阅读说明：本技术 用于感测流体介质的至少一个特性的传感器 (Sensor for sensing at least characteristics of a fluid medium ) 是由 M·里特曼 于 2018-03-27 设计创作，主要内容包括：本发明提出一种用于感测流体介质的至少一个特性的传感器(110)。所述传感器(110)包括至少一个传感器元件(136)以及具有至少一个操控和分析处理电路(114)的至少一个电路载体(112)。所述电路载体(112)具有至少一个突出部(150)。在所述突出部(150)上施加有至少一个温度传感器(148)。(The invention proposes sensors (110) for sensing at least characteristics of a fluid medium, the sensors (110) comprising at least sensor elements (136) and at least circuit carriers (112) having at least control and evaluation circuits (114), the circuit carriers (112) having at least projections (150), at least temperature sensors (148) being applied to the projections (150).)

1. Sensor (110) for sensing at least properties of a fluid medium, comprising at least sensor elements (136) and at least circuit carriers (112) with at least control and evaluation circuits (114), characterized in that the circuit carriers (112) have at least projections (150), wherein at least temperature sensors (148) are applied to the projections (150).

2. The sensor (110) according to the preceding , wherein the sensor (110) has a sensor housing (116) with a flow channel (118), wherein the sensor element (136) is applied to a sensor carrier (134) which projects into the flow channel (118), wherein the circuit carrier (112) is arranged outside the flow channel (118) in an electronics compartment (128) of the sensor housing (116).

3. The sensor (110) according to any of the preceding claim, wherein the temperature sensor (148) is configured as an SMD component.

4. The sensor (110) according to any of the preceding claims, wherein the temperature sensor (148) is configured as an NTC.

5. The sensor (110) according to any of the preceding claims, wherein the sensor (110) is configured as a hot film air mass meter.

6. The sensor (110) according to any of the preceding claims, wherein the temperature sensor (148) is electrically connected with the steering and analytical processing circuit (114), and wherein the steering and analytical processing circuit (114) is provided for taking into account at least temperature signals of the temperature sensor (148) when analyzing at least signals of the sensor element (136).

7. The sensor (110) according to any of the preceding claims, wherein the circuit carrier (112) is configured as a circuit board (130).

8. The sensor (110) of the preceding claim , wherein the projection (150) is configured as a circuit board tab.

9. The sensor (110) according to any of the two preceding claims, wherein the circuit board (130) is substantially rectangularly configured, wherein the projections (150) protrude from the circuit board (130) at corners of the circuit board (130).

10. The sensor (110) of any of of the preceding claims, wherein the circuit carrier (112) further has at least cooling elements.

11. The sensor (110) according to , wherein the control and evaluation circuit (114) has at least integrated circuits (146), wherein at least milled sections (154) are introduced on the circuit carrier (112) between the temperature sensor (148) and the integrated circuits for thermal decoupling of the temperature sensor (148) from the integrated circuits (146).

Background

Different sensors for sensing at least properties of a fluid medium are known from the prior art, the fluid medium may in particular be a gas, for example air, and the sensors may in particular be used in the intake and/or exhaust line sections of an internal combustion engine, however other fields of application are also possible.

Thus, for example, DE 102013224831 a1 discloses sensor arrangements for determining at least flow characteristics of a flowing fluid medium, having at least sensors for determining flow characteristics, having at least hot-wire measuring elements, wherein the hot-wire measuring elements have at least carrier elements, the sensor arrangement being configured such that the carrier elements project into the fluid medium, the carrier elements having at least indentations, which are spanned by at least hot wires.

Without limiting the other possible configurations, the invention is described below with reference to a so-called hot film air mass meter, as manufactured by robert bosch limited: sensoren im Kraffrifzeug, Konrad Reif, second edition, page 146- & 148. In principle, however, other configurations are also possible.

In such hot film air mass meters, the sensor chip is usually bonded to a sensor carrier, which forms a unit together with a base plate of the control and evaluation circuit, which is additionally bonded to the base plate.

However, a technical challenge of known sensors of the type mentioned is that, in principle, in addition to the actual measured values of the sensor elements, temperature must often be sensed as an edge condition, since the flow behavior can be temperature-dependent in particular. For this purpose, for example, so-called NTC temperature sensors, i.e. temperature sensors on a semiconductor substrate having a negative temperature coefficient, can be used. However, the technical challenge here is, in particular, that the temperature sensor is electrically coupled to the control and evaluation circuit without causing a thermal coupling between the temperature sensor and the control and evaluation circuit, which distorts the temperature measurement by the temperature sensor due to the waste heat of the control and evaluation circuit.

Disclosure of Invention

Accordingly, sensors for sensing at least characteristics of a fluid medium are proposed.

