阅读说明：本技术 元件判定系统及元件判定方法 (Component determination system and component determination method ) 是由 大桥辉之 于 2017-06-07 设计创作，主要内容包括：本发明提供一种元件判定系统,在通过第一装配作业向基板的第一面装配的第一元件和通过第二装配作业向基板的第二面装配的第二元件具有特别的对应关系的情况下,判定是否允许第一元件与第二元件的组合,元件判定系统具备：第一固有信息取得部,取得第一装配作业结束后的第一元件的第一固有信息；第二固有信息取得部,取得在第二装配作业之前准备的第二元件的第二固有信息；及组合判定部,基于所取得的第一固有信息及所取得的第二固有信息,判定是否允许第一元件与第二元件的组合。(An component determination system for determining whether or not to permit combination of a th component and a second component when a th component mounted on a 0 th surface of a board by a th mounting work and the second component mounted on a second surface of the board by a second mounting work have a special correspondence, the component determination system comprising a th unique information acquisition unit for acquiring th unique information of a th component after the th mounting work is completed, a second unique information acquisition unit for acquiring second unique information of the second component prepared before the second mounting work, and a combination determination unit for determining whether or not to permit combination of the th component and the second component based on the acquired th unique information and the acquired second unique information.)

A component determination system of , in a case where a -th component mounted to a -th surface of a substrate by a -th mounting work and a second component mounted to a second surface of the substrate by a second mounting work have a special correspondence, determining whether or not to permit combination of the -th component with the second component,

the component determination system includes:

an th unique information acquiring unit for acquiring th unique information of the th element after the th assembling work is completed;

a second unique information acquiring unit that acquires second unique information of the second component prepared before the second assembly work; and

a combination determination unit configured to determine whether or not to permit the combination of the th element and the second element based on the obtained th unique information and the obtained second unique information.

2. The component determination system according to claim 1,

the component determination system further includes a board information acquisition unit that acquires board information specifying at least sides of the distinction between the type and the individual of the board,

the th unique information acquiring unit acquires th unique information specific to the th element from among the plurality of th unique information suitable for the element type of the th element, and stores the th unique information in association with the substrate information,

the second unique information acquiring unit acquires the second unique information specific to the second component, which is prepared from the plurality of pieces of second unique information suitable for the component type of the second component,

the combination determination part allows the combination of the th element and the second element in a case where the specific th inherent information is identical to the specific second inherent information .

3. The component determination system according to claim 1 or 2, wherein,

the th element and the second element have the same element type specific correspondence to each other,

the th unique information and the second unique information are any of a medium identification number for identifying a holding medium holding a plurality of components, a lot number for identifying a lot in which a plurality of the holding media are packaged, and a manufacturer of the component.

4. The component determination system according to claim 1,

the component determination system further includes a combination storage unit that stores in advance allowable combinations of the th unique information and the second unique information,

the combination determination unit allows the combination of the th element and the second element when a combination of the obtained th unique information and the obtained second unique information is stored in the combination storage unit.

5. The component determination system according to claim 4,

the th element and the second element have the correspondence specified by combination use of for constituting a specific part of an electronic circuit formed on the substrate,

the th unique information and the second unique information are any of an individual identification number for identifying an individual of the component, a medium identification number for identifying a holding medium holding the plurality of components, a lot number for identifying a lot in which the plurality of holding media are packaged, and a manufacturer of the component.

6. The component determination system according to any of claims 1 to 5, wherein,

the component determination system further includes an assembly prohibition unit that prohibits the second assembly work when the combination determination unit does not permit the combination of the th component and the second component.

7, component determination methods, in a case where a component mounted to a th face of a substrate by a th mounting work and a second component mounted to a second face of the substrate by a second mounting work have a special correspondence, determining whether or not to permit combination of the th component and the second component,

in the component determination method, in the above-described method,

obtaining the th inherent information of the th element after the th assembling operation is finished,

acquiring second unique information of the second component prepared prior to the second assembly work,

determining whether to permit the combination of the th element and the second element based on the obtained th inherent information and the obtained second inherent information.

8. The component determination method according to claim 7,

obtaining substrate information specifying at least sides of the differences between the types and the individuals of the substrates,

acquiring specific -th unique information of the -th element mounted from among a plurality of -th unique information suitable for the -th element type, and storing the acquired information in association with the substrate information,

acquiring the specific second unique information of the second component, which is prepared from the plurality of pieces of second unique information suitable for the component type of the second component,

in the case where the specific th inherent information is identical to the specific second inherent information , the combination of the th element and the second element is allowed.

