阅读说明：本技术 附接基板的设备和附接基板的方法 (Apparatus for attaching substrate and method of attaching substrate ) 是由 赵翊成 金光寿 白种化 于 2020-07-09 设计创作，主要内容包括：提供一种附接基板的设备以及附接基板的方法。设备包含：上部台,具有接触支撑上部基板的上部支撑表面；下部台,具有下部支撑表面,下部支撑表面配置于面向上部支撑表面的位置处以接触并支撑下部基板；以及下部驱动单元,包含多个下部支撑部件及多个下部驱动体,所述多个下部支撑部件连接到下部台以便支撑下部台的不同区域及所述多个下部驱动体分别连接到多个下部支撑部件以单独地上升和下降,且上部台和下部台配置成彼此相邻,其中通过操作下部驱动单元来使下部台上升。因此,根据示范性实施例的附接基板的设备可均一地按压上部基板和下部基板且防止由非均一按压引起的附接缺陷。(An apparatus for attaching a substrate and a method of attaching a substrate are provided. The apparatus comprises: an upper stage having an upper support surface contactingly supporting an upper substrate; a lower stage having a lower support surface disposed at a position facing the upper support surface to contact and support the lower substrate; and a lower driving unit including a plurality of lower support members connected to the lower stage so as to support different regions of the lower stage and a plurality of lower driving bodies respectively connected to the plurality of lower support members to be individually raised and lowered, and the upper stage and the lower stage being disposed adjacent to each other, wherein the lower stage is raised by operating the lower driving unit. Accordingly, the apparatus for attaching substrates according to the exemplary embodiments may uniformly press the upper and lower substrates and prevent attachment defects caused by non-uniform pressing.)

1. An apparatus for attaching a substrate, comprising:

an upper table having an upper support surface configured to contact and support an upper substrate;

a lower stage having a lower support surface disposed at a position facing the upper support surface to contact and support a lower substrate; and

a lower driving unit including a plurality of lower support members connected to the lower stage so as to support different regions of the lower stage, and a plurality of lower driving bodies respectively connected to the plurality of lower support members to be individually ascended and descended,

wherein the upper stage and the lower stage are disposed adjacent to each other to ascend the lower stage by operating the lower driving unit.

2. The apparatus of claim 1, wherein the plurality of lower support members are configured below the lower stage to support different edges of the lower stage.

3. The apparatus of attaching a substrate according to claim 1, further comprising:

a plurality of load cells respectively mounted to the plurality of lower support members to respectively measure a load of the lower stages supported by the plurality of lower support members; and

a lower control unit configured to lift each of the plurality of lower driving bodies by using a difference between a plurality of load values measured by the plurality of load cells.

4. The apparatus of attaching a substrate according to claim 3, wherein the lower driving unit further comprises:

a lower support having a plate shape, installed to face the lower stage, and having an upper portion mounted to the plurality of lower support members and a lower portion mounted to the plurality of lower driving bodies; and

a plurality of lower driving sources respectively connected to the plurality of lower driving bodies to lift each of the plurality of lower driving bodies,

wherein the lower support has an inclination adjusted according to a lifting operation of each of the plurality of lower driving bodies.

5. The apparatus of claim 4, wherein the plurality of lower support members comprise upper and lower shafts arranged vertically, and

the load cell is mounted between the upper shaft and the lower shaft.

6. The apparatus of attaching a substrate according to claim 4, wherein the lower control unit includes:

a support surface monitoring portion configured to decide whether an arrangement state including a parallel state between the upper support surface and the lower support surface is normal or abnormal by using a difference between the plurality of load values measured by the plurality of load cells; and

a drive control section connected to each of the plurality of lower drive sources to adjust an operation of each of the plurality of lower drive sources based on a decision result of the support surface monitoring section.

7. The apparatus of attaching a substrate according to claim 6, further comprising a disposition state measuring unit mounted on at least one of the upper stage and the lower stage to perform measurement for monitoring a disposition state including a parallel state between the upper stage and the lower stage.

8. The apparatus of attaching a substrate according to claim 7, wherein the arrangement state measurement unit includes:

a plurality of pushing members provided at different positions on an outer side surface of the upper table; and

a plurality of displacement sensors mounted on an outer side surface of the lower stage to respectively face the pushing members, the plurality of displacement sensors having a length and a shape, at least one of which is deformed by an external force, and configured to measure a displacement amount,

wherein the lower control unit includes a stage monitoring portion configured to decide whether an arrangement state including a parallel state between the upper stage and the lower stage is normal or abnormal by using a difference between the displacement amounts respectively measured by the plurality of displacement sensors.

9. The apparatus of attaching a substrate according to claim 8, wherein the arrangement state measurement unit includes a plurality of distance sensors mounted on different positions to each measure a distance between the upper support surface and the lower support surface, and

the lower control unit includes the stage monitoring portion configured to decide whether an arrangement state including a parallel state between the upper stage and the lower stage is normal or abnormal by using differences between the distance values respectively measured by the plurality of distance sensors.

10. The apparatus of claim 1, further comprising a chamber unit configured to accommodate the upper stage and the lower stage,

wherein the chamber unit includes:

an upper chamber in which the upper stage is fixedly installed and configured to ascend and descend; and

a lower chamber disposed below the upper chamber to face the upper chamber, an

The upper stage ascends and descends together with the upper chamber.

11. The apparatus of attaching a substrate according to claim 1, further comprising:

a photographing unit disposed under the lower stage to photograph an image of a lower alignment mark formed on the lower substrate; and

a horizontal moving unit connected to the lower stage and configured to horizontally move the lower stage so as to check a position of the lower alignment mark obtained by the photographing unit and a position of a pre-stored upper alignment mark of the upper substrate to align between the lower alignment mark and the upper alignment mark.

12. The apparatus of attaching a substrate according to claim 11, wherein the horizontal moving unit is connected with the lower driving unit to horizontally move the lower driving unit.

13. The apparatus of attaching substrates according to any one of claims 1 to 12, further comprising a plurality of adhesion pins each passing through the upper stage to ascend and descend in a vertical direction and each having an end toward the lower stage on which an adhesion sheet is provided.

14. The apparatus of attaching a substrate according to claim 13, wherein the upper stage comprises:

an upper body having the upper support surface;

a plurality of suction holes provided in the upper body such that each suction hole is exposed to the upper support surface and arranged in an extending direction of the upper support surface while being spaced apart from each other;

a plurality of through holes passing through the upper body in the vertical direction, and into which the plurality of adhesion pins are respectively inserted; and

an upper suction driving part connected to the plurality of suction holes to adjust an internal pressure of the plurality of suction holes to a vacuum pressure.

15. The apparatus of claim 13, wherein each of the adhesive pins comprises a suction duct passing through the adhesive sheet in the vertical direction, and

the apparatus further includes an adhesion pin suction driving part connected to the suction duct to adjust a pressure of the suction duct to a vacuum pressure.

16. A method of attaching a substrate, comprising:

adjusting a tilt of a lower support surface by adjusting a height of at least one edge of a lower table having the lower support surface, the lower support surface configured to support a lower substrate; and

reducing a distance between the lower stage and an upper stage by raising the lower stage, the upper stage having an upper support surface configured to support an upper substrate.

17. The method of attaching a substrate of claim 16, further comprising attaching the lower substrate and the upper substrate after reducing the distance between the lower stage and the upper stage,

wherein in the attachment of the lower substrate and the upper substrate,

attaching the lower substrate and the upper substrate by raising the lower stage to press the lower substrate toward the upper substrate, or

Attaching the lower substrate and the upper substrate by dropping the upper substrate supported by the upper support surface onto the lower substrate.

18. The method of attaching a substrate of claim 17, wherein adjusting the inclination of the lower support surface comprises:

deciding whether an arrangement state including a parallel state between the upper support surface and the lower support surface is normal or abnormal; and

adjusting an inclination of the lower supporting surface by adjusting a height of at least one edge of the lower stage so that the arrangement state is normal, when it is decided that the arrangement state between the upper supporting surface and the lower supporting surface is abnormal, and

the upper substrate and the lower substrate are attached to each other upon deciding that the arrangement state between the upper support surface and the lower support surface is normal.

19. The method of attaching a substrate according to claim 18, wherein determining whether the arrangement state between the upper support surface and the lower support surface is normal or abnormal includes:

contacting at least a portion of the lower substrate with the upper substrate by lifting the lower stage;

measuring a load using each of a plurality of load cells disposed below the lower table and mounted at different positions;

calculating a load difference between a minimum load value and a maximum load value among load values respectively measured by the plurality of load cells; and

deciding whether an arrangement state between the upper and lower support surfaces is normal or abnormal by comparing the calculated load difference with a preset load reference range,

wherein when the calculated load difference is within the load reference range, it is decided that the arrangement state between the upper support surface and the lower support surface is normal, and

deciding that an arrangement state between the upper support surface and the lower support surface is abnormal when the calculated load difference is not within the load reference range.

20. The method of attaching a substrate according to claim 19, wherein in adjusting the inclination of the lower support surface, when it is decided that the arrangement state between the upper support surface and the lower support surface is abnormal,

the height of a portion of the lower stage facing a load cell having a relatively low load value among the plurality of load values measured is increased or the height of a portion of the lower stage facing a load cell having a relatively large load value is decreased.

21. The method of attaching a substrate of claim 16, further comprising:

deciding whether an arrangement state including a parallel state between the upper stage and the lower stage is normal or abnormal before the upper substrate is supported by the upper support surface and the lower substrate is supported by the lower support surface; and

when it is determined that the arrangement state between the upper stage and the lower stage is abnormal, the inclination of at least one of the upper stage and the lower stage is adjusted by adjusting the height of the edge of at least one of the upper stage and the lower stage so that the arrangement state is normal.

22. The method of attaching a substrate according to claim 21, wherein determining whether the arrangement state between the upper stage and the lower stage is normal or abnormal comprises:

measuring displacement amounts of a plurality of displacement sensors mounted at different positions on an outer side surface of the lower table by reducing a distance between the upper table and the lower table such that at least a portion of the upper support surface contacts the lower support surface;

calculating a displacement amount difference between a minimum displacement amount and a maximum displacement amount among displacement amounts respectively measured by the plurality of displacement sensors; and

determining whether an arrangement state between the upper stage and the lower stage is normal or abnormal by comparing the calculated displacement amount difference with a preset displacement amount reference range,

wherein when the calculated displacement amount difference is within the displacement amount reference range, it is decided that the arrangement state between the upper stage and the lower stage is normal, and

deciding that an arrangement state between the upper stage and the lower stage is abnormal when the calculated displacement amount difference is not within the displacement amount reference range.

23. The method of attaching a substrate according to claim 21, wherein determining whether the arrangement state between the upper stage and the lower stage is normal or abnormal comprises:

measuring a plurality of distance values by measuring the distance between the upper support surface and the lower support surface at different locations;

calculating a distance difference between a minimum distance value and a maximum distance value among the plurality of distance values; and

determining whether an arrangement state between the upper stage and the lower stage is normal or abnormal by comparing the calculated distance difference with a preset distance reference range,

wherein when the calculated distance difference is within the distance reference range, it is decided that the arrangement state between the upper stage and the lower stage is normal, and

deciding that an arrangement state between the upper stage and the lower stage is abnormal when the calculated distance difference is not within the distance reference range.

24. The method of attaching a substrate according to claim 16, wherein the upper stage and the lower stage are provided in a chamber unit including an upper chamber and a lower chamber divided,

the upper table is fixedly installed in the upper chamber and ascends and descends together with the upper chamber, an

Maintaining a height of the upper table as a distance between the upper table and the lower table decreases.

25. The method of attaching a substrate according to any one of claims 16 to 24, wherein the upper substrate is supported with adhesive force using a plurality of adhesive pins including an adhesive sheet exposed to the upper support surface while the upper substrate is supported by the upper support surface of the upper stage, and

the method further comprises: separating the plurality of adhesion pins from the upper substrate by lifting the plurality of adhesion pins; thereby pressing the upper substrate toward the upper support surface after the lower stage is raised; thereby pressing the lower substrate toward the upper substrate.

Technical Field

The present disclosure relates to an apparatus for attaching a substrate and a method of attaching a substrate, and more particularly, to an apparatus for attaching a substrate capable of improving the quality of attachment between an upper substrate and a lower substrate, and a method of attaching a substrate.

Background

Flat display devices such as organic light emitting display devices and liquid crystal display devices generally involve a process of attaching an upper substrate and a lower substrate. The apparatus for attaching substrates, which performs a process of attaching upper and lower substrates, includes: a chamber; an upper stage installed in a chamber to support an upper substrate at a bottom surface thereof and capable of being elevated; a lower stage mounted in a chamber below the upper stage to support a lower substrate at a top surface of the lower stage.

Herein, when the upper stage and the lower stage are not parallel to each other, or a bottom surface of the upper stage supporting the upper substrate and a top surface of the lower stage supporting the lower substrate are not parallel to each other, an attachment defect caused by a non-uniform pressing force may be generated. Therefore, an attachment defect may be generated in which the separation distance between the upper substrate and the lower substrate is different for each position, the pressure applied to a portion of the area between the upper substrate and the lower substrate is excessive, or the desired pressure is not applied.

In addition, since the attaching process is performed while a state in which the upper stage and the lower stage are not parallel to each other is not recognized, a product defect may be generated, thereby resulting in an increase in cost of the apparatus and a reduction in operation efficiency.

[ Prior art documents ]

[ patent document ]

(patent document 1) Korean registered patent No. KR1378072

Disclosure of Invention

The present disclosure provides an apparatus for attaching substrates capable of attaching an upper substrate and a lower substrate in a parallel state and a method of attaching substrates.

The present disclosure also provides an apparatus for attaching a substrate capable of attaching an upper substrate and a lower substrate by using a uniform pressing force, and a method of attaching a substrate.

According to an exemplary embodiment, an apparatus for attaching a substrate includes: an upper table having an upper support surface configured to contact and support an upper substrate; a lower stage having a lower support surface disposed at a position facing the upper support surface to contact and support a lower substrate; and a lower driving unit including a plurality of lower support members connected to the lower stage so as to support different regions of the lower stage and a plurality of lower driving bodies respectively connected to the plurality of lower support members to be individually raised and lowered, and the upper stage and the lower stage being disposed adjacent to each other, wherein the lower stage is raised by operating the lower driving unit.

