MEMS ultrasonic positioning sensor with Helmholtz resonant cavity
阅读说明:本技术 具有亥姆霍兹谐振腔的mems超声定位传感器 (MEMS ultrasonic positioning sensor with Helmholtz resonant cavity ) 是由 孙成亮 朱伟 吴志鹏 王磊 胡博豪 林炳辉 周禹 于 2019-09-10 设计创作,主要内容包括:一种MEMS超声定位传感器,包括:上层衬底(3);亥姆霍兹谐振腔(2),形成于上层衬底(3)内;压电式超声发射单元(9),位于上层衬底(3)上,其上具有至少一个与亥姆霍兹谐振腔(2)连通的通孔(7);超声接收单元(1),位于亥姆霍兹谐振腔(2)底部;其中,亥姆霍兹谐振腔(2)的谐振频率与压电式超声发射单元(9)的谐振频率相同,超声接收单元(1)的谐振频率大于或等于压电式超声发射单元(9)的谐振频率。本公开的MEMS超声定位传感器,可以提高传感器的能量转换效率和避免传感器的串扰。(A MEMS ultrasonic positioning sensor comprising: an upper substrate (3); a Helmholtz resonant cavity (2) formed in the upper substrate (3); the piezoelectric ultrasonic transmitting unit (9) is positioned on the upper substrate (3) and is provided with at least one through hole (7) communicated with the Helmholtz resonant cavity (2); the ultrasonic receiving unit (1) is positioned at the bottom of the Helmholtz resonant cavity (2); the resonance frequency of the Helmholtz resonant cavity (2) is the same as that of the piezoelectric ultrasonic transmitting unit (9), and the resonance frequency of the ultrasonic receiving unit (1) is greater than or equal to that of the piezoelectric ultrasonic transmitting unit (9). The MEMS ultrasonic positioning sensor can improve the energy conversion efficiency of the sensor and avoid crosstalk of the sensor.)
1. A MEMS ultrasonic positioning sensor, comprising:
an upper substrate (3);
a Helmholtz resonant cavity (2) formed in the upper substrate (3);
the piezoelectric ultrasonic transmitting unit (9) comprises a piezoelectric lamination (8) or a piezoelectric bimorph (16) which is positioned on the upper-layer substrate (3), and the piezoelectric lamination (8) and the piezoelectric bimorph (16) are provided with one or more through holes (7) communicated with the Helmholtz resonant cavity (2);
the ultrasonic receiving unit (1) is positioned at the bottom of the Helmholtz resonant cavity (2);
the resonance frequency of the Helmholtz resonant cavity (2) is the same as that of the piezoelectric ultrasonic transmitting unit (9), and the resonance frequency of the ultrasonic receiving unit (1) is greater than or equal to that of the piezoelectric ultrasonic transmitting unit (9).
2. The MEMS ultrasonic positioning sensor according to claim 1, wherein the piezoelectric stack (8) comprises a first lower electrode (4) arranged on the upper substrate (3), a first piezoelectric layer (5) arranged on the first lower electrode (4), a first upper electrode (6) arranged on the first piezoelectric layer (5).
3. The MEMS ultrasonic positioning sensor according to claim 1, characterized in that the ultrasonic receiving unit (1) is a piezoelectric ultrasonic transducer or a capacitive ultrasonic transducer.
4. The MEMS ultrasonic positioning sensor of claim 3, wherein the ultrasonic receiving unit (1) is a piezoelectric ultrasonic transducer, comprising: a second piezoelectric layer (12) bonded to the bottom of the upper substrate (3); a second upper electrode (13) located within the Helmholtz resonator (2) and disposed on an upper surface of the second piezoelectric layer (12); a second lower electrode (11) bonded to a lower surface of the second piezoelectric layer (12); and a lower substrate (15) bonded to the lower surface of the second lower electrode (11).
5. The MEMS ultrasonic positioning sensor according to claim 3, wherein the ultrasonic receiving unit (1), when being a capacitive ultrasonic transducer, comprises: a lower substrate (15) located below the upper substrate (3); SiO on the lower substrate (15)2A layer (14); a diaphragm (17) bonded between the upper substrate (3) and the lower substrate (15); and the second upper electrode (13) is positioned in the Helmholtz resonant cavity (2) and is arranged on the vibrating diaphragm (17).
Technical Field
The utility model belongs to the technical field of ultrasonic transducer, a MEMS ultrasonic positioning sensor with Helmholtz resonant cavity is related to.
