Conductive connection structure, manufacturing method thereof and solar cell module

文档序号:1660169 发布日期:2019-12-27 浏览:33次 中文

阅读说明:本技术 一种导电连接结构及其制作方法、太阳能电池组件 (Conductive connection structure, manufacturing method thereof and solar cell module ) 是由 张东明 于 2018-06-19 设计创作,主要内容包括:本发明公开一种导电连接结构及其制作方法、太阳能电池组件,涉及光伏发电技术领域,为解决引出电极与导电布之间的接触电阻较高的问题。所述导电连接结构包括引出电极和导电布,所述引出电极和所述导电布层叠在一起,所述引出电极和所述导电布压合在一起。所述导电连接结构的制作方法、太阳能电池组件包括上述技术方案所述的导电连接结构。本发明提供的导电连接结构及导电连接结构制作方法、太阳能电池组件用于光伏发电中。(The invention discloses a conductive connection structure, a manufacturing method thereof and a solar cell module, relates to the technical field of photovoltaic power generation, and aims to solve the problem that contact resistance between an extraction electrode and conductive cloth is high. The conductive connection structure comprises an extraction electrode and conductive cloth, wherein the extraction electrode and the conductive cloth are laminated together, and the extraction electrode and the conductive cloth are pressed together. The manufacturing method of the conductive connection structure and the solar cell module comprise the conductive connection structure in the technical scheme. The conductive connection structure and the manufacturing method thereof provided by the invention are used for photovoltaic power generation of the solar cell module.)

1. A method for making a conductive connection structure, comprising:

arranging an extraction electrode;

forming a conductive cloth on the surface of the extraction electrode, so that the conductive cloth and the extraction electrode are laminated together;

and pressing the conductive cloth and the extraction electrode together.

2. The method for manufacturing the conductive connection structure according to claim 1, wherein the forming of the conductive cloth on the surface of the extraction electrode includes:

forming a low-temperature welding agent on the surface of the extraction electrode;

forming conductive cloth on the surface of the extraction electrode;

the melting point of the low-temperature welding agent is lower than the laminating temperature of the lead-out electrode and the conductive cloth laminated together.

3. The method of claim 1, wherein before the step of disposing the extraction electrode, the method further comprises: providing a first substrate, the providing a first substrate comprising:

laying a first water-resistant layer;

forming a first hot melt adhesive layer on the surface of the first water-resistant layer, so that the first water-resistant layer and the first hot melt adhesive layer form a first base material;

after the conductive cloth and the extraction electrode are laminated together, the manufacturing method of the conductive connection structure further comprises the following steps: providing a second substrate, the providing a second substrate comprising:

forming a second hot melt adhesive layer on the surface of the conductive cloth; forming a second water-resistant layer on the surface of the second hot melt adhesive layer, so that the second hot melt adhesive layer and the second water-resistant layer form a second base material;

the pressing the conductive cloth and the extraction electrode together includes:

pressing the first base material, the extraction electrode, the conductive cloth, and the second base material together;

wherein the extraction electrode and the conductive cloth are disposed between the first base material and the second base material.

4. The method for manufacturing the conductive connection structure according to claim 1, wherein the conductive layer of the conductive cloth comprises a copper layer and a nickel layer which are stacked, and the copper layer and the nickel layer form a metal grid structure; the copper layer has a thickness of 3 μm to 6 μm, the nickel layer has a thickness of 0.8 μm to 1.2 μm, and/or,

the length of the conductive cloth is 35mm-45mm, the width of the conductive cloth is at least 20mm, and the width of the extraction electrode is 4mm-6 mm.

5. An electrically conductive connection structure, comprising: a conductive connection unit comprising: the lead-out electrode and the conductive cloth are laminated together.

6. The conductive connection structure according to claim 5, wherein a low-temperature solder is filled between the conductive cloth and the extraction electrode; the melting point of the low-temperature welding agent is lower than the pressing temperature of the conductive cloth and the leading-out electrode.

7. The conductive connection structure of claim 5, wherein the conductive layer of the conductive cloth comprises a copper layer and a nickel layer which are stacked, and the copper layer and the nickel layer form a metal grid structure; the copper layer has a thickness of 3 μm to 6 μm, the nickel layer has a thickness of 0.8 μm to 1.2 μm, and/or,

the length of the conductive cloth is 35mm-45mm, the width of the conductive cloth is at least 20mm, and the width of the extraction electrode is 4mm-6 mm.