A plurality of lower support members may be disposed below the lower table to support different edges of the lower table.

The apparatus may further comprise: a plurality of load cells respectively mounted to the plurality of lower support members to respectively measure a load of a lower stage supported by the plurality of lower support members; and a lower control unit configured to lift each of the plurality of lower driving bodies by using a difference between a plurality of load values measured by the plurality of load cells.

The lower driving unit may further include: a lower support having a plate shape, installed to face the lower stage, and having an upper portion to which a plurality of lower support members are mounted and a lower portion to which a plurality of lower driving bodies are mounted; and a plurality of lower driving sources respectively connected to the plurality of lower driving bodies to lift each of the plurality of lower driving bodies, and the lower supporter may have an inclination adjusted according to a lifting operation of each of the plurality of lower driving bodies.

The plurality of lower support members may include upper and lower shafts arranged vertically, and the load cell may be mounted between the upper and lower shafts.

The lower control unit may include: a support surface monitoring portion configured to decide whether an arrangement state including a parallel state between the upper support surface and the lower support surface is normal or abnormal by using a difference between a plurality of load values measured by a plurality of load cells; and a drive control section connected to each of the plurality of lower drive sources to adjust an operation of each of the plurality of lower drive sources based on a decision result of the support surface monitoring section.

The apparatus may further include a disposition state measuring unit mounted on at least one of the upper table and the lower table to perform measurement for monitoring a disposition state including a parallel state between the upper table and the lower table.

The arrangement state measurement unit may include: a plurality of pushing members provided at different positions on an outer side surface of the upper table; and a plurality of displacement sensors mounted on an outer side surface of the lower stage to respectively face the pushing member, the plurality of displacement sensors having a length and a shape and configured to measure a displacement amount, at least one of the length and the shape being deformed by an external force. Herein, the lower control unit may include a stage monitoring portion configured to decide whether an arrangement state including a parallel state between the upper stage and the lower stage is normal or abnormal by using a difference between displacement amounts respectively measured by the plurality of displacement sensors.

The arrangement state measuring unit may include a plurality of distance sensors mounted on different positions to each measure a distance between the upper support surface and the lower support surface, and the lower control unit may include a stage monitoring portion configured to decide whether an arrangement state including a parallel state between the upper stage and the lower stage is normal or abnormal by using differences between distance values respectively measured by the plurality of distance sensors.

The apparatus may further include a chamber unit configured to accommodate the upper stage and the lower stage, and the chamber unit may include: an upper chamber in which an upper stage is fixedly installed and configured to ascend and descend; and a lower chamber disposed below the upper chamber to face the upper chamber. Herein, the upper stage may be raised and lowered together with the upper chamber.

The apparatus may further comprise: a photographing unit disposed under the lower stage to photograph an image of a lower alignment mark formed on the lower substrate; and a horizontal moving unit connected to the lower stage and configured to horizontally move the lower stage so as to check a position of the lower alignment mark obtained by the photographing unit and a position of a pre-stored upper alignment mark of the upper substrate to align between the lower alignment mark and the upper alignment mark.

The horizontal moving unit may be connected with the lower driving unit to horizontally move the lower driving unit.

The apparatus may further include a plurality of adhesive pins (adhesive pins) each passing through the upper table to ascend and descend in a vertical direction and each having an end portion toward the lower table on which an adhesive sheet is disposed.

The upper stage may include: an upper body (upper body) having an upper support surface; a plurality of suction holes provided in the upper body such that each suction hole is exposed to the upper support surface and arranged in an extending direction of the upper support surface while being spaced apart from each other; a plurality of through holes passing through the upper body in a vertical direction, and into which a plurality of adhesion pins are respectively inserted; and an upper suction driving part connected to the plurality of suction holes to adjust an internal pressure of the plurality of suction holes to a vacuum pressure.

Each of the adhesion pins may include a suction duct passing through the adhesion sheet in a vertical direction, and the apparatus may further include an adhesion pin suction driving part connected to the suction duct to adjust a pressure of the suction duct to a vacuum pressure.

According to another exemplary embodiment, a method of attaching a substrate includes: adjusting a tilt of a lower support surface by adjusting a height of at least one edge of a lower table having the lower support surface, the lower support surface configured to support a lower substrate; and reducing a distance between the lower stage and an upper stage by lifting the lower stage, the upper stage having an upper support surface configured to support an upper substrate.

The method may further include attaching the lower substrate and the upper substrate after reducing a distance between the lower stage and the upper stage. Herein, in the attachment of the lower substrate and the upper substrate, the lower substrate and the upper substrate may be attached by raising the lower stage to press the lower substrate toward the upper substrate, or the lower substrate and the upper substrate may be attached by dropping the upper substrate supported by the upper support surface onto the lower substrate.

The adjustment of the inclination of the lower support surface may comprise: determining whether an arrangement state including a parallel state between the upper support surface and the lower support surface is normal or abnormal; and adjusting the inclination of the lower support surface by adjusting the height of at least one edge of the lower stage so that the arrangement state is normal, when it is determined that the arrangement state between the upper support surface and the lower support surface is abnormal. Herein, the upper substrate and the lower substrate may be attached to each other when it is decided that the arrangement state between the upper support surface and the lower support surface is normal.

Determining whether the arrangement state between the upper support surface and the lower support surface is normal or abnormal may include: contacting at least a portion of the lower substrate with the upper substrate by lifting the lower stage; measuring a load using each of a plurality of load cells disposed below the lower table and mounted at different positions; calculating a load difference between a minimum load value and a maximum load value among load values respectively measured by the plurality of load cells; and deciding whether the arrangement state between the upper and lower support surfaces is normal or abnormal by comparing the calculated load difference with a preset load reference range. Herein, when the calculated load difference is within the load reference range, it may be decided that the arrangement state between the upper and lower support surfaces is normal, and when the calculated load difference is not within the load reference range, it may be decided that the arrangement state between the upper and lower support surfaces is abnormal.

In the adjustment of the inclination of the lower support surface, in deciding that the arrangement state between the upper support surface and the lower support surface is abnormal, the height of a portion of the lower stage facing the load cell having a relatively low load value among the plurality of load values measured may be increased, or the height of a portion of the lower stage facing the load cell having a relatively large load value may be decreased.

The method may further comprise: determining whether an arrangement state including a parallel state between the upper stage and the lower stage is normal or abnormal before the upper substrate is supported by the upper support surface and the lower substrate is supported by the lower support surface; and adjusting an inclination of at least one of the upper stage and the lower stage by adjusting a height of an edge of the at least one of the upper stage and the lower stage so that the arrangement state is normal, when it is determined that the arrangement state between the upper stage and the lower stage is abnormal.

Determining whether the arrangement state between the upper stage and the lower stage is normal or abnormal may include: measuring displacement amounts of a plurality of displacement sensors mounted at different positions on an outer side surface of the lower table by reducing a distance between the upper table and the lower table so that at least a portion of the upper support surface contacts the lower support surface; calculating a displacement amount difference between a minimum displacement amount and a maximum displacement amount among displacement amounts respectively measured by the plurality of displacement sensors; and determining whether the arrangement state between the upper stage and the lower stage is normal or abnormal by comparing the calculated displacement amount difference with a preset displacement amount reference range. Herein, when the calculated displacement amount difference is within the displacement amount reference range, the arrangement state between the upper stage and the lower stage may be determined to be normal, and when the calculated displacement amount difference is not within the displacement amount reference range, the arrangement state between the upper stage and the lower stage may be determined to be abnormal.

Determining whether the arrangement state between the upper stage and the lower stage is normal or abnormal may include: measuring a plurality of distance values by measuring distances between the upper support surface and the lower support surface at different locations; calculating a distance difference between a minimum distance value and a maximum distance value among the plurality of distance values; and determining whether the arrangement state between the upper stage and the lower stage is normal or abnormal by comparing the calculated distance difference with a preset distance reference range. Herein, when the calculated distance difference is within the distance reference range, it may be determined that the arrangement state between the upper stage and the lower stage is normal, and when the calculated distance difference is not within the distance reference range, it may be determined that the arrangement state between the upper stage and the lower stage is abnormal.

The upper stage and the lower stage may be installed in a chamber unit including an upper chamber and a lower chamber divided, the upper stage may be fixedly installed in the upper chamber and ascended and descended together with the upper chamber, and the height of the upper stage may be maintained as the distance between the upper stage and the lower stage is reduced.

In supporting the upper substrate by the upper support surface of the upper stage, the upper substrate may be supported by adhesive force using a plurality of adhesive pins including an adhesive sheet exposed to the upper support surface, and the method may further include: separating the plurality of adhesion pins from the upper substrate by lifting the plurality of adhesion pins; thereby pressing the upper substrate toward the upper support surface after the lower stage is raised; thereby pressing the lower substrate toward the upper substrate.

Drawings

Exemplary embodiments may be understood in more detail by the following description taken in conjunction with the accompanying drawings, in which:

fig. 1 and 2 are diagrams illustrating an apparatus for attaching a substrate according to an exemplary embodiment.

Fig. 3 is a cross-sectional view particularly illustrating an upper stage and a plurality of adhesion pins.

Fig. 4 is a conceptual diagram illustrating a state of the upper stage viewed from above to explain an arrangement of the pushing member of the arrangement state measuring unit according to the exemplary embodiment.

Fig. 5 is a conceptual diagram illustrating a state of the lower stage viewed from above to explain an arrangement or connection relationship among the displacement sensor, the plurality of load cells, the plurality of lower support members, and the plurality of lower driving sources according to an exemplary embodiment.

Fig. 6 is a conceptual enlarged view for explaining a state in which the upper stage and the lower stage are not parallel to each other in a state in which the upper stage and the lower stage are installed in the chamber unit.

Fig. 7 to 9 are diagrams for explaining a method for controlling the operation of a lower driving unit and a plurality of load cells according to an exemplary embodiment.

Fig. 10 is a conceptual enlarged view for explaining a state in which the upper and lower supporting surfaces are not parallel to each other.

Fig. 11 and 12 are diagrams for explaining a method for controlling the operation of a lower driving unit and a plurality of load cells according to an exemplary embodiment.

[ description of reference numerals ]

1100: a chamber unit;

1110: an upper chamber;

1111: a fixing member;

1120: a lower chamber;

1200: an upper drive portion;

1210: an upper drive body;

1220: an upper drive source;

2100: an upper table;

2100 a: an upper support surface;

2110: an upper body;

2111. 2112, 2113, 2114, 4111, 4112, 4113, 4114: a side edge;

2120: a through hole;

2130: a suction hole;

2140. 2411: connecting a pipeline;

2200: an upper suction driving unit;

2210. 2510, a step of: a pump;

2220. 2520: connecting a pipeline;

2300: an adhesive pin;

2310: a pin member;

2320: an adhesive sheet;

2330: a suction duct;

2400: an adhesive pin operating part;

2410: an adhesive pin support;

2420: an adhesive pin drive body;

2430: an adhesion pin drive source;

2500: an adhesion pin suction driving unit;

3000: an arrangement state measurement unit;

3100. 3100a to 3100 d: a pushing member;

3200. 3200a to 3200 d: a displacement sensor;

4100: a lower stage;

4100 a: a lower support surface;

4110: a lower body;

4120: an adhesive member;

4200: a lower driving unit;

4210. 4210a to 4210 d: a lower support member;

4211: an upper shaft;

4212: a lower shaft;

4220: a lower support;

4230. 4230a to 4230 d: a lower drive body;

4240. 4240a to 4240 d: a lower drive source;

4300: a horizontal moving unit;

4400: a photographing unit;

5000: a lower control unit;

5100: a stage monitoring section;

5200: a support surface monitoring portion;

5300: a drive control section;

6000. 6000 a-6000 d: a load cell;

l1: a first extension line;

l2: a second extension line;

l: lower extension line

Lu: an upper extension line;

s1: an upper substrate;

s2: a lower substrate.

X, Y, Z: direction of rotation

Detailed Description

Hereinafter, exemplary embodiments will be described in more detail with reference to the accompanying drawings. This invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Like numbers refer to like elements throughout.

Fig. 1 and 2 are diagrams illustrating an apparatus for attaching a substrate according to an exemplary embodiment. Herein, fig. 1 shows a state in which an upper chamber and a lower chamber before sealing are separated, and fig. 2 shows a sealed state. Fig. 3 is a cross-sectional view particularly illustrating an upper table and a plurality of attachment pins according to an exemplary embodiment.

Fig. 4 is a conceptual diagram illustrating a state viewed from an upper side of an upper stage in order to explain an arrangement of a pushing member of an arrangement state measuring unit according to an exemplary embodiment. Fig. 5 is a conceptual diagram showing a state viewed from an upper side of the lower stage in order to explain an arrangement or connection relationship among the displacement sensor of the arrangement state measuring unit, the plurality of load cells, the plurality of support members, and the plurality of lower driving sources.

The apparatus for attaching substrates according to an exemplary embodiment (hereinafter, referred to as a substrate attaching apparatus) attaches or joins the upper substrate S1 and the lower substrate S2. Herein, the upper substrate S1 and the lower substrate S2 may be used to manufacture a display device, such as an organic light emitting display device.

In addition, a sealant as an adhesive may be applied to at least one of the upper substrate S1 and the lower substrate S2. More specifically, the sealant may be applied to an edge of at least one of one surface of the upper substrate S1 and one surface of the lower substrate S2 facing each other when attached. In addition, a filling material may be applied to one of the upper substrate S1 and the lower substrate S2. Herein, the filling material is applied to be configured at the inner side of the sealant applied at the edge. In addition, an alignment mark may be formed in each of the upper substrate S1 and the lower substrate S2. Such alignment marks may be used for alignment between the upper substrate S1 and the lower substrate S2.

Hereinafter, a substrate attachment apparatus according to an exemplary embodiment will be described with reference to fig. 1 to 5.

