阅读说明：本技术 超音波探头及超音波探头的制造方法 (Ultrasonic probe and method for manufacturing ultrasonic probe ) 是由 蒋富升 于 2019-09-27 设计创作，主要内容包括：本发明提供的超音波探头,超音波探头包括微机械超音波换能器基板、导电胶、电路板及声波传递介质,微机械超音波换能器基板具有发射面,导电胶环绕发射面上的区域且区域具有第一凹部,电路板具有开口,电路板配置在导电胶上且开口对应区域,电路板具有第二凹部,声波传递介质形成于第一凹部及第二凹部内,如此,能够能够提高操作性及减弱阻抗。(The ultrasonic probe comprises a micromechanical ultrasonic transducer substrate, conductive adhesive, a circuit board and an acoustic wave transmission medium, wherein the micromechanical ultrasonic transducer substrate is provided with an emitting surface, the conductive adhesive surrounds an area on the emitting surface, the area is provided with a first concave part, the circuit board is provided with an opening, the circuit board is arranged on the conductive adhesive and corresponds to the area with the opening, the circuit board is provided with a second concave part, and the acoustic wave transmission medium is formed in the first concave part and the second concave part, so that the operability can be improved, and the impedance can be weakened.)

1. An ultrasonic probe, comprising:

a micromechanical ultrasonic transducer substrate having an emitting surface;

the conductive adhesive surrounds the area on the emission surface, and the area is provided with a first concave part;

the circuit board is provided with an opening, the circuit board is arranged on the conductive adhesive, the opening corresponds to the area, and the circuit board is provided with a second concave part; and

and the sound wave transmission medium is formed in the first concave part and the second concave part.

2. The ultrasonic probe of claim 1, wherein the conductive adhesive is an anisotropic conductive adhesive.

3. The ultrasonic probe of claim 1, wherein the conductive adhesive is located between the micromachined ultrasonic transducer substrate and the circuit board along a direction of sound wave emission.

4. The ultrasonic probe of claim 1, further comprising:

the cover plate is arranged on the circuit board and covers the opening.

5. The ultrasonic probe of claim 1, wherein the micromachined ultrasonic transducer substrate comprises a plurality of acoustic wave generating units and a plurality of conductive wires, each conductive wire is connected to a corresponding acoustic wave generating unit, the conductive adhesive comprises a plurality of conductive adhesive pads separated from each other, and each conductive adhesive pad covers a corresponding conductive wire.

6. The ultrasonic probe of claim 5, wherein the circuit board comprises a plurality of pads, and each of the conductive adhesive pads is located between and electrically connected to the corresponding wire and pad along the sound wave emitting direction.

7. The ultrasonic probe of claim 6, wherein the conductive adhesive further comprises a dam, and the plurality of conductive adhesive pads and the dam surround the first recess.

8. A method for manufacturing an ultrasonic probe, comprising the steps of:

forming a conductive adhesive on the emitting surface of the substrate of the micro-mechanical ultrasonic transducer and surrounding the area on the emitting surface, wherein the conductive adhesive forms a first concave part corresponding to the area;

arranging a circuit board on the conductive adhesive, wherein the circuit board is provided with an opening, and a second concave part is formed above the first concave part by the opening corresponding to the area; and

formed in the first recess and the second recess in the acoustic wave transmission medium.

9. The method of manufacturing of claim 8, further comprising the steps of:

and arranging a cover plate to cover the opening of the circuit board, wherein the cover plate covers the first concave part and the second concave part.

10. The method according to claim 8, wherein the substrate of the micromachined ultrasonic transducer comprises a plurality of acoustic wave generating units and a plurality of wires, each wire is connected to a corresponding acoustic wave generating unit, the circuit board further comprises a plurality of pads, and the conductive adhesive is anisotropic conductive adhesive; in the step of disposing the circuit board on the conductive adhesive, the conductive adhesive electrically connects the corresponding wire and the pad.

Technical Field

The present invention relates to an ultrasonic probe and a method for manufacturing the ultrasonic probe, and more particularly, to an ultrasonic probe with a conductive adhesive and a method for manufacturing the ultrasonic probe.

Background

Known ultrasonic probes include a circuit board and an acoustic wave generating array. Currently, bonding wires (bonding wires) are mostly used to laterally bridge the circuit board and the acoustic wave generating array to electrically connect the acoustic wave generating array and the circuit board. However, the wire bonding method requires special consideration to the operability of the bonding tool head (e.g., whether there is sufficient space for operation) and the wire typically has a length that forms part of the impedance.

