Novel plate with LVL structure
阅读说明：本技术 Lvl结构新型板材 (Novel plate with LVL structure ) 是由 柯伟浩 于 2019-11-19 设计创作，主要内容包括：本发明属于集成板材技术领域,具体涉及一种LVL结构新型板材,包括基材层,所述的基材层由若干竖向粘接在一起的木片组成,各木片相互平行,基材层的上下两面冲有破纤维槽；基材层的上下两面分别粘接有上单板I和下单板I。本发明基材层结构稳固,并且通过上单板I和下单板I也可以将基材层的各木片拉住,结构稳定性好,机械强度高,基材层的上下两面冲有破纤维槽,有效的将板材表面的生长纤维破断,减少板材自身应力对变形的影响,大大降低了板材的变形、翘曲几率。避免了使用粉末类、颗粒碎料,因此用胶量大大减少,可以降低到2％以下,甲醛含量极低、环保系数高,满足现代环保要求,且无静电、无放射性、绝缘、隔音、防潮性好。(The invention belongs to the technical field of integrated plates, and particularly relates to a novel plate with an LVL structure, which comprises a substrate layer, wherein the substrate layer is composed of a plurality of wood chips which are vertically bonded together, the wood chips are mutually parallel, and broken fiber grooves are punched on the upper surface and the lower surface of the substrate layer; the upper surface and the lower surface of the base material layer are respectively bonded with an upper veneer I and a lower veneer I. The base material layer has a stable structure, the wood chips of the base material layer can be pulled through the upper veneer I and the lower veneer I, the structural stability is good, the mechanical strength is high, the upper surface and the lower surface of the base material layer are provided with the fiber breaking grooves, the growing fibers on the surface of the plate are effectively broken, the influence of the self stress of the plate on the deformation is reduced, and the deformation and warping probability of the plate is greatly reduced. The method avoids the use of powder and particle crushed aggregates, so the glue consumption is greatly reduced to be less than 2 percent, the formaldehyde content is extremely low, the environmental protection coefficient is high, the modern environmental protection requirement is met, and the method has no static electricity, no radioactivity, insulation, sound insulation and good moisture resistance.)
1. The utility model provides a novel panel of LVL structure which characterized in that: the wood-plastic composite material comprises a base material layer (3), wherein the base material layer (3) is composed of a plurality of wood chips which are vertically bonded together, and fiber breaking grooves (6) are punched on the upper surface and the lower surface of the base material layer (3); an upper veneer I (2) and a lower veneer I (4) are respectively bonded on the upper surface and the lower surface of the substrate layer (3).
2. The novel plate material with LVL structure as claimed in claim 1, wherein: the fiber breaking grooves (6) are distributed in a groined shape, and the single fiber breaking groove (6) is parallel or vertical to the direction of the wood chips of the base material layer (3).
3. The novel plate material with LVL structure as claimed in claim 1, wherein: the depth of the fiber breaking groove (6) is 1-5 mm.
4. The novel plate material with LVL structure as claimed in claim 1, wherein: and an upper veneer II (1) and a lower veneer II (5) are also bonded on the outer sides of the upper veneer I (2) and the lower veneer I (4).
5. The novel plate material with LVL structure of claim 4, wherein: the fiber direction of the upper veneer I (2) is vertical to that of the upper veneer II (1), and the fiber direction of the lower veneer I (4) is vertical to that of the lower veneer II (5).
6. The novel plate material with LVL structure as claimed in claim 1, wherein: the thickness of the wood chips forming the substrate layer (3) is 1-5 mm.
7. The novel plate material with LVL structure as claimed in claim 1, wherein: the thickness c of the base material layer (3) is 10-50 mm.
8. The novel plate material with LVL structure of claim 4, wherein: the thickness of the upper veneer II (1), the thickness of the upper veneer I (2), the thickness of the lower veneer I (4) and the thickness of the lower veneer II (5) are 1-5 mm.
Technical Field
The invention relates to a novel plate with an LVL structure, and belongs to the technical field of integrated plates.
Background
LVL is a board which is made by rotary cutting or slicing raw wood as raw material into single boards, drying, gluing, assembling according to the grain or most of the grain, and hot pressing and gluing. However, after the laminated wood is used for a period of time, the deformation rate of the wood at different parts in the laminated wood is different, and the deformation and the warping of the laminated wood are caused by the change of internal stress. The base materials are made of powder and particle crushed materials, so that the adhesive is more than that of raw wood or solid wood boards, and the environmental protection problem is more easily caused. In addition, in order to reduce noise and create a quiet working and resting environment indoors, sound insulation needs to be considered during decoration. The sound is wave energy and can be transmitted only by a medium, and when the sound is transmitted in the same medium, the higher the density of the medium is, the higher the transmission speed is; another type of sound transmission is through a medium, i.e. from one medium, through the critical interface of two media into the other. However, when the board is used for manufacturing doors or wallboards, the sound insulation performance is problematic, and the use effect is poor.
Disclosure of Invention
According to the defects in the prior art, the technical problems to be solved by the invention are as follows: overcome prior art's not enough, provide a novel panel of LVL structure, structural stability is good, and mechanical strength is high, reduces the influence of internal stress change, reduces the laminated wood probability of warping to glue the volume less, the formaldehyde content is extremely low, satisfies the environmental protection demand, and the sound insulation is good.