Referring to fig. 1 to 3, the substrate attaching apparatus includes: a chamber unit 1100 having an inner space such that the upper substrate S1 and the lower substrate S2 are attached and including an upper chamber 1110 and a lower chamber 1120; an upper stage 2100 disposed in the chamber unit 1100 and having one surface (hereinafter referred to as an upper support surface 2100a) supporting an upper substrate S1; a lower stage 4100 which is installed in the chamber unit 1100 to face the upper stage 2100 and has one surface (hereinafter, referred to as a lower support surface 4100a) supporting the lower substrate S2 at a position facing the upper support surface 2100 a; a plurality of adhesion pins 2300 each passing through the upper stage 2100 in a vertical direction to be raised and each including an adhesion sheet 2320 facing the lower stage 4100 at ends thereof; a lower driving unit 4200 supporting the lower stage 4100 and raising the lower stage 4100; an arrangement state measurement unit 3000 that measures a value that determines an arrangement state between the upper stage 2100 and the lower stage 4100; and load cells 6000(6000a to 6000d) that measure values that determine the arrangement state between the upper support surface 2100a of the upper stage 2100 and the lower support surface 4100a of the lower stage 4100.

In addition, the substrate attachment apparatus includes a lower control unit 5000 that controls the operation of the lower drive unit 4200 based on values measured by the arrangement state measurement unit 3000 and the load cell 6000.

In addition, the substrate attaching apparatus includes: a pressure driving control unit (not shown) that adjusts the pressure of the chamber unit 1100; an upper driving part 1200 connected to the upper chamber 1110 to lift the upper chamber 1110; a suction driving unit (hereinafter, referred to as an upper suction driving unit 2200) which operates to provide a suction force to the upper stage 2100; an adhesion pin handling part 2400 which raises the plurality of adhesion pins 2300; a suction driving unit (hereinafter, referred to as a sticking pin suction driving unit 2500) which operates to provide a suction force into the sticking pin 2300; a horizontal moving unit 4300 that moves the lower stage 4100 in a horizontal direction for alignment between the upper substrate S1 and the lower substrate S2; and a photographing unit 4400 disposed below the lower stage 4100 to photograph the alignment mark provided on the lower substrate S2.

The chamber unit 1100 has an inner space in which a process of attaching the upper substrate S1 and the lower substrate S2 to each other is performed. The chamber unit 1100 includes an upper chamber 1110 and a lower chamber 1120, the upper chamber 1110 and the lower chamber 1120 are coupled to and spaced apart from each other, and each of the upper chamber 1110 and the lower chamber 1120 has an inner space. In addition, at least one of the upper chamber 1110 and the lower chamber 1120 is connected to a pressure adjusting part for adjusting the internal pressure of the chamber unit 1100. The pressure adjusting part may include a pump and a pipe connecting the chamber unit and the pump.

The upper stage 2100 may be installed in the chamber unit 1100 to face the lower stage 4100. Herein, the upper stage 2100 may be fixed to the upper chamber 1100. For example, a securing member 1111 may be provided to connect the upper chamber 1110 and the upper table 2100. Thus, the upper deck may be raised together as the upper chamber 1110 is raised. In addition, each of the fixing member 1111 and the upper stage 2100 may be coupled to the upper chamber 1110 or separated from the upper chamber 1110.

The upper stage 2100 includes: an upper body 2110 having a surface at a surface facing the lower stage 4100, that is, an upper support surface 2100a, supporting the upper substrate S1; a plurality of suction holes 2130 defined in the upper body 2110 to be exposed to the upper support surface 2100a and to generate a suction force; and a plurality of through holes 2120 passing through the upper body 2110, and a plurality of adhesive pins 2300 inserted into the plurality of through holes 2120, respectively. In addition, the upper table 2100 may include a first connection pipe 2140 provided in the upper body 2110 to connect the plurality of suction holes 2130.

As a component for supporting the upper substrate S1, the upper body 2110 may preferably have a shape corresponding to that of the upper substrate S1, for example, a rectangular plate shape. More specifically, as shown in fig. 4, the upper body 2110 may have a rectangular shape having: a first side 2111 and a second side 2112 each extending in the X direction (longitudinal direction) and facing each other in the Y direction (width direction) intersecting or perpendicular to the X direction; and a third side 2113 and a fourth side 2114 each extending in the Y direction (width direction) and facing each other in the X direction (longitudinal direction).

The upper body 2110 is mounted above the lower stage 4100 to face the lower stage 4100, and a bottom surface of the upper body 2110 facing the lower stage 4100 is an upper support surface 2100a that contacts and supports the upper substrate S1.

As an assembly for providing a passage for the insertion and elevation of the adhesion pin 2300, a through hole 2120 is passed through the upper body 2110 in a vertical direction. More specifically, the through hole 2120 may pass through the upper body 2110 in a vertical direction to open all of the upper support surface 2100a (bottom surface) and the top surface (which is the opposite surface of the upper support surface 2100a) of the upper body 2110. Through holes 2120 corresponding to or equal to the number of the plurality of adhesion pins 2300 are provided such that the plurality of adhesion pins 2300 are inserted into the through holes 2120. Additionally, the plurality of through holes 2120 may be spaced apart from each other to be distributed over the entire upper support surface 2100 a.

The suction hole 2130 is configured such that an end thereof (the end facing the upper support surface 2100a) is exposed to the upper support surface 2100a as a component for supporting the upper substrate S1. A plurality of suction holes 2130 are provided, and the plurality of suction holes 2130 may be spaced apart from each other to be distributed over the entire upper support surface 2100 a. In addition, the through holes 2120 and the suction holes 2130 may be alternately arranged.

The first connection pipe 2140 may be provided in the upper body 2110 to communicate with the plurality of suction holes 2130. Here, the first connection pipe 2140 is connected to the upper suction driving unit 2200.

The upper suction driving unit 2200 may include a pump 2210 and a connection line 2220 connected to the first connection pipe. Accordingly, when the connection line 2220 and the first connection pipe 2140 are adjusted to have a vacuum pressure by operating the upper suction driving unit 2200, the plurality of suction holes 2130 connected to the first connection pipe 2140 have a vacuum pressure. Accordingly, when the vacuum suction force is generated in the plurality of suction holes 2130, the upper substrate S1 is sucked and supported by the upper support surface 2100a by the vacuum suction force of the plurality of suction holes 2130.

A member having elastic force (hereinafter, referred to as an elastic member (not shown)) may be provided on a bottom surface of the upper body 2110 facing the lower stage 4100. In addition, the upper substrate S1 may be contact-supported by a bottom surface of the elastic member facing the lower stage 4100. The elastic member may be made of an inorganic material, for example, rubber made of a material containing silicon, as a component for absorbing or mitigating an impact applied to the upper substrate S1 when the upper substrate S1 is spaced apart from the plurality of adhesion pins 2300.

When the elastic member is mounted on the bottom surface of the upper body 2110, the bottom surface of the elastic member may be defined as an upper support surface 2100a supporting the upper substrate S1. In this case, a plurality of suction holes 2130 are provided to expose the bottom surface of the elastic member. In addition, a plurality of through holes 2120 may be provided to pass through the upper body and the elastic member in a vertical direction.

The adhesion pin 2300 is inserted into the through hole 2120 provided in the upper stage 2100 by using adhesion as a component for supporting the upper substrate S1. The adhesion pin 2300 includes: a pin member 2310, at least a lower portion of the pin member 2310 being inserted into the through hole 2120; a suction pipe 2330 provided in the pin member 2310; and an adhesive sheet 2320 having adhesive force and mounted around the suction duct at an end of the pin member 2310, the end facing the upper support surface 2100a or the lower stage 4100.

The pin member 2310 may have a shape extending in a vertical direction and have a vertical length greater than the through-hole 2120. In addition, at least one upper end of the pin member 2310 may protrude upward from the upper stage 2100.

The adhesive sheet 2320 may have a sheet shape and be mounted to the end of the pin member 2310 as an assembly having adhesive properties.

A suction pipe 2330 is provided to each of the adhesive sheets 2320 and the inside of the pin member 2310. In addition, the suction pipe 2330 provided in the pin member 2310 and the suction pipe 2330 provided in the adhesive sheet 2320 communicate with each other. In other words, the suction pipe 2330 passes through the pin member 2310 and the inside of the adhesive sheet 2320 in a vertical direction. Accordingly, the adhesive sheet 2320 may be described as an assembly mounted around the circumference of the suction pipe 2330 at the end of the pin member 2310 or mounted at the circumference of the suction pipe 2330.

A plurality of adhesion pins 2300 are provided, and the plurality of adhesion pins 2300 are inserted into a plurality of through holes 2120 provided in the upper stage 2100, respectively. Herein, since the through holes 2120 and the suction holes 2130 are alternately arranged, the sticking pins 2300 and the suction holes 2130 are alternately arranged.

The sticking pin operating part 2400 as a means for raising the plurality of sticking pins 2300 includes: an adhesion pin support 2410 supporting a plurality of adhesion pins 2300; a driving body (hereinafter, referred to as an adhesion pin driving body 2420) connected to the adhesion pin support 2410; and a driving source (hereinafter, referred to as an adhesion pin driving source 2430) that supplies lifting power to the adhesion pin driving body 2420.

The adhesion pin support 2410 connects the plurality of adhesion pins 2300 with the adhesion pin driving body 2420, and transmits the elevation driving force of the adhesion pin driving source 2430 to the plurality of adhesion pins 2300. The adhesion pin support 2410 described above may have a plate shape extending in the arrangement direction of the plurality of adhesion pins 2300, and be configured above the upper stage 2100 in the upper chamber 1110. In addition, second connection pipes 2411, which communicate with the suction pipes 2330 respectively provided to the plurality of adhesion pins 2300, may be provided in the adhesion pin support 2410.

The adhesion pin driving source 2430, which is a unit for supplying the elevating power to the adhesion pin driving body 2420, may include a motor. However, the exemplary embodiments are not limited thereto. For example, the adhesion pin drive source 2430 can include various components capable of raising the adhesion pin drive body 2420.

The adhesion pin driving body 2420 connects the adhesion pin supporter 2410 with the adhesion pin driving source 2430, and transmits the elevating power provided by the adhesion pin driving source 2430 to the adhesion pin supporter 2410. More specifically, the adhesion pin driving body 2420 may have a height ascending and descending by extension and contraction caused by the operation of the adhesion pin driving source 2430, or a height ascending and descending without extension and contraction. The adhesion pin driving body 2420 may have one portion disposed in the upper chamber and connected to the adhesion pin support, and the remaining portion disposed outside the upper chamber and connected to the adhesion pin driving source.

The tack pin suction driving unit 2500 may include a pump 2510 and a connection line 2520 connected to a second connection pipe. Accordingly, when the connection line 2520 and the second connection pipe 2411 are adjusted to have vacuum pressure by operating the pump 2510 of the sticking pin driving part 2520, the plurality of suction pipes 2330 connected to the second connection pipe 2411 have vacuum pressure. Accordingly, when a vacuum suction force is generated in the plurality of suction pipes 2330, the upper substrate S1 is sucked and supported by the adhesion pins 2300 by the vacuum suction force.

The upper driving part 1200, which is a component for elevating the upper chamber 1110, includes: a driving source (hereinafter, referred to as an upper driving source 1220) that provides a lifting driving force; and a driving body (hereinafter, referred to as an upper driving body 1210) connecting the upper chamber 1110 and the upper driving source 1220. The upper drive source 1220 may include, for example, a motor. The upper driving body 1210 may have a height ascending and descending by extension and contraction caused by the operation of the upper driving source 1220, or a height ascending and descending without extension and contraction. However, the exemplary embodiments are not limited thereto. For example, the upper drive source 1220 can include various components capable of raising the upper drive body 1210.

The lower stage 4100 includes a lower body 4110, the lower body 4110 having a surface facing the upper stage 2100, i.e., a lower support surface 4100a, on which the lower substrate S2 is seated and supported. The lower body 4110 may preferably have a shape corresponding to that of the lower substrate S2, for example, a rectangular plate shape.

More specifically, as shown in fig. 5, the lower body 4110 may have a rectangular shape having: a first side 4111 and a second side 4112 each extending in the X direction (longitudinal direction) and facing each other in the Y direction (width direction) that intersects or is perpendicular to the X direction; and a third side 4113 and a fourth side 4114, each extending in the Y direction (width direction) and facing each other in the X direction (longitudinal direction). The lower body 4110 is installed under the upper stage 2100 to face the upper stage 2100, and a top surface of the lower body 4110 facing the upper stage 2100 is a lower support surface 4100a contacting and supporting the lower substrate S2.

In addition, the lower stage 4100 may support the lower substrate S2 by using adhesive force. For this purpose, an adhesive member 4120 having adhesive force may be mounted to the lower body 4110. More specifically, the adhesive member 4120 may be mounted on the top surface of the lower body 4110. In addition, a plurality of adhesive members 4120 may be provided, and the plurality of adhesive members 4120 may be spaced apart from each other to be uniformly distributed over the entire top surface of the lower body 4110. In this case, a portion of the bottom surface of the lower substrate S2 is contact-supported by the adhesive member 4120, and the remaining portion is contact-supported by the top surface of the lower body 4110 on which the adhesive member 4120 is not mounted.

As described above, when the plurality of the adhesive members 4120 are not mounted on the top surface of the lower body 4110, the top surface of the adhesive members 4120 facing the upper stage 2100 and the exposed top surface of the lower body on which the adhesive members 4120 are not mounted may be defined as the lower support surface 4100a on which the lower substrate S2 is seated and supported.

In the above, the adhesion member 4120 is described as a component that is provided in plurality and spaced apart from each other on the top surface of the lower body 4110. However, the exemplary embodiments are not limited thereto. For example, an adhesive member 4120 having the same area as the top surface of the lower body 4110 may be provided, and the adhesive member 4120 may be mounted on the top surface of the lower body 4110. In this case, the entire top surface of the adhesive member 4120 facing the upper stage 2100 may be defined as the lower support surface 4100 a.

The lower driving unit 4200 adjusts the height of the lower stage 4100. The lower driving unit 4200 according to an exemplary embodiment may adjust the height of the lower stage 4100 at each position. For example, the lower drive unit 4200 may individually adjust the height of different edges in the lower support surface 4100a of the lower stage 4100. More specifically, for example, when the lower stage 4100 has a rectangular shape, the heights of four vertices in the lower support surface of the lower stage 4100 may be individually adjusted.

