Lip seal capable of improving by-product evaporation problem and semiconductor engineering device comprising same
阅读说明:本技术 改善了副产物蒸镀问题的唇封及包括其的半导体工程装置 (Lip seal capable of improving by-product evaporation problem and semiconductor engineering device comprising same ) 是由 金亨源 郑明教 郑熙锡 于 2019-05-24 设计创作,主要内容包括:本发明涉及一种包括改善了副产物蒸镀问题的唇封的半导体工程装置,其特征在于,包括:支撑部,其形成为环形而在内侧包括空腔;弹性部,其从所述支撑部的上面延伸;接触部,其从所述弹性部的一端延伸,且在上面包括平坦区域;滑动部,其从所述接触部的一端延伸,且所述滑动部的上面形成为弧形状。(The invention relates to a semiconductor engineering device comprising a lip seal which improves the problem of by-product evaporation, which is characterized by comprising: a support part formed in a ring shape and including a cavity at an inner side; an elastic part extending from an upper surface of the support part; a contact portion extending from one end of the elastic portion and including a flat region thereon; and a sliding part extending from one end of the contact part, wherein the upper surface of the sliding part is formed in an arc shape.)
1. A lip seal that ameliorates the problem of by-product evaporation, comprising:
a support part formed in a ring shape and including a cavity at an inner side;
an elastic part extending from an upper surface of the support part;
a contact portion extending from one end of the elastic portion and including a flat region thereon; and
a sliding portion extending from one end of the contact portion,
and the upper surface of the sliding part is formed into an arc shape,
when the contact portion is in contact with the substrate, the sliding portion is spaced from the substrate by an arc shape without contact, whereby by-products are evaporated on the sliding portion while a flat region of the contact portion maintains a contact state with the substrate.
2. The lip seal that ameliorates byproduct evaporation problems of claim 1,
the thickness of the contact portion increases toward the extending direction.
3. The lip seal that ameliorates byproduct evaporation problems of claim 1,
the elastic part extends from the outer periphery of the support part in a manner that the sliding part faces the center direction of the cavity; or
The elastic portion extends from an inner periphery of the support portion in such a manner that the sliding portion faces in a direction opposite to a center direction of the cavity.
4. The lip seal that ameliorates byproduct evaporation problems of claim 1,
the elastic part extends in the middle of the upper surface of the supporting part,
the contact portion includes a first contact portion and a second contact portion branched from the elastic portion to both sides and extending respectively,
the sliding portion includes a first sliding portion extending from one end of the first contact portion and a second sliding portion extending from one end of the second contact portion.
5. The lip seal that ameliorates byproduct evaporation problems of claim 1,
when the flat area is pressurized, the pressure is applied,
an end of the sliding portion extends to protrude outward of the support portion.
6. A semiconductor engineering device including a lip seal that ameliorates byproduct evaporation problems, comprising:
a chuck for mounting a substrate;
an annular insertion groove formed on the upper surface of the chuck;
a gas flow passage located at the chuck and inside the insertion groove, and supplying a heat transfer gas to an upper surface of the chuck; and
the lip seal with improved by-product evaporation of claim 1, inserted into said insertion slot.
7. The semiconductor engineering device including a lip seal that ameliorates byproduct evaporation problems of claim 6, further comprising:
a groove inclined surface formed in an inclined shape on an inner circumferential surface of the insertion groove; and
a support portion inclined surface formed on the inner side of the support portion in a shape corresponding to the groove inclined surface,
and the inclined surface of the supporting part is tightly attached to the inclined surface of the groove to prevent the lip seal from being separated from the chuck.
8. The semiconductor engineering device comprising a lip seal that ameliorates byproduct evaporation problems of claim 6,
when the flat region is in contact with the underside of the substrate,
the end of the sliding part is disposed downward from the upper surface of the chuck.
9. The semiconductor engineering device comprising a lip seal that ameliorates byproduct evaporation problems of claim 8,
the end portion of the sliding portion is disposed downward corresponding to an increased thickness of the contact portion in an extending direction.
