阅读说明：本技术 摄像头模组的整版制程方法 (Full-page processing method of camera module ) 是由 赵立新 石金川 卢群 于 2018-06-14 设计创作，主要内容包括：本发明涉及一种摄像头模组的整版制程方法,提供摄像头模组、柔性电路板；将柔性电路板切割成若干条,所述条上对应若干摄像头模组；将至少一条柔性电路板固定在框架上作为一整版；通过柔性电路板的触点与测试设备电性连接可实现点亮、动态校准、调焦、测试、烧录及检测OTP信息中的一步或多步工序。(The invention relates to a full-page processing method of a camera module, which comprises the steps of providing the camera module and a flexible circuit board; cutting the flexible circuit board into a plurality of strips, wherein the strips correspond to a plurality of camera modules; fixing at least one flexible circuit board on the frame as a whole plate; one or more steps of lighting, dynamic calibration, focusing, testing, burning and detecting OTP information can be realized by electrically connecting the contact of the flexible circuit board with the testing equipment.)

1. A full-page processing method of a camera module is characterized in that:

providing a camera module and a flexible circuit board;

cutting the flexible circuit board into a plurality of strips, wherein the strips correspond to a plurality of camera modules;

fixing at least one flexible circuit board on the frame as a whole plate;

one or more steps of lighting, dynamic calibration, focusing, testing, burning and detecting OTP information can be realized by electrically connecting the contact of the flexible circuit board with the testing equipment.

2. The method of claim 1, wherein the frame has a high temperature tape thereon, and at least one flexible printed circuit board is adhered to the high temperature tape.

3. The method of claim 2, wherein a hollow portion is formed on the high temperature adhesive tape, and the hollow portion corresponds to a contact position on the back surface of the flexible printed circuit board.

4. The method of claim 1, wherein a test apparatus is provided to perform the optical alignment with respect to the strip.

5. The method of claim 1, wherein the camera modules are individually tested on a single strip in an entire plate.

6. The method of claim 1, wherein the camera modules of different versions are tested simultaneously.

7. The method of claim 1, wherein an upper platen is provided to match the position of the camera module, and the upper platen is electrically connected to the contacts on the test strip through bumps or elastic pins.

8. The method of claim 1, wherein a lower support is provided and electrically connected to the contacts of the test strip via bumps or pins.

Technical Field

The invention relates to the technical field of camera module testing, in particular to a full-page processing method of a camera module.

Background

A Cell phone Camera Module (CCM) is widely used in various new-generation portable cameras due to its advantages of miniaturization, low power consumption, low cost, and high image quality. The CCM includes a lens unit, a Voice Coil Motor (VCM), an infrared cut filter, an image sensor chip, a Flexible Printed Circuit Board (FPC) or a Printed Circuit Board (PCB), and a connector connected to a main Board of the mobile phone. Along with the increase of the types of the camera module interfaces, the module testing efficiency and the compatibility gradually become the bottleneck in the production process.

The conventional test flow in the industry now includes: the module is divided into a module version, a single module is manually taken, the module is manually aligned with the electrical connection position of the test circuit board and is pressed or inserted, the module is automatically tested, and the module is manually taken down. The test procedure has the following disadvantages: the operation mode of manual operation of loading and unloading occupies a large amount of time, and is a main bottleneck for improving the testing efficiency; single test has lower efficiency compared with multiple tests; the manual operation proficiency has great influence on the test accuracy; the connector is inaccurate in alignment and unstable in pressing, and misdetection is easy to occur; the potential risk of damage to the module due to manual pressing and bending actions of the module, human body static electricity and the like; frequent manual operation is easy to damage the test equipment; and the test head version is frequently replaced aiming at the modules defined by different interfaces.

In order to simplify manual operation and improve the testing efficiency and accuracy of a single module, a special testing jig (Socket) can be manufactured in the prior art to realize electrical connection. The test flow comprises the following steps: the method comprises the steps of die component edition, manual single die group taking, manual test fixture opening and die group putting, manual test fixture closing, automatic test and manual die group taking. The test flow can simplify the operation flow, reduce manual intervention and improve the test efficiency to a certain extent. However, the test fixture has requirements on the shape and interface definition of the module, one test fixture can only test one module, and has no compatibility, and the test fixture is more expensive than the test head.

To sum up, in order to further improve the module test efficiency, improve the test compatibility and accuracy, and reduce the unit test cost, a new structure and a new technology are needed.

Disclosure of Invention

The invention aims to provide a full-page manufacturing method of a camera module, which improves the testing efficiency and improves the compatibility and the accuracy.

In order to solve the above technical problems, the present invention provides a method for performing a full-page process of a camera module, comprising:

providing a camera module and a flexible circuit board;

cutting the flexible circuit board into a plurality of strips, wherein the strips correspond to a plurality of camera modules;

fixing at least one flexible circuit board on the frame as a whole plate;

one or more steps of lighting, dynamic calibration, focusing, testing, burning and detecting OTP information can be realized by electrically connecting the contact of the flexible circuit board with the testing equipment.

