阅读说明：本技术 包括具有三维效果的印刷图像的防伪元件 (Security element comprising a printed image with three-dimensional effect ) 是由 J.努涅斯 O.穆勒 于 2018-06-22 设计创作，主要内容包括：本发明涉及一种用于制造具有三维效果的图案(10)的物理防伪元件的方法。提供载体(1)和至少一个透明覆层(8、9)。在载体(1)上施加设计层(3)。载体(1)在热量下的尺寸稳定性低于覆层(8)的尺寸稳定性,或者覆层(9)在热量下的尺寸稳定性低于载体(1)的尺寸稳定性。设计层(3)在压力的作用下可变形。在载体(1)与覆层(8)之间布置透明结构层,所述结构层形成图案(10)。结构层(5)在热量下的尺寸稳定性高于载体(1)或覆层(9)的尺寸稳定性。在压力和热量的作用下对载体(1)和层(3、5、8、9)进行层压。在层压过程期间,结构层(5)被压入载体(1)中或压入覆层(9)中,由此设计层(3)按照由结构层(5)形成的图案(10)的方式发生变形,并且结构层(5)在该结构层的边缘区域(15)中发生变形,使得该结构层的表面(17、18)在横截面中沿切向靠拢。(The invention relates to a method for producing a physical security element having a three-dimensional design (10). A carrier (1) and at least one transparent coating (8, 9) are provided. A design layer (3) is applied to the carrier (1). The dimensional stability of the carrier (1) under heat is lower than the dimensional stability of the coating (8), or the dimensional stability of the coating (9) under heat is lower than the dimensional stability of the carrier (1). The design layer (3) is deformable under the action of pressure. A transparent structural layer is arranged between the carrier (1) and the cover layer (8), said structural layer forming a pattern (10). The dimensional stability of the structural layer (5) under heat is higher than the dimensional stability of the support (1) or the coating (9). The carrier (1) and the layers (3, 5, 8, 9) are laminated under the action of pressure and heat. During the lamination process, the structural layer (5) is pressed into the carrier (1) or into the cover layer (9), whereby the design layer (3) is deformed in the manner of a pattern (10) formed by the structural layer (5), and the structural layer (5) is deformed in the edge region (15) of the structural layer such that the surfaces (17, 18) of the structural layer come together tangentially in cross section.)

1. A method for manufacturing a physical security element having a pattern (10) with a spatial appearance, comprising the steps of:

-providing a carrier (1),

-providing at least one see-through transparent coating (7, 8),

-applying a design layer (3) on a carrier (1),

-wherein the dimensional stability of the carrier (1) under heat is lower than the dimensional stability of the coating (7) or the dimensional stability of the coating (8) under heat is lower than the dimensional stability of the carrier (1),

-wherein the design layer (3) is deformable under pressure,

-arranging a see-through transparent structural layer (5) between the carrier (1) and the cover layer (7) to form a pattern (10), wherein the dimensional stability of the structural layer (5) under heat is higher or similar to the dimensional stability of the carrier (1) or the cover layer (7, 8),

-laminating the carrier (1) and the layers (3, 5, 7, 8) under pressure and heat,

the method is characterized in that:

during the lamination, the structural layer (5) is pressed into the carrier (1) or into the coating (8) via the carrier (1), whereby the design layer (3) is deformed according to the pattern (10) formed by the structural layer (5), and whereby the structural layer (5) is reshaped in its edge region (15) such that the surfaces (17, 18) of the structural layer (5) in cross section are brought together tangentially.

2. The method according to claim 1, characterized in that the design layer (3) has a thickness which does not change at all or changes slightly at most, i.e. changes by 10% at most, during the deformation.