9. The component determination method according to claim 7 or 8,

the th element and the second element have the same element type specific correspondence to each other,

the th unique information and the second unique information are any of a medium identification number for identifying a holding medium holding a plurality of components, a lot number for identifying a lot in which a plurality of the holding media are packaged, and a manufacturer of the component.

10. The component determination method according to claim 7,

the permitted combinations of the th inherent information and the second inherent information are stored in advance,

in a case where a combination of the acquired th unique information and the acquired second unique information is stored, the combination of the th element and the second element is permitted.

11. The component determination method according to claim 10,

the th element and the second element have the correspondence specified by combination use of for constituting a specific part of an electronic circuit formed on the substrate,

the th unique information and the second unique information are any of an individual identification number for identifying an individual of the component, a medium identification number for identifying a holding medium holding the plurality of components, a lot number for identifying a lot in which the plurality of holding media are packaged, and a manufacturer of the component.

12. The component determination method according to any one of claims 7 to 11,

in a case where the combination of the th element and the second element is not permitted, the second fitting work is prohibited.

Technical Field

The present invention relates to a component mounting machine for mounting electronic components (hereinafter referred to as components) on a front surface and a back surface of a substrate to produce a double-sided mounting substrate, and more particularly, to a method for determining whether or not a component mounted on the front surface and a component mounted on the back surface can be combined.

Background

There are a solder printer, a component mounter, a reflow soldering machine, a substrate inspection machine, and the like as a substrate-to-substrate working machine for performing a substrate-to-substrate working, a substrate working line is generally configured by connecting these substrate-to-substrate working machines, a component mounter is generally provided with a substrate transfer device, a component supply device, and a component transfer device, types of substrates for performing a mounting work by the component mounter are double-sided mounting substrates for mounting components to a front side and a back side, and patent document 1 discloses a technical example relating to a double-sided mounting substrate.

In the component mounting method of patent document 1, after mounting components on the front surface of a substrate, the substrate is inverted and the components are mounted on the back surface, and a double-sided mounting substrate in which circuit patterns on the front and back surfaces are pairs and the front and back surfaces are the same is produced.

Disclosure of Invention

Problems to be solved by the invention

However, in patent document 1, the same kind of elements are mounted to the front side and the back side of the substrate. Elements of the same kind are usually interchangeable elements. When comparing the attributes of two interchangeable elements, there are various cases such as a case where the manufacturers are different, a case where the manufacturers are the same but the lots are different, a case where the lots are the same but the holding mediums holding a plurality of elements are different, and a case where the manufacturers and the holding mediums are the same. In this specification, information indicating an attribute that may be different among the interchangeable elements is referred to as inherent information. The unique information includes manufacturer identification, lot number, medium identification number, individual identification number, and the like.

In the production of the substrate having the same front and back surfaces as disclosed in patent document 1, if the intrinsic information of the elements mounted on the front and back surfaces is satisfied, the characteristic of the circuit pattern on the front and back surfaces is satisfied, and good quality of the substrate can be ensured, whereas if the intrinsic information of the elements on the front and back surfaces is different, there is a difference in the characteristic of the circuit pattern on the front and back surfaces, and the quality of the substrate is reduced.

In addition, there is also a double-sided mounting substrate that spans over a front side surface and a back side surface to constitute a specific portion of an electronic circuit. In this double-sided mounting substrate, when the combination of the specific information of the elements on the front side and the specific information of the elements on the back side constituting the specific portion is not managed, the performance of the specific portion is degraded, and the quality of the substrate is degraded.

In patent document 1, the information unique to the elements mounted on the front and back surfaces is not managed, and the quality of the substrate may be degraded. In addition, it is troublesome to manually manage the unique information of the component, and an error is likely to occur. In particular, in recent years, the production of many varieties and small quantities has been progressing, and much labor is required to manage unique information.

In the present specification, an object to be solved is to provide a component determination system and a component determination method that ensure good quality of a substrate by managing a combination of unique information of a plurality of components when the plurality of components having a particular correspondence relationship are mounted on a front side surface and a back side surface of the substrate.

Means for solving the problems

Disclosed is a component determination system for determining whether or not to permit combination of a th component and a second component when a th component mounted on a 0 th surface of a board by a th mounting work and the second component mounted on a second surface of the board by a second mounting work have a special correspondence, the component determination system being provided with a th unique information acquisition unit for acquiring th unique information of the th component after the th mounting work is completed, a second unique information acquisition unit for acquiring second unique information of the second component prepared before the second mounting work, and a combination determination unit for determining whether or not to permit the combination of the th component and the second component based on the th unique information acquired and the second unique information acquired.

