阅读说明：本技术 基板边缘测试装置、系统和方法 (Substrate edge testing device, system and method ) 是由 黄成赞 郑址和 金泰皓 宋素瑛 于 2018-04-18 设计创作，主要内容包括：一种用于测试基板的边缘部的装置,包括：第一照明源,被配置为将光照射到基板的边缘部的端部；第二照明源,被配置为将光照射到边缘部的下部；第三照明源,被配置为将光照射到边缘部的上部；以及第一、第二和第三拍摄部分,分别对应于第一、第二和第三照明源,其中第一照明源包括C形横截面并包括面对边缘部的端部的第一弯曲表面,第二照明源包括半C形横截面并且包括面对边缘部的下部的第二弯曲表面,且第三照明源包括半C形横截面并且包括面对边缘部的上部的第三弯曲表面。(an apparatus for testing an edge portion of a substrate includes a illumination source configured to irradiate light to an end portion of the edge portion of the substrate, a second illumination source configured to irradiate light to a lower portion of the edge portion, a third illumination source configured to irradiate light to an upper portion of the edge portion, and , second and third photographing portions corresponding to the , second and third illumination sources, respectively, wherein the th illumination source includes a C-shaped cross section and includes a th curved surface facing the end portion of the edge portion, the second illumination source includes a half C-shaped cross section and includes a second curved surface facing the lower portion of the edge portion, and the third illumination source includes a half C-shaped cross section and includes a third curved surface facing the upper portion of the edge portion.)

an apparatus for testing an edge portion of a substrate, the apparatus comprising:

an th illumination source configured to irradiate light to an end of the edge portion of the substrate;

a second illumination source configured to irradiate light to a lower portion of the edge portion;

a third illumination source configured to irradiate light to an upper portion of the edge portion; and

th photographing part, second photographing part and third photographing part corresponding to the th illumination source, the second illumination source and the third illumination source, respectively,

wherein the illumination source includes a C-shaped cross-section and includes a curved surface facing the end of the rim portion, the second illumination source includes a half C-shaped cross-section and includes a second curved surface facing the lower portion of the rim portion, and the third illumination source includes a half C-shaped cross-section and includes a third curved surface facing the upper portion of the rim portion.

2. The apparatus of claim 1, wherein the illumination source, the second illumination source, and the third illumination source are spaced apart from each other, arranged along directions, and configured to travel in the directions.

3. The apparatus of claim 1, further comprising:

a th reflective part corresponding to the th photographing part and a second reflective part corresponding to the second photographing part.

4. The apparatus of claim 1, wherein the th shot portion, the second shot portion, and the third shot portion are spaced apart from each other, arranged along directions, and configured to travel in the directions.

5. The apparatus of claim 1, wherein each of the profile of the second curved surface and the profile of the third curved surface comprises portions of at least of a circle, an ellipse, a parabola, or a hyperbola.

6. The apparatus of claim 1, wherein the second illumination source and the third illumination source are symmetric with respect to each other with respect to the substrate.

7. The apparatus of claim 1, wherein the illumination source comprises a plurality of light sources arranged along the curved surface.

8. The apparatus of claim 7, wherein the plurality of light sources are arranged such that a distance between adjacent light sources in each pair of the plurality of light sources along the th curved surface is substantially the same.

9. The apparatus of claim 1, wherein the second illumination source and the third illumination source comprise a plurality of light sources arranged along the second curved surface and the third curved surface, respectively.

10. The apparatus of claim 9, wherein the plurality of light sources are arranged such that distances between the plurality of light sources along the second curved surface and the third curved surface are substantially the same.

11, a system for testing an edge portion of a substrate, the system comprising:

an th photographing part configured to generate a th image by photographing an end of the edge portion of the substrate;

a second photographing section configured to generate a second image by photographing a lower portion of the edge portion;

a third photographing section configured to generate a third image by photographing an upper portion of the edge portion;

an th, second and third illumination sources sequentially corresponding to the th, second and third photographing parts, respectively, and configured to provide light having uniform illuminance, and

a test data analysis unit configured to collect the th image, the second image and the third image,

wherein the second illumination source is semi-C shaped and includes a second curved surface facing the lower portion of the edge portion, and the third illumination source is semi-C shaped and includes a third curved surface facing the upper portion of the edge portion.

12. The system of claim 11, wherein the th shot portion, the second shot portion, and the third shot portion are substantially parallel to each other.

13. The system of claim 11, further comprising:

a th reflective part corresponding to the th photographing part and a plurality of second reflective parts corresponding to the second photographing part.

14. The system of claim 11, wherein the illumination source is C-shaped and includes a th curved surface facing the end of the rim portion.

15. The system according to claim 11, wherein the th photographing part, the second photographing part, and the third photographing part are arranged along an extending direction of the edge part.

16. The system according to claim 11, wherein the test data analysis unit acquires a whole image after synchronizing the position of the start point of the edge portion on the th image, the second image, and the third image, or after correcting the th image, the second image, and the third image based on the difference between the physical positions of the th photographed portion, the second photographed portion, and the third photographed portion.

