阅读说明：本技术 Pet基膜底涂剂、改性pet膜和cmos芯片切割工艺用胶带及其制备方法与应用 (PET (polyethylene terephthalate) base film primer, modified PET film and adhesive tape for CMOS (complementary metal oxide semiconductor) chip cutting process as well as preparation method and applica) 是由 魏成龙 于 2019-10-14 设计创作，主要内容包括：本发明涉及电子元件制备技术领域,公开了一种PET基膜底涂剂,其组分包括溶剂以及粘接组分,粘接组分按重量份数计包括：天然橡胶0.48-0.72份、硅烷偶联剂0.8-1.2份以及聚乙烯醇8-12份。还公开了上述底涂剂的制备方法,即将上述各种组分混合均匀。还公开了改性PET膜,在PET基膜的一面涂布上述底涂剂。该改性PET膜与UV减粘胶层的粘接性好。还公开了CMOS芯片切割工艺用胶带,包括：依次设置的PET基膜、底涂剂层、UV减粘胶层以及离型膜,底涂剂层由上述的底涂剂涂布得到。还公开了以及上述胶带的制备方法。上述胶带应用在CMOS芯片切割工艺中时厚度变化量小,UV照射前具有优异的粘接性能。(The invention relates to the technical field of electronic element preparation, and discloses a PET (polyethylene terephthalate) base film primer which comprises the following components in parts by weight: 0.48-0.72 part of natural rubber, 0.8-1.2 parts of silane coupling agent and 8-12 parts of polyvinyl alcohol. Also discloses a preparation method of the primer, namely, the components are uniformly mixed. Also disclosed is a modified PET film, wherein the primer is coated on one side of the PET base film. The modified PET film has good adhesion with the UV visbreaking adhesive layer. Also disclosed is an adhesive tape for a CMOS chip dicing process, comprising: the PET base film, the primer layer, the UV visbreaking adhesive layer and the release film are sequentially arranged, and the primer layer is obtained by coating the primer. Also discloses a preparation method of the adhesive tape. When the adhesive tape is applied to a CMOS chip cutting process, the thickness variation is small, and the adhesive tape has excellent adhesive property before UV irradiation.)

1. The PET base film primer is characterized by comprising the following components in parts by weight: 0.48-0.72 part of natural rubber, 0.8-1.2 parts of silane coupling agent and 8-12 parts of polyvinyl alcohol.

2. The PET base film primer according to claim 1, characterized in that the ratio of the amount of the solvent to the mass of the polyvinyl alcohol is 100: 8-12;

preferably, the solvent is a small molecular alcohol, and the number of hydroxyl groups contained in each small molecular alcohol molecule is 1-4;

preferably, the small molecule alcohol comprises at least one of methanol, ethanol, ethylene glycol, propanol, propylene glycol and glycerol;

preferably, the components of the PET-based film primer further comprise water, and the ratio of the mass of the water to the mass of the solvent is 10-20: 100.

3. A method for preparing a PET-based film primer, comprising uniformly mixing the components of the PET-based film primer according to claim 1 or 2.

4. The method for preparing a PET-based film primer according to claim 3, wherein the natural rubber is mixed with the remaining components in the form of a natural rubber emulsion;

preferably, the amount of the natural rubber emulsion in the bonding component is 0.8-1.2 parts by weight.

5. A modified PET film comprising a PET base film and a primer layer formed by coating the PET base film primer according to claim 1 or 2 or the PET base film primer prepared by the method for preparing the PET base film primer according to claim 3 or 4 on one side of the PET base film.

6. A method for preparing a modified PET film, comprising coating the PET base film primer according to claim 1 or 2 or the PET base film primer prepared by the method for preparing a PET base film primer according to claim 3 or 4 on one side of a PET base film to form a primer layer.

7. An adhesive tape for a CMOS chip cutting process is characterized by comprising a PET base film, a bottom coating agent layer, a UV (ultraviolet) anti-adhesive layer and a release film which are sequentially arranged, wherein the bottom coating agent layer is formed by coating the PET base film bottom coating agent according to claim 1 or 2 or the PET base film bottom coating agent prepared by the preparation method of the PET base film bottom coating agent according to claim 3 or 4.