10. The semiconductor engineering device comprising a lip seal that ameliorates byproduct evaporation problems of claim 8,
the width of the insertion groove is formed to be greater than that of the support portion so that the insertion groove has a space capable of receiving an end of the sliding portion protruding to the outside of the support portion.
Technical Field
The invention relates to a lip seal capable of improving the problem of by-product evaporation and a semiconductor engineering device comprising the same.
Background
A semiconductor engineering apparatus is an apparatus for processing a substrate by semiconductor engineering by placing the substrate on a chuck.
For example, an apparatus for processing a substrate through semiconductor engineering may be an apparatus for performing one or more of etching, evaporation, and ashing using plasma or an apparatus for performing evaporation using a metal gas.
The substrate may refer to a wafer or a tray on which the wafer is mounted.
In such a semiconductor engineering apparatus, since semiconductor engineering is performed in a chamber in a vacuum state, an inert gas as a heat transfer gas is supplied from a chuck to a substrate to perform thermal conditioning of the substrate.
At this time, a lip seal is interposed between the chuck and the substrate to reduce the heat transfer gas from being exposed to be consumed.
The by-products generated during the semiconductor process of the substrate are evaporated on the lip seal.
In particular, the by-product is evaporated at one end of the lip seal.
Due to such a by-product evaporated on the lip seal, there is a problem that the substrate does not completely contact when it contacts the lip seal.
Further, the amount of leakage of the heat transfer gas to the portion where the substrate and the lip seal are not completely in contact with each other increases.
Such an increase in the amount of heat transfer gas leakage may cause a temperature difference between a portion where the amount of heat transfer gas leakage is increased and a portion where the amount of heat transfer gas leakage is not increased, and such a temperature difference may eventually cause a problem of a decrease in uniformity of substrate engineering.
Disclosure of Invention
Technical subject
The invention aims to provide a lip seal capable of improving the problem of by-product evaporation and a semiconductor engineering device comprising the same.
Technical scheme
The lip seal of the present invention which improves the problem of by-product evaporation is characterized by comprising: a support part formed in a ring shape and including a cavity at an inner side; an elastic part extending from an upper surface of the support part; a contact portion extending from one end of the elastic portion and including a flat region thereon; and a sliding portion extending from one end of the contact portion, and an upper surface of the sliding portion is formed in an arc shape.
The lip seal which improves the problem of by-product evaporation is characterized in that the thickness of the contact portion increases in the direction of extension.
The lip seal for improving the problem of by-product evaporation is characterized in that the elastic part extends from the periphery of the outer side of the supporting part in a manner that the sliding part faces the center direction of the cavity; or the elastic part extends from the inner periphery of the supporting part in a manner that the sliding part faces the opposite direction of the central direction of the cavity.
The lip seal with the improved evaporation problem of by-products is characterized in that the elastic part extends in the middle of the upper surface of the supporting part, the contact part comprises a first contact part and a second contact part which are branched from the elastic part to two sides and respectively extend, and the sliding part comprises a first sliding part extending from one end of the first contact part and a second sliding part extending from one end of the second contact part.
The lip seal in which the problem of by-product evaporation is improved is characterized in that when the flat region is pressurized, the end portion of the sliding portion extends so as to protrude outward of the support portion.
The invention provides a semiconductor engineering device with a lip seal for improving the problem of by-product evaporation, which is characterized by comprising: a chuck for mounting a substrate; an annular insertion groove formed on the upper surface of the chuck; a gas flow passage located at the chuck and inside the insertion groove, and supplying a heat transfer gas to an upper surface of the chuck; and the lip seal which improves the problem of byproduct evaporation is inserted into the insertion groove.