Therefore, it is necessary to design a new ultrasonic probe and a manufacturing method of the ultrasonic probe to overcome the above-mentioned drawbacks.

Disclosure of Invention

The invention aims to provide an ultrasonic probe and a manufacturing method of the ultrasonic probe, which can improve the operability and weaken the impedance. In order to achieve the above object, the present invention provides an ultrasonic probe, comprising: a micromechanical ultrasonic transducer substrate having an emitting surface; the conductive adhesive surrounds the area on the emission surface, and the area is provided with a first concave part; the circuit board is provided with an opening, the circuit board is arranged on the conductive adhesive, the opening corresponds to the area, and the circuit board is provided with a second concave part; and an acoustic wave transmission medium formed in the first recess and the second recess.

Preferably, the conductive adhesive is anisotropic conductive adhesive.

Preferably, the conductive adhesive is located between the substrate of the micromachined ultrasonic transducer and the circuit board along the direction of sound wave emission.

Preferably, the ultrasonic probe further comprises: the cover plate is arranged on the circuit board and covers the opening.

Preferably, the substrate of the micro-mechanical ultrasonic transducer includes a plurality of acoustic wave generating units and a plurality of wires, each of the wires is connected to a corresponding one of the acoustic wave generating units, the conductive adhesive includes a plurality of conductive adhesive pads separated from each other, and each of the conductive adhesive pads covers a corresponding one of the wires.

Preferably, the circuit board includes a plurality of pads, and each of the conductive adhesive pads is located between the corresponding wire and the pad along the sound wave emission direction and electrically connected to the corresponding wire and the pad.

Preferably, the conductive adhesive further includes a retaining wall, and the plurality of conductive adhesive pads and the retaining wall surround the first concave portion.

The invention also provides a manufacturing method of the ultrasonic probe, which is characterized by comprising the following steps: forming a conductive adhesive on the emitting surface of the substrate of the micro-mechanical ultrasonic transducer and surrounding the area on the emitting surface, wherein the conductive adhesive forms a first concave part corresponding to the area; arranging a circuit board on the conductive adhesive, wherein the circuit board is provided with an opening, and a second concave part is formed above the first concave part by the opening corresponding to the area; and the sound wave transmission medium is formed in the first concave part and the second concave part.

Preferably, the method further comprises the steps of: and arranging a cover plate to cover the opening of the circuit board, wherein the cover plate covers the first concave part and the second concave part.

Preferably, the substrate of the micro-mechanical ultrasonic transducer comprises a plurality of sound wave generating units and a plurality of wires, each wire is connected to the corresponding sound wave generating unit, the circuit board further comprises a plurality of connecting pads, and the conductive adhesive is anisotropic conductive adhesive; in the step of disposing the circuit board on the conductive adhesive, the conductive adhesive electrically connects the corresponding wire and the pad.

Compared with the prior art, the ultrasonic probe provided by the invention comprises a micromechanical ultrasonic transducer substrate, conductive adhesive, a circuit board and an acoustic wave transmission medium, wherein the micromechanical ultrasonic transducer substrate is provided with an emitting surface, the conductive adhesive surrounds an area on the emitting surface, the area is provided with a first concave part, the circuit board is provided with an opening, the circuit board is arranged on the conductive adhesive and corresponds to the area with the opening, the circuit board is provided with a second concave part, and the acoustic wave transmission medium is formed in the first concave part and the second concave part, so that the operability can be improved and the impedance can be weakened.

Drawings

FIG. 1A is a top view of an ultrasonic probe according to an embodiment of the present invention;

FIG. 1B is a cross-sectional view of the ultrasonic probe of FIG. 1A taken along the direction 1B-1B';

FIG. 2A is a top view of an ultrasonic probe according to another embodiment of the present invention;

FIG. 2B is a cross-sectional view of the ultrasonic probe of FIG. 2A taken along the direction 2B-2B';

FIG. 2C is a cross-sectional view of the ultrasonic probe of FIG. 2A taken along the direction 2C-2C';

FIGS. 3A-3F are schematic views illustrating a manufacturing process of the ultrasonic probe of FIG. 1A;

fig. 4A, 4B and 4C are process diagrams of manufacturing the ultrasonic probe of fig. 2A.

Detailed Description

In order to further understand the objects, structures, features and functions of the present invention, the following embodiments are described in detail.