8. The electrically conductive connection structure of claim 5, further comprising a first substrate and a second substrate; the conductive connecting unit is arranged between the first base material and the second base material.

9. The electrically conductive connection structure of claim 8, wherein the first substrate comprises: the first water-blocking layer and the first hot-melt adhesive layer are formed on the surface of the first water-blocking layer; the conductive connecting unit is formed on the surface of the first hot melt adhesive layer, which is far away from the first waterproof layer;

the second substrate comprises a second water-resistant layer and a second hot-melt adhesive layer formed on the surface of the second water-resistant layer, and the conductive connecting unit is located on the surface, deviating from the second water-resistant layer, of the second hot-melt adhesive layer.

10. A solar cell module, comprising at least two conductive connection structures according to any one of claims 5 to 9, wherein the conductive cloths of two adjacent conductive connection structures are integrally connected; the solar cell module further comprises at least two solar cell panels, and the solar cell panels are connected in series or in parallel through the conductive connection structure.

11. The solar cell assembly of claim 10 wherein when each of the electrically conductive connection structures comprises a first substrate and a second substrate, each of the solar panels comprises a solar functional layer; the first base material of the conductive connection structure corresponding to each solar cell panel extends to the light facing surface corresponding to the solar functional layer, and the second base material of the conductive connection structure corresponding to each solar cell panel extends to the backlight surface corresponding to the solar functional layer.

12. The solar cell module as claimed in claim 10, wherein when each of the electrically conductive connection structures comprises a first substrate and a second substrate, the solar cell module further comprises a first flexible protective layer and a second flexible protective layer;

the first flexible protective layer is formed on the surface, away from the conductive connection unit, of the first base material of at least two conductive connection structures, and at least covers a gap between the first base materials of two adjacent conductive connection structures;

the second flexible protective layer is formed on the surface, away from the conductive connection unit, of the second base material of at least two conductive connection structures, and the second flexible protective layer at least covers a gap formed between the second base materials of two adjacent conductive connection structures.

Technical Field

The invention relates to the field of photovoltaic power generation, in particular to a conductive connection structure, a manufacturing method of the conductive connection structure and a solar cell module.

Background

The solar cell module is a power generation device for converting solar energy into electric energy, and is a core part in a solar power generation system, and is also the most important part in the solar power generation system.

In order to conveniently store the solar cell module, a plurality of solar cell panels generally need to be electrically connected together by using a flexible conductive material, so that the solar cell module has a folding function. The flexible conductive material used by the existing solar cell module is a braided copper strip, and although the braided copper strip has good flexibility and folding resistance, the braided copper strip is thick, so that the thickness of the folded solar cell module is large, and the hand feeling is poor.

The inventor finds that: the conductive cloth used in the field of electromagnetic interference is light and thin, and if the conductive cloth is used in a solar cell module, the thickness of the folded solar cell module can be greatly reduced. However, when the conductive cloth is connected to the conductive member, the conductive adhesive is generally coated between the conductive cloth and the conductive member, so that the conductive cloth and the conductive member are electrically connected together, which makes the contact resistance ratio of the conductive cloth and the conductive member higher, and thus the conductive cloth and the conductive member are difficult to be applied to a solar cell module.

Disclosure of Invention

The invention aims to provide a conductive connection structure, a manufacturing method thereof and a solar cell module, so as to reduce the contact resistance between an extraction electrode and conductive cloth and further achieve the purpose of reducing the power transmission loss of a solar cell panel.

In order to achieve the purpose, the invention adopts the following technical scheme:

a manufacturing method of a conductive connection structure comprises the following steps:

arranging an extraction electrode;

forming a conductive cloth on the surface of the extraction electrode, so that the conductive cloth and the extraction electrode are laminated together;

and pressing the conductive cloth and the extraction electrode together.

Compared with the prior art, in the manufacturing method of the conductive connection structure, the extraction electrode and the conductive cloth are laminated together, and the extraction electrode and the conductive cloth are pressed together, so that the conductive cloth can be fully contacted with the extraction electrode, the contact area between the conductive cloth and the extraction electrode is increased, and the contact resistance between the conductive cloth and the extraction electrode is reduced. Therefore, when the conductive connection structure manufactured by the manufacturing method of the conductive connection structure provided by the invention is applied to the solar cell module with folding performance, the current can be transmitted under lower basic resistance on the premise that each solar cell module has good folding performance, and the electric energy loss in the power generation process of the solar cell module is reduced.