The sensor comprises at least sensor elements and at least circuit carriers with at least control and evaluation circuits, the sensor elements being understood as meaning in general terms elements, in particular monolithic elements, which can sense at least measurement variables, the sensor elements in particular comprising at least sensor chips, the circuit carriers being understood as meaning in general terms devices which can carry at least circuits within the framework of the invention, the circuit carriers being able in particular to be of plate-like design, preferably of circuit board design, the circuit carriers accordingly being able, for example, to be of planar circuit board, for example made of fiber-reinforced plastic and/or ceramic material, however, in principle other designs are also possible.

The circuit carrier has at least projections, wherein at least temperature sensors are applied to the projections, the temperature sensors can in particular comprise at least temperature-sensitive resistors, preferably resistors with a Negative Temperature Coefficient (NTC). The projections are generally understood to be regions of the circuit carrier which project from other planes of the circuit carrier or from other linearly running edges of the circuit carrier.

The sensor may in particular have a sensor housing. A sensor housing is generally understood here to mean an element or a device which substantially closes the sensor to the outside and/or gives the sensor mechanical stability. The sensor housing can in particular be produced completely or partially from plastic and/or from a metallic material.

The sensor housing can have, in particular, at least flow channels, the flow channels being understood here as channels or channel sections which are formed within the housing and through which a fluid medium can flow, the housing can have, for example, at least inlets and at least outlets, the inlets and outlets being connected by flow channels.

The temperature sensor can be designed in particular as an SMD component. The temperature sensor may be designed, in particular, as a resistor with a Negative Temperature Coefficient (NTC), for example as an NTC in an SMD design.

The sensor element can in particular comprise at least sensor chips and/or can be designed completely or partially as a sensor chip, the sensor element can in particular have at least measuring surfaces with at least heating elements arranged on the measuring surfaces and at least two temperature probes arranged on the measuring surfaces, the sensor chip can in particular be a hot-film air mass meter sensor chip, wherein the asymmetry generated in the temperature profile generated by means of the heating elements as a result of the air mass flow is sensed by means of the two temperature probes, as has already been explained above, the sensor can in particular be designed as an insertion probe, the sensor can in particular be designed as a hot-film air mass meter, the temperature sensor can in particular be electrically connected to a control and evaluation circuit, the control and evaluation circuit can in particular be designed to take into account at least temperature signals of the temperature sensor when evaluating at least signals of the sensor element, the control and evaluation circuit can thus be designed, for example, to carry out at least temperature corrections in at least signals of the sensor element.

The circuit carrier can be designed in particular as a circuit board. The projection can be designed in particular as a circuit board tab projecting from the circuit carrier. The circuit board may in particular have a substantially rectangular configuration, wherein the projections project from the circuit board at the corners of the circuit board.

The circuit carrier can in particular also have at least cooling elements, the cooling elements can in particular be arranged in the region of the temperature sensor, for example at a distance of not more than 20mm, preferably not more than 10mm, relative to the temperature sensor, and the cooling elements can have for example at least cooling ribs.

As already explained above, the control and evaluation circuit may have at least integrated circuits, in particular at least asics for the further -step decoupling between the integrated circuit which normally generates waste heat and the temperature sensor, a further thermal decoupling measure may be provided between the temperature sensor and the integrated circuit, in particular at least milled sections may be introduced on the circuit carrier between the temperature sensor and the integrated circuit for thermally decoupling the temperature sensor from the integrated circuit, for example at least slots and/or at least asics may be provided grooves are milled into the upper and/or lower side of the circuit board, so that in particular at least milled webs can be formed

The sensor according to the invention has several advantages compared to known sensors of the mentioned type. The measures mentioned make it possible in particular to produce a good thermal decoupling between the temperature sensor and a possible heat source in the control and evaluation circuit. As a result, temperature measurements which are as precise as possible and short response times can generally be achieved. The invention makes it possible in particular to decouple a temperature sensor in the form of an NTC, shown in the SMD design, which is mounted on the circuit board electronics of the hot-film air mass meter, well relative to the remaining circuit board. This minimizes the self-heating effect of the thermal film air mass meter electronics. Therefore, the invention can realize higher measurement precision and short response time when the temperature is suddenly changed. By using an NTC in the form of an SMD design on the circuit board of the hot-film air-mass meter, the temperature sensor can be connected to the evaluation circuit in a cost-effective manner.

The use of temperature sensors in the form of SMD constructions, in particular NTCs, is generally more cost-effective than NTCs using wiring. Furthermore, by integrating the temperature sensor into the control and evaluation circuit, the sensor housing can be configured cost-effectively, since no separate installation space for the temperature sensor in the sensor housing is necessary, and since no separate joining of the temperature sensor to the control and evaluation circuit, for example by means of an expensive soldering method, has to be carried out. In particular, a conductor comb for connecting the temperature sensor to the control and evaluation circuit can be dispensed with.

