a sound absorbing element within a circumferentially extending open area and a sound absorbing layer covering the sound absorbing element and the speaker. In an exemplary embodiment, each of the music ear cup and the HP/amp ear cup includes a base structure having a circumferentially extending outer portion defining an open area aligned with the speaker, and a cushion structure mounted to the base structure such that the cushion structure defines an ear receiving open area aligned with the open area of the base structure.

An example pad structure may include a resilient circumferentially extending pad structure having an inner circumferentially extending surface, an outer circumferentially extending surface, and an end surface connecting the inner and outer circumferentially extending surfaces. The body cover covering the inner and outer circumferentially extending surfaces and the end faces may also be part of the liner structure. In one exemplary implementation, the cushion structure is made of polyurethane memory sponge and the body cover is made of polyurethane synthetic leather. The cushion structure further includes an acoustically transparent cover covering the open area of the base structure.

The exemplary HP/amp ear cup includes a sound absorbing element within a circumferentially extending open area and a sound absorbing layer covering the sound absorbing element and the speaker. The sound absorbing element is made of one or more of polyurethane foam, cotton, melamine or composite material. Combinations of these materials, other materials, and combinations thereof are contemplated by the disclosed technology. An exemplary headphone employs sound absorbing elements having a thickness of 5mm to 15 mm. In another exemplary earphone, the sound-absorbing layer is made of one or more of polyurethane foam, cotton, melamine, or a composite material, and the thickness of the sound-absorbing layer is 2mm to 4 mm.

In one embodiment, the amplification circuitry in the HP/amp ear cup stops sound amplification in response to the pulsed sound. The amplification circuitry in the HP/amp ear cup may cease sound amplification in response to the pulsed sound exceeding an adjustable threshold. For example, the amplification circuitry in the HP/amp ear cup stops sound amplification in response to pulsed sound exceeding the 82dB level. The amplification circuitry in the HP/amp ear cup can resume sound amplification within 2 milliseconds. Some implementations also include a switch that enables a user to selectively activate the ability of the amplification circuitry in the HP/am ear cup to cease amplification upon detection of a pulsing sound.

In another embodiment, a headphone system includes a headband and an earpiece mounted to the headband. The earpiece includes a canister that includes a speaker. The canister is secured to the headband. A hearing protection/sound amplification (HP/amp) ear cup mounted to the can to cover the speaker. The tank also includes a tank body. The tank includes a circumferentially extending sidewall surrounding the speaker. A circumferentially extending region is defined within the interior region, the interior region being defined between the speaker and the sidewall. The ear cup includes a sound absorbing element within a circumferentially extending region, a sound absorbing layer covering the sound absorbing element and the speaker, and an external ear cup structure configured to engage an ear of a user and mount to the can and cover the sound absorbing layer.

One example of an earphone system, an external ear cup structure includes a base structure having a circumferentially extending outer portion defining an open area aligned with a speaker, and a cushion structure mounted to the base structure such that the cushion structure defines an ear receiving open area aligned with the open area of the base structure. The pad structure also includes a resilient circumferentially extending pad structure having an inner circumferentially extending surface, an outer circumferentially extending surface, and an end surface connecting the inner circumferentially extending surface and the outer circumferentially extending surface. A body cover covering the inner and outer circumferentially extending surfaces and the end faces is also part of the liner structure. Furthermore, the acoustically transparent cover covers the open area of the base structure. Other features, aspects, and advantages of the disclosed technology can be seen from a review of the figures, the detailed description, and the claims that follow.

Drawings

The drawings are included for illustrative purposes and are merely intended to provide examples of possible structures and process operations for one or more implementations of the present disclosure. These drawings in no way limit any changes in form and detail that may be made by one skilled in the art without departing from the spirit and scope of the disclosure. A more complete understanding of the subject matter may be derived by referring to the detailed description and claims when considered in conjunction with the following figures, wherein like reference numbers refer to similar elements throughout the figures.

Fig. 1 is a front view of a modular headphone system with a removable and replaceable ear cup, a left earpiece with an HP/amp ear cup and a right earpiece with a music ear cup.

Fig. 2 is an exploded perspective view of the music ear cup of the right music earpiece of fig. 1.

Fig. 3 is a side view of the right music earpiece of fig. 1.

FIG. 4 is a somewhat simplified cross-sectional view of the structure of FIG. 3 taken along line 4-4.

Fig. 5 is an exploded perspective view of the HP/amp ear cup of the left HP/amp handset of fig. 1.

Fig. 6 is a side view of the left HP/amp handset of fig. 1.