Referring to fig. 1A and 1B, fig. 1A is a top view of an ultrasonic probe according to an embodiment of the invention, and fig. 1B is a cross-sectional view of the ultrasonic probe of fig. 1A along a direction 1B-1B'. The Ultrasonic probe 100 includes a micro-Machined Ultrasonic Transducer (MUT) substrate 110 (the micro-machined Ultrasonic Transducer substrate 110 of fig. 1A is drawn by a thick line), a conductive adhesive 120, a circuit board 130, an acoustic wave transmission medium 140, a cover plate 150, and a package 160. The micromachined ultrasonic transducer substrate 110 has an emitting surface 110 u. The conductive paste 120 surrounds a region R1 of the emission surface 110u, and the corresponding region R1 has a first recess 120R. The circuit board 130 has an opening 130a, the circuit board 130 is disposed on the conductive adhesive 120, the opening 130a corresponds to the region R1, and the circuit board 130 has a second concave portion 130R. Thus, the substrate 110 of the micromachined ultrasonic transducer can be electrically connected to the circuit board 130 through the conductive adhesive 120. Specifically, the micromachined ultrasonic transducer substrate 110 can be electrically connected to the circuit board 130 without bonding wires.

The substrate 110 of the micromachined ultrasonic transducer further includes an acoustic wave generating array 111 and at least one conductive line, such as at least one ground line 110g and at least one signal line 110 s. The acoustic wave generating array 111, the ground line 110g, and the signal line 110s are formed on the emitting surface 110 u. The acoustic wave generating array 111 includes at least one acoustic wave generating unit 1111, wherein a ground line 110g and a signal line 110s are connected to a corresponding acoustic wave generating unit 1111 and extend to the edge of the emitting surface 110 u. The "edge" is, for example, a region outside the acoustic wave generating array 111, and the range thereof may extend to the outer side 110e of the substrate 110 of the micromachined ultrasonic transducer, but the embodiment of the invention is not limited thereto.

As shown in fig. 1B, each acoustic wave generating unit 1111 includes at least one resonant cavity 1111r and at least one resonant membrane 1112, and each resonant membrane 1112 is formed on the emitting surface 110u and covers the resonant cavity 1111 r. For the control of one sound wave generating unit 1111, the control signal C1 of the controller 10 can be transmitted to the signal line 110s through the circuit board 130, and then returned to the controller 10 through the ground line 110g and the circuit board 130 after passing through the signal connection line 1111s and the ground connection line 1111g connected to each resonance film 1112. The control signal C1 can control all the resonant membranes 1112 of each sound wave generating unit 1111 to oscillate up and down to emit ultrasonic waves. In addition, depending on the focusing characteristics of the acoustic wave, different acoustic wave generating units 1111 can be controlled by different control signals C1, such as control signals C1 with different delay times, so that all the acoustic wave generating units 1111 are focused on the same region as a point.

In addition, the resonant cavity 1111r, the resonant diaphragm 1112, the signal connection 1111s, and the ground connection 1111g may be formed by a semiconductor process, such as photolithography, coating, and/or any other semiconductor technique that can form the acoustic wave generating array 111.

The conductive adhesive 120 is located between the micromachined ultrasonic transducer substrate 110 and the circuit board 130 along the acoustic emission direction E1, so as to be electrically connected to the micromachined ultrasonic transducer substrate 110 and the circuit board 130. The conductive adhesive 120 allows electrical transmission in a Z-axis direction (e.g., the Z-axis direction is substantially parallel to the sound wave emitting direction E1), but does not allow electrical transmission in X-and Y-axes directions (e.g., the X-axis direction is substantially perpendicular to the Z-axis direction), so even if the conductive adhesive 120 is a continuously extending conductive adhesive, two adjacent signal lines 110s are not electrically shorted through the conductive adhesive 120 and two adjacent ground lines 110g are not electrically shorted through the conductive adhesive 120. In the present embodiment, the Conductive paste 120 is Anisotropic Conductive Film (ACF) or other Conductive material that allows Z-axis electrical transmission only. In addition, one of the illustrated X-axis and Y-axis is, for example, a long axis transmission direction of the ultrasonic probe 100, and the other of the X-axis and Y-axis is, for example, a short axis transmission direction of the ultrasonic probe 100.