3. Method according to claim 1, characterized in that the dimensional stability of the carrier (1) under heat is lower than the dimensional stability of the design layer (3), the cover layer (7) and the structural layer (5), and in that the structural layer (5) is arranged between the design layer (3) and the cover layer (7), so that during lamination the design layer (3) is pressed into the carrier (1) by the structural layer (5), wherein the structural layer (5) is lenticular reshaped in its edge region (15) such that the surface (17) of the structural layer facing the top layer (7) and the surface (18) of the structural layer facing the design layer come together tangentially at the edges.

4. Method according to claim 1, characterized in that the design layer (3) is applied to the side (6) of the carrier (1) facing away from the surface and a further cover layer (8) is arranged thereon, wherein the dimensional stability of the further cover layer (8) under heat is lower than the dimensional stability of the design layer (3), the cover layer (7), the carrier (1) and the structural layer (5), and the structural layer (5) is arranged between the carrier (1) and the cover layer (7), so that during lamination the design layer (3) and the carrier (1) are pressed by the structural layer (5) into the further cover layer (8), wherein the structural layer (5) is lenticular reshaped in such a way that a surface (17) of the structural layer (5) facing the cover layer (8) and a surface (18) of the structural layer facing the design layer come together tangentially at their edge regions (15).

5. A method as claimed in claim 1, characterized in that the structural layer (5) is applied as a lacquer layer to the design layer (3) and/or the cover layer (7).

6. A method as claimed in claim 5, characterized in that the paint layer (5) is hardened.

7. The method according to claim 1, characterized in that the design layer (3) is a metallic ink and/or is applied to the carrier (1) before lamination.

8. A method as claimed in claim 1, characterized in that the surface (18) of the structural layer (5) facing the design layer is raised towards the surface (17) facing the cladding.

9. The method according to claim 1, characterized in that the design layer (3) has a thickness of 5 to 25 microns and/or is applied in the form of at least two layers (13, 14) having different material properties.

10. The method according to claim 1, characterized in that the structural layer (5) has a thickness of 25 to 125 microns.

11. The method according to claim 1, characterized in that the coating (7, 8) has a thickness of 50 to 200 microns.

12. Physical security element carrying a pattern (10) with a spatial appearance, having a carrier (1) on which a design layer (3), a transparent, see-through structural layer (5) and a transparent, see-through cover layer (7) are formed, wherein the structural layer (5) covers only a part of the security element and the pattern (10) is formed wholly or partially by the structural layer (5),

the method is characterized in that the structural layer (5) is pressed into the carrier (1) and a lenticular reshaping takes place in the edge regions (15) thereof, so that the surfaces of the structural layer (5) are brought together tangentially in the edge regions (15), and the design layer (3) is also pressed into the carrier (1) by means of the structural layer (5), the design layer (3) being deformed according to the pattern (10) in the structural layer (5).

13. A security element according to claim 12, characterized in that the thickness of the design layer (3) in the deformed region is the same as in the remaining region or is almost the same except for a maximum deviation of 10%.

14. The security element of claim 12, configured in the form of a card of standard format.

Technical Field

The invention relates to a method for producing a physical security element having a printed image with a spatial appearance and to a corresponding security element. In particular, the invention relates to a card, such as a credit card or payment card, made of plastic having a spatially printed image forming a security feature.

Background

EP 2593314B 1 discloses a method for manufacturing a plastic card with a printed image, wherein a coating layer comprising metallic, organic or non-organic pigments is first printed on a substrate. A layer of paint is printed on the coating layer which forms a pattern and is thinner than the coating layer. The paint layer is cured. The coating has higher plasticity than the paint. A coating is applied over the paint layer. The construction is then laminated under pressure and temperature. During the lamination process, the harder paint is pressed completely into the softer paint and the paint retains its shape. Embedding the paint in the coating in this manner makes the visibility of the pattern formed by the paint dependent on the viewing angle. The manufacture of the coating in this known method requires the use of special materials and the execution of special steps, which complicates the execution of the method. Furthermore, the depth to which the paint can penetrate into the coating is limited by its height. This depth is typically very small compared to the height of the substrate.