8. The CMOS chip cutting process tape according to claim 7, wherein the UV viscosity reducing glue layer is formed by coating UV viscosity reducing glue, and the UV viscosity reducing glue comprises the following components in parts by weight: 100 parts of base glue, 5-25 parts of polyfunctional group photosensitive resin, 0.5-5 parts of photoinitiator and 0.1-4 parts of curing agent;

preferably, the base rubber comprises the following components in percentage by mass: butyl acrylate, acrylic acid, methyl acrylate, BPO initiator, toluene, ethyl acetate and acetone at the ratio of 37-43:8-12:90-110:1.3-1.7:18-22:100: 25-35;

more preferably, the UV visbreaking glue further comprises 14-21 parts by weight of a diluent; further preferably, the diluent is ethyl acetate;

preferably, the multifunctional photosensitive resin includes at least one of ethylene glycol diacrylate, propylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, ditrimethylolpropane tetraacrylate, epoxy acrylate oligomer, polyurethane acrylate oligomer, isocyanate monomer and prepolymer, polyester acrylate oligomer, polyether acrylate oligomer, pure acrylic resin oligomer; more preferably, the multifunctional photosensitive resin is a trifunctional photosensitive resin: CN929, sartomer;

preferably, the photoinitiator comprises at least one of benzoin, benzil derivatives, a-hydroxyketone derivatives, a-aminoketone derivatives, acylphosphine oxides, benzophenone and derivatives thereof, triarylsulfonium salts, and ferrocenium salts; preferably, the photoinitiator is: IC-184, BASF;

preferably, the curing agent comprises at least one of an organic peroxide, a polyisocyanate, and a metal chelate;

preferably, the UV viscosity-reducing glue comprises the following components in parts by weight: 100 parts of base glue, 13-17 parts of polyfunctional group photosensitive resin, 2-3 parts of photoinitiator and 1-1.2 parts of curing agent.

9. A preparation method of an adhesive tape for a CMOS chip cutting process is characterized by comprising the following steps: sequentially arranging a primer layer, a UV (ultraviolet) adhesive reducing layer and a release film on a PET (polyethylene terephthalate) base film, wherein the primer layer is formed by coating the PET base film primer according to claim 1 or 2 or the PET base film primer prepared by the preparation method of the PET base film primer according to claim 3 or 4;

preferably, a primer layer, a UV (ultraviolet) anti-adhesive layer and a release film are sequentially arranged on the PET base film to obtain a primary adhesive tape product, and the primary adhesive tape product is dried and cured at normal temperature to obtain a finished adhesive tape product;

preferably, the drying temperature is 100-120 ℃, and the drying time is 2-3 minutes;

preferably, the normal-temperature curing time is 6-8 days;

preferably, the coating amount of the primer on the PET base film is 0.5 to 1g/m²(ii) a The coating weight of the UV visbreaking glue layer is 20-24g/m²；

Preferably, the thickness of the PET-based film is 80 to 120 μm;

preferably, the release film is a single-side silicon-coated PET release film; more preferably, the thickness of the release film is 30-50 μm;

preferably, the UV viscosity-reducing glue comprises the following components in parts by weight: 100 parts of base glue, 5-25 parts of polyfunctional group photosensitive resin, 0.5-5 parts of photoinitiator and 0.1-4 parts of curing agent; more preferably, the UV viscosity-reducing glue comprises the following components in parts by weight: 100 parts of base glue, 13-17 parts of polyfunctional group photosensitive resin, 2-3 parts of photoinitiator and 1-1.2 parts of curing agent; more preferably, the UV visbreaking glue further comprises 14-21 parts by weight of a diluent; further preferably, the diluent is ethyl acetate;

more preferably, the preparation method of the base rubber comprises the following steps: the mass ratio is as follows: 8-43: 8-12:90-110:1.3-1.7:18-22:100:25-35 butyl acrylate, acrylic acid, methyl acrylate, BPO initiator, toluene, ethyl acetate and acetone are uniformly mixed to obtain primary base glue mixed solution, one part of the primary base glue mixed solution is placed in a container to be heated to 75-95 ℃, heat is preserved for 20-40min, the rest part of the primary base glue mixed solution is dripped into the container, the dripping time is 2.5-3.5h, and heat is preserved for 3-5h after dripping is finished; more preferably, the dropping process is dropping while stirring; more preferably, the heated primary base rubber mixed liquor accounts for 50-70% of the total mass of the primary base rubber mixed liquor.