Optionally, the frame is provided with a high temperature adhesive tape, and at least one flexible circuit board is adhered to the high temperature adhesive tape.

Optionally, a hollow portion is formed on the high-temperature adhesive tape, and the hollow portion corresponds to a contact position on the back of the flexible circuit board.

Optionally, test equipment is provided to effect optical alignment according to the strips.

Optionally, the camera modules on a single strip in a full page are tested one by one.

Optionally, the camera modules on the middle strips of different versions are tested simultaneously.

Optionally, an upper pressing plate matched with the position of the camera module is provided, and the upper pressing plate is electrically connected with the contact on the test strip through a salient point or an elastic thimble.

Optionally, a matched lower supporting platform is provided, and the lower supporting platform is electrically connected with the contacts on the test strip through bumps or elastic thimbles.

Compared with the prior art, the full-page processing method of the camera module has the following beneficial effects:

according to the invention, the flexible circuit board is cut into a plurality of flexible circuit boards, each flexible circuit board corresponds to a plurality of camera modules, at least one flexible circuit board is fixed on the frame to be used as a whole version, and the whole version test of a plurality of modules is realized through automatic equipment, so that a large amount of time is saved, the utilization rate of test equipment is improved, and the test cost is reduced.

Drawings

FIG. 1 is a flowchart illustrating a method for manufacturing a camera module according to an embodiment of the present invention;

FIG. 2 is a diagram illustrating an imposition test according to an embodiment of the present invention.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather construed as limited to the embodiments set forth herein.

Next, the present invention is described in detail by using schematic diagrams, and when the embodiments of the present invention are described in detail, the schematic diagrams are only examples for convenience of description, and the scope of the present invention should not be limited herein.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, a method of manufacturing a camera module according to the present invention is described in detail below with reference to the accompanying drawings.

Referring to fig. 1 and 2, the present invention provides a method for performing a camera module:

step S1 is executed to provide the camera module 10, which includes a lens unit, a voice coil motor VCM, an infrared cut filter, and an image sensor chip. And providing a flexible circuit board, wherein the flexible circuit board is used for testing the camera module.

Step S2 is executed to cut the flexible circuit board into a plurality of strips, such as the flexible circuit board 20 shown in fig. 2, each of the strips corresponds to a plurality of camera modules 10. for example, 3 ~ 4 strips can be cut from the flexible circuit board, each of the strips corresponds to a plurality of camera modules 10 on the flexible circuit board 20, for example, 12 ~ 15 camera modules 10 are correspondingly disposed on each of the flexible circuit boards, and contacts (not shown in the figure) are formed on the front and back of the flexible circuit board 20 for electrically connecting bumps or elastic pins to transmit electrical signals during the test process.

Step S3 is executed to fix at least one flexible circuit board 20 on the frame 30 as a whole, and the camera module on the whole is tested. In this embodiment, the frame 30 has a high temperature adhesive tape thereon, and at least one flexible circuit board 20 is adhered to the high temperature adhesive tape. And, a hollow portion (not shown) is formed on the high temperature adhesive tape, and the hollow portion corresponds to a contact position on the back surface of the flexible circuit board 20, exposes the contact on the back surface of the flexible circuit board 20, and facilitates electrical connection in a test.

And step S4 is executed, a test device is provided, the test device is provided with a plurality of elastic ejector pins, the contact points of the flexible circuit board 20 are electrically connected with the elastic ejector pins of the test device, optical alignment is realized according to the strip, the camera module on the strip is tested, and one or more steps of processes of lighting, dynamic calibration, focusing, testing, burning and detecting OTP information can be realized.

In addition, in the testing process, an upper pressure plate matched with the position of the camera module 10 is provided, and the upper pressure plate is electrically connected with a contact on the test strip through a salient point or an elastic thimble. And moreover, a matched lower supporting platform can be provided, and the lower supporting platform is electrically connected with the contact on the test strip through the salient points or the elastic thimbles, so that the electric signal transmission in the test process is realized.

In the test process, the camera modules on a single strip in an entire edition can be tested one by one, the camera modules on strips or on different strips in different editions can also be tested simultaneously, different modes are selected to test as required, the entire edition test of the camera modules is realized, and the test efficiency is improved

In summary, the present invention provides a full-page processing method for camera modules, which cuts a flexible circuit board into a plurality of pieces, each piece corresponds to a plurality of camera modules, fixes at least one flexible circuit board on a frame as a full page, and realizes full-page testing of a plurality of modules through automation equipment, thereby saving a lot of time, improving the utilization rate of testing equipment, and reducing testing cost.

Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.