In addition, the present specification discloses component determination methods, wherein when a component mounted on a th surface of a board by a -th mounting work and a second component mounted on a second surface of the board by a second mounting work have a special correspondence, it is determined whether or not to permit a combination of the th component and the second component, th specific information of the th component after the -th mounting work is completed is acquired, second specific information of the second component prepared before the second mounting work is acquired, and it is determined whether or not to permit the combination of the th component and the second component based on the acquired th specific information and the acquired second specific information.

Effects of the invention

In the component determination system and the component determination method disclosed in the present specification, it is determined whether or not to permit combination of the th component and the second component based on the th unique information of the th component mounted to the th surface of the board and the second unique information of the second component mounted to the second surface of the board, the th surface is an object of the th mounting work performed in the front-side surface and the back-side surface, and the second surface is an object of the second mounting work to be performed in the front-side surface and the back-side surface.

In contrast, in the component determination system and the component determination method, it is determined whether the combination of the th unique information and the second unique information is appropriate, and the combination of the th component and the second component is allowed if appropriate.

Drawings

Fig. 1 is a perspective view of a main part of a component mounting machine incorporating a component determination system according to embodiment .

Fig. 2 is a diagram illustrating the unique information of the interchangeable element and the inclusion relationship thereof.

Fig. 3 is a block diagram showing a functional configuration of an element determination system according to embodiment .

Fig. 4 is a flowchart showing an operation flow of the element determination system according to the -th embodiment.

Fig. 5 is a block diagram showing a functional configuration of the element determination system according to the second embodiment.

Detailed Description

1. Integral structure of component mounting apparatus 1

First, the overall structure of the component mounter 1 will be described, the direction from the left to the right and downward in fig. 1 is the X-axis direction in which the substrate K is conveyed, and the direction from the right to the left and downward in fig. 1 is the Y-axis direction which is the front-rear direction of the component mounter 1, and the component mounter 1 is configured from a substrate conveying device 2, a component supply device 3, a component transfer device 4, a component camera 5, a controller 6 (see fig. 3), a stage 10, and the like.

The substrate transfer device 2 includes th guide rails 21 and second guide rails 22, , a pair of conveyor belts and a clamping device, etc., th guide rail 21 and second guide rail 22 are mounted on the machine table 10 so as to extend in the X-axis direction across the center of the upper portion of the machine table 10 and be parallel to each other, pairs of conveyor belts disposed parallel to each other are provided in parallel directly below the th guide rail 21 and the second guide rail 22, the pair of conveyor belts rotate while placing the substrate K on the conveyor transfer surface, and carry in and out the substrate K with respect to the mounting position set at the center portion of the machine table 10, and the clamping device is provided below the conveyor belt at the center portion of the machine table 10, and clamps the substrate K by a plurality of ejector pins in a horizontal posture and positions the substrate K at the mounting position.

The component supply device 3 is detachably mounted on the front side of the component mounter 1. The component supply device 3 includes a device tray 39, a plurality of feeder devices 31, and the like. The equipment tray 39 is a thin rectangular box-like member. A plurality of slots extending in parallel in the Y-axis direction are engraved in the upper surface of the apparatus tray 39. Each of the feeder devices 31 is detachably inserted into and attached to the slot.

The feeder device 31 includes a main body 32, a supply reel 33 provided on the front side of the main body 32, and a component pickup unit 34 provided on the upper rear end of the main body 32. A carrier tape in which a plurality of components are sealed at a predetermined pitch is wound and held around the supply reel 33. When the carrier tape is fed out at a predetermined pitch, the components are released from the sealing state and are sequentially fed into the component take-out section 34. Each feeder device 31 stores a device code for specifying an individual device and a component type code for specifying the type of component (component type) to be supplied. When the feeder device 31 is mounted on the equipment tray 39, the device code and the component type code are transmitted to the control unit 6.

Further, feeder device 31 may store only the component type code and transmit it to control unit 6. Further, feeder device 31 may store only the device code and transmit the device code to control unit 6. In this embodiment, combination information indicating the correspondence between the device code of feeder device 31 and the component type is registered in advance. The control unit 6 or the host computer 8 (described later) that received the device code compares the device code with the combination information, and identifies the component type of the component supplied from the feeder device 31.

The component transfer apparatus 4 includes pairs of a Y-axis rail 41, a Y-axis moving table 42, a Y-axis motor 43, an X-axis moving table 44, an X-axis motor 45, a mounting head 46, a rotary tool 47, a Z-axis motor 48, etc., pairs of Y-axis rails 41 are disposed from the rear of the stage 10 to above the component supply apparatus 3 at the front, the Y-axis moving table 42 is mounted on pairs of Y-axis rails 41, the Y-axis moving table 42 is driven by the Y-axis motor 43 via a ball screw mechanism to move in the Y-axis direction, and the X-axis moving table 44 is mounted on the Y-axis moving table 42, the X-axis moving table 44 is driven by the X-axis motor 45 via a ball screw mechanism to move in the X-axis direction.