FIG. 7 is a somewhat simplified cross-sectional view of the structure of FIG. 6, taken along line 7-7.

Fig. 8 is a schematic diagram of a circuit arrangement implementing a modular headset system.

Detailed Description

The following description will typically refer to specific structural embodiments and methods. It is to be understood that there is no intention to limit the specifically disclosed embodiments and methods to the specific embodiments and that the disclosure may be practiced using other features, elements, methods and embodiments. Preferred embodiments are described to illustrate the disclosed technology, not to limit its scope, which is defined by the claims. Those of ordinary skill in the art will recognize a variety of equivalent variations on the description that follows. Unless otherwise specified, in this application specifying a relationship (such as parallel, aligned, or in the same plane) means that the specified relationship is within the limits of the manufacturing process and within the manufacturing variations. When components are described as being coupled, connected, in contact, or contacting each other, they need not be in physical direct contact with each other unless specifically stated otherwise. Like elements are generally indicated by like reference numerals in the various embodiments.

More sophisticated hearing protection versions are provided by HP and amplification headsets, which are commonly referred to as HP/amp headsets. The HP/amp headset provides passive hearing protection against noise, just like a passive HP headset. Some implementations of HP/amp devices also include electronics for amplifying relatively low levels of ambient sound. Passive hearing protection allows the wearer to be protected from sudden impulsive sounds, such as those generated by a loud sound exceeding 82dB in an industrial or manufacturing environment or a gunshot sound when hunting. In both cases, the HP/amp device allows the wearer to hear the sound of a colleague or hunting partner while being protected from loud impulsive sounds. The design of the electronics does not amplify impulsive sounds or other loud sounds. However, they may provide enhanced hearing for low levels of ambient sound, such as to allow a hunter to hear the animal's voice as well as speech.

Fig. 1 shows one example of a modular headphone system 10, the headphone system 10 including a headband 12, a left earpiece 14, and a right earpiece 16, the right earpiece 16 being secured to the headband 12, in this example by a pivot/swivel joint 18. Each earpiece of the modular headset system 10 may be used in either a hearing protection/sound amplification (HP/amp) mode or a music headphone mode. Each earpiece includes what is referred to herein as a can and an ear cup mounted to the can.

Typically, with the present technology, the headset system includes two different interchangeable ear cups that can be mounted to the can of the earpiece. The HP/amp ear cup is used when the system is to be used in HP/amp device mode, and the music ear cup is used when the system is to be used in music headphone mode. Using the present technology, electronics for two alternative modes (HP/amp device mode or music headphone mode) may be included in the canister. Furthermore, providing additional acoustic insulation between the canister and the user's ear (provided in the examples below by a sound absorbing layer in front of the speaker and sound absorbing elements around the speaker) may improve the ability of the passive HP to resist the effects of impulsive sounds or other loud sounds in the HP/amp device mode.

In the examples discussed below, each canister may include electronics for a speaker/driver. The electronics for the HP/amp equipment mode and the music headphone mode may be distributed between the canisters or each canister may include all the necessary electronics. An example of an electronic device suitable for implementing the HP/amp mode is shown in fig. 8: an HP/amp audio driver 805. An example of an electronic device suitable for music mode is shown in fig. 8: music audio driver 804. When the electronics are distributed between the canisters, the electronics will be coupled to each other by wires, wireless communication, or both.

Each can 20, 22 is preferably associated with two types of removable and replaceable ear cups: the HP/amp ear cup 24 is used with one of the music ear cups 26. The user selects which ear cup to mount to the jar 20, 22 based on the mode in which the system is to be used. For example, if the system is to be used in a noisy industrial environment or a shooting range, an HP/amp ear cup 24 may be selected and mounted to each tank 20, 22. The music ear cup 26 is typically used if the system is to be used, for example, when listening to music or watching video on an airplane. The modular headphone system 10 shown in the figures shows the HP/amp ear cup 24 mounted to the can 20 of the left earpiece 14 and the music ear cup 26 mounted to the can 22 of the right earpiece 16 to avoid unnecessary duplication of the figures; during use, the same type of ear cup (i.e., HP amp ear cup 24 or music ear cup 26) will typically be used for both the left and right earpieces 14, 16. Thus, a modular headset system 10 with two different interchangeable ear cups may be used, the HP/amp ear cup 24 being used when the system is to be used in HP/amp device mode and the music ear cup 26 being used when the system is to be used in music headset mode.

