阅读说明：本技术 一种面向高密度组装的大功率供电背板 (High-power supply backboard for high-density assembly ) 是由 关通 杨培和 吴福永 袁博 秦骏 郑浩 陈玉军 于 2019-09-12 设计创作，主要内容包括：本发明公开了一种面向高密度组装的大功率供电背板,包括PCB板,所述PCB板上形成有至少一个基本供电单元,所述基本供电单元包括：进线焊盘L、进线焊盘N、电源L层、电源N层以及至少一个供电接口,所述电源L层与所述电源N层之间填充有绝缘介质,所述进线焊盘L与所述电源L层电连接,所述进线焊盘N与所述电源N层电连接,所述电源L层和所述电源N层分别与所述供电接口的L脚和N脚电连接。本发明应用灵活性好,适配性高,能够实现计算插件的高密度组装,占用空间小,发热均匀,供电安全性高,可维护性好。(The invention discloses a high-power supply back plate for high-density assembly, which comprises a PCB (printed circuit board), wherein at least one basic power supply unit is formed on the PCB, and the basic power supply unit comprises: inlet wire pad L, inlet wire pad N, power L layer, power N layer and at least one power supply interface, power L layer with it has insulating medium to fill between the power N layer, inlet wire pad L with power L layer electricity is connected, inlet wire pad N with power N layer electricity is connected, power L layer with power N layer respectively with power supply interface's L foot and N foot electricity are connected. The invention has the advantages of good application flexibility, high adaptability, small occupied space, uniform heating, high power supply safety and good maintainability, and can realize high-density assembly of the computing plug-in.)

1. A high-power supply backboard facing high-density assembly is characterized by comprising a PCB, wherein at least one basic power supply unit is formed on the PCB, and the basic power supply unit comprises: inlet wire pad L, inlet wire pad N, power L layer, power N layer and at least one power supply interface, power L layer with it has insulating medium to fill between the power N layer, inlet wire pad L with power L layer electricity is connected, inlet wire pad N with power N layer electricity is connected, power L layer with power N layer respectively with power supply interface's L foot and N foot electricity are connected.

2. The high-power supply backboard facing high-density assembly according to claim 1, wherein the plurality of basic power supply units are arranged at intervals in the longitudinal direction, and the plurality of basic power supply units are electrically isolated from each other.

3. The high-power supply backboard facing high-density assembly according to claim 1, wherein the number of the power supply interfaces is multiple, the L pins of the power supply interfaces of the same basic power supply unit are electrically connected with the same L layer of the power supply, and the N pins are electrically connected with the same N layer of the power supply.

4. The high-power supply backboard facing high-density assembly according to claim 1, wherein the basic power supply unit comprises a first power supply interface and a second power supply interface, the second power supply interface and the first power supply interface are arranged in a staggered manner from front to back and are respectively arranged on two opposite side surfaces of the PCB, the extending directions of the second power supply interface and the first power supply interface are opposite, the L pin and the N pin of the first power supply interface are respectively and electrically connected with the L layer of the power supply and the N layer of the power supply, and the L pin and the N pin of the second power supply interface are respectively and electrically connected with the L layer of the power supply and the N layer of the power supply.

5. The high-power supply backboard facing high-density assembly according to claim 1, wherein the power supply L layer and the power supply N layer are implemented by large-area copper plating.

6. The high-power supply back plate facing high-density assembly according to claim 1, wherein a PE layer is disposed on one side surface of the PCB, and the PE pin of the power supply interface is electrically connected to the PE layer.

7. A high-power supply back plate facing high-density assembly according to claim 6, wherein the PCB is provided with a plurality of metallized mounting holes through the PCB, and the metallized mounting holes are electrically connected with the PE layer.

8. The high-power supply backboard facing high-density assembly of claim 1, wherein one power supply L layer and one power supply N layer form a group of power supply layers, the PCB comprises a plurality of groups of power supply layers, the power supply L layer and the power supply N layer of each group of power supply layers are arranged in an axisymmetric manner by taking a section central axis of the PCB as an axis, and both sides of each power supply L layer and both sides of each power supply N layer are provided with insulating medium layers.