A method of testing an edge portion of a substrate of the variety 17, , the method comprising:

generating a th image by irradiating light having uniform illuminance to an end portion of the edge portion of a substrate, which is chamfered, and by photographing the end portion using an th photographing part;

generating a second image by irradiating light having uniform illuminance to a lower portion of the edge portion and by photographing the lower portion using a second photographing part;

generating a third image by irradiating light having uniform illuminance to an upper portion of the edge portion and by photographing the upper portion using a third photographing part;

evaluating a quality of the edge portion of the substrate based on the th image, the second image, and the third image,

wherein evaluating the quality of the edge portion in the substrate based on the th image, the second image, and the third image comprises:

summing a th area of at least defect areas included in sets of reference lines, wherein the th reference line is a predetermined reference line on the th image;

summing a second area of at least defect areas included within sets of second reference lines, wherein the second reference lines are predetermined reference lines on the second image;

summing a third area of at least fracture defect areas included in sets of third reference lines, wherein the third reference lines are predetermined reference lines on the third image, and

dividing the sum of the th area, the second area, and the third area by the area of the edge portion.

18. The method of claim 17, wherein the acquiring of the th image, the acquiring of the second image, and the acquiring of the third image are performed substantially simultaneously, and the th image, the second image, and the third image acquired substantially simultaneously correspond to different points on the edge portion.

19. The method of claim 17, further comprising:

generating a whole image by collecting the th image, the second image and the third image.

20. The method of claim 19, wherein the acquiring of the whole image includes acquiring the whole image by synchronizing positions of start points of the edge portions on the th image, the second image, and the third image, or by correcting positions of the th image, the second image, and the third image based on differences among positions of the th photographed portion, the second photographed portion, and the third photographed portion.

Technical Field

The present disclosure relates to a substrate edge testing apparatus, system, and method, and more particularly, to a substrate edge testing apparatus, system, and method for testing defects present in an edge portion of a substrate.

Background

A glass substrate used in a flat panel display such as a thin film transistor liquid crystal display (TFT-LCD), a Plasma Display Panel (PDP), an Electro Luminescence (EL) display, etc. is manufactured through a forming process during which glass melted in a glass melting furnace is formed into a flat plate, the glass is cut according to a predetermined standard in the cutting process, and then the cut glass is moved to a processing station for further processing .

Disclosure of Invention

One or more embodiments of of the present disclosure provide an apparatus for testing an edge portion of a substrate, the apparatus including a th illumination source configured to irradiate light to an end portion of the edge portion of the substrate, a second illumination source configured to irradiate light to a lower portion of the edge portion, a third illumination source configured to irradiate light to an upper portion of the edge portion, and th, second, and third photographing portions corresponding to th, second, and third illumination sources, respectively, wherein the th illumination source includes a C-shaped cross-section and includes a th curved surface facing the end portion of the edge portion, the second illumination source includes a half-C-shaped cross-section and includes a second curved surface facing the lower portion of the edge portion, and the third illumination source includes a half-C-shaped cross-section and includes a third curved surface facing the upper portion of the edge portion.

or more embodiments of the present disclosure provide systems for testing an edge portion of a substrate, the systems including a th photographing part configured to generate a th image by photographing an end portion of the edge portion of the substrate, a second photographing part configured to generate a second image by photographing a lower portion of the edge portion, a third photographing part configured to generate a third image by photographing an upper portion of the edge portion, th, second and third illumination sources sequentially corresponding to th, second and third photographing parts, respectively, and configured to provide light having uniform illuminance, and a test data analysis unit configured to collect th, second and third images, wherein the second illumination source is semi-C-shaped and includes a second curved surface facing the lower portion of the edge portion, and the third illumination source is semi-C-shaped and includes a third curved surface facing the upper portion of the edge portion.

One or more embodiments of the present disclosure provide substrate edge testing methods including generating a image by irradiating light having uniform illuminance to an end portion of an edge portion of a substrate and photographing the end portion by using a th photographing part, wherein the edge portion of the substrate is chamfered, generating a second image by irradiating light having uniform illuminance to a lower portion of the edge portion and photographing the lower portion by using a second photographing part, generating a third image by irradiating light having uniform illuminance to an upper portion of the edge portion and photographing the upper portion by using a third photographing part, evaluating quality of the edge portion of the substrate based on , and third images, wherein evaluating quality of the edge portion in the substrate based on , the second and the third images includes summing areas of at least 6 defect areas included in a group of 5 reference lines, wherein the reference line is a predetermined reference line on images, summing a third area of at least 4637 defect areas included in a group of second reference lines, wherein the third area is a predetermined reference line on 39 and wherein the third area is a predetermined reference line on and wherein the third area is a predetermined reference line on 3638 and wherein the third area is a sum of the third reference line.

Additional features and advantages of the embodiments disclosed herein will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments as disclosed herein, including the detailed description which follows, the claims, as well as the appended drawings.