The mounting head 46 is disposed in front of the X-axis moving stage 44, the mounting head 46 has a rotary tool 47 on the lower side, although not shown in fig. 1, a plurality of suction nozzles are arranged in a ring shape on the lower side of the rotary tool 47, the plurality of suction nozzles are rotated on the lower side of the rotary tool 47 to select suction nozzles, the selected suction nozzles are driven by a Z-axis motor 48 to move up and down, the suction nozzles suck components by the supply of negative pressure, and the components are mounted on the substrate K by the supply of positive pressure.

The component transfer apparatus 4 performs the mounting operation by repeating the suction mounting cycle. To describe the suction mounting cycle in detail, the mounting head 46 of the component transfer apparatus 4 is moved to the component supply apparatus 3, and the components are sucked by the plurality of suction nozzles. Next, when the mounting head 46 is moved to the component camera 5, the suction states of the plurality of components are photographed. Next, the mounting head 46 moves to the substrate K to mount a plurality of components, and then returns to the component supply apparatus 3 again.

The component camera 5 is provided upward on the upper surface of the base 10 between the substrate transfer device 2 and the component supply device 3, and the component camera 5 captures an image of a state in which the plurality of suction nozzles of the mounting head 46 are sucking components by the component pickup unit 34 and moving the components to the substrate K, whereby the component camera 5 can pick up images of the components held by the plurality of suction nozzles, respectively, perform image processing on the obtained captured data, confirm the suction state of the components, and perform fine adjustment of the mounting operation as necessary when it is confirmed that there is a deviation in the suction position, rotation angle, or bending of the lead wire of the components.

The control unit 6 acquires operation data corresponding to the type of substrate K to be produced next from a host computer 8 described later. The control unit 6 sends various commands to the substrate transport apparatus 2, the component supply apparatus 3, the component transfer apparatus 4, and the component camera 5 based on the acquired operation data, and controls the execution of the mounting operation. The control unit 6 receives information on the operating conditions and the like from these devices.

The job data is data describing detailed steps and methods of the assembly job. The operation data is given to information of a substrate type encoding unit that specifies the type of the substrate K (substrate type), and is associated with the actual substrate K. The operation data includes data such as the mounting order of a plurality of components, the slot number of the device tray 39 indicating the supply position of each component, the type of suction nozzle used in the mounting operation, and the operation control method of the mounting head 46.

In the following description, the substrate K is a double-sided mounting substrate, and the component mounting apparatus 1 performs mounting work on the front side surface and the back side surface of the substrate K, respectively, and any sides may be performed in the work order of the front side surface and the back side surface, respectively, and the side of the front side surface and the back side surface, which is the object of the th mounting work performed in advance, is referred to as the side, and the other side of the front side surface and the back side surface, which is the object of the second mounting work performed later, is referred to as the second surface.

The substrate K is provided with a substrate code including a substrate type code section for identifying the type of the substrate and an individual code section for identifying the individual of the substrate K, the substrate code is a bar code or a character string and is attached by printing, attaching a label, or the like, the front side surface and the back side surface of the substrate K are distinguished by the substrate code, and for example, the substrate code is attached only to the side of the front side surface and the back side surface, or different substrate codes are attached to the front side surface and the back side surface.

2. Interchanging information inherent in elements

Next, information unique to the interchangeable component will be described, the component determination system 7 functions when the th component mounted on the th surface of the substrate K by the th mounting work and the second component mounted on the second surface of the substrate K by the second mounting work have a special correspondence relationship, in the th embodiment, the th component and the second component have a special correspondence relationship such that the same component type is used, the component of the same component type is usually the interchangeable component, and fig. 2 is a diagram illustrating the unique information of the interchangeable component and the inclusion relationship thereof.

The type of the element (element type) is determined by the electrical characteristic value, size, shape, and the like described in the specification, for example, the type of the element having a chip resistor having a rectangular shape with a resistance value of 1k Ω, a vertical dimension of 0.4mm, and a horizontal dimension of 0.2mm is determined, and the chip resistors are manufactured by manufacturers a, B, and C as illustrated in fig. 2, the chip resistors are supplied by the manufacturer a in units of th lot, second lot, and … …, and a plurality of holding media, that is, a plurality of supply reels 33 are packaged in each lot.

