阅读说明：本技术 一种晶圆传送时间的控制方法、装置及系统 (Method, device and system for controlling wafer transmission time ) 是由 崔凯 田国军 于 2021-07-22 设计创作，主要内容包括：本申请公开了一种晶圆传送时间的控制方法、装置及系统。方法包括：获取当前待研磨的目标晶圆；基于云数据确定目标晶圆的在各个研磨工位的处理时长,其中,云数据包括历史晶圆在各个研磨工位的历史处理时长；获取目标晶圆传送至研磨工位的传送时长,并根据处理时长以及传送时长确定目标晶圆的传送起始时间；根据传送起始时间生成控制指令,并向机器人发送控制指令,控制指令用于控制机器人根据传送起始时间将目标晶圆传送至研磨工位。本申请通过云数据预测目标晶圆在各个研磨工位的处理时长,并结合传送时长能够得到传送晶圆的最佳时刻,从而解决晶圆在进入每个研磨工位前出现的排队情况,避免晶圆受到研磨工位所产生颗粒的破坏,保证晶圆的良率。(The application discloses a method, a device and a system for controlling wafer transfer time. The method comprises the following steps: acquiring a target wafer to be ground currently; determining the processing time of the target wafer at each grinding station based on cloud data, wherein the cloud data comprises the historical processing time of the historical wafer at each grinding station; acquiring the transmission time length of the target wafer transmitted to the grinding station, and determining the transmission starting time of the target wafer according to the processing time length and the transmission time length; and generating a control instruction according to the transmission starting time, and sending the control instruction to the robot, wherein the control instruction is used for controlling the robot to transmit the target wafer to the grinding station according to the transmission starting time. According to the method and the device, the processing time of the target wafer at each grinding station is predicted through cloud data, and the best time for transmitting the wafer can be obtained by combining the transmission time, so that the queuing condition of the wafer before the wafer enters each grinding station is solved, the wafer is prevented from being damaged by particles generated by the grinding station, and the yield of the wafer is ensured.)

1. A method for controlling wafer transfer time, comprising:

acquiring a target wafer to be ground currently;

determining the processing time of the target wafer at each grinding station based on cloud data, wherein the cloud data comprises the historical processing time of historical wafers at each grinding station;

acquiring the transmission time length for transmitting the target wafer to the grinding station, and determining the transmission starting time of the target wafer according to the processing time length and the transmission time length;

and generating a control instruction according to the transmission starting time, and sending the control instruction to a robot, wherein the control instruction is used for controlling the robot to transmit the target wafer to the grinding station according to the transmission starting time.

2. The method of claim 1, wherein prior to determining the processing duration of the target wafer at each grinding station based on cloud data, the method further comprises:

obtaining a plurality of historical wafers which execute various grinding types in historical time;

collecting the historical processing time of the historical wafer at each grinding station;

and storing the historical wafer and the historical processing time of the historical wafer according to the grinding type to generate the cloud data.

3. The method of claim 1, wherein determining the processing duration of the target wafer at each grinding station based on the cloud data comprises:

determining a target grinding type corresponding to the target wafer;

acquiring historical target processing duration matched with the target grinding type from the cloud data;

and calculating a weighted average value of the target historical processing time length, and determining the weighted average value as the processing time length.

4. The method according to claim 1, characterized in that said grinding station comprises at least: a first grinding station and a second grinding station;

the acquiring the transmission time length for transmitting the target wafer to the grinding station, and determining the transmission starting time of the target wafer according to the processing time length and the transmission time length comprises the following steps:

acquiring a first preset processing time required by the target wafer to pass through the first grinding station and a second preset processing time required by the target wafer to pass through the second grinding station from the processing time;

determining a first grinding progress of the first grinding station at the current moment and a second grinding progress of the second grinding station at the current moment;

determining the processed time length according to the first grinding progress and the second grinding progress;

calculating a first time difference between the first preset processing time length and the transmission time length;

determining the current time as the transmission start time if the processed time length is greater than or equal to the first time difference.

5. The method of claim 4, wherein if the processed duration is less than the first time difference, the method further comprises:

determining a second time difference between the processed duration and the first time difference;

and determining the sum of the current time and the second time difference as the transmission starting time.