It is to be understood that the embodiments presented in the general description of above and the detailed description below are intended to provide an overview or framework for understanding the nature and character of the claimed embodiments, the drawings are included to provide a further understanding of the specification , are incorporated into and constitute a part of this specification , illustrate various embodiments of the disclosure, and together with the description serve to explain the principles and operations thereof.

Drawings

FIG. 1 is a block diagram of a substrate edge testing system according to an exemplary embodiment;

FIG. 2 is a schematic diagram of a chamfering apparatus that may be included in a substrate edge testing system in accordance with an exemplary embodiment;

FIG. 3 is a cross-sectional view illustrating an edge of a chamfered substrate according to an example embodiment;

FIGS. 4A-4C are perspective, side, and layout views, respectively, of an optical system that may be included in a substrate edge testing apparatus according to an example embodiment;

fig. 5A through 5C are cross-sectional views illustrating an illumination source that may be included in a substrate edge testing apparatus according to an example embodiment;

FIG. 6 is a schematic diagram illustrating an optical system that may be included in a substrate edge testing apparatus in accordance with an example embodiment;

FIG. 7 is a flow chart illustrating a method of substrate edge testing according to an exemplary embodiment;

FIG. 8 is a diagram of an image of an edge of a substrate generated according to a substrate edge testing method, according to an example embodiment; and

fig. 9 is a graph for illustrating effects of the substrate edge testing apparatus, system, and method according to example embodiments.

Detailed Description

Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. On the drawings, like reference numerals denote like elements, and a repetitive description thereof will be omitted.

Fig. 1 is a block diagram of a substrate edge testing system 1000 according to an example embodiment.

Referring to fig. 1, the substrate edge testing system 1000 may include a testing module 1030 and a testing processor 1040.

According to an exemplary embodiment, the substrate processing system 1010 may include a plurality of stations for producing the substrate 1. For example, the substrate processing system 1010 may include various processing stations, such as a melt processing station, a shape processing station, a cut processing station, a chamfer processing station, a polish processing station, and the like. However, the present disclosure is not limited thereto, and the substrate processing system 1010 may further include a cleaning process station, a film deposition process station, a photolithography process station, an etching process station, a peeling process station, and the like. The substrate processing system 1010 may produce the substrate 1 and provide the substrate 1 to the transport unit 1050.

The process controller 1020 may control the substrate processing system 1010. The process controller 1020 may be a computing device such as a workstation computer, desktop computer, laptop computer, tablet computer, or the like. The process controller 1020 may store software for performing various functions such as receiving feedback regarding the process, receiving test data, adjusting the process, etc.

According to an exemplary embodiment, the substrate 1 may be a glass substrate. In this case, the substrate 1 may be used to manufacture a flat panel display such as a thin film transistor-liquid crystal display (TFT-LCD), a Plasma Display Panel (PDP), an Electroluminescence (EL) display, and the like.

The transport unit 1050 may be a transport system that may transport the substrate 1 produced by the substrate processing system 1010. The transport unit 1050 may include a conveyor system or the like. The transport unit 1050 may provide the substrate 1 to the test module 1030.

Test module 1030 may include or more test stations capable of performing various tests on substrate 1. substrate 1 may be loaded onto each test station according to an example embodiment, test module 1030 may perform a test for checking whether substrate 1 includes a defect.

The test module 1030 may include a substrate edge test apparatus. The test module 1030 may inspect for defects that may have occurred during chamfering, such as non-chamfering, excessive chamfering, burning, chipping, cracking, and the like. Test module 1030 may inspect for defects in the edge of the substrate, the upper surface of the substrate, and/or the lower surface of the substrate.

The test processor 1040 may include a test data analysis unit 1041 that analyzes test data transmitted from the test module 1030 and a test controller 1045 that controls the test module.

According to an exemplary embodiment, the test data analysis unit 1041 may compare the degree of defect occurrence with a reference value or a threshold value based on the test data according to an exemplary embodiment, the comparison may be performed by a lookup function with respect to data stored in the substrate edge testing system 1000 and/or a comparison with offline data the test data analysis unit 1041 may collect data from , second and third photographing parts 200a, 200b and 200c (see FIG. 4), which will be described later, to generate , second and third images E1, E2 and E3 (see FIG. 8), the , second and third images E1, E2 and E3 being images of an end portion 1a (see FIG. 3) of the edge portion, a lower portion 1b (see FIG. 3) of the edge portion and an upper portion 1c (see FIG. 3) of the edge portion, respectively.

The test data analysis unit 1041 may provide analysis data (obtained by analyzing the test data) to the process controller 1020. The process controller 1020 may send a feedback signal to the substrate processing system 1010 based on the analysis data. Based on the feedback signal, the substrate processing system 1010 may adjust and/or select a process to be performed.

The feedback signals may affect various elements used in performing and/or selecting substrate processing, for example, test data analyzed by the test data analysis unit 1041 may be provided to the process controller 1020.

For example, test controller 1045 may be a computing device, such as a workstation computer, desktop computer, laptop computer, tablet computer, etc., that includes or more software products capable of controlling the operation of test module 1030.