The lot is attached with a code for identifying the manufacturer and the lot number. The supply reel 33 is provided with a code for identifying the manufacturer, the lot number, and the medium identification number. The manufacturer distinction, the lot number, and the medium identification number are inherent information. In many cases, several pieces of intrinsic information are suitable in the interchange element. On the contrary, even if the inherent information is different, the interchangeable elements can be regarded as the same elements in terms of specification.

Even if the chip resistance of the D manufacturer is the same in specification, the D manufacturer is also used for other device types. That is, the chip resistance of manufacturer D is not interchangeable with the chip resistance of manufacturers a, B and C. For example, the chip resistors of the a manufacturer, the B manufacturer, and the C manufacturer have temperature-dependent characteristics of resistance values similar to each other within the allowable tolerance of the specification. In contrast, the chip resistance of the D manufacturer has a temperature-dependent characteristic of a specific resistance value even within an allowable tolerance. Therefore, the chip resistance of manufacturer D is considered to be significantly different from the chip resistances of manufacturer a, manufacturer B, and manufacturer C, and is used for other device types.

The feeder device 31 attached to the equipment tray 39 recognizes the code attached to the supply reel 33, and acquires the component type code and the unique information (the manufacturer's distinction, the lot number, and the medium identification number), and further, the feeder device 31 transmits the unique information, the device code, and the component type code to the control unit 6.

Feeder device 31 may transmit the component type code and may transmit the unique information as described above, feeder device 31 may transmit the device code as described above, feeder device 31 may not acquire the unique information in this embodiment, instead, combination information indicating the correspondence relationship between the device code of feeder device 31 and the component type and unique information may be registered in advance, and control unit 6 or host computer 8 (described later) that receives the device code may compare the device code with the combination information to identify the component type and unique information of the component supplied from feeder device 31.

The holding medium also includes a tray for storing a plurality of large-sized devices and a dicing sheet for holding a plurality of die devices formed by dicing a semiconductor wafer, and the tray and the dicing sheet may be considered as a plurality of lots and a plurality of manufacturers, and the device determination system 7 manages a combination of unique information of the th device and unique information of the second device even when the th device and the second device are supplied from the tray or the dicing sheet.

3. Functional configuration of element determination system 7 according to embodiment

The component determination system 7 of the embodiment is shifted to the detailed description of the component determination system 7, in the mounting work of the one-sided mounted substrate in which the components are mounted only on the front side, the component type is specified based on the work data, and the proper unique information is not specified, however, when the substrate K is the double-sided mounted substrate, the component determination system 7 manages the combination of the component types identical to each other, that is, the unique information of the th component and the second component.

Fig. 3 is a block diagram showing a functional configuration of the element determination system 7 according to the th embodiment, most of the element determination system 7 is configured by the control function of the controller 6, furthermore, a portion of the function of the host computer 8 is also included in the element determination system 7, and the element determination system 7 is not limited to the above-described function sharing, and may be configured by using a computer device separate from the controller 6, for example.

The host computer 8 manages the entire substrate working line including the component mounter 1. The host computer 8 can access the job database 81 and the job history database 82. The job database 81 stores job data for each substrate type. The job history of the substrate-to-substrate job performed in the substrate-to-substrate job line is transferred to and recorded in the job history database 82.

As shown in fig. 3, the component determination system 7 includes a substrate information acquisition unit 70, an -th unique information acquisition unit 71, a second unique information acquisition unit 72, a combination determination unit 73, a mounting prohibition unit 74, and the like, the substrate information acquisition unit 70 acquires a substrate code of a substrate K to be carried in, and as the substrate information acquisition unit 70, a substrate information communication unit and a substrate information photographing camera, which are not shown in the drawings, may be illustrated, the substrate information communication unit receives the substrate code of the substrate K from the upstream side device 79, and the substrate information photographing camera is disposed at the carrying-in end of the substrate transport device 2 and photographs the substrate code attached to the substrate K.

The -specific information acquiring unit 71 acquires 1-specific information of the th component 0 after the -specific assembly work is completed, specifically, the 2-specific information acquiring unit 71 acquires -specific information of the 5 th component mounted among a plurality of 4 th specific information suitable for the component type of the 3 th component, that is, of a plurality of -specific information suitable for the th component cannot be specified at a stage before the -th assembly work is performed, and specific -specific information of the th component mounted is specified and acquired by the execution of the -th assembly work.

The control unit 6 directly receives the unique information from the feeder device 31 that supplies the th component when controlling the execution of the th assembly job, or the control unit 6 indirectly recognizes the unique information by receiving the device code from the feeder device 31 and comparing it with the combination information, therefore, the th unique information acquisition unit 71 can easily acquire the specific th unique information, and further, the th unique information acquisition unit 71 associates the th unique information with the board code as the job history, and transfers and records the job history from the host computer 8 to the job history database 82.