Fig. 2, 3 and 4 show the can 22 and the music ear cup 26 of the right earpiece 16 of fig. 1, with the components of the music ear cup 26 shown in an exploded view in fig. 4. Referring again to fig. 2, the canister 22 includes a canister body 30, the canister body 30 having a circumferentially extending sidewall 32, the circumferentially extending sidewall 32 surrounding a speaker 34 to define a circumferentially extending region 36 therebetween. The ear cup 26 is mountable to and removable from the jar 22 and includes a base structure 38 and a cushion structure 40. The bottom structure 38 includes a rim 42, the rim 42 having a first edge 44 facing the tank 20, and a second edge 46. The bottom structure 38 also has an inwardly extending flange (or outer portion) 48 that extends inwardly from the second edge 46. The flange 48 defines an open area 50 aligned with the speaker 34.

The cushion structure 40 includes an acoustically transparent cover 52 aligned with the open area 50. The cover 52 may be made of a fabric material such as, but not limited to, non-woven fabrics and materials, staple fibers, and continuous filaments that may be bonded together by chemical, mechanical heat, or solvent treatment. The amount of sound attenuation provided by the cover 52 preferably does not exceed 1 dB. The cushion structure 40 further includes a cushion structure 54, the cushion structure 54 typically being made of a foam material, such as a memory foam, which primarily includes polyurethane that has been chemically treated to increase its viscosity and/or density, such as from the leifenhessokhouse, located in trestle, germanyReicofil available to the company^TM(http:// www.reicofil.com /) or equivalent, for a comfortable fit during use. The body 54 has an outer circumferentially extending surface 56, an inner circumferentially extending surface 58, and an end surface 60 connecting the inner surface 56 and the outer surface 58. The cushion structure 40 further includes a body cover 62, the body cover 62 including: an inner ring member 64, the inner ring member 64 being sized to fit within and be adjacent to the surface 58 of the body 54; a circumferential member 66, the circumferential member 66 being sized to surround and be adjacent the outer surface 56 of the body 54 and the grommet 42 of the bottom structure 38; and an end member 68, the end member 68 being connected to the inner ring member 64 and the circumferential member 66; this is shown in fig. 4. The components of the body cover 62 are shown as separate components in fig. 2, but in this example are a single component. The end member 68 has an opening 70 corresponding to an open interior 72 of the inner ring member 64, both of which are aligned with the open area 50.

The cushion structure 40 defines an ear-receiving open area 74 that is aligned with the open area 50 of the base structure 38. The body cover 62 may be made of a non-porous material to facilitate cleaning of the pad structure 40; one suitable example is polyurethane or polyvinyl chloride, which may be formed to simulate leather. Typically, the body 54 and body cover 62 are made of materials that are suitable for the intended use environment and comfortable to wear. As shown in fig. 4, circumferential member 66 has a re-bent portion 82, re-bent portion 82 engaging first edge 44 of backing ring 42 to secure backing structure 40 to base structure 38. The flexibility of circumferential member 66 also allows for liner structure 40 to be removed and for liner structure 54 and acoustic shell 52 to be cleaned, repaired or replaced as needed.

In the example that will now be discussed with reference to fig. 5, 6 and 7, the left earpiece 14 (including the can 20) is depicted as having an HP/amp ear cup 24. The portions of the can 20 and the can 22 that engage the ear cups 24, 26 are substantially identical. The main difference between the HP/amp ear cup 24 of FIG. 5 and the music ear cup 26 of FIG. 2 is the circuit arrangement used to implement the audio drivers 804, 805. Further, sound absorbing elements 76 and sound absorbing layers 78 may be incorporated into the HP/amp ear cup 24. The HP/amp ear cup 24 includes an outer ear cup structure 79, in this example, the outer ear cup structure 79 and musicThe ear cup 26 is identical and therefore these components will not be described again. In this example, the sound absorbing layer 78 is located between the sound absorbing element 76 and the flange 48 of the substructure 38. The body 30 has an inwardly directed wall 80 extending between the speaker 35 and the side wall 32. The sound absorbing element 76 is received within the circumferentially extending region 36 of the tank 22 and abuts the wall 80. The sound absorbing element 76 and the sound absorbing layer 78 are made of a material that enhances the passive hearing protection provided by the modular headphone system 10, particularly with respect to loud noise (both impulsive and non-impulsive sounds) that typically exceed 82 dB. In one example, sound absorbing element 76 is made of one or more of polyurethane foam, cotton, melamine, or a composite thereof that is about 5mm-15mm thick, and sound absorbing layer 78 is made of a similar material that is about 2mm-4mm thick. Sonex, an example material for implementing the sound-absorbing element 76 and the sound-absorbing layer 78^TMTested to produce a Noise Reduction Coefficient (NRC) equal to 0.65 acoustic attenuation. Comparing fig. 2 and 5, it can be seen that the circumferentially extending region 36 is an open area in the music ear cup 26 of fig. 2, but it substantially fills the sound absorbing element 76 in the HP/amp ear cup 24 of fig. 5.

