阅读说明：本技术 包括防潮层的导电丙烯酸类压敏粘合带 (Conductive acrylic pressure-sensitive adhesive tape including moisture barrier layer ) 是由 崔汀完 金白心 于 2018-05-03 设计创作，主要内容包括：本公开涉及一种在防粘层中包括防潮层的丙烯酸类压敏粘合带,并且涉及一种能够通过防潮层增强粘附力,从而防止由水分导致的丙烯酸类粘合剂层的粘附力下降的丙烯酸类压敏粘合带。(The present disclosure relates to an acrylic pressure-sensitive adhesive tape including a moisture-proof layer in a release layer, and to an acrylic pressure-sensitive adhesive tape capable of enhancing adhesion by the moisture-proof layer, thereby preventing a decrease in adhesion of the acrylic adhesive layer caused by moisture.)

1. A pressure-sensitive adhesive tape comprising:

a base layer comprising a metal;

an adhesive layer stacked on one surface of the base layer and including an acrylic adhesive polymer resin; and

a release layer stacked on one surface of the adhesive layer,

wherein the release layer comprises a moisture barrier.

2. The pressure-sensitive adhesive tape according to claim 1,

wherein the acrylic adhesive polymer resin is a polymer in which an alkyl acrylate monomer having an alkyl group with a carbon number of 1 to 14 and a polar comonomer including a carbonyl group are copolymerized.

3. The pressure-sensitive adhesive tape according to claim 2,

wherein the alkyl acrylate monomer and the polar comonomer containing a carbonyl group are copolymerized in a weight ratio of 99-50: 1-50.

4. The pressure-sensitive adhesive tape according to claim 1,

wherein the adhesive layer comprises a conductive filler.

5. The pressure-sensitive adhesive tape according to claim 1,

wherein the release layer comprises a release film,

wherein the moisture barrier comprises a substrate film and a barrier coating, and

wherein the pressure-sensitive adhesive tape has a structure in which the base layer, the adhesive layer, the release film, the barrier coating layer, and the base film are sequentially stacked.

6. The pressure-sensitive adhesive tape according to claim 1,

wherein the moisture barrier comprises a substrate film and a barrier coating, and wherein the barrier coating comprises one or more selected from the group consisting of: aluminum oxide (AlO)_x) Silicon oxide (SiO)_x) Ethylene vinyl alcohol (EVOH), polyvinyl alcohol (PVA), and polyvinylidene chloride (PVDC).

7. The pressure-sensitive adhesive tape according to claim 1,

wherein the moisture barrier comprises a substrate film having a release treated surface and a barrier coating, and

wherein the pressure-sensitive adhesive tape has a structure in which the base layer, the adhesive layer, the base film, and the barrier coating layer are sequentially stacked.

8. The pressure-sensitive adhesive tape according to claim 1,

wherein the moisture-proof layer has a moisture permeability of 0.01g/m²Day to 6g/m²Day.

9. The pressure-sensitive adhesive tape according to claim 1,

wherein the adhesive tape has an average thickness of 5 to 500 μm.

10. The pressure-sensitive adhesive tape according to claim 1,

wherein the adhesive tape further comprises an adhesive layer and a release layer formed on the other surface of the base layer.

Technical Field

The present disclosure relates to a conductive acrylic pressure-sensitive adhesive tape including a moisture-proof layer in a release layer, and to a conductive acrylic pressure-sensitive adhesive tape capable of enhancing adhesion by preventing a decrease in adhesion of an acrylic adhesive layer caused by moisture.

Background

A typical conductive acrylic pressure-sensitive adhesive tape includes an adhesive layer containing an adhesive polymer resin containing a carboxylic acid component and a substrate layer containing a metal component. Such acrylic pressure sensitive adhesive tapes can cause metal carboxylation by metal ions migrating from the substrate layer to the adhesive layer and reacting with the carboxylic acid component of the adhesive layer (see page 462 of the handbook of pressure sensitive adhesive technology and applications). Metal carboxylation has the following problems: the adhesion of the adhesive layer is reduced and the shelf life of the tape is reduced. In particular, metal ions move more actively in high humidity environments.