The second unique information acquiring unit 72 acquires second unique information of the second component prepared before the second mounting work. That is, the second unique information acquiring unit 72 acquires specific second unique information of the second device prepared from the plurality of second unique information suitable for the device type of the second device. The prepared second component means that the feeder device 31 for supplying the second component is mounted on the equipment tray 39. The control unit 6 directly receives the unique information from the feeder device 31. Alternatively, the control unit 6 receives the device code from the feeder device 31 and compares the device code with the combination information to indirectly identify the unique information. Therefore, the second unique information acquiring unit 72 can easily acquire the specific second unique information.

Specifically, the combination determination unit 73 determines whether or not to permit the combination of the second element and the second element based on the acquired -th unique information and the acquired second unique information, that is, the combination determination unit 73 permits the combination of the second element and the second element when the specific -th unique information acquired by the -th unique information acquisition unit 71 and the specific second unique information acquired by the second unique information acquisition unit 72 match, and the assembly prohibition unit 74 prohibits the second assembly work when the combination determination unit 73 does not permit the combination of the -th element and the second element.

4. component determination system 7 according to embodiment 7

Next, the operation and action of the component determination system 7 according to the th embodiment will be described, fig. 4 is a flowchart showing the operation flow of the component determination system 7 according to the th embodiment, the preparation work of the plurality of feeder devices 31 of the component supply device 3 is completed and the substrate K is prepared at the carrying end of the substrate carrying device 2 in the initial state of the operation flow, and the differences of manufacturers are exemplified as the unique information of the th component and the second component, specifically, as the interchangeable component of the th component and the second component, a case where the manufacturer a, the manufacturer B, and the manufacturer C are suitable and the manufacturer D is not suitable is considered.

In step S1 of fig. 4, the board information acquiring unit 70 acquires the board code of the board K, in the next step S2, the component determination system 7 acquires the operation data corresponding to the board type code unit of the acquired board code from the operation database 81 via the host computer 8, in the next step S3, the component determination system 7 refers to the operation data and determines whether or not the board K corresponds to the management target for managing the unique information of the th component and the second component, and as in patent document 1, even if the front and back surfaces are not identical, the board K on which the boards are mounted on the both surfaces and the same component type is mounted on the front and back surfaces is the management target.

The component determination system 7 assumes that the execution of the operation flow proceeds to step S9 when the board K is not the management target, and proceeds to step S4 when the board K is the management target. In step S4, the component determination system 7 acquires the job history of the mounting job to be performed on the substrate K from the job history database 82 via the host computer 8.

In the next step S5, the component determination system 7 refers to the job history, and determines whether or not the current assembly job is the th assembly job, if there is no job history relating to the board K, the current assembly job is the th assembly job, if there is a job history relating to the th assembly job relating to the board K, the current assembly job is the second assembly job, and further, the job history of the th assembly job is recorded in the job history database 82 in the step S10 described later.

In step S6 at the time of this -th assembly work, the -specific information acquiring unit 71 acquires -th specific information of the -th component, specifically, the -th specific information acquiring unit 71 acquires a specific slot number corresponding to the -th component from the work data, the -th specific information acquiring unit 71 acquires a component type code and -th specific information directly or indirectly from the feeder device 31 placed at the specific slot number, and the component determination system 7 determines whether or not the acquired -th specific information matches the -th component in the next step S7.

In these cases, the component determination system 7 branches the execution of the operation flow to step S8. in step S8, the component determination system 7 prohibits the th mounting work and instructs the th component to be changed to the correct one.in addition to the fact that the -specific information is D manufacturer, the -specific information is not suitable for the th component, the component determination system 7 displays "please change the th component to the suitable a manufacturer or B manufacturer or C manufacturer". the operator who sees this display deals with the replacement by replacing the feeder device 31 or the replacement supply reel 33 of the specific slot number ".

In step S7, when the -specific information is of the manufacturers a, B, and C, the -specific information is suitable for the -th component, and here, the -th specific information is the manufacturer B, and when suitable, the component determination system 7 advances the execution of the operation flow to step S9, and in step S9, the component determination system 7 allows the loading of the substrate K, and thereby the control unit 6 carries out the loading and positioning of the substrate K.

In the next step S10, the controller 6 performs th mounting work for the th component, and further, the controller 6 performs mounting work for the other th component, and when the mounting work is completed, the th unique information acquisition unit 71 associates th unique information, such as the B manufacturer of the th component to be mounted, with the board code of the board K as a work history of th mounting work, transfers and records the work history to the work history database 82, and in the next step S11, the controller 6 carries out the board K and completes the operation flow related to the th mounting work.