Background
Position sensors can be broadly classified into three categories. (1) Fine position sensing types operating over short distances, such as eddy current, magnetoresistive and hall effect sensors. The sensor has the advantages of high sensitivity and strong anti-interference capability, but is not suitable for long-distance measurement. (2) Optical time-of-flight and optical coherence position sensors, such as laser interferometry, ergonomic triangulation, etc. The advantage is high precision, and the disadvantage is that this kind of equipment is usually complicated in structure, and needs to be equipped with a plurality of optical elements. (3) An acoustic or ultrasonic position sensor. Among such sensors is a piezoelectric acoustic resonator (PSRC) position sensor, which is characterized by having a helmholtz resonator, and emitting sound waves by using a piezoelectric stack layer above the helmholtz resonator, and then receiving the sound waves by an acoustic sensor below the helmholtz resonator. This has the advantage of high resolution, but the measurement distance is short, and in addition, the resonance frequency of the helmholtz resonator is difficult to match with the resonance frequency of the piezoelectric stack layer when the device size is small, so that such sensors are usually large in size and have a low resonance frequency when in operation, resulting in poor resolution at close distances. Meanwhile, in order to achieve the best receiving effect, the resonant frequencies of the receiving sensor, the transmitting transducer and the helmholtz resonant cavity are generally set to be the same, but crosstalk occurs when sound waves are transmitted and received.
Disclosure of Invention
The MEMS ultrasonic positioning sensor with the Helmholtz resonant cavity aims to improve the energy conversion efficiency of the sensor and avoid signal crosstalk of the sensor.
According to an aspect of the embodiments of the present disclosure, there is provided a MEMS ultrasonic positioning sensor, including:
an upper substrate;
a Helmholtz resonant cavity formed in the upper substrate;
the piezoelectric ultrasonic transmitting unit comprises a piezoelectric lamination or a piezoelectric bimorph which is positioned on the upper-layer substrate, and one or more through holes communicated with the Helmholtz resonant cavity are formed in the piezoelectric lamination or the piezoelectric bimorph;
the ultrasonic receiving unit is positioned at the bottom of the Helmholtz resonant cavity;
the resonance frequency of the Helmholtz resonant cavity is the same as the resonance frequency of the piezoelectric ultrasonic transmitting unit, and the resonance frequency of the ultrasonic receiving unit is greater than or equal to the resonance frequency of the piezoelectric ultrasonic transmitting unit.
In the above MEMS ultrasonic positioning sensor, the piezoelectric stack includes a first lower electrode disposed on the upper substrate, a first piezoelectric layer disposed on the first lower electrode, and a first upper electrode disposed on the first piezoelectric layer.
In the above MEMS ultrasonic positioning sensor, the ultrasonic receiving unit is a piezoelectric ultrasonic transducer or a capacitive ultrasonic transducer.
In the above MEMS ultrasonic positioning sensor, the piezoelectric ultrasonic receiving unit includes: a second piezoelectric layer bonded to the bottom of the upper substrate; a second upper electrode positioned in the Helmholtz resonant cavity and disposed on an upper surface of the second piezoelectric layer; a second lower electrode bonded to a lower surface of the second piezoelectric layer; and the lower layer substrate is bonded on the lower surface of the second lower electrode.
In the above MEMS ultrasonic positioning sensor, the capacitive ultrasonic receiving unit includes: the lower layer substrate is positioned below the upper layer substrate; SiO on the lower substrate2A layer; the vibrating diaphragm is bonded between the upper substrate and the lower substrate; and the second upper electrode is positioned in the Helmholtz resonant cavity and arranged on the vibrating diaphragm.
The present disclosure combines a MEMS piezoelectric ultrasonic transducer (pMUT), a helmholtz resonator, and an acoustic sensor. The MEMS piezoelectric ultrasonic transducer is used for driving the Helmholtz resonant cavity to produce sound. The resonance frequency of the MEMS piezoelectric ultrasonic transducer is consistent with the resonance frequency of the Helmholtz resonant cavity, and the amplitude of sound waves emitted by the ultrasonic transducer is greatly increased through the Helmholtz resonant cavity, so that the electroacoustic energy conversion efficiency of the ultrasonic transducer is improved. The acoustic sensor is used for receiving ultrasonic waves, and the ultrasonic waves reflected back by obstacles can increase the sound pressure acting on the acoustic sensor through the amplification of the Helmholtz resonant cavity, so that the output electric signals are improved. Meanwhile, when the resonant frequency of the acoustic sensor is different from that of the pMUT and is higher than that of the pMUT, the crosstalk phenomenon can be effectively avoided when ultrasonic waves are transmitted and received.