The invention also provides a conductive connection structure, which adopts the technical scheme that:

an electrically conductive connection structure, comprising: a conductive connection unit comprising: the lead-out electrode and the conductive cloth are laminated together.

Compared with the prior art, the beneficial effect of the conductive connection structure provided by the invention is the same as that of the manufacturing method of the conductive connection structure provided by the technical scheme, and the detailed description is omitted here.

The invention also provides a solar cell module which comprises at least two conductive connection structures, wherein the conductive cloth of two adjacent conductive connection structures is connected into a whole; the solar cell module further comprises at least two solar cell panels, and the solar cell panels are connected in series or in parallel through the conductive connection structure.

Compared with the prior art, the beneficial effect of the solar cell module provided by the invention is the same as that of the manufacturing method of the conductive connection structure provided by the technical scheme, and the description is omitted here.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of a conductive connection structure according to an embodiment of the present invention;

FIG. 2 is a folded front view of two conductive connection structures provided by an embodiment of the present invention;

FIG. 3 is a front view of an associated conductive connection structure in an embodiment of the present invention;

FIG. 4 is a top view of a connected conductive connection structure according to an embodiment of the present invention;

FIG. 5 is a top view of a solar module provided by an embodiment of the present invention;

fig. 6 is a flow chart of a method for manufacturing a conductive connection structure according to an embodiment of the present invention.

Reference numerals:

1-a first substrate, 11-a first water-resistant layer;

12-a first hot melt adhesive layer, 2-a second substrate;

21-a second hot melt adhesive layer, 22-a second water-resistant layer;

3-conductive connection unit, 300-low temperature solder;

301-conductive cloth, 301 a-positive conductive cloth;

301 b-negative conductive cloth, 302-extraction electrode;

302 a-a first extraction electrical positive electrode, 302 b-a first extraction electrical negative electrode;

302 c-a second extraction electrical positive electrode, 302 d-a second extraction electrical negative electrode;

41-a first flexible protective layer, 42-a second flexible protective layer;

51-a first conductive connection structure, 52-a second conductive connection structure;

61-a first solar panel, 62-a second solar panel.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, an embodiment of the invention provides a conductive connection structure, which includes: a conductive connection unit 3, the conductive connection unit 3 comprising: the extraction electrode 302 and the conductive cloth 301, the conductive cloth 301 and the extraction electrode 302 are laminated together, and the extraction electrode 302 and the conductive cloth 301 are pressed together. The conductive connection structure provided by the embodiment of the invention can be used for the electrical connection between devices which are poor in folding performance or cannot be folded, such as an FPC (Flexible Printed Circuit, abbreviated as FPC), a PCB (Printed Circuit board, abbreviated as PCB) or a solar panel.

Based on the conductive connection structure provided by the embodiment of the present invention, the extraction electrode 302 and the conductive cloth 301 are laminated together, and the extraction electrode 302 and the conductive cloth 301 are pressed together, so that the conductive cloth 301 and the extraction electrode 302 can be in full contact, thereby increasing the contact area between the conductive cloth 301 and the extraction electrode 302, and reducing the contact resistance between the conductive cloth 301 and the extraction electrode 302. Therefore, when the conductive connection structure provided by the invention is applied to the solar cell modules with folding performance, each solar cell module can transmit current under low contact resistance on the premise of good folding performance, and the electric energy loss in the power generation process of the solar cell module is reduced.

The pressing process is a process of integrally combining the same or different multi-layer materials by a heating process or a pressing process. Common types of the conductive cloth 301 include composite copper-nickel plated conductive cloth, gold plated conductive cloth, carbon plated conductive cloth, or aluminum foil fiber composite cloth. The conductive cloth 301 includes a fiber cloth (generally, a polyester fiber cloth) as a base cloth, and a conductive layer is applied to a surface of the fiber cloth. The conductive cloth 301 is classified into a plain weave type conductive cloth or a mesh type conductive cloth according to appearance. The base fabric of the conductive fabric 301 is generally polyester fabric such as polyester fabric and nitrile fabric, and the base fabric of the conductive fabric 301 is relatively sensitive to temperature and cannot maintain the original molecular structure of the material at a relatively high temperature, for example, the decomposition temperature of the material of the polyester fabric is about 200 ℃. Therefore, if the above-mentioned pressing is performed to press the conductive cloth 301 and the extraction electrode 302 by the heating process, the temperature of the heating process cannot exceed the decomposition temperature of the base cloth material of the conductive cloth 301.