The substrate edge testing system 1000 may perform tests on substrates 1 having various sizes and purposes. For example, the substrate edge testing system 1000 may perform testing on a glass substrate.

FIG. 2 is a schematic diagram of a chamfering apparatus that may be included in a substrate edge testing system, according to an example embodiment. Fig. 3 is a sectional view illustrating an edge of a chamfered substrate according to an exemplary embodiment.

Referring to fig. 2 and 3, the chamfering apparatus may include an th stage (stage)10, a second stage 20, and a third stage 30. a straight arrow indicates a moving direction of the substrate 1, and a curved arrow indicates rotation of the substrate 1. the substrate 1 may be conveyed by a conveying unit such as a conveyor.

The substrate 1 may be loaded on the th stage 10 by a transportation unit, the substrate 1 may have edge portions 1e corresponding to edges or four sides of a rectangle, respectively the substrate 1 may extend in a th direction (x direction) parallel to an upper surface of the substrate 1 and a second direction (y direction) parallel to the upper surface and intersecting with a th direction (x direction), the th direction (x direction) and the second direction (y direction) may be substantially perpendicular, but is not limited thereto, two of the four edge portions 1e may extend substantially parallel to a th direction (x direction), the other two edge portions 1e of the four edge portions 1e may extend substantially parallel to the second direction (y direction), unless otherwise stated, the extending direction of the edge portions 1e and the definition of the first direction and the second direction (x direction, y direction) as the extending direction of the substrate are the same as above, the th stage 10 may include th wheels and th wheels 865 12, the chamfering wheels 387 may perform chamfering or chamfering procedures on the substrate 1e to reduce the roughness of the edge portions 387 1 when the polishing wheels 12, the edge portions of the substrate 1 may be chamfered , the chamfering wheels , 3612 may perform chamfering or the chamfering process of polishing wheel .

The chamfering process is a process of rounding the edge portion 1e of the glass substrate so as to prevent the edge portion 1e from being easily damaged by external impact or the like. When the chamfering process is performed, as shown in fig. 3, each edge portion 1e of the substrate 1 includes an end portion 1a, a lower portion 1b, and an upper portion 1 c.

The lower 1b and upper 1c portions of the edge portion 1e may be changed according to the arrangement of the substrate 1 with respect to space (e.g., the arrangement of the substrate 1 with respect to the ground), in particular, when of the th direction (x direction) and the second direction (x direction) (i.e., the direction in which the substrate extends substantially) are substantially perpendicular to the ground, the lower 1b and upper 1c portions may be disposed on the left and right sides, respectively, with respect to the end 1a of the edge portion 1e, as viewed from an observer standing vertically on the ground, as in this specification, when the th direction (x direction) and the second direction (x direction) (i.e., the direction in which the substrate extends substantially) are parallel to the ground, the lower 1b and upper 1c portions of the edge portion 1e may be disposed on the upper and lower sides, with respect to the end 1a of the edge portion 1e, with respect to the upper surface 861 c, as opposed to the upper surface of the chamfering wheel 365, and the chamfering wheel 72 c, and the upper surface of the chamfering wheel 72 e may be disposed at the same time as the chamfering wheel 14 c2, and the chamfering wheel 14 c, and the chamfering wheel 72 c may be disposed on the upper surface of the polishing wheel 72 e, after the polishing wheel 72 c polishing wheel 14 c, and the polishing wheel 72 c, as the polishing wheel 14 c, as the polishing wheel 72 c, and the polishing wheel 72 c may be disposed on the polishing wheel 72 c, as opposed to be disposed at the same time, as the same time as the upper corner of the polishing wheel 12, as the polishing wheel 14 as the polishing wheel 12, as the polishing wheel 14 c2, as the polishing wheel 14 c2, as the polishing wheel 14, as the polishing wheel 12, as the polishing wheel 14 c, as the polishing wheel 14.

The second table 20 may rotate the substrate 1. the second table 20 may, for example, rotate the substrate 1 by an angle of about 90 deg. thus, the other edge portions 1e of the substrate 1 may be chamfered and polished.

The third station 30 may include a second chamfering wheel 31 and a second polishing wheel 32. an edge portion 1e that has not been chamfered and polished on the th station 10 may be chamfered and polished on the third station 30. like the th station 10 , the third station 30 may include the second chamfering wheel 31 and the second polishing wheel 32 in two separate rows so that two facing edge portions 1e may be chamfered and polished at the same time. referring to fig. 2, the third station 30 is shown to have four second chamfering wheels 31 and six second polishing wheels 32, but is not limited thereto.

If the substrate 1 is substantially rectangular, the length of pairs of two facing edge portions 1e and the length of pairs of two facing edge portions 1e may be different from each other however, example embodiments are not limited thereto, and the lengths of four edge portions 1e may be substantially equal to each other if the substrate 1 has a substantially square shape.