US 7455235B 2 discloses a method for manufacturing a chip card with a visual relief effect. According to this method, the entire layer of metal ink is applied on the core layer. A lacquer layer of greater thickness is applied over the layer of metallic ink to form a pattern. The lacquer layer is hardened with uv light, followed by the application of a thicker coating. The construction was then laminated. During the lamination process, the paint layer becomes dull, while the areas of the card not covered by the paint layer remain bright. This results in a three-dimensional effect. The local additional height caused by the lacquer layer is compensated by the coating. The resulting dim area appears to be engraved into the card surface. This known solution provides a separate card feature. However, this feature is not easily combined with other card features and requires the construction of a sufficiently flexible and thick overlay.

EP 2886357 a2 discloses a security document with a security feature which is composed of a plurality of foils laminated together, based on a relief structure and which produces a three-dimensional effect. The relief structure is produced by means of an embossing lacquer and/or by embossing the surface of the foil carrying the embossing lacquer.

WO 2004/065135 a1 discloses a method for producing three-dimensional images on card bodies, in which a reflective layer is first of all formed on the rear side of a transparent core layer and an image-forming material which can be pressed into the core layer is applied thereon. Applying a transparent overlay over the image-forming material. The resulting layer structure is laminated into the card body. This presses the image-forming material into the reflective and core layers and creates an embedded image. When subsequently viewed from the front side of the core layer, enhanced reflections are generated at the contour edges of the resulting embedded image, which reflections achieve a three-dimensional visual effect.

Disclosure of Invention

The object of the present invention is to provide a method for producing a pattern with a spatial appearance on a security element, which method is carried out without any special requirements as to the materials used or the method steps to be carried out and which provides a feature which can be easily combined with other features.

This object is achieved by a method and a security element having the features of the independent claims.

The advantage of the method according to the invention is that it can be carried out using common manufacturing methods and that there are no higher requirements on the material to be used. The method provides in a simple manner shapes and symbols having a spatial appearance. The features producible by this method are particularly suitable for ordinary payment cards, credit cards and identification cards.

A particular advantage of the method according to the invention is that other structural parts of the security element which are provided specifically for the purpose of producing the features are not damaged or impaired when the method is carried out. In particular, the layers forming the features are not damaged during the card manufacturing process.

The method of the invention is based on a way of constructing a structural layer comprising a pattern on a multi-layer security element. The structural layer is pressed into the core layer of the security element by lamination, whereby the design layer connected to the core layer is also deformed. At this time, the thickness of the design layer is not changed, or is changed only slightly. By deformation of the design layer, the pattern contained in the structural layer becomes recognized as an image structure that is spatially perceivable.

In a particularly advantageous configuration, the structural layer is applied as a lacquer layer by a printing method. The lacquer used is preferably transparent.

Further advantageous refinements and advantageous configurations of the method according to the invention result from the features of the dependent claims.

Drawings

Embodiments of the present invention will be described in more detail hereinafter with reference to the accompanying drawings.

In the drawings:

figure 1 shows in a partial perspective view a card equipped with a plurality of features,

figure 2 shows the components to be joined prior to connection by an exemplary card,

figure 3 shows a detail of the card after connection made with the parts shown in figure 1,

figure 4 is a plan detail view of the finished card shown in figure 1 or figure 2,

FIG. 5 shows a variant of the method shown in FIG. 1 before the connection, and

fig. 6 shows the situation after the connection of a card manufactured according to the variant of fig. 4.

Detailed Description

The method of the invention is illustrated below by way of example in a plastic card of standard format, as such cards are commonly used as payment cards, credit cards or identification cards. Fig. 1 shows, by way of example, a chip card whose geometry corresponds, for example, to the ISO7810 standard. However, the method is not limited to plastic cards, but is generally suitable for physical security elements consisting of multiple layers joined under pressure and heat and having a printable surface (e.g., a label, logo, or package).