The Circuit board 130 is, for example, a Flexible Printed Circuit (FPC), but the embodiment of the invention is not limited thereto. The circuit board 130 is disposed on the conductive paste 120. The circuit board 130 includes at least one pad, such as at least one ground pad 130g and at least one signal pad 130 s. The conductive adhesive 120 is located between the ground line 110g of the micromachined ultrasonic transducer substrate 110 and the ground pad 130g of the circuit board 130, and located between the signal line 110s of the micromachined ultrasonic transducer substrate 110 and the signal pad 130s of the circuit board 130. In the present embodiment, each ground pad 130g is vertically overlapped with the corresponding ground line 110g and electrically connected to the ground line through the conductive adhesive 120 therebetween, and each signal pad 130s is vertically overlapped with the corresponding signal line 110s and electrically connected to the signal line through the conductive adhesive 120 therebetween. Thus, the ground line 110g and the signal line 110s of the substrate 110 of the micromachined ultrasonic transducer can be electrically connected to the ground pad 130g and the signal pad 130s of the circuit board 130 without the need of bonding wires.

The acoustic wave transmission medium 140 is formed in the first recess 120r and the second recess 130 r. For example, the acoustic wave transmission medium 140 fills at least a portion of the first recess 120r and the second recess 130 r. The acoustic wave transmission medium 140 is, for example, silicone oil, glycerin, or other non-conductive and acoustic wave transmissive medium. The acoustic transmission medium 140 can help transmit the ultrasonic waves generated by the acoustic wave generating array 111. As shown in fig. 1A, the conductive adhesive 120 has a closed ring shape, such that the first concave portion 120r is not communicated with the outer side surface of the conductive adhesive 120, and the circuit board 130 has a closed ring shape, such that the second concave portion 130r is not communicated with the outer side surface of the circuit board 130. Thus, the acoustic wave transmission medium 140 located in the first concave portion 130r and the second concave portion 140r does not leak laterally from the conductive adhesive 120 and the circuit board 130.

Furthermore, as shown in fig. 1B, the second recess 130r substantially overlaps, such as at least partially overlaps, the first recess 120 r. In an embodiment, the size (e.g., a top view area) of the second recess 130r may be smaller than or substantially equal to the size (e.g., a top view area) of the first recess 120r, but the size of the second recess 130r is larger than the size of the first recess 120 r.

The cover plate 150 is disposed on the circuit board 130 and covers the opening 130a to cover the first recess 120r and the second recess 130r, so as to prevent the sound wave transmission medium 140 located in the first recess 120r and the second recess 130r from leaking out of the opening 130 a. In addition, although not shown, the ultrasonic probe 100 further includes an adhesive layer formed between the cover plate 150 and the circuit board 130 to adhere the cover plate 150 and the circuit board 130. In summary, the acoustic wave transmission medium 140 is enclosed in the first recess 120r and the second recess 130r by the conductive adhesive 120, the circuit board 130 and the cover plate 150. The cover plate 150 allows sound waves to pass out, having a sound wave transmission rate of, for example, 80%, 85%, 90%, or 95% or more. In embodiments, the cover plate 150 may be a light transmissive or non-light transmissive cover plate. In terms of material, the material of the cover plate 155 includes resin, such as polyurethane.

As shown in fig. 1B, the package 160 encapsulates the substrate 110 of the micromachined ultrasonic transducer, the conductive adhesive 120, a portion of the circuit board 130, the acoustic wave transmission medium 140, and the cover plate 150. Another portion of the circuit board 130 protrudes out of the package body 160 to be electrically connected to the controller 10. The material of the encapsulant 160 includes phenolic-based resin (Novolac-based resin), epoxy-based resin (epoxy-based resin), silicone-based resin (silicone-based resin), or other suitable coating agent. The package body 160 may further include a suitable filler, such as powdered silicon dioxide. In addition, the package body 160 may be formed by using several packaging techniques, such as compression molding (compression molding), liquid encapsulation (liquid encapsulation), injection molding (injection molding) or transfer molding (transfer molding).

Referring to fig. 2A, fig. 2B and fig. 2C, fig. 2A is a top view of an ultrasonic probe according to another embodiment of the present invention, fig. 2B is a cross-sectional view of the ultrasonic probe of fig. 2A along a direction 2B-2B ', and fig. 2C is a cross-sectional view of the ultrasonic probe of fig. 2A along a direction 2C-2C'. The ultrasonic probe 200 includes a micro-mechanical ultrasonic transducer substrate 210 (the micro-mechanical ultrasonic transducer substrate 210 of fig. 2A is drawn by a thick line), a conductive adhesive 220, a circuit board 130, an acoustic wave transmission medium 140, a cover plate 150, and a package 160. The substrate 210 of the micromachined ultrasonic transducer has an emitting surface 110u, an acoustic wave generating array 111, at least one retaining wall 212 and at least one conducting wire, such as at least one grounding wire 110g and at least one signal wire 110 s. The acoustic wave generating array 111, the grounding line 110g, the signal line 110s and the dam 212 are formed on the emitting surface 110 u. The acoustic wave generating array 111 includes at least one acoustic wave generating unit 1111, wherein a ground line 110g and a signal line 110s are connected to a corresponding acoustic wave generating unit 1111 and extend to the edge of the emitting surface 110 u.