FIG. 4A is a perspective view of an optical system that may be included in a substrate edge testing apparatus according to an example embodiment, FIG. 4B is a side view of an optical system that may be included in a substrate edge testing apparatus according to an example embodiment, FIG. 4C is a layout illustrating the relative arrangement of an th illumination source and a substrate, FIGS. 5A-5C are cross-sectional views illustrating illumination sources that may be included in a substrate edge testing apparatus according to an example embodiment.

Referring to fig. 3 to 5C, the substrate edge testing apparatus may include th, second and third illumination sources 100a, 100b and 100C, and th, second and third photographing parts 200a, 200b and 200C the substrate edge testing apparatus may further include a th reflecting unit 151 and a plurality of second reflecting units 152.

The th illumination source 100a may correspond to the th reflection unit 151 and the th photographing part 200 a. the th illumination source 100a may irradiate light of uniform illuminance to the end portion 1a of the edge portion 1 e. the th illumination source 100a may irradiate light of uniform illuminance to the entire edge portion 1 e. light irradiated from the th illumination source 100a is reflected by the end portion 1a of the edge portion 1e, and thereafter, may reach the th photographing part 200a via the reflection unit 151. the end portion 1a and/or the edge portion 1e are irradiated with light of uniform illuminance means that energy per unit area of light irradiated to the end portion 1a and/or the edge portion 1e is substantially the same throughout the end portion 1a and/or the edge portion 1 e.

The second illumination source 100b may correspond to the plurality of second reflection units 152 and the second photographing part 200 b. The second illumination source 100b may irradiate light of uniform illuminance to the lower portion 1b of the edge portion 1 e. The light irradiated from the second illumination source 100b is reflected by the lower portion 1b of the edge portion 1e, and thereafter, may reach the second photographing part 200b via the plurality of second reflecting units 152.

The third illumination source 100c may correspond to the third photographing section 200 c. The third illumination source 100c may irradiate light of uniform illuminance to the upper portion 1c of the edge portion 1 e. The light irradiated from the third illumination source 100c is reflected by the upper portion 1c of the edge portion 1e, and then, may reach the third photographing portion 200 c.

, second and third illumination sources 100a, 100b and 100c may be spaced apart from each other and arranged in a predetermined direction As will be described later, a substrate edge testing apparatus may inspect an edge portion 1e of a substrate 1 while traveling in a predetermined direction, , second and third illumination sources 100a, 100b and 100c may be spaced apart from each other and arranged in a direction substantially parallel to a traveling direction of the substrate edge testing apparatus, an extending direction of the edge portion of the substrate 1 loaded on the substrate edge testing apparatus may be substantially parallel to the traveling direction of the substrate edge testing apparatus, , second and third illumination sources 100a, 100b and 100c may be spaced apart from each other and arranged in an extending direction of the edge portion 1e after the edge portion is loaded, the extending direction of the edge portion 1e of the substrate 1 may be the direction (x direction) and/or the second direction (y direction) described with reference to FIG. 2.

The th, second and third photographing sections 200a, 200b and 200c may be spaced apart from each other and arranged in a direction substantially parallel to a traveling direction of the substrate edge testing apparatus the th, second and third illumination sources 100a, 100b and 100c may be spaced apart from each other and arranged in an extending direction of the edge portion 1e after the edge portion is loaded, in an exemplary embodiment, the substrate edge testing apparatus may simultaneously test an end portion 1a, a lower portion 1b and an upper portion 1c of the edge portion 1e, the th, second and third illumination sources 100a, 100b and 100c and the th, second and third photographing sections 200a, 200b and 200c may capture an image of the edge portion 1e while traveling from the end portion to other portions in the extending direction of the edge portion 1 e.

As shown in FIG. 5A, the th illumination source 100a may be C-shaped in cross-section, and the th illumination source 100a includes portions of at least of a th curved surface 100 ar. an th curved surface 100ar facing an end 1a of an edge portion 1e, but is not limited thereto. th curved surface 100ar may have a similar profile to the edge portion 1 e. th curved surface 100ar may have substantially the same profile as the edge portion 1 e. th illumination source 100a may include a plurality of th light sources 110a arranged in rows and columns along the th curved surface 100 ar.the plurality of th light sources 110a may be uniformly distributed along the th curved surface 100 ar.the plurality of th light sources 110a may be arranged such that the spacing between adjacent th light sources 110a along the th curved surface 100ar is substantially equal to each other.the plurality of th light sources 110a may be arranged such that the light sources may be uniformly illuminated over the entire edge portion of LEDs 631 a, but is not limited to the light sources 110a may be arranged such that the edge portion of the LED may be uniformly illuminated by the light sources 638.

The center angle θ 1, which is a center angle of the th illumination source 100a, may be about 180 ° or more, but is not limited thereto, indicates an angle between a straight line connecting an end point e1 of the th illumination source 100a adjacent to the substrate 1 to a center point and a straight line connecting another end points e2 of the th illumination source 100a adjacent to the substrate 1 to the center point, when the center angle θ 1 is equal to or greater than about 180 °, light may be uniformly irradiated to the entire edge portion 1e even in a case where an angle between an upper surface and/or a lower surface of the substrate and a tangent line of a contour of the edge portion 1e is equal to or greater than a predetermined angle, the th illumination source 100a may further include a light diffuser for irradiating light of uniform illuminance at step.