9. The high-power supply back plate facing high-density assembly of claim 8, wherein the thickness of the insulating medium layer between the power supply L layer closest to the central axis of the cross section of the PCB and the power supply N layer closest to the central axis of the cross section of the PCB is greater than the thickness of the insulating medium layer between the power supply L layer farthest from the central axis of the cross section of the PCB and the surface of the PCB closest to the power supply L layer, and the thickness of the insulating medium layer between the power supply L layer farthest from the central axis of the cross section of the PCB and the surface of the PCB closest to the power supply L layer is greater than the thickness of the insulating medium layers between the power supply L layers.

10. The high-power supply back plate facing high-density assembly of claim 8, wherein a PE layer is disposed on the surface of the PCB close to the outermost N layers of the power supply, and the PE pin of the power supply interface is electrically connected with the PE layer.

Technical Field

The invention relates to the technical field of power generation, power transformation or power distribution of electrical engineering and equipment, in particular to a high-power supply back plate for high-density assembly.

Background

At present, a Power Distribution Unit (PDU) is generally used in an existing server cabinet or computing cabinet to supply power to a server or a computing plug-in unit, and a power line leads the power from a PDU power slot to the server or the computing plug-in unit. Multiple servers or computing plug-in units need to draw multiple power lines from the PDU to supply power.

The common PDU is generally low in power, low in power density, large in occupied space, disordered in wiring, easy to generate local hot spots, and incapable of meeting the use of operation loads with higher and higher power and space requirements. The wiring system is clear in layout, regular in line sequence, clear in mark and easy to maintain, and often needs professional personnel of a very professional wiring company, so that the wiring system is low in price, long in working time, large in workload and easy to make mistakes. In subsequent use, if line problems are found, the line problems need to be checked one by one, time and labor are wasted, and maintainability is low.

Therefore, the patent document with the publication number of CN102609058B discloses a "cabinet type modular high-density blade server system", which relates to the field of servers and aims to provide a large server system with high density, modular design and easy deployment; the system comprises a main body cabinet, a server host blade subsystem, a management subsystem A, a power subsystem and a cabinet back panel subsystem; the power subsystem also comprises a power module and a management subsystem B; the server host blade subsystem is arranged above the front end of the main body cabinet; the cabinet back board subsystem is used as a data signal transmission center and is in data signal connection with the server host blade subsystem, the management subsystem A, the power supply module and the management subsystem B; the rack backplane subsystem also serves as a power transmission hub for receiving power outputs of the power supply subsystem and supplying power to the server host blade subsystem, the management subsystem a, and the management subsystem B, but the flexibility is relatively poor.

Disclosure of Invention

The invention aims to solve the technical problem of the prior art, and provides a high-power supply backboard for high-density assembly, which has the advantages of good application flexibility, high power, small occupied space, uniform heating, high power supply safety and good maintainability, can realize high-density assembly of computing plug-in units and is suitable for high-density assembly.

In order to achieve the purpose, the invention adopts the technical scheme that:

a high-power supply back plate facing high-density assembly comprises a PCB board, wherein at least one basic power supply unit is formed on the PCB board, and the basic power supply unit comprises: inlet wire pad L, inlet wire pad N, power L layer, power N layer and at least one power supply interface, power L layer with it has insulating medium to fill between the power N layer, inlet wire pad L with power L layer electricity is connected, inlet wire pad N with power N layer electricity is connected, power L layer with power N layer respectively with power supply interface's L foot and N foot electricity are connected.