Fig. 1 shows a card with a chip 25 as an exemplary physical security element 20 in a partial perspective plan view. The card 20 is typically of a standard size, for example in conformity with the ISO7810 standard. The surfaces are smooth and plane-parallel to each other. The card 20 carries, on one side, which may be designated arbitrarily as the upper surface 21, a plurality of features that can be visually identified by the user, some of which are used for personalization and certain anti-counterfeiting purposes. In particular, the card 20 carries the pattern 10 produced by the method of the invention. The pattern 10 covers a portion of the surface 21 and has recesses 19, in which recesses 19 the surface 21 is visible. In addition, the card 20 is provided with letters 23, which are partially applied on the pattern 10. The card also carries a separate security feature, such as a hologram 24.

Fig. 2 shows a first variant embodiment of a method for producing a pattern 10 on a card 20. In an exploded view, not drawn to scale, a portion of the components of the board 20 are shown prior to attachment. The base of the card 20 is made of thermoplastic materialThe carrier 1 is usually provided in the form of a single plastic layer or a composite structure made up of a plurality of plastic layers. The plastic can be PVC, and can also be other common card materials. If the card to be manufactured complies with the ISO standard for credit cards, the thickness h of the carrier 1₁Typically 250 to 700 microns. The carrier 1 forms the core layer of the card 20. The actual thickness of the carrier 1 depends on the card format selected, the intended use, the specific requirements for certain card layers, and/or the desired number and thickness of the various layers forming the carrier 1.

A design layer 3 is arranged on the carrier 1. The design layer 3 is opaque or translucent. It is generally applied over the entire area of the surface 11 of the support 1 and has a thickness h of from 5 to 25 μm₂. The design layer 3 is typically applied to the carrier 1 by screen printing. It is convenient to use a conventional design ink based on a clear solution with pigment particles. In addition, the ink may contain, for example, metal particles that produce a particular optical effect (e.g., glitter effect).

In an alternative embodiment, the design layer 3 may also be provided as a separate layer in the form of a foil.

As shown in fig. 2, the design layer 3 may be implemented in a multi-layer manner. In this case, the design layer comprises, for example, a base layer 13, which is embodied, for example, as a white layer. On which an optical effect layer 14 is arranged, which is embodied, for example, as a layer with metal particles. In a variant, the base layer 13 may be formed by a thin metal foil on which the design printed layer 14 is applied as a second layer. Hereinafter, the design layer 3 is always represented as a single layer for simplicity of explanation. A structural layer 5 is laid on the design layer 3. The structural layer 5 is transparent, i.e. transparent or translucent. It usually covers only a part of the surface 11 of the carrier 1. In plan view, the structural layer 5 forms a pattern 10 representing a graphic or alphanumeric information item. The pattern 10 may be a simple closed geometric shape, such as a dot or rectangle, or may take a complex form with a recess 19, such as a letter, design pattern or graphic pattern. As an example of the complex pattern 10, an artistically crafted flower whose center is formed by the recess 19 is shown in fig. 1. The pattern 10 does not cover the entire area of the card. It consists of an inner region 16 and an edge region 15, which differ in their optical effect.

In the exemplary embodiment of fig. 2, the structural layer 5 is embodied in the form of a lacquer layer. This lacquer layer 5 is solvent-based or solvent-free and is printed in a screen printing process. Printing may be performed on the cover layer 7 or the design layer 3. After application, the lacquer layer is cured. Its thickness h₃Preferably between 25 microns and 100 microns; in practical tests, the thickness was between 30 and 60 microns.

As an alternative to a lacquer layer, the structural layer 5 can also be embodied as a separate foil in which the motif 10 is incorporated in the form of a recess structure.

A cover layer 7 is applied to the structural layer 5. The upper surface of which is smooth and forms the surface 21 of the card 20. The cover 7 is also see-through, i.e. transparent or translucent. It is preferably provided in the form of a foil and has a thickness h₄From 50 to 100 microns. Preferably, the thickness is between 60 and 80 microns.