The conductive paste 220 includes a plurality of separated conductive paste pads 221. Each conductive rubber pad 221 covers the corresponding ground line 110g or the corresponding signal line 110 s. In the present embodiment, the conductive paste 220 has non-directional electrical transmission, i.e., allows electrical transmission along the Z-axis, the X-axis and the Y-axis. Since the conductive adhesive pads 221 are separated from each other, even if the electrical transmission of the conductive adhesive 220 is non-directional, the adjacent two conductive adhesive pads 221 will not be electrically shorted. In an embodiment, the conductive paste 220 is, for example, silver paste, but may be other conductive materials.

As shown in fig. 2A, fig. 2B and fig. 2C, the conductive adhesive pads 221 of the conductive adhesive 220 are distributed on two opposite edges of the emitting surface 110u of the substrate 210 of the micromachined ultrasonic transducer, and the two retaining walls 212 are respectively located on the other two opposite edges of the emitting surface 110u, wherein the conductive adhesive pads 221 and the two retaining walls 212 surround the first recess 220r, and the first recess 220r exposes the acoustic wave generating array 111, such as exposing all the acoustic wave generating units 1111. The circuit board 130 has a second recess 130 r. The acoustic wave transmission medium 140 is located in the first recess 220r and the second recess 130 r. Due to the configuration of the retaining wall 212, the acoustic wave transmission medium 140 in the first recess 220r and the second recess 130r can be blocked from leaking. In addition, since the plurality of separated conductive rubber pads 221 are disposed adjacently (but not in contact), a certain leakage resistance is generated for the acoustic wave transmission medium 140 located in the first concave portion 220r and the second concave portion 130r, which can reduce the leakage amount or even have no leakage; in addition, non-conductive material may be filled between the separated conductive pads 221 to prevent the conductive pads 221 from short-circuiting and the acoustic wave transmission medium 140 from leaking. In an embodiment, the retaining wall 212 and the plate body of the micromachined ultrasonic transducer substrate 210 are formed as an integral structure. In addition, the retaining wall 212 is, for example, an insulating retaining wall.

As shown in fig. 2B, the circuit board 130 is disposed on the conductive adhesive 220. The circuit board 130 includes at least one pad, such as at least one ground pad 130g and at least one signal pad 130 s. In the present embodiment, each conductive adhesive pad 221 is located between the corresponding conductive line of the micro-mechanical ultrasonic transducer substrate 210 and the corresponding pad of the circuit board 130 along the sound wave emitting direction E1 and electrically connects the corresponding conductive line and the corresponding pad. For example, each conductive adhesive pad 221 is located between the corresponding signal line 110s and signal pad 130s along the sound wave emitting direction E1 and electrically connects the corresponding signal line 110s and signal pad 130s, and is located between the corresponding ground line 110g and ground pad 130g and electrically connects the corresponding ground line 110g and ground pad 130 g.

Referring to fig. 3A to 3F, fig. 3A to 3F are diagrams illustrating a manufacturing process of the ultrasonic probe of fig. 1A. A substrate 110 of the micromachined ultrasonic transducer is provided, wherein the substrate 110 of the micromachined ultrasonic transducer includes an emitting surface 110u, an acoustic wave generating array 111, at least one retaining wall 212 and at least one conducting wire, such as at least one grounding wire 110g and at least one signal wire 110 s. The acoustic wave generating array 111 includes at least one acoustic wave generating unit 1111, a ground line 110g and a signal line 110s extending from the corresponding acoustic wave generating unit 1111 to the edge of the emitting surface 110 u.

As shown in fig. 3B1 and 3B2, a conductive paste 120 may be formed on the emitting surface 110u of the micromachined ultrasonic transducer substrate 110 and surrounding the region R1 by, for example, a coating technique. The first concave portion 120R is formed corresponding to the region R1 of the conductive paste 120. The first recess 120r exposes the acoustic wave generating array 111. As shown in fig. 3B1 and 3B2, the conductive paste 120 covers a portion of each ground line 110g and a portion of each signal line 110 s.