6. The method of claim 1, wherein after generating control instructions according to the transfer start time and sending the control instructions to the robot, the method further comprises:

monitoring the grinding progress of the target wafer, and recording the actual processing time of the target wafer at each grinding station;

and storing the actual processing duration to cloud data.

7. A wafer transfer time control apparatus, comprising:

the acquisition module is used for acquiring a target wafer to be ground currently;

the determining module is used for determining the processing time of the target wafer at each grinding station based on cloud data, wherein the cloud data comprises the historical processing time of historical wafers at each grinding station;

the processing module is used for acquiring the transmission time length for transmitting the target wafer to the grinding station and determining the transmission starting time of the target wafer according to the processing time length and the transmission time length;

and the generating module is used for generating a control instruction according to the transmission starting time and sending the control instruction to the robot, wherein the control instruction is used for controlling the robot to carry out transmission operation on the target wafer at the transmission starting time.

8. A wafer transfer time control system, comprising: the system comprises a cloud computing platform, a robot and a grinding station;

the cloud computing platform is used for acquiring a target wafer to be ground currently, determining processing time of the target wafer at each grinding station based on cloud data, wherein the cloud data comprises historical processing time of a historical wafer at each grinding station, acquiring transmission time of the target wafer transmitted to the grinding station, determining transmission starting time of the target wafer according to the processing time and the transmission time, generating a control instruction according to the transmission starting time, and transmitting the control instruction to a robot;

and the robot is used for conveying the target wafer to the grinding station according to the conveying starting time.

9. A storage medium, characterized in that the storage medium comprises a stored program, wherein the program is operative to perform the method steps of any of the preceding claims 1 to 6.

10. An electronic device is characterized by comprising a processor, a communication interface, a memory and a communication bus, wherein the processor and the communication interface are used for realizing mutual communication by the memory through the communication bus; wherein:

a memory for storing a computer program;

a processor for performing the method steps of any of claims 1-6 by executing a program stored on a memory.

Technical Field

The present disclosure relates to the field of semiconductor technologies, and in particular, to a method, an apparatus, and a system for controlling wafer transfer time.

Background

With the development of semiconductor chip manufacturing technology, the role and requirement of Chemical Mechanical Planarization (CMP) process for 200mm and above wafers in chip production are increasing. Chip devices are getting smaller, the line width is getting narrower and the requirements for electrical isolation are getting higher, which also makes the performance requirements for the CMP polishing machine more and more strict, including the parameters of defect, efficiency, stability, etc.

When the CMP grinds the wafer, the wafer is firstly conveyed to a first grinding station through a conveying station to carry out a grinding process, then the ground wafer is conveyed to a second grinding station through the conveying station to carry out a cleaning process, and finally the cleaned wafer is conveyed back through the conveying station. In the current design, the wafer is transferred to the waiting station immediately after entering the transfer station to wait for the completion of the polishing process, and once the wafer is completed, the wafer is transferred to the polishing station immediately for polishing, and the polished wafer is also transferred to the waiting station immediately to wait for the completion of the cleaning process.

In the process of implementing the invention, the inventor finds that particles formed by abrasion of machine hardware and the like fall on the surface of the wafer, so that the defects of huge arc scratch, fine scratch, surface contamination and the like can be caused, the defects directly cause the yield of the wafer to be reduced, and the influence of the fragments or the particles on the yield of the wafer is more obvious when the line width of the chip is smaller.

Disclosure of Invention

In order to solve the above technical problem or at least partially solve the above technical problem, the present application provides a method, an apparatus and a system for controlling a wafer transfer time.

According to an aspect of an embodiment of the present application, there is provided a method for controlling a wafer transfer time, including:

acquiring a target wafer to be ground currently;

determining the processing time of the target wafer at each grinding station based on cloud data, wherein the cloud data comprises the historical processing time of historical wafers at each grinding station;

acquiring the transmission time length for transmitting the target wafer to the grinding station, and determining the transmission starting time of the target wafer according to the processing time length and the transmission time length;

and generating a control instruction according to the transmission starting time, and sending the control instruction to a robot, wherein the control instruction is used for controlling the robot to transmit the target wafer to the grinding station according to the transmission starting time.

Further, prior to determining a processing duration of the target wafer at each grinding station based on cloud data, the method further comprises:

obtaining a plurality of historical wafers which execute various grinding types in historical time;

collecting the historical processing time of the historical wafer at each grinding station;

and storing the historical wafer and the historical processing time of the historical wafer according to the grinding type to generate the cloud data.