In order to solve the above problems, an adhesive tape in which the acid functional group of the acrylic copolymer is replaced with a non-acidic non-polar monomer such as N-vinylpyrrolidone has been proposed (see korean patent registration No. 10-1182944). However, the adhesive tape does not have an acid functional group, and thus may have poor adhesion. Alternatively, a method of waterproofing by sealing an adhesive tape has been proposed, but there is a problem in that physical damage is caused to the adhesive tape and a separate sealing process is required.

[ Prior art documents ]

[ patent document ]

(patent document 1) Korean patent registration No. 10-1182944

[ non-patent document ]

(non-patent document 1) pressure-sensitive adhesive technology and application Manual

Disclosure of Invention

[ problem ] to

Accordingly, the inventors of the present disclosure have attempted to manufacture an adhesive tape in which the adhesion is enhanced by preventing the adhesion of the acrylic adhesive layer from being lowered due to moisture. Accordingly, the inventors of the present disclosure have completed the present invention by manufacturing a new form of adhesive tape (including a moisture-proof layer in a release layer).

Accordingly, it is an object of the present disclosure to provide an acrylic pressure-sensitive adhesive tape which enhances adhesion by preventing a decrease in adhesion of an acrylic adhesive layer caused by moisture by including a moisture-proof layer in a release layer.

[ technical solution ]

In order to achieve the above object, the present disclosure provides a pressure-sensitive adhesive tape comprising:

a base layer comprising a metal;

an adhesive layer stacked on one surface of the base layer and including an acrylic adhesive polymer resin; and

a release layer stacked on one surface of the adhesive layer,

wherein the release layer comprises a moisture barrier.

[ advantageous effects ]

The pressure-sensitive adhesive tape according to the present disclosure prevents a decrease in adhesion of an adhesive layer caused by moisture in a high-humidity environment, and has enhanced adhesion.

Drawings

Fig. 1 to 6 are schematic views of a pressure-sensitive adhesive tape according to one embodiment of the present disclosure.

Detailed Description

The pressure-sensitive adhesive tape of the present disclosure includes: a base layer comprising a metal; an adhesive layer stacked on one surface of the base layer and including an acrylic adhesive polymer resin; and a release layer stacked on one surface of the adhesive layer, wherein the release layer includes a moisture-proof layer.

In the specification of the present disclosure, "(meth) acrylic" means "acrylic and/or methacrylic", and "(meth) acrylate" means "acrylate and/or methacrylate".

Referring to fig. 1, a pressure-sensitive adhesive tape 100 according to an embodiment of the present disclosure may have a structure in which a base layer 110 including a metal, an adhesive layer 120 including an acrylic adhesive polymer resin, and a release layer 130 including a moisture-proof layer are sequentially stacked.

Base layer

The substrate layer is for supporting a pressure sensitive adhesive tape, and contains a metal and indicates electrical conductivity. In particular, the substrate layer may be one or more selected from the group consisting of: a conductive woven fabric, a conductive nonwoven fabric, a conductive treated woven fabric, a conductive treated nonwoven fabric, a metal foil, a metal film, and a conductive mesh film manufactured by coating a mesh sheet having conductivity with a polymer resin.

The thickness of the base layer may be 1 μm to 1mm, but may be thinner or thicker when necessary.

Adhesive layer

An adhesive layer may be stacked on one surface of the base layer and may include an acrylic adhesive polymer resin.

The acrylic adhesive polymer resin may be a copolymer in which an alkyl acrylate monomer having an alkyl group with a carbon number of 1 to 14 and a polar comonomer including a carbonyl group are copolymerized. Specifically, the acrylic adhesive polymer resin may be a copolymer in which the alkyl acrylate monomer and the polar comonomer including the carbonyl group are copolymerized in a weight ratio of 99 to 50:1 to 50.