Furthermore, production costs can generally be reduced, since the application of the temperature sensor to the circuit carrier by means of conventional methods can be carried out, for example, simultaneously with further electronic components. This makes it possible, for example, to use an assembly of SMD-NTC parts and a reflow soldering method instead of expensive individual production. In conventional hot-film air-mass meters, the self-heating of the circuit board can be, for example, up to 15K, depending on the variant. By the described measures for thermal decoupling, the heating effect at the location of the temperature sensor, for example the NTC, can be reduced and the measurement accuracy and dynamic performance of the sensor can thereby be improved.

In addition to the thermal decoupling of the temperature sensor, it is also possible to dissipate the heat present or generated in the region of the temperature sensor by means of additional, for example , or a plurality of cooling ribs.

Drawings

Further details and optional features of the invention will be derived from the following description of preferred embodiments shown in the drawings.

In the drawings:

FIG. 1 shows an exploded view of a possible embodiment of a sensor for sensing at least properties of a fluid medium according to the invention, and

fig. 2A and 2B show two possible embodiments of a circuit carrier for use in a sensor according to the invention in perspective view.

Detailed Description

Fig. 1 shows an exemplary embodiment of a sensor 110 according to the invention for sensing at least properties of a fluid medium 110, fig. 2A and 2B below show a circuit carrier 112 with a control and evaluation circuit 114, which can be used, for example, in the sensor 110 according to fig. 1, below describes these figures.

In the embodiment shown in FIG. 1, the sensor 110 includes a sensor housing 116 having a flow passage 118. The fluid medium can enter the flow channel 118 through an inflow opening 120 (also referred to as an inlet), flow through the flow channel and then exit again through an outflow opening 122 (also referred to as an outlet). The sensor 110 may be designed in particular as a plug-in probe 124 as a whole and may be inserted, for example, into a flow tube through which a fluid medium flows. The inflow opening 120 is directed, for example, against the flow of the fluid medium. The flow channel 118 may be closed, for example, by a flow channel cover 126.

Furthermore, an electronics compartment 128 is formed in the sensor housing 116, in which the circuit carrier 112 with the control and evaluation circuit 114 applied thereto is received, the circuit carrier 112 being formed, for example, as a circuit board 130, which is adhesively bonded to a substrate, such as a base plate 132, a sensor carrier 134, for example, made of plastic, is connected to the base plate 132, which sensor carrier projects, for example, in the form of a small fin (Fl ü gelchen), from the electronics compartment 128 into the flow channel 118, a sensor element 136, which sensor element can be formed, for example, in the form of a hot-film air mass meter sensor chip, is applied to the sensor carrier 134, which sensor element can have, for example, a measuring surface through which the fluid medium in the flow channel 118 flows, which measuring surface has at least heating elements and at least two temperature probes, which are arranged, for example, symmetrically with respect to the heating elements, the sensor element 136 can be connected, for example, by wire bonding, to the circuit board 130.

The circuit carrier 112 can be connected, for example, via a conductor comb 138 to a plug 140, via which electrical contact can be made with the sensor 110. In operation, the electronics compartment 128 may also be enclosed by an electronics compartment cover 142.

Fig. 2A shows a perspective view of an th possible configuration of the circuit carrier 112 with the control and evaluation circuit 114, it being possible to see here that the circuit carrier 112, which may be designed, for example, as a substantially rectangular printed circuit board 130, may be equipped, for example, with a plurality of electronic components 144, in particular at least integrated circuits 146, preferably at least application-specific integrated circuits (ASICs), which electronic components 144 and in particular the integrated circuits 146 may generate waste heat.

The sensor 110 furthermore has at least temperature sensors 148, which can be designed as an SMD ntc, for example, which are not integrated at any point in the sensor housing 116 and are connected to the control and evaluation circuit 114 in a complex and expensive manner, but are applied directly to the circuit carrier 112, however, in order to ensure thermal decoupling between the temperature sensors 148 and the remaining control and evaluation circuit 114 (to which the temperature sensors 148 can be electrically connected), the circuit carrier 112 has a projection 150, which projection 150 can project from the circuit board 130, for example, at an edge 152, the temperature sensors 148 can be applied to the projection 150, for example, by SMD technology, wherein the projection 150 can be designed as a narrow circuit board tab, for example, which is preferably connected to the circuit board 130 only by a small surface and is therefore decoupled as thermally as possible from the circuit board.

In fig. 2B, a further exemplary embodiments of the circuit carrier 112 are shown, which exemplary embodiments show an embodiment according to fig. 2A, which exemplary embodiments show that additional features and measures can be provided for the thermal decoupling of the temperature sensor 148 and the control and evaluation circuit 114, in addition to the configuration of the circuit carrier 112 with the projections 150, for example in the form of circuit board tabs and/or circuit board tongues, for example, or more cooling ribs (not shown) can be provided, alternatively or additionally, a milling 154 can be introduced into the circuit board 130, which can be used for additional thermal decoupling of the temperature sensor 148 from the integrated circuit 146.