Further, the determining the processing time of the target wafer at each grinding station based on the cloud data comprises:

determining a target grinding type corresponding to the target wafer;

acquiring historical target processing duration matched with the target grinding type from the cloud data;

and calculating a weighted average value of the target historical processing time length, and determining the weighted average value as the processing time length.

Further, the grinding station comprises at least: a first grinding station and a second grinding station;

the acquiring the transmission time length for transmitting the target wafer to the grinding station, and determining the transmission starting time of the target wafer according to the processing time length and the transmission time length comprises the following steps:

acquiring a first preset processing time required by the target wafer to pass through the first grinding station and a second preset processing time required by the target wafer to pass through the second grinding station from the processing time;

determining a first grinding progress of the first grinding station at the current moment and a second grinding progress of the second grinding station at the current moment;

determining the processed time length according to the first grinding progress and the second grinding progress;

calculating a first time difference between the first preset processing time length and the transmission time length;

determining the current time as the transmission start time if the processed time length is greater than or equal to the first time difference.

Further, in the case that the processed duration is less than the first time difference, the method further includes:

determining a second time difference between the processed duration and the first time difference;

and determining the sum of the current time and the second time difference as the transmission starting time.

Further, after generating a control instruction according to the transfer start time and sending the control instruction to the robot, the method further includes:

monitoring the grinding progress of the target wafer, and recording the actual processing time of the target wafer at each grinding station;

and storing the actual processing duration to cloud data.

According to still another aspect of the embodiments of the present application, there is provided a wafer transfer time control apparatus including:

the acquisition module is used for acquiring a target wafer to be ground currently;

the determining module is used for determining the processing time of the target wafer at each grinding station based on cloud data, wherein the cloud data comprises the historical processing time of historical wafers at each grinding station;

the processing module is used for acquiring the transmission time length for transmitting the target wafer to the grinding station and determining the transmission starting time of the target wafer according to the processing time length and the transmission time length;

and the generating module is used for generating a control instruction according to the transmission starting time and sending the control instruction to the robot, wherein the control instruction is used for controlling the robot to carry out transmission operation on the target wafer at the transmission starting time.

According to still another aspect of the embodiments of the present application, there is provided a wafer transfer time control system including: the system comprises a cloud computing platform, a robot and a grinding station;

the cloud computing platform is used for acquiring a target wafer to be ground currently, determining processing time of the target wafer at each grinding station based on cloud data, wherein the cloud data comprises historical processing time of a historical wafer at each grinding station, acquiring transmission time of the target wafer transmitted to the grinding station, determining transmission starting time of the target wafer according to the processing time and the transmission time, generating a control instruction according to the transmission starting time, and transmitting the control instruction to a robot;

and the robot is used for conveying the target wafer to the grinding station according to the conveying starting time.

According to another aspect of the embodiments of the present application, there is also provided a storage medium including a stored program that executes the above steps when the program is executed.

According to another aspect of the embodiments of the present application, there is also provided an electronic apparatus, including a processor, a communication interface, a memory, and a communication bus, where the processor, the communication interface, and the memory complete communication with each other through the communication bus; wherein: a memory for storing a computer program; a processor for executing the steps of the method by running the program stored in the memory.

Embodiments of the present application also provide a computer program product containing instructions, which when run on a computer, cause the computer to perform the steps of the above method.

Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: in the embodiment of the application, the processing time of the target wafer at each grinding station is predicted through cloud data, and the optimal time for transmitting the target wafer can be obtained by combining the transmission time for transmitting the target wafer to the grinding stations, so that the queuing condition before the wafer enters each grinding station is solved, the wafer is prevented from being damaged by particles generated by the grinding stations, and the yield of the wafer is ensured.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.