Specifically, the alkyl acrylate monomer may be one or more selected from the group consisting of: butyl (meth) acrylate, hexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, and dodecyl (meth) acrylate. More specifically, the alkyl acrylate monomer may be isooctyl acrylate, isononyl acrylate, 2-ethylhexyl acrylate, decyl acrylate, dodecyl acrylate, n-butyl acrylate, or hexyl acrylate.

Polar comonomers containing carbonyl groups can enhance adhesion by adding tack and cohesion to the polymer resin. Specifically, the polar comonomer may be one or more selected from acrylic acid and itaconic acid.

The adhesive layer may comprise a conductive filler. The conductive filler may be arranged in the acrylic adhesive polymer resin in horizontal and vertical directions to form a network, and current may flow through the network of the conductive filler. Accordingly, when the adhesive layer contains the conductive filler, the adhesive layer may have conductivity.

The conductive filler may be selected from: metals, including noble and non-noble metals; noble or non-noble metal plated with noble metal; noble or non-noble metals plated with non-noble metals; non-metals plated with precious or non-precious metals; a conductive non-metal; a conductive polymer; and mixtures thereof. For example, the conductive filler may include: noble metals such as gold, silver or platinum, and non-noble metals such as nickel, copper, tin or aluminum; noble or non-noble metal plated with noble metals, such as silver plated copper, nickel, aluminum, tin, or gold; noble or non-noble metals plated with non-new metals, such as copper or silver plated with nickel; non-metals plated with precious or non-precious metals, such as silver or nickel plated graphite, glass, ceramics, plastics, elastomers, mica; conductive non-metals, such as carbon black or carbon fibers; conductive polymers such as polyacetylene, polyaniline, polypyrrole, polythiophene, polysulfide, polyparaphenylene, polyphenylene sulfide, polyparaphenylene vinylene; or mixtures thereof.

The conductive filler may have a particle shape or a shape similar thereto. For example, the conductive filler may use a material that can be morphologically classified into a broad "particle type". That is, any type of filler for providing conductivity in the related art may be applied without limitation, and in particular, the filler may have a solid microspherical shape, a hollow microspherical shape, an elastomer particle shape, an elastomer balloon shape, a sheet shape, a plate shape, a fiber shape, a rod shape, an indeterminate shape, or the like.

The size of the conductive filler is not particularly limited, but for example, the average diameter of the conductive filler may be 0.250 μm to 250 μm, and specifically, may be 1 μm to 100 μm.

The conductive filler may be included in an amount of 0.01 parts by weight to 500 parts by weight with respect to 100 parts by weight of the acrylic adhesive polymer resin. Specifically, the conductive filler may be included in an amount of 0.1 parts by weight to 100 parts by weight, relative to 100 parts by weight of the acrylic adhesive polymer resin.

The thickness of the adhesive layer may be 1 μm to 100 μm. Specifically, the thickness of the adhesive layer may be 2 μm to 50 μm.

As other additives in the manufacturing method thereof, the adhesive layer may further include a polymerization initiator, a crosslinking agent, a photoinitiator, a pigment, an antioxidant, a UV stabilizer, a dispersant, an anti-foaming agent, a thickener, a plasticizer, a tackifying resin, a polishing agent, and the like.

Anti-sticking layer

The release layer may be stacked on one surface of the adhesive layer and may include a moisture barrier. In one embodiment, the release layer may include a silicon coated release film and a moisture barrier. In one embodiment, the release layer may include a silicon coating formed on a surface contacting the adhesive layer. In particular, the release layer may include a silicon coated release film having a silicon coating positioned on one surface in contact with the adhesive layer and a moisture barrier. The moisture barrier layer prevents moisture from penetrating the adhesive layer.

