阅读说明：本技术 一种高深宽比结构斜齿光栅板的制作方法及光栅板 (Manufacturing method of helical-tooth grating plate with high aspect ratio structure and grating plate ) 是由 岳力挽 毛智彪 顾大公 马潇 许从应 于 2019-09-16 设计创作，主要内容包括：本发明适用于光学全息成像技术领域,提供了一种高深宽比结构斜齿光栅板的制作方法及光栅板,其中,方法包括：对衬底进行直角刻蚀形成凹槽；对所述凹槽的一侧进行斜角刻蚀形成第一斜角；在形成所述第一斜角的衬底上设置第一介质膜并进行晶圆键合形成倒斜角；对形成所述倒斜角的衬底进行斜角刻蚀形成第二斜角,得到斜齿光栅板；在所述非对称斜齿光栅板上设置第二介质膜,进行键合及刻蚀形成高深宽比结构斜齿光栅板。本发明能够形成高深宽比结构斜齿光栅板,有利于增强光学全息成像的效果,且通过投影式光刻方式结合晶圆键合制作所述高深宽比结构斜齿光栅板,可以加快制作速度,提高生产效率。(The invention is suitable for the technical field of optical holographic imaging, and provides a manufacturing method of a helical tooth grating plate with a high aspect ratio structure and the grating plate, wherein the method comprises the following steps: carrying out right-angle etching on the substrate to form a groove; performing bevel etching on one side of the groove to form a first bevel; arranging a first dielectric film on the substrate on which the first bevel is formed and bonding wafers to form a bevel; performing bevel etching on the substrate with the bevel angle formed to form a second bevel angle to obtain a helical tooth grating plate; and arranging a second dielectric film on the asymmetric helical grating plate, and bonding and etching to form the helical grating plate with the high aspect ratio structure. The invention can form the helical tooth grating plate with the high aspect ratio structure, is beneficial to enhancing the effect of optical holographic imaging, and can accelerate the manufacturing speed and improve the production efficiency by manufacturing the helical tooth grating plate with the high aspect ratio structure by combining the projection type photoetching mode with the wafer bonding.)

1. A method for manufacturing a helical grating plate with a high aspect ratio structure is characterized by comprising the following steps:

carrying out right-angle etching on the substrate to form a groove;

performing bevel etching on one side of the groove to form a first bevel;

arranging a first dielectric film on the substrate on which the first bevel is formed and bonding wafers to form a bevel;

performing bevel etching on the substrate with the bevel angle formed to form a second bevel angle to obtain an asymmetric helical tooth grating plate;

and arranging a second dielectric film on the asymmetric helical grating plate, and bonding and etching to form the helical grating plate with the high aspect ratio structure.

2. The method for manufacturing a grating plate with a high aspect ratio and a helical tooth according to claim 1, wherein the step of performing bevel etching on one side of the groove to form a first bevel comprises:

deviating the position of the photomask plate corresponding to the groove from the first side of the groove;

photoetching the photoresist on the substrate with the groove formed, and etching the middle layer to expose a first side right-angle area of the groove and reserve the coverage of the photoresist in a second side right-angle area;

and etching the right-angle area at the first side of the groove to form the first bevel angle.

3. The method according to claim 1, wherein the step of forming the bevel angle by wafer bonding by disposing a first dielectric film on the substrate on which the first bevel angle is formed specifically comprises:

arranging a first dielectric film forming dielectric film groove in the groove of the substrate forming the first bevel;

grinding and wafer bonding are carried out on the substrate with the dielectric film groove;

turning over the substrate subjected to wafer bonding, and grinding the substrate on the upper layer of the groove of the dielectric film;

and etching the ground substrate, and removing the first dielectric film in the dielectric film groove to form a chamfer angle.

4. The method according to claim 2, wherein the step of performing bevel etching on the substrate on which the bevel is formed to form a second bevel and obtaining the grating plate comprises:

deviating the position of the photomask plate corresponding to the substrate with the chamfer angle towards the first side of the substrate;

photoetching the photoresist on the substrate with the chamfer angle, and etching the intermediate layer to expose a right-angle area at the first side of the groove for forming the chamfer angle and reserve the coverage of the photoresist in a chamfer angle area at the second side;

and etching the right-angle area of the first side of the groove which forms the chamfer angle to form the second chamfer angle, thereby obtaining the helical tooth grating plate.