The lower driving unit 4200 includes: a plurality of lower support members 4210(4210a to 4210d) which support different regions of the bottom surface of the lower stage 4100; a lower support 4220 supporting a plurality of lower support members 4210; a plurality of lower driving bodies 4230(4230a to 4230d) mounted at lower portions on the lower support 4220 to respectively face the plurality of lower support members 4210; and a plurality of lower driving sources 4240(4240a to 4240d) which respectively supply lifting power to the plurality of lower driving bodies 4230.

The lower support member 4210 supports the lower stage 4100 below. In addition, a plurality of lower support members 4210 are provided, and the plurality of lower support members 4210 support different positions, i.e., different edges, of the bottom surface of the lower stage 4100.

For example, as shown in fig. 5, when the lower stage 4100 has a rectangular shape, four lower support members (hereinafter referred to as first lower support member 4210a to fourth lower support member 4210d) are provided. In addition, lower support members 4210a to 4210d are respectively installed at positions adjacent to four vertices in the bottom surface of the lower stage 4100. Therefore, when the heights of the first to fourth lower support members 4210a to 4210d are individually adjusted, the heights of the regions of the first to fourth lower support members 4210a to 4210d facing the lower support surface 4100a are individually adjusted, respectively.

Each of the plurality of lower support members 4210 may include an upper shaft 4211 and a lower shaft 4212, the upper shaft 4211 and the lower shaft 4212 being divided in a vertical direction. In addition, a load cell 6000(6000a to 6000d), which will be described later, may be installed between the upper and lower shafts 4211 and 4212.

The lower support member 4220 is disposed between the plurality of lower support members 4210 and the plurality of lower drive bodies 4230. That is, a plurality of lower support members 4210 are supported on the lower support member 4220, and a plurality of lower driving bodies 4230 are installed below the lower support member 4220.

The same number of lower driving bodies 4230(4230a to 4230d) as the lower support members 4210 are provided, and the lower driving bodies 4230 are installed below the lower support 4220. In addition, the lower driving body 4230 is disposed below the lower support member 4220 to face the lower support member 4210. That is, below the lower support member 4220, a first lower driver 4230a is mounted at a position facing the first lower support member 4210a, a second lower driver 4230b is mounted at a position facing the second lower support member 4210b, a third lower driver 4230c is mounted at a position facing the third lower support member 4210c, and a fourth lower driver 4230d is mounted at a position facing the fourth lower support member 4210 d. Each of the first to fourth lower drivers 4230a to 4230d may have a height rising and falling by extension and contraction caused by an operation of the lower driving source 4240(4240a to 4240d), or a height rising and falling without extension and contraction.

The same number of lower driving sources 4240(4240a to 4240d) as assemblies for supplying lifting power to the lower driving bodies 4230 are provided to individually control each of the plurality of lower driving bodies 4230, and the plurality of lower driving sources 4240 are respectively connected to the plurality of lower driving bodies 4230. That is, the first to fourth lower driving sources 4240a to 4240d are provided to be connected to the first to fourth lower drivers 4230a to 4230d, respectively. Although each of the lower drive source 4240a through 4240d may include a motor, exemplary embodiments are not limited thereto. For example, each of the lower drive sources 4240 a-4240 d may include various components capable of raising a lower drive body.

According to the lower drive unit 4200 described above, the plurality of lower driving bodies 4230 are raised or lowered by the operation of the plurality of lower driving sources 4240. Accordingly, the lower support 4220 and the plurality of lower support members 4210 ascend or descend. The above-described lifting operation of the plurality of lower driving bodies 4230 allows the lower support 4220 to be lifted or the inclination of the lower support 4220 to be changed. In addition, the plurality of lower support members 4210 supported on the lower support member 4220 are raised or lowered without changing their lengths.

A photographing unit 4400 as a component for photographing the alignment marks formed on the lower substrate S2 may be disposed below the lower stage 4100. The photographing unit 4400 may include a camera.

The horizontal moving unit 4300 aligns the upper substrate S1 with the lower substrate S2 by analyzing the image photographed by the photographing unit 4400 and horizontally moving the lower driving unit 4200 in at least one direction of X, Y and θ. The horizontal moving unit 4300 stores the position of an alignment mark (hereinafter referred to as an upper alignment mark) provided in the upper substrate S1.

In addition, when an image obtained by photographing an alignment mark of a lower substrate (hereinafter, referred to as a lower alignment mark) is transferred from the photographing unit 4400, the horizontal moving unit 4300 horizontally moves the lower driving unit 4200 in at least one direction of X, Y and θ so that the position of the lower alignment mark overlaps the position of the upper alignment mark. Therefore, the lower stage 4100 moves horizontally in at least one direction of X, Y and θ.

While the lower stage 4100 is horizontally moved in at least one direction of X, Y and θ, the photographing unit 4400 photographs the lower alignment mark in real time and transfers the photographed image to the horizontal moving unit 4300. In addition, the horizontal moving unit 4300 analyzes the transferred image and horizontally moves the lower driving unit 4200 in real time.

In an exemplary embodiment, while the upper stage 2100 and the lower stage 4100 are moved to be adjacent to each other to attach the upper substrate S1 and the lower substrate S2, the lower stage 4100 is raised by using the lower driving unit 4200. That is, the upper stage 2100 and the lower stage 4100 are disposed adjacent to each other by raising the lower stage 4100 toward the upper stage 2100 instead of lowering the upper stage 2100 toward the lower stage 4100.

The case where the upper stage 2100 and the lower stage 4100 are disposed adjacent to each other by raising the lower stage 4100 is more stable than the opposite case where the upper stage 2100 is lowered toward the lower stage 4100. In other words, the case where the upper stage 2100 and the lower stage 4100 are disposed adjacent to each other generates less vibration or oscillation than the opposite case by raising the lower stage 4100.

In addition, in the exemplary embodiment, the lower stage 4100 is moved horizontally to align the upper substrate S1 with the lower substrate S2. This case may be more stable than a case where the upper stage 2100 is horizontally moved, and thus an alignment error between the upper and lower alignment marks is reduced.

As described above, since the upper stage 2100 is in a suspended state and the lower stage 4100 is in a state of being placed on the ground by the lower drive unit 4200 and the horizontal moving unit 4300, the following features are obtained: the case where the upper stage 2100 and the lower stage 4100 are disposed adjacent to each other by lifting the lower stage 4100 or the upper stage 2100 and the lower stage 4100 are aligned by horizontally moving the lower stage 4100 is more stable than the opposite case. Accordingly, when the upper stage 2100 is lowered or horizontally moved toward the lower stage 4100, a movement larger or smaller than a target movement amount may be performed due to vibration or oscillation caused by gravity.

Accordingly, in an exemplary embodiment, the upper substrate S1 and the lower substrate S2 are aligned by horizontally moving the lower stage 4100, and the distance between the lower stage 4100 and the upper stage 2100 is reduced by raising the lower stage 4100.

Fig. 6 is a conceptual enlarged view for explaining a state in which the upper stage and the lower stage are not parallel to each other in a state in which the upper stage and the lower stage are installed in the chamber unit. Herein, fig. 6 is a super enlarged view for explaining a state in which the upper stage and the lower stage are not parallel to each other.

Herein, an upper stage 2100 and a lower stage 4100 prepared for manufacturing or providing an attachment apparatus are provided in the chamber unit 1100. That is, the upper stage 2100 is disposed in the upper chamber 1110 and fixed to the upper chamber 1100 by using the fixing member 1111. In addition, the lower stage 4100 is disposed in the lower chamber 1120 and coupled or fixed with the lower driving unit 4200.

Herein, as shown in fig. 6, the upper stage 2100 and the lower stage 4100 may or may not be parallel to each other when installed in the chamber unit 1100.

More specifically, of one end portion and the other end portion of both end portions in the longitudinal direction (X direction) of the upper stage 2100, a line connecting the center of the one end portion in the thickness direction (Z direction) and the center of the other end portion in the thickness direction (Z direction) is defined as a first extension line L1. In addition, of one end portion and the other end portion of both end portions in the longitudinal direction (X direction) of the lower stage 4100, a line connecting the center of the one end portion in the thickness direction (Z direction) and the center of the other end portion in the thickness direction (Z direction) is defined as a second extension line L2.

When described again by reflecting this point, the first extension line L1 of the upper stage 2100 and the second extension line L2 of the lower stage 4100 may be parallel to each other when the upper stage 2100 and the lower stage 4100 are installed in the chamber unit 1100. Herein, the feature that the first extension line L1 and the second extension line L2 are parallel to each other may represent that the angle between the first extension line L1 and the second extension line L2 is 0 °. In addition, the feature that the first extension line L1 and the second extension line L2 are parallel to each other or the angle between the first extension line L1 and the second extension line L2 is 0 ° may indicate that the upper stage 2100 and the lower stage 4100 are arranged parallel to each other. In addition, when the upper stage 2100 and the lower stage 4100 are arranged parallel to each other, the upper support surface 2100a and the lower support surface 4100a may face parallel to each other.

In contrast, when the upper stage 2100 and the lower stage 4100 are installed in the chamber unit 1100 as shown in fig. 6, the first extension line L1 of the upper stage 2100 and the second extension line L2 of the lower stage 4100 may not be parallel to each other. The feature that the first extension line L1 and the second extension line L2 are not parallel to each other may represent that the angle between the first extension line L1 and the second extension line L2 is greater than 0 °. In addition, the feature that the first extension line L1 and the second extension line L2 are not parallel to each other or that the angle between the first extension line L1 and the second extension line L2 is greater than 0 ° may indicate that the upper stage 2100 and the lower stage 4100 are not parallel to each other. In addition, when the upper stage 2100 and the lower stage 4100 are not parallel to each other, the upper support surface 2100a and the lower support surface 4100a may not be parallel to each other.

When the angle between the first extension line L1 and the second extension line L2 is greater than 0 °, the first extension line L1 and the second extension line L2 may become parallel to each other as the angle between the first extension line L1 and the second extension line L2 decreases. Therefore, as the angle between the first extension line L1 and the second extension line L2 decreases, the upper stage 2100 and the lower stage 4100 or the upper support surface 2100a and the lower support surface 4100a may approach a mutually parallel state. Conversely, as the angle between first extension line L1 and second extension line L2 increases, first extension line L1 and second extension line L2 may become farther from a parallel state. Accordingly, as the angle between the first extension line L1 and the second extension line L2 increases, the upper stage 2100 and the lower stage 4100 or the upper support surface 2100a and the lower support surface 4100a may be away from the parallel state.

When the upper substrate S1 and the lower substrate S2 are attached in a state where the upper stage 2100 and the lower stage 4100 are not parallel to each other, a non-uniform pressing force is applied. Thus, attachment defects may be generated in the following manner: the spaced distance between the upper substrate S1 and the lower substrate S2 is different for each position, excessive pressure is applied to a portion of the region between the upper substrate S1 and the lower substrate S2, and necessary pressure is not applied.

Therefore, it is necessary to detect or check whether the upper stage 2100 and the lower stage 4100 are in a parallel state with each other after the upper stage 2100 and the lower stage 4100 are mounted in the chamber unit 1100 or before an attaching process of attaching the upper substrate S1 and the lower substrate S2. In other words, it is necessary to detect or check whether the arrangement state between the upper stage 2100 and the lower stage 4100 is normal or abnormal.

The feature that the arrangement state between the upper stage 2100 and the lower stage 4100 is normal may indicate that the angle between the first extension line L1 and the second extension line L2 is equal to or smaller than a predetermined angle (approximately 0 °). In contrast, the characteristic that the arrangement state between the upper stage 2100 and the lower stage 4100 is not normal may indicate that the angle between the first extension line L1 and the second extension line L2 is greater than a predetermined angle (equal to or greater than 0 °).

Herein, the feature of deciding the arrangement state between the upper stage 2100 and the lower stage 4100 to be the normal state when the angle between the first extension line L1 and the second extension line L2 is 0 ° or within a range of equal to or greater than 0 ° and equal to or less than the predetermined angle is a feature that is substantially difficult to achieve since the first extension line L1 and the second extension line L2 are completely parallel to each other to form an angle of 0 ° therebetween.

Accordingly, a maximum angle that generates a normal attached product or does not generate a poor attached product even when the upper stage 2100 and the lower stage 4100 are not completely parallel to each other (i.e., the angle between the first extension line L1 and the second extension line L2 is not 0 °) and an angle greater than 0 ° is formed therebetween may be set as the "predetermined angle".

Therefore, when the angle between the first extension line L1 and the second extension line L2 is equal to or smaller than a predetermined angle (substantially 0 °), the arrangement state between the upper stage 2100 and the lower stage 4100 is decided as the normal state. Herein, when the angle between the first extension line L1 and the second extension line L2 is greater than 0 ° and equal to or less than a predetermined angle, the first extension line L1 and the second extension line L2 may be regarded as being parallel to each other.

In contrast, when the angle between the first extension line L1 and the second extension line L2 is greater than the predetermined angle, the arrangement state between the upper stage 2100 and the lower stage 4100 is decided as the abnormal state. In addition, when the arrangement state between the upper stage 2100 and the lower stage 4100 is determined to be abnormal, it is necessary to adjust the arrangement state of at least one of the upper stage 2100 and the lower stage 4100.

Herein, the operation of adjusting the arrangement state of at least one of the upper stage 2100 and the lower stage 4100 may include an operation of adjusting the height of at least one edge of the upper stage 2100 and the lower stage 4100. In addition, when the height of at least one edge of the upper stage 2100 and the lower stage 4100 is adjusted, the inclination of the stage of which the height is adjusted is changed, and the angle between the first extension line L1 and the second extension line L2 is changed. Accordingly, the feature of adjusting the arrangement state of at least one of the upper stage 2100 and the lower stage 4100 may include a feature of adjusting the inclination of the height-adjusted stage.

The exemplary embodiment provides an arrangement state measuring unit 3000 that detects an arrangement state between the upper stage 2100 and the lower stage 4100.

The arrangement state measurement unit 3000 according to an exemplary embodiment includes: a plurality of pushing members 3100(3100a to 3100d) (refer to fig. 1 to 4) mounted to different positions at an outer side surface of the upper stage 2100; and a plurality of displacement sensors 3200(3200a to 3200d) (refer to fig. 1, 2 and 5) mounted on an outer side surface of the lower stage 4100 to face the plurality of pushing members 3100, respectively.