10. The use of the adhesive tape for CMOS chip dicing process according to claim 7 or 8 in a CMOS chip dicing process.

Technical Field

The invention relates to the technical field of electronic element preparation, in particular to a PET base film primer, a modified PET film and a CMOS chip adhesive tape for a cutting process, and a preparation method and application thereof.

Background

The image sensor is an important component of the camera, and mainly performs the task of converting an external optical signal of the camera into an electrical signal, and then the electrical signal is processed by a series of electrical signals and further converted into an image which can be displayed on a display or other display equipment. The most widely used image sensors are Charge Coupled Device (CCD) image sensors and Complementary Metal Oxide Semiconductor (CMOS) image sensors.

The CMOS image sensor chip adopts a CMOS process, can integrate an image acquisition unit and a signal processing unit on one chip, not only reduces the power consumption, but also has the advantages of lighter weight, reduced occupied space and lower overall price.

In the CMOS process packaging section, finished products are cut into independent chips from a prepared wafer, an adhesive tape is used for bearing, the material is divided into multiple layers made of different materials, the cutting process is divided into two steps, half cutting of the chips is firstly carried out, and then final cutting is finished. The half-cut process has high requirements for TTV (total thermal degradation), the adhesive tape needs to keep certain viscosity during cutting to prevent the wafer from shaking and damaging, the bearing adhesive tape is required to be easily torn off after cutting, the traditional non-UV anti-sticking adhesive tape is easy to tear off to cause the cutting part to break, and the commonly used PO substrate UV anti-sticking adhesive tape easily causes circuit damage due to large deviation of the substrate TTV, so that the yield is reduced.

In view of this, the invention is particularly proposed.

Disclosure of Invention

The invention provides a PET (polyethylene terephthalate) base film primer and a preparation method thereof, and a modified PET film and a preparation method thereof, aiming at solving the problem of small bonding strength between the PET base film and a UV (ultraviolet) anti-adhesive layer.

The invention provides an adhesive tape for a CMOS chip cutting process and a preparation method thereof, aiming at solving the problem of overlarge thickness change of the adhesive tape in the CMOS chip cutting process.

When the adhesive tape for the CMOS chip cutting process is applied to the CMOS chip cutting process, the CMOS chip with better quality can be obtained.

The invention is realized by the following steps:

in a first aspect, an embodiment of the present invention provides a PET-based film primer, which comprises components including a solvent and an adhesion component, wherein the adhesion component includes, in parts by weight: 0.48-0.72 part of natural rubber, 0.8-1.2 parts of silane coupling agent and 8-12 parts of polyvinyl alcohol.

In an alternative embodiment of the invention, the ratio of the amount of solvent to the mass of polyvinyl alcohol is from 100:8 to 12;

in an alternative embodiment of the invention, the solvent is a small molecule alcohol, and the number of hydroxyl groups contained in each small molecule alcohol molecule is 1-4;

in an alternative embodiment of the present invention, the small molecule alcohol comprises at least one of methanol, ethanol, ethylene glycol, propanol, propylene glycol, and glycerol.

In an alternative embodiment of the invention, the components of the PET-based film primer further comprise water, the ratio of the mass of water to the mass of solvent being 10-20: 100.

In a second aspect, embodiments of the present invention provide a method for preparing a PET-based film primer, including uniformly mixing various components of any one of the above PET-based film primers.

In an alternative embodiment of the invention, the natural rubber is mixed with the remaining components in the form of a natural rubber emulsion;

in an alternative embodiment of the invention, the natural rubber latex is used in an amount of 0.8 to 1.2 parts by weight of the adhesive component.

In a third aspect, an embodiment of the present invention provides a modified PET film, including a PET base film and a primer layer formed by coating one side of the PET base film with any one of the above PET base film primers or the PET base film primer prepared by the preparation method of any one of the above PET base film primers.

In a fourth aspect, embodiments of the present invention provide a method for preparing a modified PET film, including coating any one of the above PET base film primers or the PET base film primer prepared by the above preparation method on one side of a PET base film to form a primer layer.

In a fifth aspect, an embodiment of the present invention provides an adhesive tape for a CMOS chip dicing process, including a PET base film, a primer layer, a UV anti-adhesive layer, and a release film, which are sequentially disposed, wherein the primer layer is formed by coating any one of the above PET base film primers or a PET base film primer prepared by the above preparation method of any one of the above PET base film primers.