In the scheme, an incoming line pad L and an incoming line pad N are used for power supply incoming line welding, and a power supply current path is a power supply line L-pad L-power supply L layer-power supply interface L pin-calculating plug-in unit connector L pin-calculating plug-in unit connector N pin-power supply interface N pin-power supply N layer-pad N-power supply line N, wherein the calculating plug-in unit is equipment needing power supply in the computer cabinet in the prior art, such as a calculating plug-in unit, a server, a network communicator and the like; according to the power supply back plate, the PCB is used as a carrier of the feed path, the allocation amount of the basic power supply units on the same PCB can be increased or decreased according to the requirements of specific installation positions, the application flexibility is high, high-density assembly of the calculating plug-in units can be realized, the power is high and guaranteed, and the basic power supply units occupy small space; the power supply circuit has the advantages that printed lines such as the power supply L layer and the power supply N layer are used as feed lines, so that a general power supply line is omitted, the space occupied by the original power supply line can be greatly reduced, local hot spots caused by improper bundling of the power supply line can be avoided, and the power supply safety is improved; on the whole, the circuit distributes clearly not fragile, and maintainability is good, can make in the most work load of rack distribution construction can shift to the production factory of power supply backplate and accomplish, is favorable to the construction in batches to carry out quality control betterly, simplified the on-the-spot distribution installation work load of rack.

Furthermore, the basic power supply units are arranged at intervals in the longitudinal direction and are electrically isolated from each other. The plurality of basic power supply units can provide independent power supplies, high reliability of power supply is achieved, electrical isolation is beneficial to mutual noninterference among the basic power supply units, and the excellent characteristic of high power is guaranteed.

Furthermore, the number of the power supply interfaces is multiple, the L pins of the multiple power supply interfaces of the same basic power supply unit are electrically connected to the same power supply L layer, and the N pins are electrically connected to the same power supply N layer. Set up a plurality ofly in same basic power supply unit power supply interface can make things convenient for the grafting of a plurality of plug-in components units of calculating, makes things convenient for same power to supply power simultaneously for a plurality of plug-in components of calculating, and then is favorable to reducing basic power supply unit and is equipped with the demand, makes things convenient for the control of PCB plate size.

Furthermore, the basic power supply unit comprises a first power supply interface and a second power supply interface, the second power supply interface and the first power supply interface are arranged in a staggered mode from front to back and are respectively arranged on two opposite side faces of the PCB, the extending directions of the second power supply interface and the first power supply interface are opposite, the L pin and the N pin of the first power supply interface are respectively electrically connected with the L layer of the power supply and the N layer of the power supply, and the L pin and the N pin of the second power supply interface are respectively electrically connected with the L layer of the power supply and the N layer of the power supply. Generally, the high-density equipment demand of current rack can be satisfied to same basic power supply unit being equipped with two power supply interfaces, and stagger around first power supply interface and the second power supply interface are moreover arranges, cartridge around when can satisfying the equipment of rack high density equipment, when conveniently calculating plug-in components unit and having sufficient space grafting promptly, can help clear differentiation to calculate the concrete power supply source that plug-in components unit is connected again.

Further, the power supply L layer and the power supply N layer are realized by adopting large-area copper plating. The whole PCB can be heated uniformly, and the thermal stress of the whole PCB can be uniformly distributed.

Furthermore, a PE layer is arranged on the surface of one side of the PCB, and a PE pin of the power supply interface is electrically connected with the PE layer. The PCB is beneficial to the uniform grounding of a plurality of power supply interfaces on the PCB.

Furthermore, the PCB board is provided with a plurality of metallized mounting holes in a penetrating manner, and the metallized mounting holes are electrically connected with the PE layer. The PCB is convenient to mount on the cabinet through the metalized mounting holes, and the grounding of the PCB is realized by means of the grounding realized on the cabinet, so that the safe operation is guaranteed.

Furthermore, one power L layer and one power N layer constitute a set of power layer, the PCB board includes multiunit power layer, every power layer of every group the power L layer with power N layer with the cross-section center pin of PCB board sets up as the axial symmetry, every the both sides on power L layer and every the both sides on power N layer all are equipped with insulating medium layer. The number of the power supply layers is increased or decreased in groups to change the feeding section of the basic power supply unit.