A plurality of pushing members 3100(3100a to 3100d) are provided. The same number of push members 3100 as, or a corresponding number of lower support members 4210 are preferably provided. In addition, each of the plurality of pushing members 3100 is mounted on an outer side surface of the upper stage 2100, that is, on edges in the longitudinal direction and the width direction of the upper stage 2100. For example, as shown in fig. 4, the first and second pushing members 3100a and 3100b are spaced apart from each other in the width direction (Y direction) on the outer side surface of the upper stage 2100 corresponding to the third side 2113, and the third and fourth pushing members 3100c and 3100d are spaced apart from each other in the width direction (Y direction) on the outer side surface of the upper stage 2100 corresponding to the fourth side 2114. Herein, first pushing member 3100a faces third pushing member 3100c, and second pushing member 3100b faces fourth pushing member 3100 d. In addition, the spacing distance between the first pushing member 3100a and the second pushing member 3100b is equal to the spacing distance between the third pushing member 3100c and the fourth pushing member 3100 d. However, the exemplary embodiment is not limited to the installation location of each of the plurality of pushing members 3100. For example, multiple pushing members 3100 may face multiple displacement sensors 3200, respectively.

Each of the plurality of urging members 3100 has at least one surface (hereinafter referred to as an urging surface) facing the displacement sensor. This pushing surface contacts the displacement sensor 3200 to push or press the displacement sensor 3200 when the upper stage 2100 and the lower stage 4100 are arranged adjacent to each other.

The same number or the corresponding number of displacement sensors 3200(3200a to 3200d) as pushing member 3100 is provided. Plurality of displacement sensors 3200 face plurality of pushing members 3100, respectively. For example, four displacement sensors (hereinafter, referred to as first to fourth displacement sensors 3200a to 3200d) may be provided. In addition, each of the first to fourth displacement sensors 3200a to 3200d is mounted on the outer side surface of the lower stage 4100, i.e., at the edges in the longitudinal direction and the width direction of the lower stage 4100. For example, as shown in fig. 5, the first and second displacement sensors 3200a and 3200b are spaced apart from each other in the width direction (Y direction) on the outer side surface of the lower stage 4100 corresponding to the third side 4113, and the third and fourth displacement sensors 3200c and 3200d are spaced apart from each other in the width direction (Y direction) on the outer side surface of the lower stage 4100 corresponding to the fourth side 4114. Herein, in the vertical direction (Z direction), first displacement sensor 3200a faces first pushing member 3100a, second displacement sensor 3200b faces second pushing member 3100b, third displacement sensor 3200c faces third pushing member 3100c, and fourth displacement sensor 3200d faces fourth pushing member 3100 d.

Plurality of displacement sensors 3200 may be components that change in height and deform in shape when an external force is applied. In addition, the plurality of displacement sensors 3200 may be a device that measures or senses the amount of displacement between an initial state before an external force is applied and a state when the external force is applied. For example, displacement sensor 3200 may be a component that contracts in the Z direction with a force applied from the outside. In addition, displacement sensor 3200 may be a member that measures a change in height or a change in length in the Z direction (displacement amount) of the uppermost portion between an initial state before an external force is applied and a state when the force is applied by pushing member 3100. More specifically, displacement sensor 3200 may maintain an initial state before being in contact with or pressed by pushing member 3100, and contract in the Z-direction when being in contact with or pressed by pushing member 3100. Herein, the displacement amounts (hereinafter referred to as first to fourth displacement amounts) are measured by the first to fourth displacement sensors 3200, respectively.

When the displacement sensor 3200 is a component that measures a displacement amount between a length in an initial state (hereinafter referred to as an initial length) and a length when contracted by a force applied from the outside (hereinafter referred to as a deformed length), the displacement amount (initial length — deformed length) may have, for example, a unit of "millimeter (mm)". However, the exemplary embodiments are not limited thereto. For example, the amount of displacement may have various length portions.

The difference between the first displacement amount to the fourth displacement amount may vary according to the arrangement state between the upper stage 2100 and the lower stage 4100.

For example, as the angle between the first and second extension lines L1 and L2 decreases, the difference value (hereinafter referred to as a displacement difference) between the maximum value (hereinafter referred to as a maximum displacement amount) and the minimum value (hereinafter referred to as a minimum displacement amount) of the first to fourth displacement amounts may decrease. In addition, as the angle between the first and second extension lines L1 and L2 increases, a displacement amount difference between the maximum and minimum displacement amounts of the first to fourth displacement amounts may increase. Therefore, as the displacement amount difference between the maximum displacement amount and the minimum displacement amount among the first to fourth displacement amounts decreases, it may be decided that the arrangement state between the upper stage 2100 and the lower stage 4100 approaches the parallel state. In contrast, as the displacement amount difference from the first displacement amount to the fourth displacement amount increases, the arrangement state between the upper stage 2100 and the lower stage 4100 is away from the parallel state.

Accordingly, the arrangement state between the upper stage 2100 and the lower stage 4100 can be decided by analyzing the first to fourth displacement amounts measured by the first to fourth displacement sensors 3200a to 3200 d. That is, in the exemplary embodiment, when a displacement amount difference between the maximum displacement amount and the minimum displacement amount among the first to fourth displacement amounts is within a preset reference range (hereinafter, referred to as a displacement amount reference range), the arrangement state between the upper stage 2100 and the lower stage 4100 is decided as a normal state. In contrast, when the displacement amount difference is not within the displacement amount reference range, the arrangement state between the upper stage 2100 and the lower stage 4100 is decided as an abnormal state.

Herein, the reference range of the amount of displacement may be, for example, "10 mm or less than 10 mm (0 mm or more than 0 mm)". However, the exemplary embodiments are not limited thereto. For example, the displacement amount reference range may be changed differently within a range where a normal attached product is generated in the attaching process. For example, the displacement amount reference range may be set differently in the range of less than 10 mm or the range of more than 10 mm described above. For example, the reference range of the amount of displacement may be variously set to "a range of 5 mm or less (0 mm or more than 0 mm)", "a range of 1 mm or less (0 mm or more than 0 mm)", "a range of 20 mm or less than 20 mm", or "a range of 50 mm or less than 50 mm".

Hereinafter, referring to fig. 1 to 5, a method for deciding whether an arrangement state between an upper stage and a lower stage is normal or abnormal and adjusting an arrangement state of at least one of the upper stage and the lower stage by using an arrangement state measuring unit.

A process of deciding whether the arrangement state between the upper stage 2100 and the lower stage 4100 is normal or abnormal is performed before a process of attaching the upper substrate S1 and the lower substrate S2, and the substrate is not supported by each of the upper stage 2100 and the lower stage 4100.

First, in a state where the upper chamber 1110 and the lower chamber 1120 are separated from each other, the upper stage 2100 and the lower stage 4100 are inserted and fixed to the upper chamber 1110 and the lower chamber 1120, respectively. In addition, the upper chamber 1110 and the upper stage 2100 are lowered by operating the upper driving part 1200. Here, the upper chamber 1110 and the lower chamber 1120 are coupled to each other for sealing, and the upper support surface 2100a of the upper stage 2100 is lowered until contacting the lower support surface 4100a of the lower stage 4100. Herein, at least one of the first to fourth push members 3100a to 3100d mounted on the outer side surface of the upper stage 2100 is lowered until contacting or pressing the facing displacement sensor and then stopped.

When the descent of the upper stage 2100 is stopped, the first to fourth displacement amounts measured by the first to fourth displacement sensors 3200a to 3200d, respectively, are compared with each other. In addition, a difference between the maximum displacement amount and the minimum displacement amount, i.e., a displacement amount difference, of the first to fourth displacement amounts is calculated.

Thereafter, the calculated displacement amount difference is compared with the displacement amount reference range. When the calculated displacement amount difference is within the displacement amount reference range, the current arrangement or installation state between the upper stage 2100 and the lower stage 4100 is maintained.

However, the calculated displacement amount difference is not within the displacement amount reference range, and the arrangement state, that is, the inclination of at least one of the upper stage 2100 and the lower stage 4100 is adjusted. For this purpose, the upper chamber 1110 and the upper stage 2100 are raised by operating the upper driving part 1200 to space the upper stage 2100 and the lower stage 4100 from each other.

In addition, the arrangement state or inclination of at least one of the upper stage 2100 and the lower stage 4100 (e.g., the lower stage 4100) is adjusted. Herein, the inclination of the lower stage 4100 may be adjusted using a method for raising the height of at least one edge of the lower stage 4100. In addition, the rising position and the rising height may be adjusted by using the measured first to fourth displacement amounts and the displacement amount difference. Herein, the rising height may be adjusted by rising a position having a relatively small displacement amount and relatively comparing the difference between the first displacement amount to the fourth displacement amount.

The above-described operation of adjusting the inclination of the lower stage 4100 may be performed by: a separate member (hereinafter, referred to as a height adjustment member) is inserted between the lower driving unit and the lower portion of the lower stage 4100, which corresponds to an edge having a height to be raised in the lower stage 4100. This may be performed by a worker.

Although the feature of adjusting the arrangement state of the lower stage 4100 is described, the arrangement state of the upper stage 2100 may be adjusted. For example, when the upper stage 2100 is fixed to the upper chamber by connecting the upper stage 2100 and the fixing part 1111, the arrangement state, i.e., inclination, of the upper stage 2100 may be adjusted by adjusting the position of the fixing part 1111.

However, embodiments of the inventive concept are not limited thereto. For example, the arrangement state of all of the upper stage 2100 and the lower stage 4100 may be adjusted.

After the operation of adjusting the arrangement state of at least one of the upper stage 2100 and the lower stage 4100 is completed, the arrangement state of the upper stage 2100 and the lower stage 4100 must be checked. For this purpose, the following is performed again: a process of measuring first to fourth displacement amounts from the first to fourth displacement sensors 3200a to 3200d by lowering the upper chamber 1110 and the upper stage 2100; calculating the displacement difference; and a process of deciding whether the arrangement state of the upper stage 2100 and the lower stage 4100 is normal or abnormal by comparing the calculated displacement amount difference with the displacement amount reference range. In addition, the above-described process is repeated until the displacement amount difference is within the displacement amount reference range.

When the displacement amount difference is within the displacement amount reference range by the above-described process, the current arrangement state between the upper stage 2100 and the lower stage 4100 is maintained. Accordingly, the upper stage 2100 and the lower stage 4100 may be arranged in a normal state or in a mutually parallel state. Therefore, the upper substrate and the lower substrate can be attached with a uniform pressing force during the attaching process.

Although the following features are described: an arrangement state (i.e., inclination) of at least one of the upper stage 2100 and the lower stage 4100 is adjusted by a worker such that the arrangement state between the upper stage 2100 and the lower stage 4100 is normal, but the exemplary embodiment is not limited thereto.

For example, the operation of the lower driving unit 4200 may be automatically controlled according to the measured displacement amounts from the first to fourth displacement sensors 3200a to 3200d to adjust the arrangement state between the upper stage 2100 and the lower stage 4100 to be normal.

For this purpose, a lower control unit 5000 is provided, which is connected to the first through fourth displacement sensors 3200a through 3200d and controls the operation of the lower driving unit 4200 according to the measured amounts of displacement from the first through fourth displacement sensors 3200a through 3200 d.

The lower control unit 5000 includes: a stage monitoring part 5100 that determines whether the arrangement state between the upper stage 2100 and the lower stage 4100 is normal or abnormal by comparing the displacement amount difference with a preset displacement amount reference range; and a drive control section 5300 that adjusts the operation of the lower drive unit 4200 according to the determination result of the monitoring section 5100.

In addition, the lower control unit 5000 may further include a support surface monitoring portion 5200 which decides whether an arrangement state between the upper support surface 2100a of the upper stage 2100 and the lower support surface 4100a of the lower stage 4100 is normal or abnormal according to load values measured by a plurality of load cells 6000 (which will be described later). In addition, the drive control portion 5300 adjusts the operation of the lower drive unit 4200 according to the determination result of the support surface monitoring portion 5200. The operation of the drive control portion 5300 according to the decision result of the support surface monitoring portion 5200 and the support surface monitoring portion 5200 will be described in detail later.

The stage monitoring portion 5100 calculates a difference between the maximum displacement amount and the minimum displacement amount, that is, a displacement amount difference, by receiving the first to fourth displacement amounts measured by the first to fourth displacement sensors 3200a to 3200 d. In addition, the stage monitoring section 5100 decides whether the arrangement state between the upper stage 2100 and the lower stage 4100 is normal or abnormal by comparing the calculated displacement amount difference with a preset displacement amount reference range.

Herein, the reference range of the amount of displacement set in the stage monitoring portion 5100 may be the same as the above-described exemplary embodiment. That is, the reference range of the amount of displacement may be, for example, "10 mm or less than 10 mm (0 mm or more than 0 mm)". However, embodiments of the inventive concept are not limited thereto. For example, the displacement amount reference range may be changed differently within a range where a normal attached product is generated in the attaching process. For example, the displacement amount reference range may be set differently in the range of less than 10 mm or the range of more than 10 mm described above. For example, the reference range of the amount of displacement may be variously set to "a range of 5 mm or less (0 mm or more than 0 mm)", "a range of 1 mm or less (0 mm or more than 0 mm)", "a range of 20 mm or less than 20 mm", or "a range of 50 mm or less than 50 mm".

The drive control portion 5300 is connected with the arrangement state measuring unit 3000 and the stage monitoring portion 5100 to control the operation of the lower drive unit 4200. That is, when deciding that the arrangement state between the upper stage 2100 and the lower stage 4100 is an abnormal state, the drive control portion 5300 operates at least one of the first lower drive source 4240a to the fourth lower drive source 4240 d.

Accordingly, at least one of the first to fourth lower driving bodies 4230a to 4230d ascends or descends. Accordingly, a portion of the lower support 4220 connected to the ascending or descending lower driving body ascends or descends. In addition, a lower support member supported by a rising or falling lower support member among the first to fourth lower support members 4210a to 4210d rises or falls. That is, when one of the first to fourth lower drivers 4230a to 4230d ascends, the lower support member arranged to face the ascended lower driver ascends. Similarly, when one of the first to fourth lower drive bodies 4230a to 4230d descends, the lower support member configured to face the descending lower drive body descends. Further, a portion of the lower stage 4100 connected to the lower support member that is raised, and a portion connected to the lower support member that is lowered.