Referring to fig. 4C, the th illumination source 100a may be inclined toward the extending direction of the edge portion by an angle θ of , and thus, light irradiated from the th illumination source 100a is reflected by the end 1a of the edge portion 1E and the th reflection unit 151 and reaches the th photographing part 200a the th photographing part 200a may generate an th image E1 (see fig. 8) and transmit a th image E1 to the test data analysis unit 1041, the th image E1 being an image of the end 1a of the edge portion 1E.

As shown in FIG. 5B, the cross-section of the second illumination source 100B may be semi-C-shaped, with the second curved surface 100 br. facing the lower portion of the rim portion 1e as shown in FIG. 5C, the cross-section of the third illumination source 100C may be semi-C-shaped, with the third curved surface 100 cr., the second curved surface 100br and the third curved surface 100cr having an upper portion facing the rim portion 1e may include at least portions of a circle, an ellipse, a parabola and a hyperbola, respectively, but is not limited thereto, the second and third curved surfaces 100br and 100cr may have a similar profile to the portion of the rim portion 1e, the second and third curved surfaces 100br and 100cr may have substantially the same profile as the portion of the rim portion 1e, i.e., the profiles of the second and third curved surfaces 100br and 100cr may be substantially equal to the profile of the portion of the rim portion 1 e. the second and the third curved surface 100br and 100cr may include a curved line of light sources 351B and 100C, respectively, which may be arranged substantially equal to the light source 100B, i.e. the curved surface 100B and 100C may be arranged along the curved light sources 100B and 100C may be arranged substantially equal to each other, even though the curved surface 100C may be arranged along the curved, the curved surface 100B may be arranged substantially equal to the curved, i.e. the curved surface 100B may include a curved light source 100B and 100C may be arranged substantially equal to the curved surface 100C may be arranged along the curved edge portion of the edge 1 e.e.e.e.e.e.e. the edge 1B and 100B may be arranged between the edge 1C may include a curved edge 1B and 100C, i.e. the edge 1C, and the edge 1C may be arranged substantially equal to be arranged such that the light source 100C may be arranged substantially aligned on the edge 1C, and the light source 100B may be arranged on the edge 1C, and the light source 100B may be arranged substantially aligned on the light source 100C, and the edge 1C, and the light source 100C may be arranged substantially aligned on the light source 100C, and the light.

The light irradiated from the second illumination source 100b may be reflected by the lower portion 1b of the edge portion 1e and the plurality of second reflection units 152 toward the second photographing part 200 b. The second photographing part 200b may generate a second image E2 (see fig. 8) and transmit the second image E2, which is an image of the lower portion 1b of the edge portion 1E, to the test data analyzing unit 1041 and the like, the second image E2.

The light irradiated from the third illumination source 100c is reflected by the upper portion 1c of the edge portion 1e, and reaches the third photographing portion 200 c. The third photographing section 200c generates a third image E3 (see fig. 8), which is an image of the upper portion 1c of the edge portion 1E, and transmits the third image E3 to the test data analysis unit 1041 or the like, the third image E3.

If the second and third illumination sources having a cross section having a C shape, not a half C shape, are used, the sharpness of an image may be reduced due to interference between light transmitted through the upper or lower surface of the substrate 1 and light reflected by the edge portion 1 e. In detail, if the image of the lower portion 1b of the edge portion 1e is captured using the second illumination source 100b having the C-shape, light transmitted through the upper surface (the upper surface is not chamfered) of the substrate 1 and light reflected by the lower portion 1b of the edge portion 1e interfere with each other. Therefore, when the second illumination source is C-shaped, a clear image of the lower portion 1b of the edge portion 1e may not be acquired due to interference between the transmitted light and the reflected light. In addition, if an image of the upper portion 1C of the edge portion 1e is captured using the third illumination source 100C having a C-shaped cross section, light transmitted through the lower surface (the lower surface is not chamfered) of the substrate 1 and light reflected by the upper portion 1C of the edge portion 1e interfere with each other. Therefore, when the third illumination source is C-shaped in cross section, a clear image of the upper portion 1C of the edge portion 1e may not be acquired due to interference between the transmitted light and the reflected light.

According to an exemplary embodiment, the second illumination source 100b may cover the lower portion 1b of the edge portion 1E. the second illumination source 100b may irradiate light such that the irradiated light reaches the lower portion 1b of the edge portion 1E, but the upper portion 1C of the edge portion 1E may not be exposed by the second illumination source 100b, but the upper portion 1C of the edge portion 1E may not be covered by the third illumination source 100C may cover the upper portion 1C of the edge portion 1E. the third illumination source 100C may irradiate light such that the irradiated light reaches the upper portion 1C of the edge portion 1E, but the lower portion 1b of the edge portion 1E may not be exposed by the third illumination source 100C, the lower portion 1b of the edge portion 1E may not be covered by the third illumination source 100℃ according to an exemplary embodiment, since the second and third illumination sources 100b and 100C of a half C shape different from the illumination source 100a of are used, the second and the third illumination sources 100b and 100C may not cover the lower portion 1E. according to an exemplary embodiment, the second and the third illumination source 100E 3 and the third image may be acquired with high resolution (see fig. 368 and 368).