The semiconductor engineering device with the lip seal for improving the problem of by-product evaporation is characterized by further comprising: a groove inclined surface formed in an inclined shape on an inner peripheral surface of the chuck groove; and a support inclined surface formed at an inner side of the support in a shape corresponding to the groove inclined surface, the support inclined surface being in close contact with the groove inclined surface to prevent the lip seal from being separated from the chuck.
The semiconductor engineering device including the lip seal for improving the problem of by-product evaporation is characterized in that when the flat region is in contact with the lower surface of the substrate, the end portion of the sliding portion is disposed downward from the upper surface of the chuck.
The semiconductor engineering device comprising the lip seal for improving the problem of the evaporation of the by-products is characterized in that the end part of the sliding part is downwards arranged corresponding to the increased thickness of the contact part which is increased along the extending direction.
The semiconductor engineering device including the lip seal for improving the problem of the evaporation of the by-products is characterized in that the width of the insertion groove is formed to be larger than the width of the support portion so that the insertion groove has a space capable of accommodating an end portion of the sliding portion protruding to the outside of the support portion.
ADVANTAGEOUS EFFECTS OF INVENTION
First, by the arc-shaped sliding portion, by-products are accumulated at the end of the sliding portion. Therefore, the substrate will be in contact with the flat area of the contact portion without by-products, preventing incomplete contact when the substrate is in contact with the lip seal.
Since the occurrence of a portion where the amount of leakage of the heat transfer gas increases is prevented, the occurrence of a temperature difference in the substrate is prevented, and as a result, there is an effect of preventing the uniformity of the substrate process from decreasing.
Further, since the thickness increases in the direction in which the contact portion extends, when the substrate is placed on the flat region of the contact portion such that the upper surface of the contact portion is horizontal to the substrate, the increased thickness of the contact portion places the slide portion further downward. Therefore, even if the by-product is deposited on the sliding portion, the contact portion with the substrate is not affected. This can effectively prevent incomplete contact between the substrate and the lip seal.
Further, if the first contact portion and the second contact portion are formed, the substrate is more stably supported, and the heat transfer gas is doubly shielded by the first contact portion and the second contact portion, thereby having an effect of reducing leakage of the heat transfer gas.
Further, when the elastic portion is bent to place the substrate on the flat region of the contact portion, the sliding portion approaches or contacts the support portion. As the opening area formed by the support portion and the sliding portion is reduced, accumulation of by-products in the area between the support portion and the sliding portion can be prevented. In this case, if the end portion of the sliding portion is formed to extend long, the end portion of the support portion is completely covered, and thus the problem of accumulation of by-products in the region between the support portion and the sliding portion can be effectively improved.
In addition, the lip seal inclined surface is closely attached to the groove inclined surface, so that the lip seal is prevented from being separated from the chuck.
Further, when the substrate is placed on the lip seal, if the slide portion is disposed downward from the upper surface of the chuck, the by-product can be prevented from being accumulated in the flat region of the contact portion even if the repetitive process is performed on the substrate. Therefore, the substrate can be effectively brought into close contact with the contact portion. Thus, incomplete contact is prevented when the substrate is brought into contact with the lip seal, and leakage of the heat transfer gas is prevented.
Further, since the contact portion is disposed so that the lower surface of the sliding portion faces downward in accordance with the difference between the thickness of the portion adjacent to the elastic portion and the thickness adjacent to the sliding portion, the by-product can be prevented from being deposited on the flat area of the contact portion even when the repetitive process is performed on the substrate. Therefore, the substrate can be effectively brought into close contact with the contact portion.
Further, by designing the insertion groove to have a width larger than that of the support portion so as to have a space in which the end portion of the sliding portion can be disposed downward, even if a repetitive process is performed on the substrate, deposition of by-products into the space of the insertion groove and deposition of by-products into the flat region of the contact portion can be prevented. Therefore, the substrate can be effectively brought into close contact with the contact portion. Therefore, incomplete contact is prevented when the substrate and the lip seal are in contact, and the heat transfer gas is prevented from being leaked and exposed.