Fig. 7 to 9 are diagrams for explaining a method for controlling an operation of a lower driving unit using an arrangement state measuring unit and a lower control unit according to an exemplary embodiment.

Hereinafter, a method for controlling the operation of the lower driving unit using the arrangement state measuring unit and the lower control unit will be described with reference to fig. 7 to 9.

First, in a state where the upper chamber 1110 and the lower chamber 1120 are separated from each other, the upper stage 2100 and the lower stage 4100 are inserted and fixed to the upper chamber 1110 and the lower chamber 1120, respectively. Here, as shown in fig. 7, the upper stage 2100 and the lower stage 4100 are arranged to face each other.

In addition, as the upper chamber 1110 and the lower chamber 1120 are coupled to each other, and the upper chamber 1110 and the upper stage 2100 are lowered until the upper support surface 2100a of the upper stage 2100 contacts the lower support surface 4100a of the lower stage 4100, the chamber unit is sealed. Herein, as shown in fig. 8, the upper stage 2100 is lowered until at least one of the first to fourth pushing members 3100a to 3100d (which are mounted on the outer side surface) contacts or presses the facing displacement sensor, and then the movement thereof is stopped.

While the descent of the upper stage 2100 is stopped, each of the first to fourth displacement sensors 3200a to 3200d transmits each of the measured first to fourth displacement amounts to the stage monitoring portion 5100 of the lower control unit 5000. In addition, the stage monitoring section 5100 calculates a difference between the maximum amount of displacement and the minimum amount of displacement, i.e., a displacement amount difference, of the first to fourth amounts of displacement. Thereafter, the stage monitoring portion 5100 decides whether the arrangement state between the upper stage 2100 and the lower stage 4100 is normal or abnormal by comparing the calculated displacement amount difference with a preset displacement amount reference range.

Herein, when the calculated displacement amount difference is within the displacement amount reference range, the stage monitoring section 5100 decides the arrangement state between the upper stage 2100 and the lower stage 4100 as a normal state, and transmits this to the drive control section 5300. The drive control portion 5300 does not operate the first to fourth lower drive sources 4240a to 4240 d. Accordingly, the current arrangement state, i.e., inclination, between the upper stage 2100 and the lower stage 4100 is maintained.

However, when the calculated displacement amount difference is not within the displacement amount reference range, the stage monitoring section 5100 decides that the arrangement state between the upper stage 2100 and the lower stage 4100 is an abnormal state, and transmits this to the drive control section 5300.

In this case, the drive control portion 5300 operates at least one of the first lower drive source 4240a to the fourth lower drive source 4240 d. To this end, the upper drive portion 1200 is operable to raise the upper chamber 1110 and the upper stage 2100, thereby spacing the upper stage 2100 from the lower stage 4100.

Hereinafter, the following features will be assumed for more detailed description.

For example, among the first to fourth displacement amounts, the first and second displacement amounts are equal to each other, and the third and fourth displacement amounts are equal to each other. In addition, each of the third displacement amount and the fourth displacement amount is smaller than each of the first displacement amount to the fourth displacement amount. In this case, each of the first displacement amount to the fourth displacement amount is the minimum displacement amount, and each of the third displacement amount and the fourth displacement amount is the maximum displacement amount. In addition, since the difference between the maximum displacement amount and the minimum displacement amount (i.e., displacement amount difference) is not within the displacement amount reference range, the stage monitoring portion 5100 decides that the arrangement state between the upper stage 2100 and the lower stage 4100 is an abnormal state.

Since the stage monitoring portion 5100 decides that the arrangement state between the upper stage 2100 and the lower stage 4100 is an abnormal state, the arrangement state, that is, the inclination between the upper stage 2100 and the lower stage 4100 is adjusted by operating at least one of the first lower drive source 4240a to the fourth lower drive source 4240 d.

Here, since each of the third displacement amount and the fourth displacement amount is smaller than each of the first displacement amount and the second displacement amount, the drive control portion 5300 allows a portion of the lower stage 4100 where the third displacement sensor 3200c and the fourth displacement sensor 3200d are mounted to rise. For this purpose, the lower control unit 5000 allows the third and fourth driving bodies 4230c and 4230d to ascend by operating the third and fourth lower driving sources 4240c and 4240d as shown in fig. 9. Accordingly, the height of each of the third and fourth lower support members 4210c and 4210d, which are mounted on the lower support 4220, of the first to fourth lower support members 4210a to 4210d is raised. Therefore, the height of a portion of the lower stage 4100 supported by the third lower support member 4210c and the fourth lower support member 4210d is raised.

As another method, the driving control portion 5300 allows a portion of the lower stage 4100 where the first and second displacement sensors 3200a and 3200b facing the third and fourth displacement sensors 3200c and 3200d are arranged to descend. For this purpose, the drive control portion 5300 allows the first and second lower drivers 4230a and 4230b to descend by operating the first and second lower drive sources 4240a and 4240 b. Accordingly, the height of each of the first and second lower support members 4210a and 4210b mounted on the lower support 4220 among the first to fourth lower support members 4210a to 4210d is lowered. Therefore, the height of a portion of the lower stage 4100 supported by the first and second lower support members 4210a and 4210b is lowered.

When the operation of adjusting the inclination of the lower stage 4100 is completed as described above, the arrangement state between the upper stage 2100 and the lower stage 4100 is checked.

For this purpose, the following is performed again: a process of measuring first to fourth displacement amounts from the first to fourth displacement sensors 3200a to 3200d by lowering the upper chamber 1110 and the upper stage 2100; calculating the displacement difference; and a process of deciding whether the arrangement state of the upper stage 2100 and the lower stage 4100 is normal or abnormal by comparing the calculated displacement amount difference with the displacement amount reference range. In addition, the above-described process is repeated until the displacement amount difference is within the displacement amount reference range.

When the displacement amount difference is within the displacement amount reference range by the above-described method, the current arrangement state between the upper stage 2100 and the lower stage 4100 is maintained. Accordingly, the upper stage 2100 and the lower stage 4100 may be arranged in a normal state or arranged in parallel to each other. Therefore, the upper substrate S1 and the lower substrate S2 can be attached with a uniform pressing force during the attaching process.

Hereinabove, arrangement state measurement unit 3000 is described as an assembly including pushing member 3100 and displacement sensor 3200. However, embodiments of the inventive concept are not limited thereto. For example, the arrangement state measurement unit 3000 may include a plurality of distance sensors (not shown) for measuring a spaced distance between the upper support surface 2100a and the lower support surface 4100 a.

A plurality of distance sensors may be mounted on one of the upper stage 2100 and the lower stage 4100, for example, on the lower stage 4100. In addition, a plurality of distance sensors are mounted at different positions to measure the separation distance between the upper support surface 2100a and the lower support surface 4100 a. That is, the separation distance between the upper support surface 2100a and the lower support surface 4100a is measured at different positions, which are measured by a plurality of distance sensors. Here, distance sensors corresponding to the number of the plurality of lower support members 4210a to 4230d, for example, four distance sensors (hereinafter, referred to as first to fourth distance sensors) may be provided. In addition, the first to fourth distance sensors are provided to measure the distance between regions of the lower support surface 4100a respectively facing the first to fourth lower support members 4210a to 4210d and regions of the upper support surface respectively facing the regions.

In addition, the stage monitoring portion 5100 of the lower control unit 5000 decides whether the arrangement state between the upper stage 2100 and the lower stage 4100 is normal or abnormal by using the distance value measured by each of the plurality of distance sensors.

Hereinafter, a method is used for controlling the operation of the lower driving unit using the lower control unit and the arrangement state measuring unit including the plurality of distance sensors.

First, in a state where the upper chamber 1110 and the lower chamber 1120 are separated from each other, the upper stage 2100 and the lower stage 4100 are inserted and fixed to the upper chamber 1110 and the lower chamber 1120, respectively. Subsequently, a separation distance between the upper support surface and the lower support surface is measured by using each of the plurality of distance sensors.

Each of the plurality of distance sensors transmits the first to fourth distance values to the station monitoring portion 5100 of the lower control unit 5000. In addition, the stage monitoring section 5100 calculates a difference between the maximum distance value and the minimum distance value of the first to fourth distance values, that is, a distance difference. Thereafter, the stage monitoring section 5100 decides whether the arrangement state between the upper stage 2100 and the lower stage 4100 is normal or abnormal by comparing the calculated distance difference with a preset distance reference range.

Herein, when the calculated distance difference is within the distance reference range, the stage monitoring section 5100 decides the arrangement state between the upper stage 2100 and the lower stage 4100 as a normal state, and transmits this to the drive control section 5300. The drive control portion 5300 does not operate the first to fourth lower drive sources 4240a to 4240 d. Accordingly, the current arrangement state, i.e., the current inclination, between the upper stage 2100 and the lower stage 4100 is maintained.

However, when the calculated distance difference is not within the distance reference range, the stage monitoring section 5100 decides that the arrangement state between the upper stage 2100 and the lower stage 4100 is an abnormal state, and transmits this to the drive control section 5300. In this case, the drive control portion 5300 operates at least one of the first to fourth lower drive sources 4240a to 4240d to adjust the inclination of the lower stage 4100.

Fig. 10 is a conceptual enlarged view for explaining a state in which the upper and lower supporting surfaces are not parallel to each other. Herein, fig. 10 is a super enlarged view for explaining a state in which the upper stage and the lower stage are not parallel to each other.

Although the upper stage 2100 and the lower stage 4100 are arranged parallel to each other in the normal state, the upper support surface 2100a of the upper stage 2100 and the lower support surface 4100a of the lower stage 4100 may not be parallel to each other. In other words, although the displacement amount difference of the first to fourth displacement amounts measured by the first to fourth displacement sensors 3200a to 3200d is within the displacement amount reference range and the arrangement state between the upper stage 2100 and the lower stage 4100 is normal, the upper support surface 2100a and the lower support surface 4100a may not be parallel to each other. This is because at least one support surface is not in a horizontal state when the upper stage 2100 and the lower stage 4100 are disposed. That is, at least one of the upper support surface 2100a of the upper stage 2100 and the lower support surface 4100a of the lower stage 4100 may not be in a horizontal state.

More specifically, a line extending parallel to the upper support surface 2100a of the upper stage 2100 is defined as an upper extension line Lu, and a line extending parallel to the lower support surface 4100a of the lower stage 4100 is defined as a lower extension line Ll.

When described again by reflecting this point, in the chamber unit 1100, the upper extension line Lu of the upper stage 2100 and the lower extension line Ll of the lower stage 4100 may be parallel to each other. Herein, the feature that the upper extension line Lu and the lower extension line Ll are parallel to each other may mean that the angle between the upper extension line Lu and the lower extension line Ll is 0 °. In addition, the feature that the upper extension line Lu and the lower extension line Ll are parallel to each other or the angle between the upper extension line Lu and the lower extension line Ll is 0 ° may indicate that the upper support surface 2100a and the lower support surface 4100a are arranged parallel to each other.

In contrast, in the chamber unit 1100, the upper extension line Lu of the upper stage 2100 and the lower extension line Ll of the lower stage 4100 may not be parallel to each other, as illustrated in fig. 10. The feature that the upper extension line Lu and the lower extension line Ll are not parallel to each other may mean that the angle between the upper extension line Lu and the lower extension line Ll is greater than 0 °. In addition, the feature that the upper extension line Lu and the lower extension line Ll are not parallel to each other or that the angle between the upper extension line Lu and the lower extension line Ll is greater than 0 ° may indicate that the upper support surface 2100a and the lower support surface 4100a are not parallel to each other.

When the angle between the upper extension line Lu and the lower extension line Ll is greater than 0 °, the upper extension line Lu and the lower extension line Ll approach a parallel state as the angle between the upper extension line Lu and the lower extension line Ll decreases. Therefore, as the angle between the upper extension line Lu and the lower extension line Ll decreases, the arrangement state between the upper support surface 2100a and the lower support surface 4100a approaches the mutually parallel state. Conversely, as the angle between the upper extension line Lu and the lower extension line Ll increases, the upper extension line Lu and the lower extension line Ll are moved away from the parallel state. Therefore, as the angle between the upper extension line Lu and the lower extension line Ll increases, the arrangement state between the upper support surface 2100a and the lower support surface 4100a is away from the mutually parallel state.

When the upper substrate S1 and the lower substrate S2 are attached in a state where the upper support surface 2100a and the lower support surface 4100a are not parallel to each other, a non-uniform pressing force is applied. Thus, attachment defects may be generated in the following manner: the spaced distance between the upper substrate S1 and the lower substrate S2 is different for each position, excessive pressure is applied to a portion of the region between the upper substrate S1 and the lower substrate S2, and necessary pressure is not applied.

Therefore, during the process of attaching the upper substrate S1 and the lower substrate S2 or before performing the final pressing, it is necessary to detect or check whether the arrangement state between the upper support surface 2100a and the lower support surface 4100a is in the mutually parallel state. In other words, it is necessary to detect or check whether the arrangement state between the upper support surface 2100a and the lower support surface 4100a is normal or abnormal.

The feature that the arrangement state between the upper support surface 2100a and the lower support surface 4100a is normal may indicate that the angle between the upper extension line Lu and the lower extension line Ll is equal to or smaller than a predetermined angle (approximately 0 °). In contrast, the characteristic that the arrangement state between the upper support surface 2100a and the lower support surface 4100a is not normal may indicate that the angle between the upper extension line Lu and the lower extension line Ll is greater than a predetermined angle (equal to or greater than 0 °).

Here, the feature of deciding that the arrangement state between the upper support surface 2100a and the lower support surface 4100a is the normal state when the angle between the upper extension line Lu and the lower extension line Ll is 0 ° or in the range of 0 ° or more and 0 ° or less than the predetermined angle is a feature that the feature is substantially difficult to achieve since the upper extension line Lu and the lower extension line Ll are completely parallel to each other to form an angle of 0 ° therebetween.

Accordingly, a maximum angle at which a normal attached product is generated or a poor attached product is not generated even when the upper and lower support surfaces 2100a and 4100a are not completely parallel to each other (i.e., the angle between the upper and lower extension lines Lu and L2 is not 0 °) and an angle greater than 0 ° is formed therebetween may be set as the "predetermined angle".