In an optional embodiment of the present invention, the UV viscosity-reducing glue layer is formed by coating UV viscosity-reducing glue, and the UV viscosity-reducing glue comprises the following components in parts by weight: 100 parts of base glue, 5-25 parts of polyfunctional group photosensitive resin, 0.5-5 parts of photoinitiator and 0.1-4 parts of curing agent;

in an optional embodiment of the present invention, the base rubber comprises, by mass: butyl acrylate, acrylic acid, methyl acrylate, BPO initiator, toluene, ethyl acetate and acetone at the ratio of 37-43:8-12:90-110:1.3-1.7:18-22:100: 25-35;

in an optional embodiment of the invention, the UV visbreaking glue further comprises 14-21 parts by weight of a diluent; further preferably, the diluent is ethyl acetate;

in an alternative embodiment of the present invention, the multifunctional photosensitive resin includes at least one of ethylene glycol diacrylate, propylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, ditrimethylolpropane tetraacrylate, epoxy acrylate oligomers, urethane acrylate oligomers, isocyanate monomers and prepolymers, polyester acrylate oligomers, polyether acrylate oligomers, pure acrylic resin oligomers; more preferably, the multifunctional photosensitive resin is a trifunctional photosensitive resin: CN929, sartomer;

in an alternative embodiment of the present invention, the photoinitiator comprises at least one of benzoin, benzil derivatives, a-hydroxyketone derivatives, a-aminoketone derivatives, acylphosphine oxides, benzophenone and its derivatives, triarylsulfonium salts, and ferrocenium salts; preferably, the photoinitiator is: IC-184, BASF;

in an alternative embodiment of the present invention, the curing agent comprises at least one of an organic peroxide, a polyisocyanate, and a metal chelate;

in an optional embodiment of the invention, the UV viscosity-reducing glue comprises the following components in parts by weight: 100 parts of base glue, 13-17 parts of polyfunctional group photosensitive resin, 2-3 parts of photoinitiator and 1-1.2 parts of curing agent.

In a sixth aspect, an embodiment of the present invention provides a method for preparing an adhesive tape for a CMOS chip dicing process, including: sequentially arranging a bottom coating agent layer, a UV (ultraviolet) anti-adhesive layer and a release film on the PET base film, wherein the bottom coating agent layer is formed by coating any one of the PET base film bottom coating agents or the PET base film bottom coating agent prepared by the preparation method of any one of the PET base film bottom coating agents;

in an optional embodiment of the invention, a primer layer, a UV (ultraviolet) anti-adhesive layer and a release film are sequentially arranged on a PET (polyethylene terephthalate) base film to obtain a primary adhesive tape product, and the primary adhesive tape product is dried and cured at normal temperature to obtain a finished adhesive tape product;

in an alternative embodiment of the present invention, the drying temperature is 100-120 ℃, and the drying time is 2-3 minutes;

in an optional embodiment of the invention, the normal temperature ripening time is 6-8 days;

in an alternative embodiment of the invention, the primer is applied to the PET base film in an amount of 0.5 to 1g/m²(ii) a The coating amount of the UV viscosity reducing glue on the UV viscosity reducing glue layer is 20-24g/m²；

In an alternative embodiment of the invention, the PET-based film has a thickness of 80 to 120 μm;

in an optional embodiment of the invention, the release film is a single-sided silicon-coated PET release film; more preferably, the thickness of the release film is 30-50 μm;

in an optional embodiment of the invention, the UV viscosity-reducing glue comprises the following components in parts by weight: 100 parts of base glue, 5-25 parts of polyfunctional group photosensitive resin, 0.5-5 parts of photoinitiator and 0.1-4 parts of curing agent; more preferably, the UV visbreaking glue comprises the following components in parts by weight: 100 parts of base glue, 13-17 parts of polyfunctional group photosensitive resin, 2-3 parts of photoinitiator and 1-1.2 parts of curing agent; more preferably, the UV visbreaking glue also comprises 14-21 parts by weight of diluent; further preferably, the diluent is ethyl acetate;

in an alternative embodiment of the invention, the method of preparing the base gum comprises: the mass ratio is as follows: 8-43: 8-12:90-110:1.3-1.7:18-22:100:25-35 butyl acrylate, acrylic acid, methyl acrylate, BPO initiator, toluene, ethyl acetate and acetone are uniformly mixed to obtain primary base glue mixed solution, one part of the primary base glue mixed solution is placed in a container to be heated to 75-95 ℃, after heat preservation is carried out for 20-40min, the rest part of the primary base glue mixed solution is dripped into the container, the dripping time is 2.5-3.5h, and after the dripping is finished, heat preservation is carried out for 3-5 h; more preferably, the dropping process is dropping while stirring; more preferably, the heated primary base gum mixed liquor accounts for 50-70% of the total mass of the primary base gum mixed liquor.