Fig. 1 is a flowchart illustrating a method for controlling a wafer transfer time according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a wafer transfer process according to an embodiment of the present disclosure;

FIG. 3 is a flowchart illustrating a method for controlling wafer transfer time according to another embodiment of the present disclosure;

FIG. 4 is a flowchart illustrating a method for controlling wafer transfer time according to another embodiment of the present application;

FIG. 5 is a block diagram of a wafer transfer time control apparatus according to an embodiment of the present disclosure;

FIG. 6 is a block diagram of a wafer transfer time control system according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments, and the illustrative embodiments and descriptions thereof of the present application are used for explaining the present application and do not constitute a limitation to the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another similar entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The embodiment of the application provides a method, a device and a system for controlling wafer transfer time. The method provided by the embodiment of the invention can be applied to any required electronic equipment, for example, the electronic equipment can be electronic equipment such as a server and a terminal, and the method is not particularly limited herein, and is hereinafter simply referred to as electronic equipment for convenience in description.

In the embodiment of the present application, the wafer to be polished is located at the transfer station, so that in a normal polishing process, the robot first uses the transfer station as a starting point to transfer the wafer to the first polishing station for polishing, after the wafer is polished at the first polishing station, the robot transfers the wafer from the first polishing station to the second polishing station for cleaning, and after the wafer is cleaned at the second polishing station, the robot transfers the wafer from the second polishing station back to the transfer station.

However, in the case of a large number of wafers, the wafers are queued in each polishing station, and in the queuing process, the wafers are damaged by particles generated by the polishing stations, which results in a great reduction in the yield of the wafers.

According to an aspect of the embodiments of the present application, an embodiment of a method for controlling a wafer transfer time is provided, and fig. 1 is a flowchart of the method for controlling a wafer transfer time provided by the embodiment of the present application, as shown in fig. 1, the method includes:

step S11, obtain the target wafer to be polished currently.

In the embodiment of the present application, as shown in fig. 2, there are a plurality of wafers to be polished in the transfer station, so that the arrangement order of the wafers in the transfer station is obtained, and the wafer that is the most front wafer in the arrangement order is determined as the target wafer.

Step S12, processing time length of the target wafer at each grinding station is determined based on cloud data, wherein the cloud data comprises historical processing time length of the historical wafer at each grinding station.

In the embodiment of the present application, the step S12 of determining the processing duration of the target wafer at each polishing station based on the cloud data includes the following steps a 1-A3:

step a1, determine a target polishing type corresponding to the target wafer.

In the embodiment of the present application, since the processing time lengths corresponding to different polishing types are different, before determining the processing time length of the target wafer at each polishing station, the polishing type corresponding to the target wafer needs to be determined first.

Step A2, obtaining the target historical processing duration matched with the target grinding type from the cloud data.

In the embodiment of the present application, the cloud data includes a plurality of historical processing durations corresponding to a plurality of different polishing types, so that the target historical processing duration associated with the type can be queried from the cloud data according to the target polishing type of the target wafer.

In the embodiment of the present application, the method for generating cloud data specifically includes the following steps B1-B3:

step B1, a plurality of history wafers with various polishing types performed in history time are obtained.

And step B2, acquiring historical processing time of the historical wafer at each grinding station.

Step B3, storing the historical wafers and the historical processing time of the historical wafers according to the grinding types, and generating cloud data.

In the embodiment of the application, historical wafers of all grinding types and historical processing time of all the historical wafers at all the grinding stations are collected in historical time, then the grinding types and the historical processing time are stored in a correlation mode, and finally cloud data are generated.

As an example, cloud data includes: the historical processing time length corresponding to the grinding type A comprises a1, a2, a3 and a 4; the historical processing time length corresponding to the grinding type B comprises B1, B2 and B3; the history processing time length corresponding to the grinding type C includes C1, C2, C3 and C4.

Step a3, a weighted average of the target history processing time period is calculated, and the weighted average is determined as the processing time period.

In the embodiment of the present application, a plurality of target historical processing durations belonging to a target grinding type are queried from cloud data, a weighted average is calculated based on the plurality of target historical processing durations, and the weighted average is determined as a processing duration.

In an embodiment of the application, the grinding station comprises at least: a first grinding station and a second grinding station. The first grinding station is used for grinding the target wafer, and the second grinding station is used for cleaning the ground target wafer.

As an example, the historical processing durations corresponding to mill type a include a1, a2, a3, and a4, a1 includes (a11, a12), a2 includes (a21, a22), a3 includes (a31, a32), and a4 includes (a41, a 42). Wherein a11, a21, a31 and a41 are all the historical processing time lengths of the first grinding station, and a12, a22, a32 and a42 are all the historical processing time lengths of the second grinding station. Then, the weighted average value of a11, a21, a31, and a41 is calculated as a10 (as the first preset processing period), and the weighted average value of a12, a22, a32, and a42 is calculated as a20 (as the second preset processing period). Then, (a10, a20) is determined as the processing duration.