Therefore, when the angle between the upper extension line Lu and the lower extension line L2 is equal to or smaller than a predetermined angle (substantially 0 °), the arrangement state between the upper support surface 2100a and the lower support surface 4100a is decided to be the normal state. Herein, when the angle between the upper extension line Lu and the lower extension line Ll is greater than 0 ° or equal to or less than a predetermined angle, the upper extension line Lu and the lower extension line Ll are considered to be in a parallel state.

Conversely, when the angle between the upper extension line Lu and the lower extension line Ll is larger than the predetermined angle, the arrangement state between the upper support surface 2100a and the lower support surface 4100a is decided as the normal state. In addition, when deciding that the arrangement state between the upper support surface 2100a and the lower support surface 4100a is an abnormal state, it is necessary to adjust the arrangement state of at least one of the upper stage 2100 and the lower stage 4100 so that the arrangement state between the upper stage 2100 and the lower stage 4100 is a normal state.

Herein, the operation of adjusting the arrangement state of at least one of the upper stage 2100 and the lower stage 4100 may include an operation of adjusting the height of at least one edge of the upper stage 2100 and the lower stage 4100. In addition, when the height of at least one edge of the upper stage 2100 and the lower stage 4100 is adjusted, the inclination of the stage and the inclination of the support surface of which the height is adjusted are changed. Accordingly, the feature of adjusting the arrangement state of at least one of the upper stage 2100 and the lower stage 4100 may include a feature of adjusting the inclination of at least one of the height-adjusted stage support surfaces (at least one of the upper support surface 2100a and the lower support surface 4100 a).

In the exemplary embodiment, load cells 6000(6000a to 6000d) for detecting the arrangement state between the upper support surface 2100a and the lower support surface 4100a are provided. In addition, the drive control portion 5300 adjusts the operation of the lower drive unit 4200 according to the load (hereinafter, referred to as a load value) measured in the load cell 6000.

The load cell 6000 measures the load or weight of the lower stage supported by the lower support member. Load cells 6000, for example, four load cells, equal to or corresponding to the number of the support members 4210 may be provided. In addition, four load cells (hereinafter, referred to as first to fourth load cells 6000a to 6000d) may be arranged between the lower stage 4100 and the lower support 4220.

More specifically, the load cell 6000 may be installed between the upper shaft 4211 and the lower shaft 4212 of each of the first through fourth lower support members 4210a through 4210 d. More specifically, the first load cell 6000a may be installed between the upper and lower shafts 4211 and 4212 of the first lower support member 4210a, the second load cell 6000b may be installed between the upper and lower shafts of the second lower support member 4210b, the third load cell 6000c may be installed between the upper and lower shafts of the third lower support member 4210c, and the fourth load cell 6000d may be installed between the upper and lower shafts of the fourth lower support member 4210 d.

As described above, since the first to fourth load cells 6000a to 6000d are connected to the first to fourth lower support members 4210a to 4210d, respectively, when the upper stage 2100 contacts the lower stage 4100, the load value measured by at least one of the first to fourth load cells 6000a to 6000d is changed by the load applied from the upper stage 2100 to the lower stage 4100.

Hereinafter, for convenience of description, the loads respectively measured by the first to fourth load cells 6000a to 6000d are referred to as first to fourth load values, respectively.

The first to fourth load values may be changed according to the arrangement state between the upper support surface 2100a and the lower support surface 4100 a.

For example, as the angle between the upper extension line Lu and the lower extension line Ll decreases, a difference (hereinafter, referred to as a load difference) between a maximum value (hereinafter, referred to as a maximum load value) and a minimum value (hereinafter, referred to as a minimum load value) of the first to fourth load values may decrease. In addition, as the angle between the upper extension line Lu and the lower extension line Ll increases, the load difference (i.e., the difference between the maximum load value and the minimum load value among the first to fourth load values) may increase. Therefore, as the load difference (i.e., the difference between the maximum load value and the minimum load value among the first to fourth load values) decreases, the arrangement state between the upper support surface 2100a and the lower support surface 4100a may be decided to be a state close to the parallel state. Conversely, as the load difference from the first load value to the fourth load value increases, the arrangement state between the upper support surface 2100a and the lower support surface 4100a may be decided to be a state away from the parallel state.

Therefore, the arrangement state between the upper support surface 2100a and the lower support surface 4100a can be decided by analyzing the first to fourth load values measured by the first to fourth load cells 6000a to 6000 d. That is, in the exemplary embodiment, when the load difference, i.e., the difference between the maximum load value and the minimum load value among the first to fourth load values, is within a preset reference range (hereinafter, referred to as a load reference range), the arrangement state between the upper support surface 2100a and the lower support surface 4100a is decided as the normal state. In contrast, when the load difference is not within the load reference range, the arrangement state between the upper support surface 2100a and the lower support surface 4100a is decided as the abnormal state.

In an exemplary embodiment, a normal arrangement state between the upper support surface 2100a and the lower support surface 4100a is obtained by automatically controlling the lower driving unit 4200 using the lower control unit 5000.

For this purpose, the lower control unit 5000 according to the exemplary embodiment includes a support surface monitoring portion 5200 which decides whether the arrangement state between the upper support surface 2100a and the lower support surface 4100a is normal or abnormal according to the first to fourth load values measured by the first to fourth load cells 6000a to 6000 d.

The support surface monitoring portion 5200 calculates a difference between the maximum load value and the minimum load value of the first to fourth load values transmitted from the first to fourth load cells 6000a to 6000 d. In addition, the support surface monitoring portion 5200 compares the calculated load difference with a preset load reference range. In addition, when the calculated load difference is within the load reference range, the support surface monitoring portion 5200 decides the arrangement state between the upper support surface 2100a and the lower support surface 4100a to be the normal state. In contrast, when the calculated load difference is not within the load reference range, the support surface monitoring portion 5200 decides the arrangement state between the upper support surface 2100a and the lower support surface 4100a to be an abnormal state.

The drive control portion 5300 is connected with the plurality of load cells 6000 and the support surface monitoring portion 5200 to control the operation of the lower drive unit 4200. That is, when the support surface monitoring portion 5200 decides the arrangement state between the upper support surface 2100a and the lower support surface 4100a to be an abnormal state, the drive control portion 5300 operates at least one of the first lower drive source 4240a to the fourth lower drive source 4240 d.

Fig. 11 and 12 are diagrams for explaining a method for controlling the operation of a lower driving unit and a plurality of load cells according to an exemplary embodiment.

Hereinafter, a method for controlling the operation of the lower driving unit and the plurality of load cells will be described with reference to fig. 11 and 12.

When the upper substrate S1 is contact-supported by the upper support surface 2100a of the upper stage 2100 and the lower substrate S2 is contact-supported by the lower support surface 4100a of the lower stage 4100, the lower stage 4100 is raised to reduce the distance from the upper stage 2100. Herein, by operating all of the first to fourth drive sources 4240a to 4240d in the lower drive unit 4200, the lower stage 4100 may be raised as the lower support 4220 and the first to fourth lower support members 4210a to 4210d are raised.

When the lower stage 4100 is raised, at least a portion of the lower substrate S2 contacts the upper substrate S1, as can be seen in fig. 11. Accordingly, the load or weight applied to the upper stage 2100 and the upper substrate S1 is transferred to the lower stage 4100 and the lower substrate S2. Therefore, in the exemplary embodiment, the lower stage 4100 is raised until at least one of the load values measured by the first to fourth load cells 6000a to 6000d starts to change. In other words, when the lower stage 4100 is raised, at least one of the load values measured by the first to fourth load cells 6000a to 6000d starts to change, and the raising of the lower stage 4100 is stopped.

When the ascent of the lower stage 4100 is stopped, the first to fourth load values measured by the first to fourth load cells 6000a to 6000d, respectively, are transmitted to the support surface monitoring portion 5200. In addition, the support surface monitoring portion 5200 calculates a difference between the maximum load value and the minimum load value, that is, a load difference, of the first load value to the fourth load value. Thereafter, the support surface monitoring portion 5200 decides whether the arrangement state between the upper support surface 2100a and the lower support surface 4100a is normal or abnormal by comparing the calculated load difference with a preset load reference range.

When the calculated load difference is within the load reference range, the support surface monitoring portion 5200 decides the arrangement state between the upper support surface 2100a and the lower support surface 4100a to be a normal state. In this case, the lower stage 4100 ascends from the current state to press the upper substrate S1 and the lower substrate S2, thereby attaching the upper substrate S1 and the lower substrate S2. For this purpose, the drive control portion 5300 operates the first to fourth lower drive sources 4240a to 4240d in the same condition or the same amount. Therefore, the first support member 4210a to the fourth support member 4210d rise by the same amount. Herein, whether the upper substrate S1 and the lower substrate S2 contact or press each other may be monitored by monitoring a load value measured by each of the plurality of load sensors 6000a to 6000 d.

The method for attaching the upper substrate S1 and the lower substrate S2 may include various methods in addition to the method for lowering the lower stage 4100. That is, in a state where the upper substrate S1 and the lower substrate S2 are spaced apart from each other by a predetermined distance, the upper substrate S1 is spaced apart from the upper stage 2100, the upper substrate S1 is seated on the lower substrate S2, and then the upper substrate S1 and the lower substrate S2 are attached to each other.

Herein, when the upper substrate S1 is spaced apart from the upper stage 2100, the following method is used in the exemplary embodiment: the rear surface of the upper substrate S1 is pressed to the upper support surface 2100a by raising or lowering the adhesion pins 2300, thereby separating the upper substrate S1 from the upper stage 2100.

In addition, when the calculated load difference is not within the load reference range, the support surface monitoring section 5200 decides the arrangement state between the upper support surface 2100a and the lower support surface 4100a to be an abnormal state, and transmits this signal to the drive control section 5300. In this case, the drive control portion 5300 operates at least one of the first to fourth lower drive sources 4240a to 4240d to adjust the arrangement state, i.e., the inclination, of the lower stage 4100.

Hereinafter, the following features are assumed for a more detailed description.

Among the first to fourth load values, the first and second load values are equal to each other, and the third and fourth load values are equal to each other. In addition, each of the third load value and the fourth load value is smaller than each of the first load value and the second load value. In this case, the first load value or the second load value is a minimum load value, and the third load value or the fourth load value is a maximum load value. In addition, assuming that when the difference between the maximum load value and the minimum load value (load difference) is not within the load reference range, the support surface monitoring portion 5200 decides the arrangement state between the upper support surface 2100a and the lower support surface 4100a as an abnormal state.

A signal deciding that the arrangement state between the upper support surface 2100a and the lower support surface 4100a is an abnormal state is transmitted to the drive control portion, and the drive control portion 5300 adjusts the inclination of the lower stage 4100 by operating at least one of the first lower drive source 4240a to the fourth lower drive source 4240 d.

Here, since each of the third load value and the fourth load value is smaller than each of the first load value to the second load value, the drive control portion 5300 operates the third lower drive source 4240c and the fourth lower drive source 4240d and allows the third lower drive source 4240c and the fourth lower drive source 4240d to ascend, as can be seen in fig. 12. Accordingly, the third and fourth lower support members 4210c and 4210d connected to the third and fourth lower drive sources 4230c and 4230d are raised by the lower support 4220. Therefore, as at least a portion of the lower stage 4100 supporting the third and fourth lower support members 4210c and 4210d is raised, the height of the corresponding position of the lower support surface 4100a is raised. By the above-described operation, the inclinations of the lower support surface 4100a and the lower stage 4100 are changed or adjusted.

As another method, the first and second drivers 4230a and 4230b are lowered by operating the first and second lower driving sources 4240a and 4240 b. Accordingly, the first and second lower support members 4210a and 4210b connected to the first and second lower drive sources 4230a and 4230b are lowered by the lower support 4220. Therefore, as at least a portion of the lower stage 4100 supporting the first and second lower support members 4210a and 4210b is lowered, the height of the corresponding position of the lower support surface 4100a is lowered. By the above-described operation, the inclinations of the lower support surface 4100a and the lower stage 4100 are changed or adjusted.

The above-described operation of adjusting the inclination of the lower support surface 4100a or the lower stage 4100 is repeated until the load difference is within the reference range. That is, at least one of the first to fourth lower drive sources 4240a to 4240d operates by raising or lowering at least one of the first to fourth lower support members 4210a to 4210d until a difference between the maximum load value and the minimum load value is within the load reference range while adjusting the inclination of the lower support surface 4100 a.

Accordingly, the upper stage 2100 and the lower stage 4100 may be arranged in a normal state or in a mutually parallel state. Therefore, the upper substrate S1 and the lower substrate S2 may be attached with a uniform pressing force during the attaching process.

When the load difference is within the load reference range by the above-described method, the current arrangement state between the upper stage 2100 and the lower stage 4100 is maintained. Accordingly, the upper support surface 2100a and the lower support surface 4100a may be arranged in a normal state or in a mutually parallel state. Therefore, the upper substrate and the lower substrate can be attached with a uniform pressing force during the attaching process.

Hereinafter, a method of attaching an upper substrate and a lower substrate by using a substrate attaching apparatus according to an exemplary embodiment will be described with reference to fig. 1 to 5, 11, and 12.

As shown in fig. 1, the upper chamber 1110 and the lower chamber are spaced apart from each other, and the upper stage 2100 and the lower stage 4100 are spaced apart from each other. In addition, an upper substrate S1 and a lower substrate S2 are inserted into the chamber unit 1100, the upper substrate S1 is supported by the upper support surface 2100a of the upper stage 2100, and the lower substrate S2 is supported by the lower support surface 4100a of the lower stage 4100.

First, a method for causing the upper stage 2100 to support the upper substrate S1 will be described.

The upper substrate S1 contacts the upper support surface 2100a of the upper stage 2100, and the upper suction driving unit 2200 operates to make the plurality of suction holes 2130 have vacuum pressure. Accordingly, the upper support surface 2100a supports the upper substrate S1 by the vacuum suction force of the plurality of suction holes 2130.