The novel plate with the LVL structure comprises a base material layer, wherein the base material layer is composed of a plurality of wood chips which are vertically bonded together, the wood chips are mutually parallel, and fiber breaking grooves are punched on the upper surface and the lower surface of the base material layer; the upper surface and the lower surface of the base material layer are respectively bonded with an upper veneer I and a lower veneer I.
The wood chips of the base material layer, the upper veneer I, the base material layer and the lower veneer I are bonded through a small amount of aldehyde-free glue, the base material layer structure formed by the vertical wood chips is stable, and the wood chips of the base material layer can be pulled through the upper veneer I and the lower veneer I, so that structural stability is realized, and force applied in all directions can be borne. The upper surface and the lower surface of the substrate layer are subjected to fiber breaking treatment, the fiber breaking grooves can be manufactured by punching blades perpendicular to the fiber direction of the plate or other directions, the growing fibers on the surface of the plate can be effectively broken, the influence of the self stress of the plate on deformation is reduced, and the deformation probability of the plate is greatly reduced. Moreover, because the substrate layer avoids the internal powder structures such as fiber boards and particle boards, the glue consumption is greatly reduced, the environmental protection coefficient is high, and the modern environmental protection requirement is met.
The invention also avoids the defect that the expansion coefficient of the powder structure is larger after absorbing water, and has better moisture resistance.
The transmission of the sound energy is substantially the transmission of vibration amplitude, and when the sound energy is transmitted across the medium, the more the number of times of crossing the medium is, the larger the density difference between the media is, the larger the loss of the sound energy is, and the better the sound insulation performance is. When passing through the air medium, the sound wave transmitted by the air medium sequentially passes through the upper veneer I, the aldehyde-free glue layer, the base material layer, the aldehyde-free glue layer and the lower veneer I, and the sound wave is transmitted by multiple cross media among the air, the upper veneer I, the aldehyde-free glue layer, the base material layer, the aldehyde-free glue layer, the lower veneer I and the air, so that the sound insulation performance of the plate is greatly improved, and the plate has good sound insulation performance and good use effect when being used for manufacturing doors or wallboards.
Preferably, the fiber breaking grooves are distributed in a groined shape, and the single fiber breaking groove is parallel or vertical to the direction of the wood chips of the base material layer or at any other angle.
Preferably, the depth of the fiber breaking groove is 1-5 mm.
Last veneer I and lower veneer I outside still bond veneer II and lower veneer II, go up veneer II and lower veneer II and paste for the secondary, go up veneer I and lower veneer I about the substrate layer after two sides paste the completion promptly, paste veneer II and lower veneer II again, make the panel more firm, further improve structural stability and mechanical strength, and increase the sound wave and stride the medium number of times, further improve sound insulation performance.
The fiber directions of the upper single plate I and the upper single plate II are vertical to form a transverse and vertical cross type, and the fiber directions of the lower single plate I and the lower single plate II are vertical to form a transverse and vertical cross type, so that the stress of the plate is more balanced and stable.
Preferably, the thickness of the wood chips forming the base material layer is 1-5 mm.
Preferably, the thickness c of the base material layer is 10-50 mm.
Preferably, the thicknesses of the upper veneer I, the upper veneer II, the lower veneer I and the lower veneer II are respectively 1-5 mm.
Compared with the prior art, the invention has the beneficial effects that:
according to the novel plate with the LVL structure, the base material layer formed by the vertical wood chips is stable in structure, the wood chips of the base material layer can be pulled through the upper veneer I and the lower veneer I, the structural stability is good, the mechanical strength is high, fiber breaking grooves are punched in the upper surface and the lower surface of the base material layer, growing fibers on the surface of the plate are effectively broken, the influence of the self stress of the plate on deformation is reduced, and the deformation and warping probability of the plate is greatly reduced. Although the content of the solid wood particle board is generally lower than 5 percent when the adhesive is used, the invention avoids using powder and particle crushed aggregates, thereby greatly reducing the adhesive consumption to be lower than 2 percent, having extremely low formaldehyde content and high environmental protection coefficient, meeting the modern environmental protection requirement, and having better static electricity, radioactivity free, insulation, sound insulation and moisture resistance.
Drawings
FIG. 1 is a schematic view of an exploded structure of the present invention;
FIG. 2 is a schematic view of the combined structure of the present invention;
FIG. 3 is a partial enlarged view of portion A of FIG. 2;
FIG. 4 is a partial enlarged view of the portion B in FIG. 2;
FIG. 5 is a schematic view of the structure of the substrate layer;
fig. 6 is a side view of the substrate layer.
In the figure: 1. an upper veneer II; 2. an upper single board I; 3. a substrate layer; 4. a lower veneer I; 5. a lower veneer II; 6. fiber breaking grooves.
Detailed Description
The invention is further described below with reference to examples:
as shown in fig. 1 to 6, the novel plate material with the LVL structure comprises a
The
In this embodiment, the thickness of the wood chips constituting the
The invention effectively reduces the influence of the self stress of the plate on the deformation, has good structural stability and high mechanical strength, and greatly reduces the deformation probability of the plate. The composite material can use formaldehyde-free glue, greatly reduces the glue consumption, has extremely low formaldehyde content and high environmental protection coefficient, meets the requirement of modern environmental protection, has no static electricity, no radioactivity, is insulating, moistureproof and soundproof, reduces the volume passing through the embodiment by 42-45 db, can only reduce the volume of common LVL structural plates, fiberboards and solid wood particle boards by 22-25 db, 20-23 db and 18-22 db respectively under the same condition, and has excellent comprehensive performance.