When the conductive cloth 301 and the extraction electrode 302 are connected by welding, the melting point of the welding agent cannot exceed the decomposition temperature of the base cloth material of the conductive cloth 301. Based on this, as shown in fig. 1, a low temperature solder 300 is disposed between the leading electrode 302 and the conductive cloth 301 in the embodiment of the present invention, and a melting point of the low temperature solder 300 is lower than a hot pressing temperature when the conductive cloth 301 and the leading electrode 302 are pressed together, and the hot pressing temperature is lower than a decomposition temperature of a base cloth material of the conductive cloth 301. At this time, when the conductive cloth 301 and the extraction electrode 302 are pressed together by a heating process, the low-temperature welding agent 300 between the conductive cloth 301 and the extraction electrode 302 is in a molten state under a heating condition, so that the low-temperature welding agent 300 is uniformly spread in a gap between the conductive cloth 301 and the extraction electrode 302, and thus, the contact area between the conductive cloth 301 and the extraction electrode 302 can be further increased, and the contact resistance between the conductive cloth 301 and the extraction electrode 302 is effectively reduced. Moreover, a thermal welding effect can be generated between the conductive cloth 301 and the extraction electrode 302, so that the connection and fixation of the conductive cloth 301 and the extraction electrode 302 are more reliable. Meanwhile, the melting point temperature of the low-temperature welding agent 300 is lower than the decomposition temperature of the base cloth material of the conductive cloth 301, the melting point of the low-temperature welding agent 300 is lower than the hot pressing temperature when the conductive cloth 301 and the extraction electrode 302 are pressed together, and the hot pressing temperature is lower than the decomposition temperature of the base cloth material of the conductive cloth 301, so that the embodiment of the invention utilizes the low-temperature welding agent 300 to enable the conductive cloth 301 and the extraction electrode 302 to achieve the welding purpose, and simultaneously avoids the damage to the base cloth of the conductive cloth 301 caused by overhigh temperature during welding.

Optionally, as shown in fig. 1, the low-temperature soldering agent 300 in the embodiment of the present invention may be a low-temperature alloy soldering agent capable of being electroplated, chemically plated, or pasted, such as an alloy solder paste and/or a tin alloy plating layer, as long as the low-temperature soldering agent 300 can be used to perform low-temperature soldering on the conductive cloth 301 and the extraction electrode 302. The low-temperature solder paste is a paste mixture formed by mixing solder powder, soldering flux, other surfactants, thixotropic agents and the like. The low-temperature solder paste generally includes a lead solder paste or a lead-free solder paste, and the lead-free low-temperature solder paste is generally a tin-bismuth alloy solder paste, such as a bismuth 58 solder paste or a bismuth 57 solder paste, and has a melting point of only 138 ℃.

Considering that the existing conductive cloth 301 is generally used in the field of anti-electromagnetic interference, the conductivity of the conductive cloth is not high, and the resistivity is high. In order to make the conductive cloth 301 have better conductivity, and thus reduce the line loss, the resistivity of the conductive cloth 301 needs to be reduced. The embodiment of the invention adopts two modes to reduce the resistivity of the conductive cloth 301.

The first embodiment: as shown in fig. 1, since the conductive cloth 301 includes the base cloth and the conductive layer formed on the surface of the base cloth, under the condition that the length and width of the conductive cloth 301 are not changed, the thickness of the conductive layer needs to be increased to reduce the resistivity of the conductive cloth 301, and the conductive layer is too thick, which may cause the conductive cloth 301 to become brittle and reduce the folding endurance of the conductive cloth 301, so that the thickness and folding endurance of the conductive cloth 301 need to be balanced. Multiple tests show that when the conductive layer of the conductive cloth 301 adopts the copper layer and the nickel layer which are arranged in a laminated manner, the thickness of the copper layer is 3-6 μm, the thickness of the nickel layer is 0.8-1.2 μm, the copper layer and the nickel layer form a metal grid structure, and the conductive layer of the conductive cloth 301 has the structure, so that the resistance of the conductive cloth 301 is smaller, and the flexibility of the conductive cloth 301 is ensured not to cause the conductive cloth 301 to become brittle due to the increase of the thickness of the conductive layer of the conductive cloth 301.