5. The method for manufacturing a grating plate with a high aspect ratio and a slanted tooth as claimed in claim 1, wherein the step of disposing a second dielectric film on the asymmetric slanted tooth grating plate specifically comprises:

arranging the second dielectric film on the asymmetric helical grating plate for full coverage;

and grinding the upper surface of the asymmetric helical grating plate, and removing the second dielectric film arranged on the upper surface of the asymmetric helical grating plate.

6. The method for manufacturing a grating plate with a tapered grating having a high aspect ratio according to claim 1, wherein the steps of bonding and etching to form the grating plate with a tapered grating having a high aspect ratio comprise:

bonding the two ground asymmetric helical grating plates, and offsetting the asymmetric helical grating plate arranged on the upper layer to one side relative to the helical grating plate on the lower layer, so that the positions of the parts of the upper layer and the lower layer on which the second dielectric films are formed correspond;

grinding the bonded upper layer of the asymmetric helical-tooth grating plate, and removing the substrate on the upper surface of the upper layer of the second dielectric film;

and removing the second dielectric film of the asymmetric helical grating plate by etching, and repeatedly executing the processes of setting the second dielectric film, grinding, bonding, re-grinding and etching for multiple times to form the helical grating plate with the high aspect ratio structure.

7. The method for manufacturing a grating plate with a helical tooth structure and a high aspect ratio according to claim 1, wherein the step of performing right-angle etching on the substrate to form the groove specifically comprises:

arranging the photomask plate right above the substrate;

photoetching the photoresist formed on the substrate, and etching the intermediate layer;

and carrying out the right-angle etching on the substrate to form a groove.

8. The method for manufacturing a grating plate with a high aspect ratio and slanted teeth as claimed in claim 2, wherein before the step of disposing the position of the photomask plate corresponding to the groove to deviate from the first side of the groove, the method further comprises the steps of:

removing the photoresist and the intermediate layer on the substrate on which the groove is formed;

and spin-coating the photoresist and the intermediate layer on the substrate with the groove to completely cover the substrate.

9. A grating plate, comprising the method for manufacturing a grating plate with inclined teeth and high aspect ratio structure as claimed in any one of claims 1 to 8.

Technical Field

The invention belongs to the technical field of optical holographic imaging, and relates to a manufacturing method of a helical tooth grating plate with a high aspect ratio structure and the grating plate.

Background

A grating plate is a precision optical element with a spatially periodic structure. The conversion of the phase and amplitude of the object to be shot is realized by decomposing the polychromatic light by using the principle of light diffraction, and the human brain processes several pictures at different angles through the visual difference of two eyes to form an image with depth. The product can be widely used in indoor advertising lamp boxes such as hotels, shopping malls, gymnasiums, airport lounges, waiting kiosks and the like, and wedding buildings, figure portraits and decorative paintings.

In the prior art, in the manufacture of an integrated circuit chip, an immersion lithography machine is used for lithography, photoresist is exposed and then is combined with a part needing to be removed through etching treatment, so that a symmetrical tooth-shaped grid plate, such as a right-angle type, a reverse oblique angle type or an oblique angle type, can be manufactured, the three-dimensional imaging effect of the symmetrical grating plate is poor, an oblique tooth-shaped grating is developed for improving the three-dimensional imaging effect, the existing oblique tooth-shaped grating is in an electron beam direct writing mode, the speed is slow, 2-5 hours are needed for writing an 8-inch wafer, and the depth/width ratio of the written grating is limited.

Disclosure of Invention

The embodiment of the invention provides a method for manufacturing a helical grating plate with a high aspect ratio structure, and aims to solve the problems that the conventional manufacturing method is low in manufacturing speed, and the manufactured helical grating plate is limited in aspect ratio, so that the production cost is reduced and the imaging effect is poor.