Accordingly, the depth of focus can be adjusted by considering the optical paths from the , the second and third photographing parts 200a, 200b and 200c to the end 1a, the lower portion 1b and the upper portion 1c of the edge part 1 e.

To determine the depth of focus of the th, second, and third photographing sections 200a, 200b, and 200c, the distance to the edge portion 1e having a circular shape should be accurately measured, and thus, the th, second, and third photographing sections 200a, 200b, and 200c may include an Auto Focus (AF) module, the AF module of the th photographing section 200a may perform focusing based on the end 1a of the edge portion 1e, the AF modules of the second and third photographing sections 200b, 200c may perform focusing based on the lower surface and the upper surface of the substrate 1 adjacent to the edge portion 1e, respectively.

Although not shown in the drawings, the substrate edge testing apparatus may include a moving unit , second and third illumination sources 100a, 100b and 100c, and , second and third photographing parts 200a, 200b and 200c, a th reflecting unit 151, and the plurality of second reflecting units 152 may be integrally coupled to the moving unit, and thus, the substrate edge testing apparatus may simultaneously generate , second and third images E1, E2 and E3 (see FIG. 8) while moving from a end to another end of the edge part 1E.

The substrate edge testing apparatus may further include an optical microscope and a fourth illumination source corresponding to the optical microscope the fourth illumination source may include, but is not limited to, a point illumination source, a vertical illumination source, a lateral illumination source, and the like.

Fig. 6 is a schematic diagram illustrating an optical system that may be included in a substrate edge testing apparatus according to an example embodiment.

Referring to fig. 6, the th, second, and third photographing parts 200a, 200b, and 200c may directly sequentially receive light reflected from the end 1a, the lower portion 1b, and the upper portion 1c of the edge portion 1e in the substrate, and thus, the th reflecting unit 151 and the plurality of second reflecting units 152 may be omitted.

Fig. 7 is a flowchart illustrating a substrate edge testing method according to an exemplary embodiment. Fig. 8 is a diagram of an image of an edge of a substrate generated according to a substrate edge testing method, according to an example embodiment. Fig. 9 is a graph for illustrating effects of the substrate edge testing apparatus, system, and method according to example embodiments.

Referring back to fig. 1, 3, 4A, 4B, and 7 to 9, in operation P510, the substrate 1 may be loaded on a test module 1030 including a substrate edge testing apparatus according to an exemplary embodiment.

In addition, in operation P520, the substrate edge testing apparatus may test the edge portion 1e of the substrate 1. As described above, the substrate edge testing apparatus may continuously capture an image of the edge portion 1e of the substrate 1 while moving from the end of the edge portion 1e to the other end the , the second and third photographing sections 200a, 200b and 200c may be spaced apart from each other by a predetermined distance along the extending direction of the edge portion 1e, and thus, the , the second and third photographing sections 200a, 200b and 200c may capture images of different portions in the edge portion 1e at the same time point.

In addition, in operation P530, the test data analysis unit 1041 may generate an th image E1 including an image of the end 1a of the edge portion 1E, the second photographing part 200b may generate a second image E2 including an image of the lower portion 1b of the edge portion 1E, the third photographing part 200c may generate a third image E3. th including an image of the upper portion 1c of the edge portion 1E, and the second and third photographing parts 200a, 200b, and 200c may simultaneously generate , second and third images E1, E2, and E3.

If necessary, the test data analysis unit may combine , the second and third images E1, E2 and E3. so that the third E3., the second and third photographing parts 200a, 200b and 200c may capture images of different portions in the edge part 1E at the same point in time as E3., thus correcting the positional difference to combine the third E3., the second and third images E E3., E E3. and E3. in order to correct the difference, the test data analysis unit 1041 may synchronize the position of the start point of the edge part 1E among the third E3., the second and third images E E3., E E3. and E E3., that is, the first E3., the second and third images E E3., E E3. and E E3. may be synchronized with each other so that the start point of the end 1a of the edge part 1E in the image E E3., the start point of the lower part 1b of the edge part 1E in the second image E E3., and the start point of the upper part E3. E may be moved from the second E3. to the second E3., the third image E E3., so that the entire test data may be generated so that the third image E E3., the entire overlap with the third image E E3., the start point E3. and the entire third image E E3. may be removed so that the third image E E3. may be overlapped with each other.

In addition, in operation P540, the test data analysis unit 1041 may sum up areas where defects such as chipping defects may occur. Due to dispersion or interference of light, the illuminance or brightness of a portion where chipping defect may occur may be different from that of a portion where defect does not occur. The test data analysis unit 1041 may determine whether there is a defect such as a chipping defect based on the illuminance or brightness, and may calculate an area of the defect.