The second embodiment: increasing the width of the conductive cloth 301 to reduce the resistance of the conductive cloth 301; specifically, the direction from the left to the right in fig. 3 is set as the longitudinal direction of the conductive cloth 301 and the width direction of the extraction electrode 302, and the direction perpendicular to the paper surface is set as the width direction; when the length of the conductive cloth 301 is 35mm-45mm, the degree is at least 20mm, the width of the extraction electrode 302 is 4mm-6mm, the conductive connection structure is applied to the solar cell module, each solar cell panel is connected with the conductive connection structure, and the conductive cloth 301 included in the conductive connection structure corresponding to the two adjacent solar cell panels are connected into a whole, the contact resistance between the conductive cloth 301 and the extraction electrode 302 can be reduced.

Through the test: when the length of the conductive cloth 301 is 40mm, the width thereof is 20mm, and the width of the extraction electrode 302 is 4mm, the total resistance of the extraction electrodes 302 of the conductive connection structure corresponding to two adjacent solar panels is not higher than 70 milliohms. If the conductive connection structure corresponding to each solar cell panel is removed and does not contain the low-temperature soldering flux 300, the resistance value is slightly increased.

As an achievable embodiment, as shown in fig. 1, the conductive connection structure provided by the embodiment of the present invention further includes a first substrate 1 and a second substrate 2; the extraction electrode 302 and the conductive cloth 301 form a conductive connection unit 3, and the conductive connection unit 3 is arranged between the first substrate 1 and the second substrate 2, so that the first substrate 1 and the second substrate 2 form a protective layer serving as the conductive connection unit 3, and the conductive connection unit 3 is well protected.

Illustratively, as shown in fig. 1, the first substrate 1 includes: a first water-resistant layer 11 and a first hot melt adhesive layer 12 formed on the surface of the first water-resistant layer 11; the conductive connection unit 3 is formed on the surface of the first hot melt adhesive layer 12 facing away from the first water resistant layer 11. The second substrate 2 includes a second water-resistant layer 22 and a second hot-melt adhesive layer 21 formed on the surface of the second water-resistant layer 22, and the conductive connection unit 3 is located on the surface of the second hot-melt adhesive layer 21 away from the second water-resistant layer 22.

As can be seen from the above-mentioned structures of the first substrate 1 and the second substrate 2, the first water-blocking layer 11 and the second water-blocking layer 22 are located at the outermost side of the conductive connection structure, so that in the conductive connection structure in an environment with high humidity, the first water-blocking layer 11 and the second water-blocking layer 22 can prevent moisture from entering, and prevent corrosion caused by oxidation of the contact portion between the conductive cloth 301 and the extraction electrode 302 in the conductive connection unit 3. And be equipped with first hot melt adhesive layer 12 and second hot melt adhesive layer 21 between first water resisting layer 11 and the second water resisting layer 22, this makes first hot melt adhesive layer 12 and second hot melt adhesive layer 21 can closely bond first water resisting layer 11, electrically conductive linkage unit 3, second water resisting layer 22 together to make electrically conductive linkage have better wholeness.

As shown in fig. 1, the first hot melt adhesive layer 12 and/or the second hot melt adhesive layer 21 are/is a reactive hot melt adhesive layer. When hot pressing is carried out, the first reaction type hot melt adhesive layer has adhesiveness after being heated, and can generate cross-linking reaction with the first water-resistant layer 11, so that the first water-resistant layer 11 and the first reaction type hot melt adhesive layer are cross-linked to form a network structure; after the second reactive hot melt adhesive layer is heated, the second reactive hot melt adhesive layer has adhesiveness and simultaneously has a crosslinking reaction with the second water-resistant layer 22, so that the second water-resistant layer 22 and the second reactive hot melt adhesive layer are crosslinked into a network structure; meanwhile, the surface of the first reaction type hot melt adhesive layer, which is far away from the first water resisting layer 11, is bonded with the surface of the conductive connecting unit 3, and the surface of the second reaction type hot melt adhesive layer, which is far away from the second water resisting layer 22, is bonded with the surface of the conductive connecting unit 3, which is far away from the first reaction type hot melt adhesive layer; further, when the areas of the first reaction type hot melt adhesive layer and the second reaction type hot melt adhesive layer are larger than the area of the conductive connection unit 3, the surface of the first reaction type hot melt adhesive layer away from the first water-resistant layer 11 and the surface of the second reaction type hot melt adhesive layer away from the second water-resistant layer 22 are connected to trigger a cross-linking reaction, and the conductive connection unit 3 is cross-linked between the first reaction type hot melt adhesive layer and the second reaction type hot melt adhesive layer, so that the conductive connection unit 3 is tightly connected with the first water-resistant layer 11 and the second water-resistant layer 22, and the conductive connection unit 3 is also ensured to be in a stable state, so that the conductive cloth 301 and the extraction electrode 302 included by the conductive connection unit 3 can maintain a high contact area.