In the disclosed example, fig. 8 shows the electronics required for the music mode and the HP/amp mode, and fig. 8 is a schematic diagram of the circuit arrangement implementing the modular headset system. The circuit arrangement of fig. 8 comprises an HP/amp audio driver 805 for driving the speaker 35 of the tank 20 and a music audio driver 804 for driving the speaker 34 of the tank 22. Alternatively, the required electronics for both music mode and HP/amp mode can be found in either of the cans 20 or 22, with wires establishing connections to speakers on the opposite can. In either case, it is preferred that the various switches, buttons, and indicators be located on the canister 20 and canister 22 to keep the functions separate and not bring the switches, buttons, and indicators too close to each other.

Preferably, the headset 10 includes a microphone for detecting ambient noise. The microphone may be located in one or both of the earpieces 14, 16. Fig. 6 shows a volume control switch 84, in this example the volume control switch 84 controls the volume of both earpieces 14, 16 in music mode and also controls the amplification of low level noise in HP/amp mode, such as when in an industrial environment, hunting or shooting. Fig. 3 shows the mode switch 86 activating a search mode in which the user can adjust the volume that needs to be heard. In one embodiment, pressing the up arrow button of the mode switch 86 causes the headset 10 to enter the search mode and raise the threshold for amplifying the sound above the threshold. Pressing the down arrow button of the mode switch 86 causes the headset to lower the threshold for sound amplification. Referring back to fig. 5, the various controls and optional visual indicators provide the user with the ability to control features of the headset 10. The Bluetooth button 55 enables the user to pair the headset with a Bluetooth signal source. A properly positioned Bluetooth indicator LED blinks during pairing and turns off when not in operation. The HP button 57 provides the user with control of switching between the HP/amp mode and the music mode. The conveniently located HP indicator appears white when active, red when battery power is low, and off when the headset 10 is not operating. When the HP button 57 is pressed, the HP indicator shows a red color for 3 seconds and then turns off to save power. The NC button 59 enables the user to turn Noise Cancellation (NC) on and off. The nearby NC indicator shows white for 3 seconds when noise cancellation is activated and is turned off when noise cancellation is turned off. The control buttons 55, 57 and 59 are turned on by a long press and turned off by a short press. Alternatively, a simple switching of functions may be implemented. Alternatively, a 3.5mm input 61 provides the user with the ability to enjoy music when the headset has no connection to Bluetooth. When activated, the headset 10 will automatically turn off HP protection, Bluetooth and noise cancellation. Noise level amplification may be provided by different techniques, with sound compression being currently preferred. The electronics are preferably designed to stop amplification when the external sound level (e.g., pulsed or ambient sound as described above) exceeds a threshold of about 82dB or is adjusted in hunter mode; this is true for both modes. Thus, in the HP/amp mode, sound amplification is turned off quickly in response to a pulsing sound such as a gunshot, and is quickly restored to sound amplification, preferably within 2 ms. Preferably, a Noise Reduction Rating (NRR) of at least 22, and preferably 28-30, is achieved using both the left and right earpieces 14, 16 of both the HP/amp ear cup 24 and the music ear cup 26. When in music mode, preferably, music or other sounds delivered to the user are paused when a telephone call is received, and automatically reopened when the telephone call is completed. Conventional noise cancellation may be provided for one or both of the music mode and the HP/amp mode, preferably at least 20 dB.

The above description may use terms such as above, below, top, bottom, over, under, and the like. These terms may be used in the specification and claims to facilitate understanding of the disclosure, and are not used in a limiting sense.

While implementations of the technology are disclosed with reference to the preferred embodiments and examples detailed above, it is to be understood that these examples are intended in an illustrative rather than in a limiting sense. It is contemplated that modifications and combinations will occur to those skilled in the art that will be within the spirit of the disclosed technology and the scope of the following claims. For example, different materials may be used to construct the headset, and its components, switches, and controls may be placed in different configurations and/or locations. For simplicity, some controls may be merged into a single control. The audible feedback may replace or augment the visual indicator. Other colors and states of the visual indicator may be used. Component values are suggested values, but may vary from implementation to implementation and from unit to unit of a particular implementation due to manufacturing tolerances. The components may come from different suppliers that provide similar functional parts under different brands or type names.

One or more elements of one or more claims may be combined with elements of other claims. Any and all patents, patent applications, and printed publications mentioned above are incorporated herein by reference.