In a seventh aspect, an embodiment of the present invention provides an application of the adhesive tape for a CMOS chip dicing process according to the foregoing embodiment or the adhesive tape for a CMOS chip dicing process manufactured by the method for manufacturing the adhesive tape for a CMOS chip dicing process according to the foregoing embodiment in a CMOS chip dicing process.

The invention has the following beneficial effects:

according to the PET base film primer obtained through the design, the primer is composed of natural rubber, a silane coupling agent, polyvinyl alcohol and a solvent which are reasonably proportioned, the components are matched and cooperated with each other, the primer is coated on one surface of the PET base film, the bonding strength between the PET base film and a UV (ultraviolet) anti-adhesive layer can be improved, so that the adhesive tape for the CMOS chip cutting process using the PET material as the base film has excellent bonding performance on the premise of meeting the requirement of small thickness variation, and has excellent stripping performance after UV irradiation.

The PET base film primer provided by the invention can be prepared by the preparation method of the PET base film primer designed by the invention.

According to the modified PET film obtained through the design, as the PET base film primer is coated on one surface of the PET base film, the modified PET film has good adhesion with the UV visbreaker layer when being used for manufacturing the adhesive tape for the CMOS chip cutting process.

According to the preparation method of the modified PET film designed by the invention, the modified PET film provided by the invention can be prepared.

According to the adhesive tape for the CMOS chip cutting process, which is obtained through the design, the base film of the adhesive tape is the PET base film, the primer provided by the invention is coated between the PET base film and the UV visbreaking adhesive layer, and the bonding performance between the ET base film and the UV visbreaking adhesive layer is good, so that the adhesive tape has the advantages of small thickness variation when being applied to the CMOS chip cutting process, excellent bonding performance before UV irradiation and excellent stripping performance after UV irradiation.

The adhesive tape for the CMOS chip cutting process can be prepared by the preparation method of the adhesive tape for the CMOS chip cutting process.

When the adhesive tape for the CMOS chip cutting process, which is obtained by the design, is applied to the CMOS chip cutting process, the CMOS image sensor chip with good quality can be prepared.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic diagram corresponding to a case where the adhesive force of the hundred grids is 5B;

FIG. 2 is a schematic diagram corresponding to the case where the hundred lattice adhesion is 4B;

FIG. 3 is a schematic diagram corresponding to the case where the hundred lattice adhesion is 3B;

FIG. 4 is a schematic diagram corresponding to the case where the hundred lattice adhesion is 2B;

FIG. 5 is a schematic diagram corresponding to the case where the hundred lattice adhesion is 1B;

fig. 6 is a corresponding schematic diagram when the hundred lattice adhesion is 0B.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

The PET base film primer, the modified PET film, and the adhesive tape for CMOS chip dicing process, which are provided by the embodiment of the present invention, and the preparation method and the application thereof are specifically described below.

The PET base film primer provided by the embodiment of the invention comprises the following components in parts by weight: 0.48-0.72 part of natural rubber, 0.8-1.2 parts of silane coupling agent and 8-12 parts of polyvinyl alcohol.

In order to enable the adhesive tape for the CMOS chip cutting process to meet the requirement of the CMOS chip cutting process on the TTV (total thickness variation), the inventor finds that the TTV of the adhesive tape can be effectively improved by replacing the existing PO substrate with the PET film, but the adhesion of the PET substrate to the UV viscosity reducing adhesive is poor.

The silane coupling agent generates strong secondary valence bonds with the surface of the base material and the adhesive layer to increase the adhesive force, so that the main force and the adhesive force are improved (4B); the natural rubber coating coupling agent mainly supplements viscosity and buffers UV shrinkage effect, the polyvinyl alcohol assists in improving adhesive force (2B), and the three components cooperate with each other to achieve synergistic effect, so that the primer can enhance the adhesive strength between the UV visbreaking adhesive layer and the PET base film after being coated on the PET base film.