In step S5, when the second assembly work is performed, the component determination system 7 branches the execution of the operation flow to step S16, in step S16, the second unique information acquisition unit 72 acquires the second unique information of the second component, specifically, first, the second unique information acquisition unit 72 acquires a specific slot number corresponding to the second component from the work data, then, the second unique information acquisition unit 72 acquires the component type code and the second unique information directly or indirectly from the feeder device 31 disposed at the position of the specific slot number, and in next step S17, the combination 73 determines whether the acquired second unique information matches the -th unique information recorded in the work history in units of the board K specified by the board code.

Here, as described above, the subject matter that the th unique information is the B manufacturer is recorded in the work history, and it is assumed that the second unique information does not match the th unique information even if it is suitable for the second element in the case that the second unique information is the a manufacturer or the C manufacturer, the combination determination unit 73 branches the execution of the operation flow to step S18.

In step S18, the mounting prohibition unit 74 prohibits the second mounting work and instructs a change work to the correct second component, the mounting prohibition unit 74 displays, for example, "please change the second component to the same B manufacturer as the component", the operator who sees the display deals with the replacement of the feeder device 31 having the specific slot number or the replacement of the supply reel 33, and in addition , the mounting prohibition unit 74 returns the execution of the operation flow to step S16 after the display.

In step S17, when the second unique information is the B manufacturer, the second unique information matches the unique information , and therefore, the combination determination unit 73 merges the execution of the operation flow with step S9, and in step S9, the component determination system 7 allows the loading of the substrate K, and the control unit 6 carries out the loading and positioning of the substrate K.

In the next step S10, the control unit 6 performs a second assembly work of the second component, and further, the control unit 6 performs an assembly work of another component on the second surface, and when the assembly work is finished, the second unique information acquisition unit 72 associates unique information such as the B manufacturer of the second component with the substrate code of the substrate K to obtain a work history of the second assembly work, transfers and records the work history to the work history database 82, and records the work history of the th assembly work and the second assembly work to facilitate subsequent follow-up investigation, in other words, to improve traceability, and in the next step S11, the control unit 6 carries out the substrate K to finish the operation flow related to the second assembly work.

In the th embodiment, the th element on the th surface of the substrate K and the second element on the second surface have a special correspondence relationship such that the elements are of the same type, whereas the element determination system 7 automatically makes a difference between manufacturers, which is information unique to the th element and the second element, match th unique information (B manufacturer) of the th element mounted in the th mounting work to define second unique information (B manufacturer) of the second element to be mounted.

Generally, large electronic circuits are formed on the front side and the back side of the substrate K, or different electronic circuits are formed in association with each other, that is, the th element and the second element are associated with each other in the characteristics of the electronic circuits, and thus, the characteristics of the electronic circuits are made good by the unique information of the th element and the second element, and good quality of the substrate K can be ensured.

5. Component determination system 7A of the second embodiment

Next, a component determination system 7A according to a second embodiment will be mainly described with respect to the point different from the th embodiment, the component determination system 7A according to the second embodiment is configured to span between the th component mounter 11 and the second component mounter 12, fig. 5 is a block diagram showing a functional configuration of the component determination system 7A according to the second embodiment, and the host computer 8, the job database 81, and the job history database 82 are commonly used in the th component mounter 11 and the second component mounter 12.

As shown in fig. 5, the control unit 6 of the component mounter 11 is provided with a board information acquisition unit 70, a specific information acquisition unit 71, a second specific information acquisition unit 72, a combination determination unit 73, and a mounting prohibition unit 74 which constitute the component determination system 7A, and similarly, the control unit 6 of the second component mounter 12 is also provided with a board information acquisition unit 70, a specific information acquisition unit 71, a second specific information acquisition unit 72, a combination determination unit 73, and a mounting prohibition unit 74 which constitute the component determination system 7A, and according to the component determination system 7A of the second embodiment, even if a component mounter which performs the mounting work is different from a component mounter which performs the second mounting work, the same operation and the same function as those of the embodiment can be performed.

The element determination system 7A according to the second embodiment also functions when a specific portion of an electronic circuit formed on a substrate is configured by a combination of the th element and the second element, for example, consider a case where the th element is a quartz oscillator and the second element is a resistance for adjustment, a resistance value of the resistance for adjustment can be finely adjusted to an oscillation frequency output from the quartz oscillator, and in this case, an effect of reducing a variation in the oscillation frequency can be expected by managing a combination of the th unique information of the quartz oscillator and the second unique information of the resistance for adjustment, and besides, there are many circuit configuration examples in which characteristics of the electronic circuit can be made good by managing a combination of the th unique information and the second unique information.