The embodiment of the invention is realized in such a way, and provides a method for manufacturing a helical tooth grating plate with a high aspect ratio structure, which comprises the following steps:

carrying out right-angle etching on the substrate to form a groove;

performing bevel etching on one side of the groove to form a first bevel;

arranging a first dielectric film on the substrate on which the first bevel is formed and bonding wafers to form a bevel;

performing bevel etching on the substrate with the bevel angle formed to form a second bevel angle to obtain an asymmetric helical tooth grating plate;

and arranging a second dielectric film on the asymmetric helical grating plate, and bonding and etching to form the helical grating plate with the high aspect ratio structure.

Further, the step of performing bevel etching on one side of the groove to form a first bevel specifically includes:

deviating the position of the photomask plate corresponding to the groove from the first side of the groove;

photoetching the photoresist on the substrate with the groove formed, and etching the middle layer to expose a first side right-angle area of the groove and reserve the coverage of the photoresist in a second side right-angle area;

and etching the right-angle area at the first side of the groove to form the first bevel angle.

Further, the step of forming a bevel angle by providing a first dielectric film on the substrate on which the first bevel angle is formed and performing wafer bonding specifically includes:

arranging a first dielectric film forming dielectric film groove in the groove of the substrate forming the first bevel;

grinding and wafer bonding are carried out on the substrate with the dielectric film groove;

turning over the substrate subjected to wafer bonding, and grinding the substrate on the upper layer of the groove of the dielectric film;

and etching the ground substrate, and removing the first dielectric film in the dielectric film groove to form a chamfer angle.

Further, the step of performing bevel etching on the substrate on which the bevel angle is formed to form a second bevel angle to obtain the asymmetric skewed tooth grating plate specifically includes:

deviating the position of the photomask plate corresponding to the substrate with the chamfer angle towards the first side of the substrate;

photoetching the photoresist on the substrate with the chamfer angle, and etching the intermediate layer to expose a right-angle area at the first side of the groove for forming the chamfer angle and reserve the coverage of the photoresist in a chamfer angle area at the second side;

and etching the right-angle area of the first side of the groove for forming the chamfer angle to form the second chamfer angle so as to obtain the helical tooth grating plate.

Further, the step of disposing a second dielectric film on the asymmetric helical grating plate specifically includes:

arranging the second dielectric film on the asymmetric helical grating plate for full coverage;

and grinding the upper surface of the asymmetric helical grating plate, and removing the second dielectric film arranged on the upper surface of the helical grating plate.

Furthermore, the specific steps of bonding and etching to form the helical grating plate with the high aspect ratio structure include:

bonding the two ground asymmetric helical grating plates, and offsetting the asymmetric helical grating plate arranged on the upper layer to one side relative to the asymmetric helical grating plate on the lower layer, so that the positions of the parts of the upper layer and the lower layer on which the second dielectric films are formed correspond to each other;

grinding the bonded upper layer of the asymmetric helical-tooth grating plate, and removing the substrate on the upper surface of the upper layer of the second dielectric film;

and removing the second dielectric film of the asymmetric helical grating plate by etching, and repeatedly executing the processes of setting the second dielectric film, grinding, bonding, re-grinding and etching for multiple times to form the helical grating plate with the high aspect ratio structure.

Further, the step of performing right-angle etching on the substrate to form the groove specifically includes:

arranging the photomask plate right above the substrate;

photoetching the photoresist formed on the substrate, and etching the intermediate layer;

and carrying out the right-angle etching on the substrate to form a groove.

Further, before the step of disposing the position of the photomask corresponding to the groove to deviate from the first side of the groove, the method further comprises the steps of:

removing the photoresist and the intermediate layer on the substrate on which the groove is formed;

and spin-coating the photoresist and the intermediate layer on the substrate with the groove to completely cover the substrate.

The invention also provides a grating plate, comprising the manufacturing method of the high aspect ratio structure helical tooth grating plate as claimed in any one of claims one to eight.