Thereafter, the adhesive sheet 2320 provided to each of the plurality of adhesive pins 2300 is lowered to contact the rear surface of the upper substrate S1, and the adhesive pin suction driving unit 2500 operates to make the suction pipe 2330 of each of the plurality of adhesive pins 2300 have vacuum pressure. Accordingly, the upper substrate S1 is sucked and supported by the adhesive sheet 2320 of each of the plurality of adhesive pins 2300 by the vacuum suction force of the suction pipe 2330. Herein, the plurality of suction holes 2130 are in a state of releasing the vacuum suction force, that is, the plurality of suction holes 2130 do not have the vacuum pressure.

Thereafter, the plurality of adhesion pins 2300 are lowered by operating the adhesion pin operating part 2400. Herein, the plurality of the adhesion pins 2300 are lowered such that an end of each of the adhesion pins 2300 (i.e., the adhesion sheet 2320) protrudes downward from the upper support surface 2100a, and the vacuum suction force (i.e., vacuum pressure) of the suction pipe 2330 is released when each of the adhesion pins 2300 protrudes.

When the adhesion pin 2300 is lowered such that the adhesion sheet 2320 protrudes downward from the upper support surface, the upper substrate S1 is spaced apart from the upper support surface 2100 a.

Thereafter, the plurality of adhesion pins 2300 are lifted up by operating the adhesion pin operating part 2400 again. Here, each of the plurality of sticking pins 2300 is raised until the rear surface of the upper substrate S1 contacts the upper support surface 2100a of the upper stage 2100. Accordingly, the upper substrate S1 is contact-supported by the upper support surface 2100a of the upper stage 2100 by the adhesive force of the plurality of adhesive pins 2300.

Thereafter, the lower substrate S2 is seated on the lower support surface 4100a of the lower stage 4100. For this purpose, first, the end of the support pin passing through the lower stage 4100 is raised to protrude upward from the lower support surface 4100a, and the lower substrate S2 is supported by the end of the support pin. Thereafter, the support pins are lowered so that the end portions are disposed inside the lower stage 4100. Subsequently, the lower substrate S2 mounted on the support pins is mounted on the lower support surface 4100a of the lower stage 4100. Herein, the adhesive member 4120 may be provided to the lower stage 4100 such that a top surface of the adhesive member 4120 is exposed. Accordingly, the lower substrate S2 is fixed and supported on the lower support surface 4100a by the adhesive force of the adhesive member 4120.

When the upper substrate S1 and the lower substrate S2 are supported by the upper stage 2100 and the lower stage 4100, respectively, the interior of the chamber unit 1100 is adjusted to a vacuum pressure. For this purpose, the upper chamber 1110 is lowered by operating the upper driving part 1200 to seal the upper chamber 1110 and the lower chamber 1120. In addition, the pressure adjusting part operates to reduce the internal pressure of the chamber unit 1100 and adjust the internal pressure to a vacuum pressure.

When the vacuum pressure is provided inside the chamber unit 1100, the upper substrate S1 and the lower substrate S2 are not moved. This is because the upper substrate S1 and the lower substrate S2 are not supported by the vacuum suction force. In other words, this is because the upper substrate S1 and the lower substrate S2 are supported by adhesive force.

When the upper chamber 1110 is lowered to form a vacuum in the chamber unit 1100 as described above, the upper stage 2100 connected to the upper chamber 1110 is lowered together. Therefore, the upper stage 2100 and the lower stage 4100 are disposed adjacent to each other.

In this state, the upper substrate S1 and the lower substrate S2 are aligned with each other. For this purpose, the alignment mark formed on the lower substrate S2 is photographed by using the photographing unit 4400. Subsequently, the obtained image is transmitted to the horizontal moving unit 4300.

The horizontal moving unit 4300 analyzes the lower alignment mark on the image and prestores the position of the upper alignment mark and horizontally moves the lower driving unit 4200 in at least one direction of X, Y and θ so that the position of the lower alignment mark overlaps the position of the upper alignment mark. Therefore, the lower stage 4100 moves horizontally in at least one direction of X, Y and θ.

When the lower stage 4100 is horizontally moved in at least one direction of X, Y and θ, the photographing unit photographs the lower alignment mark in real time and transfers the photographed lower alignment mark to the horizontal moving unit 4300. In addition, the horizontal moving unit 4300 analyzes the transferred image and horizontally moves the lower driving unit 4200 in real time, thereby aligning the lower alignment mark with the upper alignment mark.

When the upper substrate S1 and the lower substrate S2 to be attached are new substrates, the following process may be performed: the height of the lower stage 4100 to be horizontally moved is set to perform alignment between the upper substrate S1 and the lower substrate S2 in advance. That is, before the upper substrate S1 and the lower substrate S2 are aligned, the following process may be first performed: the height of the lower stage 4100 to be horizontally moved is set to perform alignment in advance.

For this purpose, the lower stage 4100 is raised by first operating the lower driving unit 4200. Here, the lower stage 4100 may be raised when the first to fourth lower support members 4210a to 4210d are raised by operating all of the first to fourth drive sources 4240a to 4240d of the lower drive unit 4200 under the same condition.

When the lower stage 4100 is raised as described above, at least a portion of the lower substrate S2 contacts the upper substrate S1. Herein, the load values measured by the first to fourth load cells 6000a to 6000d are changed by the load applied from the upper stage 2100.

In an exemplary embodiment, the lower stage 4100 is raised until a load value among load values measured by the first to fourth load cells 6000a to 6000d starts to change. That is, when at least one of the load values measured by the first to fourth load cells 6000a to 6000d starts to change, the ascent of the lower stage 4100 stops.

In addition, a height that is relatively lower than a height at which one of the load values measured by the first to fourth load cells 6000a to 6000d starts to change is set as the height of the lower stage 4100 for performing the alignment process. In other words, the height just before (in the lower direction) the height at which one of the load values starts to change is set as the height of the lower stage for performing the alignment process. In setting the height of the lower stage, the lower stage 4100 (which is set when aligning the upper substrate and the lower substrate) is positioned at the set height and then alignment is performed.

Upon completion of alignment between the upper substrate S1 and the lower substrate S2, the arrangement state between the upper support surface 2100a of the upper stage 2100 and the lower support surface 4100a of the lower stage 4100 is checked. For this purpose, the lower stage 4100 is raised when the first to fourth lower support members 4210a to 4210d are raised by operating all of the first to fourth drive sources 4240a to 4240d of the lower drive unit 4200 under the same condition.

When the lower stage 4100 is raised as described above, at least a portion of the lower substrate S2 contacts the upper substrate S1. Herein, the load values measured by the first to fourth load cells 6000a to 6000d are changed by the load applied from the upper stage 2100.

In an exemplary embodiment, while the lower stage 4100 is raised to check the arrangement state between the upper support surface 2100a and the lower support surface 4100a, the lower stage 4100 is raised until at least one of the load values measured by the first to fourth load cells 6000a to 6000d starts to change. That is, when at least one of the load values measured by the first to fourth load cells 6000a to 6000d starts to change, the elevation of the lower stage 4100 is stopped.

When the ascent of the lower stage 4100 is stopped, the first to fourth load values measured by the first to fourth load cells 6000a to 6000d, respectively, are transmitted to the support surface monitoring portion 5200. In addition, the support surface monitoring portion 5200 calculates a difference between the maximum load value and the minimum load value, that is, a load difference, of the first load value to the fourth load value. Thereafter, the support surface monitoring portion 5200 decides whether the arrangement state between the upper support surface 2100a and the lower support surface 4100a is normal or abnormal by comparing the calculated load difference with a preset load reference range.

When the calculated load difference is within the load reference range, the support surface monitoring portion 5200 decides the arrangement state between the upper support surface 2100a and the lower support surface 4100a to be a normal state.

However, when the calculated load difference is not within the load reference range, the support surface monitoring portion 5200 decides the arrangement state between the upper support surface 2100a and the lower support surface 4100a to be an abnormal state, and transmits this signal to the drive control portion 5300. In this case, the drive control portion 5300 operates at least one of the first to fourth lower drive sources 4240a to 4240d to adjust the arrangement state, i.e., the inclination, of the lower stage 4100 and adjust the inclination of the lower support surface 4100 a.

The operation of adjusting the inclination of the lower support surface 4100a or the lower stage 4100 is repeated until the load difference is within the reference range. That is, at least one of the first to fourth lower drive sources 4240a to 4240d operates by raising or lowering at least one of the first to fourth lower support members 4210a to 4210d until a difference between the maximum load value and the minimum load value is within the load reference range while adjusting the inclination of the lower support surface 4100 a.

When the load difference between the maximum load value and the minimum load value is within the load reference range by the above-described operation, the lower stage 4100 rises from the current state. Here, the lower stage 4100 may be raised when the first to fourth lower support members 4210a to 4210d are raised by operating all of the first to fourth drive sources 4240a to 4240d of the lower drive unit 4200 under the same condition. Accordingly, the lower substrate S2 mounted on the lower support surface 4100a of the lower stage 4100 presses the upper substrate S1, and the upper substrate S1 and the lower substrate S2 are attached to each other.

Alternatively, the upper substrate S1 and the lower substrate S2 are attached to each other by separating the upper substrate S1 from the upper stage 2100 and seating the upper substrate S1 on the lower substrate S2 in a state where the upper substrate S1 and the lower substrate S2 are spaced apart from each other by a predetermined distance.

When the attachment between the upper substrate S1 and the lower substrate S2 is completed, the plurality of adhesion pins 2300 are spaced apart from the upper substrate S1. For this purpose, the plurality of sticking pins 2300 are lifted up by operating the sticking pin operating part 2400. Herein, the plurality of adhesion pins 2300 are raised or lowered such that the adhesion sheet 2320 is not exposed to the upper support surface 2100a or the adhesion sheet 2320 is disposed inside the through-hole 2120. Herein, the adhesive sheet 2320 of each of the plurality of adhesive pins 2300 is spaced apart from the rear surface of the upper substrate S1.

When the plurality of adhesion pins 2300 are lifted as described above, the rear surface of the upper substrate S1 presses the upper support surface 2100a in the upward direction, the movement of the upper substrate S1 is stopped, and the adhesion pins 2300 are spaced apart from the upper substrate by this force.

In addition, when distributing the force generated when the plurality of adhesion pins 2300 are spaced apart from the upper substrate by operating the plurality of adhesion pins 2300 to move backward (ascend), it is possible to prevent or minimize the excessive force transmitted to the positioning portion of the upper substrate S1, which contacts the adhesive sheet 2320, when the plurality of adhesion pins 2300 are spaced apart from the upper substrate S1. Therefore, the upper substrate S1 can be prevented from being damaged.

When the plurality of sticking pins 2300 are spaced apart from the upper substrate S1, the inside of the chamber unit 1100 is returned to the atmospheric pressure. In addition, the attached upper and lower substrates S1 and S2 are withdrawn from the chamber unit 1100, and then the sealant is cured to complete the attachment of the upper and lower substrates S1 and S2.

Hereinbefore, the upper substrate S1 is supported by the upper support surface 2100a, the lower substrate S2 is supported by the lower support surface 4100a, and then the inclination of the lower stage 4100 is adjusted to adjust the arrangement state between the upper support surface 2100a and the lower support surface 4100 a. However, the exemplary embodiments are not limited to the process of adjusting the inclination of the lower stage 4100 and the process of supporting the substrate. For example, before the substrate is supported by the upper and lower support surfaces 2100a and 4100a, respectively, the inclination of the lower stage 4100 may be adjusted to adjust the arrangement state between the upper and lower support surfaces 2100a and 4100a, and then the substrate may be supported by the upper and lower support surfaces 2100a and 4100a, respectively.

According to the substrate attachment apparatus according to the exemplary embodiment, the upper substrate S1 and the lower substrate S2 are aligned with each other by horizontally moving the lower stage 4100, and then the upper substrate S1 and the lower substrate S2 are attached. Accordingly, it is possible to minimize or prevent an alignment error between the upper substrate S1 and the lower substrate S2.

In addition, the arrangement state between the upper support surface 2100a and the lower support surface 4100a is checked before the upper substrate S1 and the lower substrate S2 are pressed, and the arrangement state between the upper support surface 2100a and the lower support surface 4100a is adjusted to a normal state or a parallel state. Accordingly, the upper substrate S1 and the lower substrate S2 may be uniformly pressed, and attachment defects caused by non-uniform pressing may be prevented.

In addition, after each of the upper stage 2100 and the lower stage 4100 is set in the chamber unit 1100 or before the attaching process, the arrangement state between the upper stage 2100 and the lower stage 4100 is checked. Accordingly, the upper substrate S1 and the lower substrate S2 may be uniformly pressed, and attachment defects caused by non-uniform pressing may be prevented. In addition, since the attaching process is not performed when the arrangement state between the upper stage 2100 and the lower stage 4100 is abnormal, product defects may be reduced, and costs of defects may also be reduced.

The substrate attaching apparatus according to an exemplary embodiment horizontally moves the lower stage to align the upper substrate with the lower substrate and raises the lower stage, thereby pressing the lower substrate toward the upper substrate to attach between the lower substrate and the upper substrate. Accordingly, an alignment error between the upper substrate and the lower substrate may be minimized or prevented from being generated, and an attaching process may be stably performed.

In addition, the arrangement state between the upper and lower support surfaces is checked before the upper and lower substrates are pressed, and the arrangement state between the upper and lower support surfaces is adjusted to a normal state or a parallel state. Therefore, the upper substrate and the lower substrate can be uniformly pressed, and attachment defects caused by non-uniform pressing can be prevented.

In addition, the arrangement state between the upper stage and the lower stage is checked after each of the upper stage and the lower stage is mounted in the chamber unit or before the attaching process, and the arrangement state is adjusted to a normal state or a parallel state. Therefore, the upper substrate and the lower substrate can be uniformly pressed, and attachment defects caused by non-uniform pressing can be prevented. In addition, since the attaching process is not performed when the arrangement state between the upper stage and the lower stage is abnormal, product defects may be reduced, and the cost thereof may also be reduced.

Although the apparatus for attaching a substrate and the method of attaching a substrate have been described with reference to specific embodiments, the apparatus for attaching a substrate and the method of attaching a substrate are not limited thereto. Accordingly, it will be readily understood by those skilled in the art that various modifications and changes may be made thereto without departing from the spirit and scope of the present invention as defined by the appended claims.