The carrier 1 has a higher plasticity than the other components, i.e. can permanently change its shape at a lower temperature than the other components. The glass transition temperature of the carrier 1 is lower than the glass transition temperature of the cover layer 7.

The cover layer 7 is harder than the carrier 1 and other components and undergoes no or hardly any change in shape during normal lamination, i.e. it can be compressed by up to 15%.

The structural layer 5 has a higher or similar dimensional stability under heat compared to the carrier 1. During lamination, the edge region 15 undergoes a change in shape under the action of pressure and heat, while the rest remains substantially unchanged in shape and is compressed by up to 10%.

Also, the design layer 3 has a higher dimensional stability under heat than the carrier 1. The design layer 3 is hardly compressed under ordinary lamination conditions, i.e., its thickness varies by at most 15%. However, the design layer 3 can be deformed under pressure, while its thickness is unchanged. The connection of the components shown in fig. 1 is divided into two phases: in a first stage, the design layer 3 is applied to the carrier 1 and the structural layer 5 is applied to the design layer 3 or the cover layer 7. In the second stage, the existing components are joined to each other under pressure and heat by conventional lamination methods.

During lamination, the carrier 1 appears softer relative to the design layer 3 and the lacquer layer 5. The carrier 1 also behaves softer than the coating 7 and the structural layer 5. This means that the shape of the carrier 1 is changed during the lamination, although the cover layer 7, the structural layer 5, the design layer 3 and the lacquer layer 5 completely or at least substantially retain their shape. During the lamination, the lacquer layer 5 is pressed into the carrier 1. The design layer 3 is pressed into the carrier 1 together with the lacquer layer 5. Thus, the carrier 1 is compressed and reshaped, whatever the position of the lacquer layer 5 is.

The lacquer layer 5 remains substantially unchanged during lamination, but the edge region 15 changes shape. The inner region 16 of the lacquer layer 5 remains substantially unchanged. In particular, in the inner region, the thickness of the paint layer 5 remains substantially constant; lamination can result in the thickness being compressed uniformly by up to 10%. However, in the edge region 15, the shape of the lacquer layer 5 changes in a lenticular manner. When viewed in cross section, the lower surface 18 of the lacquer layer 5 facing the carrier 1 and the upper surface 1 facing the coating 7 extend tangentially towards one another after deformation and form an acute angle. And the lower surface 18 rises in the edge region 15 towards the upper surface 17.

During lamination, the design layer 3 is deformed at the location of the lacquer layer 5, but this does not or only slightly change its thickness (i.e. less than 10%) and the design layer 3 maintains a continuous morphology.

Fig. 3 shows the resulting card structure after laminating the components shown in fig. 2 together. In the area of the card 20, in which the lacquer layer 5 and the pattern 10 are formed, the carrier 1 is compressed and reshaped accordingly. The lacquer layer 5 is pressed into the carrier 1 together with the intermediate design layer 3. The design layer 3 deforms according to the contour of the structural layer 5, but its thickness does not change or changes only slightly (i.e. by at most 10%) and maintains a continuous morphology. The lacquer layer 5 is substantially undeformed in the inner region 16 (i.e. its thickness varies by at most 10%), whereas a lenticular deformation occurs in the edge region 15. The paint layer 5 is thus depleted in the edge region 15, forming a gentle transition by reducing the layer thickness until it finally disappears. The design layer 3 is accordingly located in the inner region 16 between the structural layer 5 and the carrier 1. In the edge region 15, it rises in a gentle, continuous transition towards the coating 8, respectively, so as to meet the coating 7 tangentially at the location of the transition towards the recess 19 or towards the adjacent region of the surface 21 without the pattern 10. In the recesses 19 or in the regions of the surface 21 without the pattern 10, the design layer 3 directly adjoins the cover layer 7.