Referring to fig. 2, the pressure-sensitive adhesive tape 100 according to one embodiment of the present disclosure may have a structure in which a base layer 110 including a metal, an adhesive layer 120 including an acrylic adhesive polymer resin, a release film 131, and a moisture-proof layer 132 are sequentially stacked. In addition, the release film 131 may include a silicon coating layer formed on the surface 210 contacting the adhesive layer 120.

The release film may be one or more selected from the group consisting of: polyester (PET) films, Polyethylene (PE) films, polypropylene (PP) films, and paper.

The thickness of the release film may be 5 μm to 100 μm, but may be thinner or thicker when necessary.

The moisture barrier layer may include a substrate film and a barrier coating.

The moisture permeability of the moisture barrier layer can be 0.01g/m²Day to 6g/m²Day. When the moisture permeability of the moisture-proof layer is within the above range, the adhesive force of the adhesive layer may be prevented from being lowered by moisture in a high-humidity environment, and thus the adhesive force of the adhesive tape may be enhanced.

Referring to fig. 3, the pressure-sensitive adhesive tape 100 according to an embodiment of the present disclosure may have a structure in which a base layer 110 including a metal, an adhesive layer 120 including an acrylic adhesive polymer resin, a release film 131, a barrier coating 133, and a base film 134 are sequentially stacked, and the release film 131 may include a silicon coating layer formed on a surface contacting the adhesive layer 120.

Referring to fig. 4, the pressure-sensitive adhesive tape 100 according to one embodiment of the present disclosure may have a structure in which a base layer 110 including a metal, an adhesive layer 120 including an acrylic adhesive polymer resin, a barrier coating layer 133 having one surface 220 subjected to release treatment, and a base film 134 are sequentially stacked. In this case, the anti-sticking treatment may be a silicon coating treatment.

Referring to fig. 5, the pressure-sensitive adhesive tape 100 according to one embodiment of the present disclosure may have a structure in which a base layer 110 including a metal, an adhesive layer 120 including an acrylic adhesive polymer resin, a base film 134 having one surface 220 subjected to release treatment, and a barrier coating 133 are sequentially stacked. In this case, the anti-sticking treatment may be a silicon coating treatment. That is, the barrier coating 133 may be exposed.

The base film 134 may be one or more selected from the group consisting of: polyester (PET) films, Polyethylene (PE) films, polypropylene (PP) films and Oriented Polyamide (OPA) films.

The thickness of the base film 134 may be 5 μm to 100 μm, but may be thinner or thicker when necessary.

The barrier coating 133 may be transparent. In particular, the transparent barrier coating may comprise one or more selected from the group consisting of: aluminum oxide (AlO)_x) Silicon oxide (SiO)_x) Ethylene vinyl alcohol (EVOH), polyvinyl alcohol (PVA), and polyvinylidene chloride (PVDC). When the barrier coating 133 is transparent, the adhesive layer 120 can be inspected with the naked eye.

The thickness of the barrier coating 133 may be 5nm to 500nm, but may be thinner or thicker when necessary.

The average thickness of the adhesive tape may be 5 μm to 500 μm. Specifically, the average thickness of the adhesive tape may be 10 μm to 300 μm.

The adhesive tape may further include the adhesive layer and the release layer formed on the other surface of the base layer. Referring to fig. 6, the pressure-sensitive adhesive tape 100 according to one embodiment of the present disclosure may have a structure in which a first release layer 130-1 including a moisture-proof layer, a first adhesive layer 121 including an acrylic adhesive polymer resin, a base layer 110 including a metal, a second adhesive layer 122 including an acrylic adhesive polymer resin, and a second release layer 130-2 including a moisture-proof layer are sequentially stacked. The first and second release layers are the same as the above release layer, and the first and second adhesive layers are the same as the above adhesive layer.

Hereinafter, the present disclosure will be described in more detail with reference to the following examples. However, the following embodiments are merely examples, and the scope of the present disclosure is not limited thereto.