As shown in fig. 3C, the circuit board 130 is disposed on the conductive adhesive 120, the circuit board 130 has an opening 130a, and the opening 130a corresponds to the region R1 to form a second concave portion 130R above the first concave portion 120R.

As shown in fig. 3D, the acoustic wave transmission medium 140 can be formed in the first recess 120r and the second recess 130r by, for example, an injection technique. For example, the acoustic wave transmission medium 140 fills at least a portion of the first recess 120r and the second recess 130 r.

As shown in FIG. 3E, the cover plate 150 is disposed to cover the opening 130a of the circuit board 130, wherein the cover plate 150 covers the first recess 120r and the second recess 130 r. Although not shown, an adhesive layer may be formed between the cover plate 150 and the circuit board 130 to fix the relative position between the cover plate 150 and the circuit board 130.

As shown in fig. 3F, the package 160 may be formed by compression molding, liquid encapsulation, injection molding or transfer molding, for example, to encapsulate the micromachined ultrasonic transducer substrate 110, the conductive adhesive 120, a portion of the circuit board 130 and the cover plate 150, so as to form the ultrasonic probe 100. Another portion of the circuit board 130 protrudes out of the package body 160 to be electrically connected to the controller 10 (the controller 10 is shown in fig. 1B).

Referring to fig. 4A, 4B and 4C, fig. 4A, 4B and 4C are process diagrams of manufacturing the ultrasonic probe of fig. 2A.

As shown in fig. 4A, a micro-mechanical ultrasonic transducer substrate 210 is provided, wherein the micro-mechanical ultrasonic transducer substrate 110 includes an emitting surface 110u, an acoustic wave generating array 111, at least one retaining wall 212 and at least one conducting wire, such as at least one grounding wire 110g and at least one signal wire 110 s. The acoustic wave generating array 111 includes at least one acoustic wave generating unit 1111, a ground line 110g, and a signal line 110s extending from the corresponding acoustic wave generating unit 1111 to the edge of the emitting surface 110 u. As shown in fig. 4A, two retaining walls 212 are formed on two opposite edges of the emitting surface 110u, respectively.

As shown in fig. 4B, the conductive paste 120 may be formed on the emitting surface 110u of the micromachined ultrasonic transducer substrate 210 by, for example, a coating technique, for example, and is formed on the other two opposite edges of the emitting surface 110 u. The two retaining walls 212 and the conductive paste 120 surround the region R1, and a first recess 120R is formed corresponding to the region R1. The first recess 120r exposes the acoustic wave generating array 111. As shown in fig. 4B, the conductive adhesive 120 covers a portion of each ground line 110g and a portion of each signal line 110 s.

As shown in fig. 4C, the conductive adhesive 220 may be cut into a plurality of separated conductive adhesive pads 221 by using, for example, a cutting technique, wherein each ground line 110g is covered by the corresponding conductive adhesive pad 221 and each signal line 110s is covered by the corresponding conductive adhesive pad 221. Since the conductive adhesive pads 221 are separated from each other, even if the electrical transmission of the conductive adhesive 220 is non-directional, the adjacent two conductive adhesive pads 221 will not be electrically shorted. In addition, the aforementioned cutting step can be performed by using a knife or a laser, for example.

The remaining processing steps of the ultrasonic probe 200 are similar to the corresponding processing steps of the ultrasonic probe 100, and are not described herein again.

In summary, the ultrasonic probe provided by the present invention includes a micro-mechanical ultrasonic transducer substrate, a conductive adhesive, a circuit board and an acoustic wave transmission medium, wherein the micro-mechanical ultrasonic transducer substrate has an emitting surface, the conductive adhesive surrounds an area on the emitting surface, the area has a first recess, the circuit board has an opening, the circuit board is disposed on the conductive adhesive and corresponds to the area of the opening, the circuit board has a second recess, and the acoustic wave transmission medium is formed in the first recess and the second recess, so that the operability can be improved and the impedance can be weakened.

Although the present invention has been described in connection with the accompanying drawings, the embodiments disclosed in the drawings are intended to be illustrative of preferred embodiments of the present invention and should not be construed as limiting the invention. The scale in the schematic drawings does not represent the scale of actual components for the sake of clarity in describing the required components.

The present invention has been described in relation to the above embodiments, which are only exemplary of the implementation of the present invention. It should be noted that the disclosed embodiments do not limit the scope of the invention. Rather, it is intended that all such modifications and variations be included within the spirit and scope of this invention.