Lens module
阅读说明:本技术 镜头模组 (Lens module ) 是由 陈信文 马晓梅 樊珂华 张龙飞 于 2018-06-29 设计创作,主要内容包括:一种镜头模组,包括:一电路板;一感光芯片,固定于所述电路板的其中一表面;一中空的安装支架,固定于所述电路板上并将所述感光芯片收容于其中;一滤光片,固定于所述安装支架且与所述感光芯片相对;以及一镜头单元,通过一中空的胶粘层固定于所述安装支架远离所述电路板的表面,所述镜头单元固定于所述安装支架的表面设有多个凸台,所述凸台位于所述胶粘层的内侧,且所述凸台的高度大于或等于所述胶粘层的高度。(A lens module, comprising: a circuit board; the photosensitive chip is fixed on one surface of the circuit board; the hollow mounting bracket is fixed on the circuit board and accommodates the photosensitive chip therein; the optical filter is fixed on the mounting bracket and is opposite to the photosensitive chip; the lens unit is fixed on the surface of the mounting bracket far away from the circuit board through a hollow adhesive layer, a plurality of bosses are arranged on the surface of the lens unit fixed on the mounting bracket, the bosses are positioned on the inner side of the adhesive layer, and the height of each boss is larger than or equal to that of the adhesive layer.)
1. A lens module, comprising:
a circuit board;
the photosensitive chip is fixed on one surface of the circuit board;
the hollow mounting bracket is fixed on the circuit board and accommodates the photosensitive chip therein;
the optical filter is fixed on the mounting bracket and is opposite to the photosensitive chip; and
the lens unit is fixed on the surface of the mounting bracket far away from the circuit board through a hollow adhesive layer, a plurality of bosses are arranged on the surface of the lens unit fixed on the mounting bracket, the bosses are positioned on the inner side of the adhesive layer, and the height of each boss is larger than or equal to that of the adhesive layer.
2. The lens module as claimed in claim 1, wherein the lens unit includes a lens holder and a lens integrally formed in the lens holder, the lens holder is fixed to a surface of the mounting bracket away from the circuit board, and the lens is opposite to the photo sensor chip.
3. The lens module as claimed in claim 2, wherein the lens holder includes a first lens holder portion having a hollow square shape, the first lens holder portion is fixed to the mounting bracket, the adhesive layer has a hollow square shape and is formed by sequentially connecting four side edges end to end, the number of the bosses is four, the bosses are respectively arranged in parallel to the four edges of the surface of the mounting bracket to which the first lens holder portion is fixed, and the bosses are respectively abutted against and contacted with the inner sides of the side edges of the adhesive layer.
4. The lens module as claimed in claim 3, wherein four corners of the surface of the first lens holder portion fixed to the mounting bracket are recessed to form four recesses.
5. The lens module as claimed in claim 1, wherein the circuit board is a rigid-flex board including a first hard board portion, a second hard board portion and a soft board portion located between the first hard board portion and the second hard board portion, and the photo sensor chip is fixed to the first hard board portion.
6. The lens module as claimed in claim 5, wherein a plurality of electronic components and gold fingers are mounted on the surface of the first hard board portion to which the photosensitive chip is fixed, the electronic components and the gold fingers are located around the photosensitive chip, a metal wire is disposed on an edge of the surface of the photosensitive chip, the metal wire is electrically connected to the gold fingers, and an electrical connection portion is mounted on one surface of the second hard board portion.
7. The lens module as claimed in claim 1, wherein the mounting bracket has a through-hole, the inner wall of the hole extends toward the central axis of the hole to form a flange, the flange divides the hole into a first space near the circuit board and a second space far from the circuit board, the photo sensor chip is accommodated in the first space, and the filter is fixed to the flange and accommodated in the second space.
8. The lens module as claimed in claim 7, wherein a surface of the filter away from the circuit board is flush with a surface of the mounting bracket away from the circuit board.
9. The lens module as claimed in claim 1, further comprising a protective cover, wherein the protective cover is disposed on the lens unit.
Technical Field
The invention relates to the field of camera shooting, in particular to a lens module.
Background
The conventional lens module generally includes a lens, a lens holder, a mounting bracket, a filter, a photo sensor chip and a circuit board. Generally, a lens is mounted in a lens holder, and the lens holder is adhered to a mounting bracket by an adhesive layer. However, when the lens module is subjected to an external force, the adhesive layer may be deformed and cracked, thereby causing the lens mount to be separated from the mounting bracket, thereby reducing the lifespan of the lens module. Moreover, external strong light can penetrate through the adhesive layer and reach the photosensitive chip in the lens base through a series of reflections, so that an image generates obvious error points, and the imaging quality is influenced.
Disclosure of Invention
Accordingly, there is a need for a lens module that can solve the above problems.
An embodiment of the present invention provides a lens module, including: a circuit board; the photosensitive chip is fixed on one surface of the circuit board; the hollow mounting bracket is fixed on the circuit board and accommodates the photosensitive chip therein; the optical filter is fixed on the mounting bracket and is opposite to the photosensitive chip; the lens unit is fixed on the surface of the mounting bracket far away from the circuit board through a hollow adhesive layer, a plurality of bosses are arranged on the surface of the lens unit fixed on the mounting bracket, the bosses are positioned on the inner side of the adhesive layer, and the height of each boss is larger than or equal to that of the adhesive layer.
In the lens module of the embodiment of the invention, because the surface of the lens unit fixed on the mounting bracket is provided with the plurality of bosses, the bosses can block external light from being incident on the photosensitive chip through the fourth adhesive layer, thereby preventing the image from generating error points and ensuring the shooting quality of the lens module; when the lens module is under the action of external force, the bearing action of the boss can block the fourth adhesive layer from cracking, so that the lens unit and the mounting bracket are prevented from being separated from each other.
Drawings
Fig. 1 is a schematic structural diagram of a lens module according to a preferred embodiment of the invention.
Fig. 2 is an exploded view of the lens module shown in fig. 1.
Fig. 3 is a schematic cross-sectional view of the lens module shown in fig. 1 along the direction III-III.
Fig. 4 is a schematic view of another angle structure of the lens unit of the lens module shown in fig. 1.
Description of the symbols
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The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
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It will be appreciated by those skilled in the art that the above embodiments are illustrative only and not intended to be limiting, and that suitable modifications and variations may be made to the above embodiments without departing from the true spirit and scope of the invention.
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