In order to achieve an effect of improving the characteristics of the electronic circuit, the host computer 8 is provided with a combination storage unit 83, the combination storage unit 83 is of the element determination system 7A, the combination storage unit 83 stores allowable combinations of the -th unique information and the second unique information in advance in the memory 84, the memory 84 is of the combination storage unit 83, and the lot number is exemplified as the unique information of the -th element and the second element.

The allowable combinations are found, for example, by a preliminary combination compatibility test in which sample elements extracted from the respective lots of the th element and the second element are combined to form a temporary electronic circuit, and then, the characteristics of the temporary electronic circuit are measured to determine whether the compatibility is good or not, and as a result, the combinations of lots in which the good compatibility is obtained are allowed to be stored in the combination storage unit 83, and in the example of fig. 5, the combination of the 11 th lot number L11 of the th element and the 22 nd lot number L22 of the second element, and the combination of the 12 th lot number L12 of the th element and the 23 rd lot number L23 of the second element are stored in the memory 84.

When the stored combination is used to determine the th component and the second component, the component determination system 7A executes an operation flow similar to that shown in fig. 4, but actually performs operations of the substrate information acquisition unit 70, the specific information acquisition unit 71, the second specific information acquisition unit 72, the combination determination unit 73, and the mounting prohibition unit 74 of the component mounting machines (11, 12) that prepare for loading of the substrate, and further changes the operation contents of step S7, step S17, and the like.

In step S7, the -specific information acquisition unit 71 determines whether or not the lot number of the th cell acquired in step S6 is stored in the combination storage unit 83, that is, the -specific information acquisition unit 71 determines whether or not the lot number of the th cell matches of the 11 th lot number L11 or the 12 th lot number L12, and here, the lot number of the th cell matches the 11 th lot number L11 , the -specific information acquisition unit 71 advances the execution of the operation flow to step S9 to permit the loading of the substrate, and in the next step S10, a job history in which the th cell of the 11 th lot number L11 is mounted is recorded.

In step S17, the combination determination unit 73 compares the combination of the lot number of the second component acquired in step S16 and the 11 th lot number L11 of the th component recorded in the job history with the stored contents of the combination storage unit 83 in units of the substrate specified by the substrate code, for example, when the lot number of the second component is the 21 st lot number L21, the combination of the 11 th lot number L11 and the 21 st lot number L21 is not stored, and when such a comparison does not result in , the combination determination unit 73 branches the execution of the operation flow to step S18.

In addition, for example, when the lot number of the second component is the 22 nd lot number L22, the combination of the 11 th lot number L11 and the 22 nd lot number L22 is stored, in the case of such a check , the combination determination unit 73 merges the execution of the operation flow with step S9, in the next step S10, the second mounting work is performed to mount the second component of the 22 nd lot number L22 on the second surface, and as described above, the combination of the unique information of the component and the second component is limited to the combination stored in the combination storage unit 83.

In contrast, the element determination system 7A stores in advance a combination of the st unique information and the second unique information that improves the characteristics of the electronic circuit, and the element determination system 7A limits the combination of the th unique information of the th element to be mounted and the second unique information of the second element to be mounted within the range of the stored combination.

6. Applications and variants of the embodiments

In addition, although the difference in manufacturer is unique information in the embodiment and the lot number is unique information in the second embodiment, the present invention is not limited to this, and for example, in the embodiment, the lot number and the medium identification number can be unique information to match the lot of the th element and the second element and the supply reel 33 , and in the second embodiment, for example, the individual identification number can be unique information, and a good combination of the th element and the second element can be found by a preliminary total number combination compatibility test and stored in the combination storage unit 83, and in the component determination system 7 of the embodiment, the combination storage unit 83 can be added to perform the same operation as in the second embodiment, and further, the component determination systems (7, 7A) of the embodiment and the second embodiment can be implemented as a component determination method, and various applications and modifications can be made in addition to the embodiment and the second embodiment.

Description of the reference numerals

The component mounter 11, the component mounter 12, the second component mounter 2, the substrate conveying device 3, the component supplying device 31, the feeder device 4, the component moving and mounting device 5, the component camera 6, the control unit 7, the component determination system 70, the substrate information acquiring unit 71, the unique information acquiring unit 72, the second unique information acquiring unit 73, the assembly prohibition unit 8, the host computer 81, the work database 82, the work history database 83, the assembly memory unit K, and the substrate.