Drawings
Fig. 1 is a view of a lip seal of the present invention with improved by-product evaporation problems viewed from above.
FIG. 2 is an enlarged cross-sectional view of the lip seal of the present invention which improves the by-product evaporation problem.
Fig. 3 is a diagram illustrating an operation when a substrate is brought into contact with a lip seal according to the present invention, which improves the problem of by-product evaporation.
FIG. 4 is a diagram illustrating one embodiment of a lip seal that improves the problem of by-product evaporation according to the present invention.
FIG. 5 is a diagram illustrating another embodiment of a lip seal of the present invention that ameliorates the problem of by-product evaporation.
Fig. 6 is a diagram illustrating a substrate mounted to a chuck of a semiconductor engineering device including a lip seal of the present invention that improves byproduct evaporation problems.
Description of the symbols
100: lip seal, 110: support portion, 111: support portion inclined surface, 120: elastic portion, 130: contact portion, 131: flat region, 130 a: first contact portion, 130 b: second contact portion, 140: sliding portion, 140 a: first sliding portion, 140 b: second sliding portion, 200: chuck, 210: insertion groove, 211: groove inclined surface, 220: gas flow passage, S: a substrate.
Detailed Description
The lip seal and the semiconductor engineering device including the same according to the present invention, which improve the problem of by-product evaporation, will be described in detail with reference to the accompanying drawings.
By-products generated during the semiconductor process of the substrate S are evaporated on the
Due to such a by-product evaporated on the
Further, the amount of leakage of the heat transfer gas to the portion where the substrate S and the
Such an increase in the amount of heat transfer gas leakage may cause a temperature difference between a portion of the substrate S where the amount of heat transfer gas leakage is increased and a portion where the amount of heat transfer gas leakage is not increased, and such a temperature difference may eventually cause a problem of a decrease in the uniformity of the substrate S process.
As illustrated in fig. 1 to 3, the
The
That is, with the
The
The
The lip seal improving the problem of by-product evaporation is characterized in that the sliding
At this time, the sliding
However, if only the upper surface of the sliding
By forming the upper surface of the sliding
That is, the substrate S is in contact with the
A by-product such as polymer particles is deposited on the sliding
Therefore, the substrate S is in contact with the
Since the occurrence of a portion where the leakage amount of the heat transfer gas increases is prevented, the occurrence of a temperature difference in the substrate S is prevented, and as a result, the effect of preventing the degradation of the uniformity of the process of the substrate S is obtained.
As illustrated in fig. 3, the thickness of the
When the substrate S is in contact with the
As described above, since the thickness increases in the direction in which the
Therefore, even if the by-product is deposited on the sliding
An example of the shape of the
As embodiment 1, as illustrated in fig. 2, the
As embodiment 2, as illustrated in fig. 4, the
Such embodiment 2 means that the sliding
As embodiment 3, as illustrated in fig. 5, the
The
Thus, the substrate S can be supported more stably by forming the first contact portion 130a and the second contact portion 130 b. In addition, the heat transfer gas is doubly shielded by the first contact portion 130a and the second contact portion 130b, thereby having an effect of reducing leakage of the heat transfer gas.
On the other hand, when the
When the
In this case, the end of the sliding
That is, it is preferable that when the
Therefore, as the opening area formed by the
As illustrated in fig. 6, the semiconductor process apparatus including the
The substrate S is seated on the
An
At this time, the support surface of the
The
The
In this way, the inclined surface of the
At this time, when the
When the substrate S is mounted on the
Accordingly, even if the repetitive process is performed, the substrate S can be effectively brought into close contact with the
On the other hand, in the
That is, in the
In addition, the width of the
Therefore, even if a repetitive process is performed on the substrate S, that is, even if the byproducts are accumulated and continue to be accumulated, the byproducts are accumulated along the sliding
Although the embodiments of the present invention have been described above with reference to the drawings, it will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. The described embodiments are, therefore, to be considered in all respects as illustrative and not restrictive.
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