As described above, the th, second and third images E1, E2 and E3 may have overlapping portions in detail, the overlapping portion of the th image E1 and the second image E2 indicates that a certain position on the edge portion 1E is shown in both the th image E1 and the second image E2.

In order to remove any error caused by the overlapped portion, the test data analysis unit 1041 may sum up the area of the defect such as the chipping defect individually for every of the end portion 1a, the lower portion 1b, and the upper portion 1c of the rim portion 1E. the test data analysis unit 1041 may sum up the area of the defect included in a th reference line c1, which th reference line c1 is a predetermined reference line on a th image E1. the test data analysis unit 1041 may sum up the area of the defect included in a second reference line c2, which second reference line c2 is a predetermined reference line on a second image E2. the test data analysis unit 1041 may sum up the area of the defect included in a third reference line c3, which third reference line c3 is a predetermined reference line on a third image E3.

As shown in fig. 8, the , the second and third reference lines c1, c2 and c3 may be substantially parallel to the extending direction of the edge portion 1e the , the second and third reference lines c1, c2 and c3 may be reference lines for dividing the end portion 1a, the lower portion 1b and the upper portion 1c of the edge portion 1e based on the shape of the edge portion 1e manufactured according to a desired manufacturing process, for example, the reference line c1 may include reference lines for dividing the end portion 1a and the lower portion 1b of the edge portion 1e and reference lines for dividing the end portion 1a and the upper portion 1c of the edge portion 1e the second reference line c2 may include reference lines for dividing the lower portion 1b of the edge portion 1e and the lower surface of the substrate, and reference lines for dividing the lower portion 1b and the end portion 1a of the edge portion 1e the third reference line c3 may include reference lines for dividing the upper portion 1c of the edge portion 1e and the upper surface of the substrate, and the reference lines 461 c may correspond to the same reference lines 3624 in the end portion 461 c 465.

However, the exemplary embodiment is not limited to the above example, and the test data analysis unit 1041 may sum up the areas of the chipping defects and the like occurring on the edge portion 1e based on the whole image generated in operation P530.

In addition, in operation P550, the degree of progress of the test may be determined if portions of the edge portion of the substrate 1 are to be tested, the substrate 1 may be rotated to perform a continuous test in operation P560. the substrate 1 may be rotated by about 90, but is not limited thereto.

During the cutting process for the chamfered surface of the glass substrate, defects may occur, such as non-chamfering, excessive chamfering, burning, chipping, cracking, and the like. In particular, chipping defects occurring during chamfering may cause generation of fine particles. These fine particles may cause defective gates in post-processing, and therefore, the yield and reliability of the manufacturing process of the glass substrate may be degraded.

Fine particles generated by chipping in the edge portion may adhere to the surface of the edge portion. Since the fine particles are exposed by chemical reaction in post-processing, there is no way to inspect the chipping defect in the edge portion according to the related art. As an index indicating a defect such as a chipping defect in an edge portion, a BCD index may be defined according to the following equation 1.

That is, the BCD index is an index for measuring the occurrence of defects by measuring the ratio of an area having a chipping defect to the total area.

Accordingly, the test data analysis unit 1041 may separately calculate BCD indexes of each of the end portion 1a, the lower portion 1b, and the upper portion 1c of the rim portion 1E, for example, the test data analysis unit 1041 may calculate the BCD index of the end portion 1a of the rim portion 1E by dividing the sum of the areas of the chipping defects on the th image E1 acquired in operation P540 by the area of the rim portion 1E disposed between the th reference lines c1 on the th image E1, the test data analysis unit 1041 may calculate the BCD index of the lower portion 1b of the rim portion 1E by dividing the sum of the areas of the chipping defects on the second image E2 acquired in operation P540 by the area of the rim portion 1E disposed between the second reference lines c2 on the second image E2, the test data analysis unit 1041 may calculate the BCD index of the rim portion 1E between the third reference lines 3 c of the rim portion 1E by dividing the sum of the areas of the chipping defects on the third image E3 acquired in operation P540 by the upper reference lines 3 c of the third image E3.

However, the exemplary embodiments are not limited thereto, and the test data analysis unit 1041 may calculate a total BCD index by summing the areas of the chipping defects on the th, second and third images E1, E2 and E3 acquired in operation P540 and dividing the summed area by the area of the margin portion 1E. alternatively, the test data analysis unit 1041 may calculate a total BCD index by dividing the sum of the total areas of the chipping defects occurring on the margin portion 1E by the area of the margin portion 1E, the sum of the total areas of the chipping defects being calculated based on the whole image in operation P540.

As shown in fig. 9, the BCD index has a positive correlation with the rate at which chipping defects are generated. That is, as the BCD index increases, the rate of generation of chipping defects increases. By measuring the BCD index from the image acquired by the substrate edge testing apparatus according to the exemplary embodiment, a fast feedback may be acquired, and thus, a yield and quality of a manufacturing process may be improved.

While the present disclosure has been particularly shown and described with reference to the exemplary embodiments described herein, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the appended claims.