Further, the thickness of an insulating medium layer between the power supply L layer closest to the central axis of the cross section of the PCB and the power supply N layer closest to the central axis of the cross section of the PCB is greater than the thickness of an insulating medium layer between the power supply L layer farthest from the central axis of the cross section of the PCB and the surface of the PCB closest to the power supply L layer, and the thickness of an insulating medium layer between the power supply L layer farthest from the central axis of the cross section of the PCB and the surface of the PCB closest to the power supply L layer is greater than the thickness of insulating medium layers between the power supply L layers. Utilize above-mentioned thickness law control PCB board, be favorable to conveniently controlling the gross thickness of PCB board, when reducing the volume as far as and occupying, the permanent stability of guarantee performance.

Furthermore, a PE layer is arranged on the surface, close to the outermost layer, of the PCB, of the power supply N layer, and a PE pin of the power supply interface is electrically connected with the PE layer.

After the technical scheme is adopted, the invention has the beneficial effects that: the PCB is used as a carrier of the feed path, the allocation quantity of the basic power supply units on the same PCB can be increased or decreased according to the requirement of a specific installation position, the allocation quantity of the power supply interfaces on the same basic power supply unit can be increased or decreased, and the application flexibility is high;

the plurality of basic power supply units and the plurality of power supply interfaces can realize high-density assembly of the computing plug-in units, and have high power and guarantee;

the PCB is used as a carrier of a feed path, and the basic power supply unit occupies small space;

the power supply circuit has the advantages that printed lines such as the power supply L layer and the power supply N layer are used as feed lines, so that a general power supply line is omitted, the space occupied by the original power supply line can be greatly reduced, local hot spots caused by improper bundling of the power supply line can be avoided, and the power supply safety is improved;

the power supply L layer and the power supply N layer are realized by large-area copper coating, the heat dissipation effect is good, the heating uniformity of the whole plate can be ensured, and the thermal stress of the whole plate is uniformly distributed;

the plurality of groups of power supply layers are arranged, so that the number of the power supply layers can be increased or decreased in groups to change the feed cross section of the basic power supply unit, and the power supply backboard can meet the power consumption of the installed cabinet conveniently;

in conclusion, the power supply back plate breaks through the conventional arrangement of the prior art, is beneficial to transferring most of workload of cabinet power distribution construction to a production factory of the power supply back plate for completion, is beneficial to large-batch construction, better performs quality control, simplifies the field power distribution installation workload of the cabinet, and can be directly installed on a vertical plate of the cabinet by common installers through screws, so that the working time is saved by more than 50%, and the power supply is safe and reliable; the PCB routing is designed by large-area copper coating, and the total transmission current can reach 600A; the power supply back plate can be plugged on the front side and the back side, can be used for matching with a cabinet with two sides for plugging, and has extremely high power density; the thickness of the whole plate is controllable, and can be controlled to be less than 5mm, so that the size of the cabinet is saved.

Drawings

In order to more clearly illustrate embodiments of the present invention or prior art solutions, the drawings are as follows:

fig. 1 is a schematic structural diagram of a high-power supply backplane for high-density assembly according to embodiment 1 of the present invention;

fig. 2 is a schematic structural diagram of a basic power supply unit provided in embodiment 1 of the present invention;

fig. 3 is a top view of a structure of a high-power supply backplane for high-density packaging according to embodiment 2 of the present invention;

fig. 4 is a schematic structural diagram of a preferred high-power supply backplane oriented to high-density assembly according to embodiment 2 of the present invention;

fig. 5 is a schematic diagram of a PCB laminated structure facing a high-power supply backplane assembled in high density according to embodiment 3 of the present invention.

Detailed Description

The invention provides a high-power supply backboard for high-density assembly, which is suitable for power distribution of high-density assembly and is used for replacing a power distribution unit. The power supply back plate is based on a PCB manufacturing process, adopts a multilayer printed board design, takes a large-area PCB printed line as a feed path, and is also provided with a plurality of power supply interfaces approximately symmetrically on the plate surfaces at two sides in a welding or crimping mode, so that a computing plug-in unit can be connected to any power supply interface at two sides of the power supply back plate to obtain electric energy.

The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.