Preferably, the ratio of the amount of the solvent to the mass of the polyvinyl alcohol is 100: 8-12. The solvent in the dosage range can ensure that the bonding components are completely dissolved and uniformly dispersed with each other. The solvent is small molecular alcohol, and the number of hydroxyl contained in each small molecular alcohol molecule is 1-4. The small molecular alcohol is mainly selected from the leveling property of the primer, and the high molecular weight of the selected solvent can cause the leveling property of the primer to be poor. In the present invention, small molecule alcohol mainly refers to alcohol having a molecular weight of less than 500. More preferably, the small molecule alcohol comprises at least one of methanol, ethanol, ethylene glycol, propanol, propylene glycol, and glycerol. In various embodiments of the present invention, a methanol working solvent is selected.

Preferably, the composition further comprises water. Water is added into the components to adjust the leveling property of the primer, so that the leveling property of the primer is better. Preferably, the ratio of the mass of water to the mass of solvent is 10-20: 100.

The preparation method of the PET base film primer provided by the embodiment of the invention comprises the step of uniformly mixing various components of the PET base film primer provided by the embodiment of the invention.

Preferably, the natural rubber is mixed with the remaining components in the form of a natural rubber emulsion; the natural rubber is directly mixed with other components and is difficult to be uniformly mixed. Therefore, the finished natural rubber emulsion is usually purchased directly in the production process to produce the primer, and the natural rubber in the emulsion state is easy to be mixed with other components uniformly. Preferably, the natural rubber emulsion is used in an amount of 0.8 to 1.2 parts by weight. The natural rubber latex used in each of the examples provided herein had a mass concentration of 60%.

The modified PET film provided by the embodiment of the invention comprises a PET base film and a primer layer formed by coating the base film primer provided by the embodiment of the invention or the PET base film primer prepared by the preparation method of the PET base film primer provided by the embodiment of the invention on one surface of the PET base film.

The preparation method of the modified PET film provided by the embodiment of the invention comprises the step of coating the PET base film primer provided by the embodiment of the invention or the PET base film primer prepared by the preparation method of the PET base film primer provided by the embodiment of the invention on one surface of the PET base film to form a primer layer.

According to the modified PET film provided by the embodiment of the invention, the PET base film primer is coated on one surface of the PET base film, and when the modified PET film is used for manufacturing an adhesive tape for a CMOS chip cutting process, the modified PET film has good adhesion with a UV (ultraviolet) adhesive reducing layer.

The adhesive tape for the CMOS chip cutting process comprises a PET base film, a bottom coating agent layer, a UV (ultraviolet) anti-adhesive layer and a release film which are sequentially arranged, wherein the bottom coating agent layer is formed by coating the bottom coating agent prepared by the preparation method of the PET base film bottom coating agent provided by the embodiment of the invention.

The adhesive tape for the CMOS chip cutting process takes the film made of the PET material as the base film, so that compared with a PO base film, the TTV of the adhesive tape can be effectively improved, and the TTV value meets the requirement that the TTV value is less than or equal to 5. And because the primer layer is arranged between the PET base film and the UV visbreaking adhesive layer, the adhesive property between the UV visbreaking adhesive layer and the PET base film can be improved, and the SUS peel strength can reach the requirement of more than 14N/25mm before irradiation.

Preferably, the UV viscosity-reducing glue layer is formed by coating UV viscosity-reducing glue, and the UV viscosity-reducing glue comprises the following components in parts by weight: 100 parts of base glue, 5-25 parts of polyfunctional group photosensitive resin, 0.5-5 parts of photoinitiator and 0.1-4 parts of curing agent. The UV light-induced strippable glue layer can be formed after the UV light-induced strippable glue formed by the components is coated.

Specifically, the base rubber comprises the following components in percentage by mass: 37-43:8-12:90-110:1.3-1.7:18-22:100:25-35 of butyl acrylate, acrylic acid, methyl acrylate, BPO initiator, toluene, ethyl acetate and acetone.

Preferably, the UV visbreaking glue also comprises 14-21 parts by weight of diluent; further preferably, the diluent is ethyl acetate. The function of the diluent is to adjust the leveling of the UV visbreaker glue.