Step S13, obtaining a transfer duration of the target wafer to the polishing station, and determining a transfer start time of the target wafer according to the processing duration and the transfer duration.

In the embodiment of the present application, the step S13 of obtaining a transfer duration of the target wafer to the polishing station, and determining a transfer start time of the target wafer according to the processing duration and the transfer duration includes the following steps C1-C5:

step C1, obtaining a first preset processing time required by the target wafer to pass through the first polishing station and a second preset processing time required by the target wafer to pass through the second polishing station from the processing time.

And step C2, determining a first grinding progress of the first grinding station at the current moment and a second grinding progress of the second grinding station at the current moment.

In the embodiment of the present application, before the robot transfers the target wafer, it needs to determine whether the first polishing station and the second polishing station are performing processing operations on other wafers, so that the first polishing progress of the first polishing station and the second polishing progress of the second polishing station are queried. The first polishing progress and the second polishing progress can be percentages and are used for indicating the processing stage of the wafer at the first polishing station or the second polishing station.

And step C3, determining the processed time length according to the first grinding progress and the second grinding progress.

In the embodiment of the application, the product of the first grinding progress and the first preset processing time length and the product of the second grinding progress and the second preset processing time length are calculated, and the sum of the two products is determined as the processed time length.

Step C4, a first time difference between the first preset processing time period and the transmission time period is calculated.

In the embodiment of the application, in order to avoid that the target wafer can directly enter the first grinding station after being sent out by the robot, and queuing is avoided. A time difference between the first preset processing time period and the transfer time period needs to be calculated.

Step C5, in case the processed time length is greater than or equal to the first time difference, determining the current time as the transmission start time.

In the embodiment of the application, the processed time length is compared with the first time difference, and if the processed time length is greater than or equal to the first time difference, it indicates that the robot can directly transfer the target wafer to the first grinding station at the current time, and the situation that the target wafer is queued to enter the first grinding station does not occur, so that the current time is determined as the transfer start time.

And step S14, generating a control instruction according to the transfer starting time, and sending the control instruction to the robot, wherein the control instruction is used for controlling the robot to transfer the target wafer to the grinding station according to the transfer starting time.

In the embodiment of the application, the processing time of the target wafer at each grinding station is predicted through cloud data, and the optimal time for transmitting the target wafer can be obtained by combining the transmission time for transmitting the target wafer to the grinding stations, so that the queuing condition before the wafer enters each grinding station is solved, the wafer is prevented from being damaged by particles generated by the grinding stations, and the yield of the wafer is ensured.

In the embodiment of the present application, as shown in fig. 3, in the case that the processed time length is less than the first time difference, the method further includes the following steps:

in step S21, a second time difference between the processed time length and the first time difference is determined.

In step S22, the sum of the current time and the second time difference is determined as the transfer start time.

In the embodiment of the application, when the processed time length is less than the first time difference, the condition that the target wafer is transmitted at the current time and queued is indicated. It is therefore necessary to calculate a sum of the current time and the second time difference and determine the sum as the transmission start time.

In the embodiment of the present application, as shown in fig. 4, after generating a control instruction according to the transfer start time and sending the control instruction to the robot, the method further includes:

step S31, monitoring the polishing progress of the target wafer, and recording the actual processing time of the target wafer at each polishing station.

Step S32, storing the actual processing time to the cloud data.

In the embodiment of the application, the grinding progress of the target wafer is monitored, and the recorded actual processing time of the target wafer at each station is stored, so that the historical processing time stored in the cloud data is updated, and an accurate basis can be provided for the subsequent calculation of the transmission time of the ground wafer.

Fig. 5 is a block diagram of a device for controlling wafer transfer time according to an embodiment of the present disclosure, which may be implemented as part or all of an electronic device through software, hardware, or a combination of the two. As shown in fig. 5, the apparatus includes:

an obtaining module 51, configured to obtain a target wafer to be currently ground;

a determining module 52, configured to determine processing durations of the target wafer at the grinding stations based on cloud data, where the cloud data includes historical processing durations of historical wafers at the grinding stations;

the processing module 53 is configured to obtain a transmission duration for transmitting the target wafer to the polishing station, and determine a transmission start time of the target wafer according to the processing duration and the transmission duration;

and the generating module 54 is configured to generate a control instruction according to the transfer start time, and send the control instruction to the robot, where the control instruction is used to control the robot to perform a transfer operation on the target wafer at the transfer start time.