As shown in fig. 1 and fig. 6, an embodiment of the present invention further provides a method for manufacturing a conductive connection structure, where the method for manufacturing the conductive connection structure includes:

step S200: an extraction electrode 302 is provided; the extraction electrode 302 is a photovoltaic solder strip or a back plate electrode of a solar cell panel. The photovoltaic solder strip is a copper strip with a tinned surface, and is generally used as a current leading-out electrode of a solar panel or a bus bar of a solar cell module;

step S400: forming a conductive cloth 301 on the surface of the extraction electrode 302 so that the conductive cloth 301 and the extraction electrode 302 are laminated together;

step S600: the conductive cloth 301 and the extraction electrode 302 are pressed together.

Compared with the prior art, the manufacturing method of the conductive connection structure provided by the embodiment of the invention has the same beneficial effects as the conductive connection structure provided by the embodiment, and the details are not repeated herein.

Specifically, in the manufacturing method of the conductive connection structure, when the conductive layer of the conductive cloth 301 includes the copper layer and the nickel layer which are stacked, the copper layer and the nickel layer form a metal grid structure; the thickness of the copper layer is 3-6 μm, the thickness of the nickel layer is 0.8-1.2 μm, and/or the length of the conductive cloth is 35-45 mm, the width of the conductive cloth is at least 20mm, and the width of the leading-out electrode is 4-6 mm, so that the self resistance of the conductive cloth can be effectively reduced, and the contact resistance between the conductive cloth and the leading-out electrode can be reduced.

Optionally, in the embodiment of the present invention, pressing the conductive cloth 301 and the extraction electrode 302 together includes: the conductive cloth 301 and the extraction electrode 302 are vacuum-compressed together. Air between the pair of conductive cloth 301 and the pair of extraction electrodes 302 is discharged to the greatest extent in the pressing process, so that the conductive cloth 301 is more favorably in full contact with the extraction electrodes 302, the contact area between the conductive cloth 301 and the extraction electrodes 302 is increased, and the contact resistance between the conductive cloth 301 and the extraction electrodes 302 is reduced.

Optionally, in the embodiment of the present invention, the manner of pressing the conductive cloth 301 and the extraction electrode 302 together is as follows: the conductive cloth 301 and the extraction electrode 302 are pressed together, so that the pressing temperature is at least lower than the decomposition temperature of the base cloth material of the conductive cloth 301, the conductive cloth 301 and the extraction electrode 302 are better combined, meanwhile, the cloth base of the conductive cloth 301 cannot be damaged due to overhigh temperature, the pressing mode can be hot pressing, laminating and other pressing processes, and the pressing temperature is at least lower than the decomposition temperature of the base cloth material of the conductive cloth 301.

Optionally, as shown in fig. 1 and fig. 6, forming the conductive cloth 301 on the surface of the extraction electrode 302 in the embodiment of the present invention specifically includes:

step S300: the low-temperature welding agent 300 is formed on the surface of the extraction electrode 302, the melting point of the low-temperature welding agent 300 is lower than the decomposition temperature of the base cloth material of the conductive cloth 301, the melting point of the low-temperature welding agent 300 is lower than the hot pressing temperature when the conductive cloth 301 and the extraction electrode 302 are pressed, and the hot pressing temperature is lower than the decomposition temperature of the base cloth material of the conductive cloth 301.

The low-temperature soldering flux 300 in the embodiment of the invention has various options, and can be alloy solder paste and/or tin alloy plating.