Preferably, the multifunctional photosensitive resin includes at least one of ethylene glycol diacrylate, propylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, ditrimethylolpropane tetraacrylate, epoxy acrylate oligomer, urethane acrylate oligomer, isocyanate monomer and prepolymer, polyester acrylate oligomer, polyether acrylate oligomer, pure acrylic resin oligomer; in preferred embodiments of the present invention, the multifunctional photosensitive resin is a trifunctional photosensitive resin: CN929, sartomer.

Preferably, the photoinitiator includes at least one of benzoin, benzil derivatives, a-hydroxyketone derivatives, a-aminoketone derivatives, acylphosphine oxides, benzophenones and derivatives thereof, triarylsulfonium salts, and ferrocenium salts. In preferred embodiments of the present invention, the photoinitiator is selected from the group consisting of: IC-184, BASF.

Preferably, the curing agent includes at least one of an organic peroxide, a polyisocyanate, and a metal chelate. In each preferred embodiment provided by the invention, the curing agent is isocyanate curing agent (L-45).

Preferably, the UV visbreaking glue comprises the following components in parts by weight: 100 parts of base glue, 13-17 parts of polyfunctional group photosensitive resin, 2-3 parts of photoinitiator and 1-1.2 parts of curing agent.

The preparation method of the adhesive tape for the CMOS chip cutting process, provided by the embodiment of the invention, comprises the following steps: the primer coating, the UV anti-adhesive layer and the release film are sequentially arranged on the PET base film, and the primer coating is formed by coating the primer prepared by the preparation method of the PET base film primer provided by the embodiment of the invention.

The method specifically comprises the following steps:

firstly, the UV viscosity-reducing glue is prepared in advance for standby, and the finished UV viscosity-reducing glue can be directly purchased. The preparation method of the UV visbreaking glue comprises the following steps: the same amount of base glue, polyfunctional group photosensitive resin, photoinitiator, curing agent and diluent in the components of the adhesive tape for the CMOS chip cutting process mentioned in the above are mixed uniformly.

The preparation method of the base rubber comprises the following steps: the mass ratio is as follows: 8-43: 8-12:90-110:1.3-1.7:18-22:100:25-35 butyl acrylate, acrylic acid, methyl acrylate, BPO initiator, toluene, ethyl acetate and acetone are uniformly mixed to obtain primary base glue mixed solution, the primary base glue mixed solution is divided into two parts, one part of the primary base glue mixed solution is heated to 75-95 ℃ in a container, the temperature is kept for 20-40min, the other part of the primary base glue mixed solution is dripped into the container, the dripping time is 2.5-3.5h, and the temperature is kept for 3-5h after the dripping is finished; more preferably, the dropping process is dropping while stirring; more preferably, the heated primary base gum mixed liquor accounts for 50-70% of the total primary base gum mixed liquor mass.

Secondly, uniformly coating the primer on the PET base film by using an RSD10# wire bar on an automatic coating machine, wherein the PET base film can be 80-120 mu m thick. In various embodiments provided herein, the PET base film is a 100 μm thick PET base film (tokyo, PY 2). The coating weight of the primer is 0.5-1g/m to ensure the bonding effect²。

Then, coating UV (ultraviolet) viscosity reducing glue on the PET (polyethylene terephthalate) base film coated with the primer, wherein the coating weight is 20-24g/m for ensuring the use quality of the adhesive tape for the CMOS (complementary metal oxide semiconductor) chip cutting process²To form a UV vis-breaking bond line. And after the coating is finished, arranging a release film on the UV viscosity-reducing adhesive layer to obtain an adhesive tape primary product. Preferably, the release film is a single-sided silicon-coated PET release film, and more preferably, the thickness of the release film is 30-50 μm. The manufacturers and the models of the release films selected in the embodiments provided by the invention are as follows: east li of japan, XP3 BR.

And (3) placing the primary adhesive tape in an oven, drying at the temperature of 100-120 ℃ for 2-3 minutes, and curing at normal temperature for 6-8 days to obtain a finished adhesive tape.

The adhesive tape for the CMOS chip cutting process provided by the embodiment of the invention can be applied to the CMOS chip cutting process, when the adhesive tape is applied to the CMOS chip cutting process, the SUS peel strength can reach the requirement of more than 14N/25mm before irradiation, and the TTV value can meet the requirement of less than or equal to 3.

The features and properties of the present invention are described in further detail below with reference to examples.