The device of the embodiment of the application further comprises: the acquisition module is used for acquiring a plurality of historical wafers which execute various grinding types in historical time; collecting the historical processing time of the historical wafer at each grinding station; and storing the historical wafer and the historical processing time of the historical wafer according to the grinding type to generate cloud data.

In the embodiment of the present application, the determining module 52 is configured to determine a target polishing type corresponding to a target wafer; acquiring historical target processing duration matched with the target grinding type from the cloud data; a weighted average of the target history processing time periods is calculated, and the weighted average is determined as the processing time period.

In an embodiment of the application, the grinding station comprises at least: a first grinding station and a second grinding station;

the processing module 53 is configured to obtain, from the processing time duration, a first preset processing time duration required by the target wafer to pass through the first polishing station, and a second preset processing time duration required by the target wafer to pass through the second polishing station; determining a first grinding progress of the first grinding station at the current moment and a second grinding progress of the second grinding station at the current moment; determining the processed time length according to the first grinding progress and the second grinding progress; calculating a first time difference between a first preset processing time length and a transmission time length; and determining the current time as the transmission starting time under the condition that the processed time length is greater than or equal to the first time difference.

The device of the embodiment of the application further comprises: the calculation module is used for determining a second time difference between the processed time length and the first time difference under the condition that the processed time length is smaller than the first time difference; and determining the sum of the current time and the second time difference as the transmission starting time.

The device of the embodiment of the application further comprises: the monitoring module is used for monitoring the grinding progress of the target wafer and recording the actual processing time of the target wafer at each grinding station after generating a control instruction according to the transmission starting time and sending the control instruction to the robot; and storing the actual processing time to the cloud data.

Fig. 6 is a block diagram of a wafer transfer time system according to an embodiment of the present application, where the apparatus may be implemented as part of or all of an electronic device through software, hardware, or a combination of the software and the hardware. As shown in fig. 6, the system includes: a cloud computing platform 61, a robot 62, and a grinding station 63;

the cloud computing platform 61 is used for acquiring a target wafer to be ground currently, determining the processing time of the target wafer at each grinding station based on cloud data, wherein the cloud data comprises the historical processing time of a historical wafer at each grinding station, acquiring the transmission time of the target wafer transmitted to the grinding station, determining the transmission starting time of the target wafer according to the processing time and the transmission time, generating a control instruction according to the transmission starting time, and sending the control instruction to the robot;

and a robot 62 for transferring the target wafer to the polishing station 63 according to the transfer start time.

An embodiment of the present application further provides an electronic device, as shown in fig. 7, the electronic device may include: the system comprises a processor 1501, a communication interface 1502, a memory 1503 and a communication bus 1504, wherein the processor 1501, the communication interface 1502 and the memory 1503 complete communication with each other through the communication bus 1504.

A memory 1503 for storing a computer program;

the processor 1501 is configured to implement the steps of the above embodiments when executing the computer program stored in the memory 1503.

The communication bus mentioned in the above terminal may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The communication bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is shown, but this does not mean that there is only one bus or one type of bus.

The communication interface is used for communication between the terminal and other equipment.

The Memory may include a Random Access Memory (RAM) or a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. Optionally, the memory may also be at least one memory device located remotely from the processor.

The Processor may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the Integrated Circuit may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, or a discrete hardware component.

In yet another embodiment provided herein, a computer-readable storage medium is provided, having instructions stored thereon, which when executed on a computer, cause the computer to perform the wafer transit time system method of any of the above embodiments.

In yet another embodiment provided herein, a computer program product containing instructions that, when executed on a computer, cause the computer to perform the wafer transfer time system method of any of the above embodiments is also provided.

In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the application to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another, for example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wire (e.g., coaxial cable, fiber optic, digital subscriber line) or wirelessly (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device, such as a server, a data center, etc., that incorporates one or more of the available media. The usable medium may be a magnetic medium (e.g., floppy Disk, hard Disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., Solid State Disk), among others.

The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.

The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.