The gentle transition between the region with the lacquer layer 5 and the region without the lacquer layer 5 present in the edge region 15 of the lacquer layer 5 brings about an effect which is optically perceptible in plan view, since the reflection of light in the edge region 15 differs from the reflection in the inner region 16 and in the region outside the pattern 10 only of the design layer 3. The effect produced by the edge region 15 is that the pattern 10 represented by the lacquer layer 5 appears to be spatial.

Fig. 4 illustrates this spatial effect. The figure shows a card 20 in plan view, which has a pattern 10 produced in accordance with the method. The pattern 10 in this example is an asymmetric "U" shape. A cross-section through the pattern 10 along line a-a generally corresponds to the cross-section shown in fig. 3. If the illustrated pattern 10 receives incident light from the left as indicated by the arrow, the edge regions 15 appear to reflect at a different intensity depending on whether they are tilted away from, parallel to, or towards the direction of light incidence. In this way, the edge region 15 produces a depth effect. Thus, the combination of patterns 10 can be perceived as a spatial structure in the design layer 3.

Fig. 5 and 6 show a variant embodiment of the method, in which the structural layer 5 is pressed indirectly into the coating 8 via the carrier layer 1. The design layer 3 is not formed on the side 11 of the carrier 1 facing the structural layer 5, but on the side 12 facing away from the structural layer 5. Furthermore, a further cover layer 8 is also arranged above the structural layer 5 on the rear side. The upper surface of which is smooth and forms the lower surface 22 of the card 20. Like the coating 7, the further coating 8 is also transparent and has a thickness of 50 to 150 microns, preferably 60 to 90 microns. However, the further coating 8 has a lower dimensional stability and a higher plasticity under heat than the carrier 1 and the design layer 3. This means that the further coating 8 is more plastically deformable than the carrier 1 and the design layer 3 and has a lower glass transition temperature.

During lamination of the construction shown in fig. 5, the structural layer 5 is pressed into the carrier 1. Here, too, the structural layer 5 changes its cross-sectional profile in the edge region 15, as shown in fig. 2, and is reshaped. The carrier 1 is deformed by the compressed structural layer 5 and reproduces its surface contour. In contrast to the exemplary embodiment of fig. 2, however, the contour of the carrier 1 is not reshaped or at most slightly reshaped, and the thickness h of the carrier 1 is substantially maintained over the entire area thereof₁. "slight" is understood herein to mean a consistent change in size of up to 10%. The carrier 1 is not reshaped but only deformed and reproduces the contour of the structural layer 5 on the side facing away.

On the rear side 6, the carrier 1 is pressed against the design layer 3 and the further cover layer 8. The design layer 3 is deformed by the carrier 1, but substantially retains its thickness h₂(i.e., a maximum of 10% change) and maintain a continuous morphology. This causes the design layer 3 to replicate the profile of the structural layer 5 again and to be pressed into the further cover layer 8.

In contrast to the exemplary embodiment of fig. 2, in the variant shown in fig. 5, the further coating 8 is now compressed and thus reshaped. Due to the deformation of the edge region 15, the pattern 10 represented by the structural layer 5 can be perceived as a spatial pattern on the other side 6 of the carrier 1.

The method allows a series of reasonable and obvious variations on the basic idea of constructing a spatially effective pattern 10 on a multilayer security element 20 by deforming the inner layer of the multilayer security element 20 carrying the design layer 3 by means of the structural layer 5, whereby the structural layer 5 itself is deformed lenticular at its edge regions 15. For example, further layers may be provided in the layer structure, which further layers are also deformed or not.

List of reference numerals

1 vector

3 design layer

5 structural layer

6 side facing away from the support

7 coating layer

8 another coating

10 pattern

11 surface of the carrier

12 the other surface of the carrier

13 base layer of design layer

14 optical layer of design layer

15 edge region of the structural layer

16 internal region of structural layer

17 surface of the structural layer

18 another surface of the structural layer

19 recess

20 card

Surface of 21 card

22 card another surface

23 letters

24 security feature

25 chip