The invention achieves the following beneficial effects: in the invention, the substrate with the groove is obtained by performing the right-angle etching on the substrate, and then the first bevel angle is formed by performing the bevel-angle etching, and after arranging the first dielectric film on the substrate with the first bevel formed, carrying out wafer bonding to form a groove with the bevel, then carrying out bevel etching to form the second bevel to obtain the asymmetric helical-tooth grating plate, then, the steps of arranging a second dielectric film on the asymmetric helical grating plate for grinding, bonding and etching are repeatedly executed for a plurality of times, and finally the helical grating plate with the high aspect ratio structure is obtained, the helical teeth are asymmetric unidirectional helical teeth, so that the optical holographic imaging effect is enhanced, and the high-aspect-ratio helical tooth grating plate is manufactured by combining a projection photoetching mode and wafer bonding, so that the manufacturing speed can be increased, and the production efficiency can be improved.

Drawings

Fig. 1 is a flowchart of a method for manufacturing a high aspect ratio structure helical grating plate according to an embodiment of the present disclosure;

FIG. 2 is a flow diagram of one embodiment of step 102 of FIG. 1;

FIG. 3 is a flow diagram of one embodiment of step 103 of FIG. 1;

FIG. 4 is a flow diagram of one embodiment of step 104 of FIG. 1;

FIG. 5 is a flow diagram of one embodiment of step 105 of FIG. 1;

FIG. 6 is a flow diagram of another embodiment of step 105 of FIG. 1;

FIG. 7 is a flow diagram of one embodiment of step 101 of FIG. 1;

fig. 8 is a flowchart of a method for manufacturing a high aspect ratio tapered grating plate according to an embodiment of the present disclosure;

FIG. 9 is a schematic structural diagram of a first bevel provided by an embodiment of the present application;

FIG. 10 is a schematic view of another first bevel provided in an embodiment of the present application;

FIG. 11 is a schematic structural diagram of a chamfer provided in an embodiment of the present application;

FIG. 12 is a schematic structural view of another chamfer provided in the embodiments of the present application;

FIG. 13 is a schematic structural view of another chamfer provided in an embodiment of the present application;

FIG. 14 is a schematic structural view of another chamfer provided in the embodiments of the present application;

FIG. 15 is a schematic structural view of another chamfer provided in the embodiments of the present application;

FIG. 16 is a schematic structural view of a second bevel provided by an embodiment of the present application;

FIG. 17 is a schematic view of an alternative second bevel provided in accordance with an embodiment of the present application;

FIG. 18 is a schematic structural diagram of a second dielectric film provided in an embodiment of the present application;

FIG. 19 is a schematic structural diagram of another second dielectric film provided in the embodiments of the present application;

FIG. 20 is a schematic structural diagram of a helical grating plate bonding provided in an embodiment of the present application;

FIG. 21 is a schematic structural diagram of another helical grating plate bonding provided in the embodiments of the present application;

FIG. 22 is a schematic structural diagram of a high aspect ratio tapered grating plate according to an embodiment of the present disclosure;

FIG. 23 is a schematic structural diagram of a helical grating plate with a high aspect ratio structure according to an embodiment of the present disclosure;

FIG. 24 is a schematic structural diagram of a groove provided in an embodiment of the present application;

fig. 25 is a schematic structural diagram of another groove provided in the embodiments of the present application.

The photoresist comprises a substrate 1, a substrate 2, a groove 3, a photomask plate 4, a first bevel angle 5, a first dielectric film 6, a chamfer angle 7, a second bevel angle 8, photoresist 9, a middle layer 10 and a second dielectric film.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the prior art, in the manufacture of an integrated circuit chip, a symmetric tooth-shaped grid plate, such as a right-angle type, a reverse oblique angle type or an oblique angle type, can be manufactured by photoetching a photoresist through an immersion photoetching machine and then combining with a part needing to be removed through etching treatment; the invention obtains the substrate with the groove by carrying out right angle etching on the substrate, then carries out bevel angle etching to form a first bevel angle, carries out wafer bonding after a first dielectric film is arranged on the substrate with the first bevel angle, forms the groove with the bevel angle, then carries out bevel angle etching to form a second bevel angle to obtain the asymmetric helical tooth grating plate, and then repeats the steps of grinding, bonding and etching after a second dielectric film is arranged on the asymmetric helical tooth grating plate, finally obtains the helical tooth grating plate with the high aspect ratio structure, and the helical tooth is an asymmetric unidirectional helical tooth, thereby being beneficial to enhancing the effect of optical holographic imaging.