Drawings
The present disclosure is described in further detail below with reference to the attached drawings and the detailed description.
FIG. 1 shows a cross-sectional view of a MEMS ultrasonic positioning sensor having a Helmholtz resonator.
Fig. 2 shows a top view of the MEMS ultrasonic positioning sensor shown in fig. 1.
Fig. 3 shows a cross-sectional view of a MEMS ultrasonic positioning sensor with a sandwich structure pMUT as the transmitting and receiving unit, according to one embodiment of the present disclosure.
Fig. 4 shows a top view of the MEMS ultrasonic positioning sensor shown in fig. 3.
Fig. 5 illustrates a cross-sectional view of a MEMS ultrasonic positioning sensor with a dual-wafer pMUT as the transmitting unit and a sandwich pMUT as the receiving unit, according to one embodiment of the disclosure.
FIG. 6 shows a top view of the MEMS ultrasonic positioning sensor shown in FIG. 5.
Fig. 7 shows a cross-sectional view of a MEMS ultrasonic positioning sensor with a sandwich structure pMUT as the transmitting unit and cMUT as the receiving unit, according to one embodiment of the present disclosure.
FIG. 8 illustrates a top view of the MEMS ultrasonic positioning sensor shown in FIG. 7.
FIG. 9 illustrates a cross-sectional view of a MEMS ultrasonic positioning sensor having a plurality of through-hole Helmholtz resonators, according to one embodiment of the present disclosure.
FIG. 10 illustrates a top view of the MEMS ultrasonic positioning sensor shown in FIG. 9.
Description of reference numerals:
1-ultrasonic receiving unit, 2-Helmholtz resonant cavity, 3-upper substrate, 4-first lower electrode, 5-first piezoelectric layer, 6-first upper electrode, 7-through hole, 8-piezoelectric lamination, 9-piezoelectric ultrasonic transmitting unit and 10-piezoelectric ultrasonic transmitting unitSound receiving unit, 11-second lower electrode, 12-second piezoelectric layer, 13-second upper electrode, 14-SiO2Layer, 15-lower substrate, 16-piezoelectric bimorph, 17-diaphragm, 18-capacitive ultrasound receiving unit.
In addition, the MEMS piezoelectric ultrasonic transducer is generally called a piezoelectric micro-machined ultrasonic transducer, which is abbreviated as: pMUT. The MEMS capacitive ultrasonic transducer is called a capacitive piezoelectric ultrasonic transducer for short: cMUT.
Detailed Description
FIG. 1 illustrates a cross-sectional view of a MEMS ultrasonic positioning sensor having a Helmholtz cavity, according to one embodiment of the present disclosure. Fig. 2 shows a top view of the MEMS ultrasonic positioning sensor shown in fig. 1. As shown in fig. 1 and 2, the MEMS ultrasonic transducer having a helmholtz resonator includes an ultrasonic receiving unit 1, a
As shown in fig. 3 and 4, the
As shown in fig. 5 and 6, alternatively, the piezoelectric type
The ultrasound receiving unit 1 may employ a piezoelectric ultrasound transducer (pMUT), or a capacitive ultrasound transducer (cMUT), or other types of acoustic sensors.
Referring to fig. 3 to 6, the piezoelectric type
As shown in fig. 7 and 8, if the capacitive
The second
This MEMS supersound positioning sensor with helmholtz resonant cavity disclosed is when being used for the location, at first add an electric signal on piezoelectric type
The resonance frequency of the
in the formula, c is the sound velocity in the medium, S is the opening area of the through
The above formula is the case where there is one through
Where n is the number of
The utility model discloses a MEMS ultrasonic positioning sensor with Helmholtz resonant cavity belongs to ultrasonic position sensor, compares in PSRC position sensor, and the ultrasonic positioning sensor of this disclosure belongs to the MEMS field, and the size is micron order or submicron order usually. The resonance frequency of the Helmholtz resonant cavity can be made to coincide with the resonance frequency of the MEMS piezoelectric ultrasonic transducer (pMUT) above it by adjusting the size and structure, so as to obtain higher device operating frequency. In addition, by staggering the resonance frequencies of the pMUT for transmitting the ultrasonic wave and the ultrasonic receiving unit, the problem of crosstalk of the sensor can be effectively avoided.
- 上一篇:一种医用注射器针头装配设备
- 下一篇:一种砂石筛分装置