Specifically, the hot-pressing temperature of the hot-pressing process and the melting point of the low-temperature soldering agent 300 are both lower than the decomposition temperature of the base fabric material of the conductive fabric 301, and the melting point of the low-temperature soldering agent 300 is also lower than the hot-pressing temperature of the hot-pressing process, and if the base fabric of the conductive fabric 301 is dacron or dacron, the decomposition temperature of the dacron or dacron is about 200 ℃, so the optimal temperature of the hot-pressing process is 110 ℃ to 180 ℃, and the optimal temperature of the melting point of the low-temperature soldering agent 300 is 100 ℃ to 170 ℃.

Optionally, as shown in fig. 1 and fig. 6, before the step of providing the extraction electrode 302, the method for manufacturing the conductive connection structure further includes: providing a first substrate 1, the providing of the first substrate 1 comprising:

s100: laying a first water resisting layer 11, forming a first hot melt adhesive layer 12 on the surface of the first water resisting layer 11, so that the first water resisting layer 11 and the first hot melt adhesive layer 12 form a first base material 1, and sequentially stacking and arranging a leading-out electrode 302 and a conductive cloth 301 on one side of the first hot melt adhesive layer 12, which is far away from the first water resisting layer 11; the first hot melt adhesive layer 12 is made of a reactive hot melt adhesive.

As shown in fig. 1 and 6, after the conductive cloth 301 and the extraction electrode 302 are laminated together, the method for manufacturing the conductive connection structure further includes: providing a second substrate 2, the providing of the second substrate 2 comprising:

s500: forming a second hot melt adhesive layer 21 on the surface of the conductive cloth 301, and forming a second water-resistant layer 22 on the surface of the second hot melt adhesive layer 21, so that the second hot melt adhesive layer 21 and the second water-resistant layer 22 form a second substrate 2; the material of the second hot melt adhesive layer 21 is a reactive hot melt adhesive.

The above pressing together of the conductive cloth 301 and the extraction electrode 302 includes: the first substrate 1, the extraction electrode 302, the conductive cloth 301 and the second substrate 2 are pressed together, wherein the extraction electrode 302 and the conductive cloth 301 are arranged between the first substrate 1 and the second substrate 2, so that the conductive cloth 301 and the extraction electrode 302 can be fully contacted, the contact area between the conductive cloth 301 and the extraction electrode 302 is increased, and the contact resistance between the conductive cloth 301 and the extraction electrode 302 is reduced.

The pressing temperature is at least lower than the decomposition temperature of the base cloth material of the conductive cloth 301; further, the pressing temperature is lower than the decomposition temperature of the hot melt adhesive of the first hot melt adhesive layer 12 and the second hot melt adhesive layer 21, so that the hot melt adhesive of the first hot melt adhesive layer 12 and the second hot melt adhesive layer 21 cannot be damaged due to overhigh temperature in the pressing process.

As shown in fig. 2, fig. 3 and fig. 4, an embodiment of the present invention further provides a solar cell module, where the solar cell module includes at least two conductive connection structures, and conductive cloths 301 included in two adjacent conductive connection structures are connected into a whole; the solar cell module further comprises at least two solar cell panels, and the solar cell panels are connected in series or in parallel through the conductive connection structure.

Compared with the prior art, the beneficial effects of the solar cell module provided by the embodiment of the invention are the same as those of the conductive connection structure provided by the embodiment, and are not repeated herein. Moreover, since the conductive cloths 301 included in the two conductive connection structures are connected into a whole, and the conductive cloth 301 has good flexibility, even if the solar cell module is folded for many times, the conductivity of the conductive cloth 301 is not reduced.

As shown in fig. 4, the number of the extraction electrodes 302 of each conductive connection structure is two, each extraction electrode 302 includes an extraction electric positive electrode and an extraction electric negative electrode, the number of the conductive cloths 301 is two, the two conductive cloths 301 include a positive conductive cloth 301a and a negative conductive cloth 301b, the positive conductive cloth 301a and the extraction electric positive electrode are pressed together, the extraction electric negative electrode and the negative conductive cloth 301b are pressed together, the positive electrode of each solar cell panel is connected with the extraction electric positive electrode included in each conductive connection structure in a one-to-one correspondence manner, and the negative electrode of each solar cell panel is connected with the extraction electric negative electrode included in each conductive connection structure in a one-to-one correspondence manner.

When two adjacent solar cell panels are connected in parallel, the positive conductive cloth 301a included in the two adjacent conductive connection structures are connected into a whole, and the negative conductive cloth 301b included in the two adjacent conductive connection structures are connected into a whole, so that the two adjacent solar cell panels are connected in parallel to transmit charges mutually.

When two adjacent solar panels are connected in series, in the two adjacent conductive connection structures, the positive conductive cloth 301a of one conductive connection structure and the negative conductive cloth 301b of the other conductive connection structure are connected into a whole, so that the two adjacent solar panels are connected in series to transmit charges mutually.

Further, as shown in fig. 1, fig. 2 and fig. 5, when each conductive connection structure includes a first substrate 1 and a second substrate 2, each solar panel includes a solar functional layer, the first substrate 1 of the conductive connection structure corresponding to each solar panel extends to a light facing surface of the corresponding solar functional layer, and the second substrate 2 of the conductive connection structure corresponding to each solar panel extends to a backlight surface of the corresponding solar functional layer; based on the conductive connection structure, in the solar cell module provided by the embodiment of the invention, the first substrate 1 and the second substrate 2 of each conductive connection structure can also be used as a protective film for protecting the corresponding solar cell panel.

From another perspective, the solar cell panel not only comprises the solar functional layer, but also comprises a first protective layer arranged on the light-facing surface of the solar functional layer, and a second protective layer arranged on the backlight surface of the solar functional layer.

As for the first protective layer and the second protective layer, the application environment of the solar cell module may be considered. If solar module is applied to in the great environment of steam, then first protective layer and second protective layer are the water blocking layer, first protective layer is in the same place with the plain noodles gluing of solar function layer (if pass through the hot melt adhesive), the second protective layer is in the same place with the plain noodles gluing of solar function layer (if pass through the hot melt adhesive), first protective layer and first substrate 1's structure this moment, the material is identical, the structure of second protective layer and second substrate 2, the material, consequently, first protective layer that solar cell panel includes can also regard as the first substrate 1 that corresponds electrically conductive connection structure includes, second substrate 2 that second protective layer that solar cell panel includes can also regard as corresponding electrically conductive connection structure to include.

Illustratively, fig. 5 shows a solar cell module made using the conductive structure of fig. 4, which includes a first solar cell panel 61, a second solar cell panel 62, a first conductive connection structure 51, and a second conductive connection structure 52. The first conductive connecting structure 51 comprises a first leading-out electric anode 302a, a first leading-out electric cathode 302b, first anode conductive cloth and first cathode conductive cloth, wherein the first leading-out electric anode 302a and the first anode conductive cloth are pressed together, and the first leading-out electric cathode 302b and the first cathode conductive cloth are pressed together; the second conductive connection structure 52 includes a second leading-out electric anode 302c, a second leading-out electric cathode 302d, a second anode conductive cloth, and a second cathode conductive cloth, the second leading-out electric anode 302c and the second anode conductive cloth are pressed together, and the second leading-out electric cathode 302d and the second cathode conductive cloth are pressed together; the first extraction electric anode 302a is connected with the anode of the first solar cell panel 61, the first extraction electric cathode 302b is connected with the cathode of the first solar cell panel 61, the second extraction electric anode 302c is connected with the anode of the second solar cell panel 62, and the second extraction electric cathode 302d is connected with the cathode of the second solar cell panel 62; it can be seen that the first and second solar panels 61 and 62 are not only structurally connected together, but also electrically connected together by the first and second electrically conductive connection structures 51 and 52. And because the conductive cloth of two adjacent conductive connection structures are connected into a whole, the solar cell module has good folding performance.

Alternatively, as shown in fig. 3, an embodiment of the present invention provides a solar cell module manufactured by using the conductive structures shown in fig. 1-2, where each conductive connection structure includes a first substrate 1 and a second substrate 2, the solar cell module further includes a first flexible protection layer 41 and a second flexible protection layer 42; the first flexible protection layer 41 is formed on the surface of the first substrate 1 of at least two conductive connection structures, which is away from the conductive connection unit 3, and at least covers the gap between the first substrates 1 of two adjacent conductive connection structures; the second flexible protection layer 42 is formed on the surface of the second substrate 2 of at least two conductive connection structures, which faces away from the conductive connection unit 3, and covers at least the gap between the second substrates 2 of two adjacent conductive connection structures. Because the first flexible protection layer 41 and the second flexible protection layer 42 are formed on the surface of the conductive connection structure, the conductive connection structure can be well protected while the foldability of the conductive structure which can be repeatedly folded is not affected, and the conductive cloth 301 and the exposed conductive layer of the conductive cloth 301 can be protected.

In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

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