阅读说明：本技术 一种采用包围式储液腔的环路热管 (Loop heat pipe adopting surrounding type liquid storage cavity ) 是由 蒋昊霖 于 2021-06-29 设计创作，主要内容包括：本发明公开了一种采用包围式储液腔的环路热管,包括蒸发器、气体管线、冷凝器、液体管线、毛细芯传热结构、分液器和多个液体支管,所述毛细芯传热结构设于蒸发器内腔,所述气体管线的一端与蒸发器内腔相通,气体管线的另一端与冷凝器相联通,所述冷凝器的出水口通过气体管线与分液器相联通,所述分液器与蒸发器之间设有多个液体支管。该热管中的毛细芯传热结构的大小可依据实际情况定制,网孔大小及密度不限,高度可根据散热空间限制进行调节。结构紧凑合理,实现了大功率、高流速的传热需求,降低成本,提高散热效率。(The invention discloses a loop heat pipe adopting a surrounding liquid storage cavity, which comprises an evaporator, a gas pipeline, a condenser, a liquid pipeline, a capillary wick heat transfer structure, a liquid distributor and a plurality of liquid branch pipes, wherein the capillary wick heat transfer structure is arranged in an inner cavity of the evaporator, one end of the gas pipeline is communicated with the inner cavity of the evaporator, the other end of the gas pipeline is communicated with the condenser, a water outlet of the condenser is communicated with the liquid distributor through the gas pipeline, and the plurality of liquid branch pipes are arranged between the liquid distributor and the evaporator. The size of the capillary core heat transfer structure in the heat pipe can be customized according to actual conditions, the size and the density of the meshes are not limited, and the height can be adjusted according to the limitation of a heat dissipation space. The structure is compact and reasonable, the heat transfer requirements of high power and high flow speed are realized, the cost is reduced, and the heat dissipation efficiency is improved.)

1. A loop heat pipe with an enclosed liquid storage cavity is characterized by comprising an evaporator, a gas pipeline, a condenser, a liquid pipeline, a capillary wick heat transfer structure, a liquid distributor and a plurality of liquid branch pipes, wherein the capillary wick heat transfer structure is arranged in an inner cavity of the evaporator, one end of the gas pipeline is communicated with the inner cavity of the evaporator, the other end of the gas pipeline is communicated with the condenser, a water outlet of the condenser is communicated with the liquid distributor through the liquid pipeline, and the plurality of liquid branch pipes are arranged between the liquid distributor and the evaporator.

2. A loop heat pipe using a liquid storage cavity as defined in claim 1, wherein the wick heat transfer structure is in close contact with the side wall of the inner cavity of the evaporator, the wick heat transfer structure comprises an annular sealing structure, a heat absorbing part and an evaporation cavity, the annular sealing structure is connected with the inner side wall of the evaporator, the liquid storage cavity is formed between the periphery of the annular sealing structure and the periphery of the inner cavity of the evaporator, the annular sealing structure is provided with a grid heat absorbing part for absorbing heat generated by the high power chip, and the grid heat absorbing part is provided with a plurality of evaporation cavities.

3. A loop heat pipe using a liquid storage chamber according to claim 1 or 2, wherein a sealing ring for preventing steam leakage is provided on a surface of the wick heat transfer structure contacting the evaporator cover plate.

4. A loop heat pipe using a liquid storage chamber as defined in claim 1, wherein the wick heat transfer structure comprises an annular sealing structure and a heat absorbing portion, the annular sealing structure is connected to an inner sidewall of the evaporator, the liquid storage chamber is formed between an outer periphery of the annular sealing structure and an inner periphery of the evaporator, and the heat absorbing portion comprises a heat absorbing section disposed transversely and a plurality of evaporation chambers vertically connected to the heat absorbing section.

5. The loop heat pipe adopting the enclosed liquid storage cavity as claimed in claim 1 or 2, wherein the liquid branch pipe comprises a first liquid branch pipe, a second liquid branch pipe, a third liquid branch pipe and a fourth liquid branch pipe, the liquid outlet end of the first liquid branch pipe is communicated with the liquid separator, and the liquid inlet end of the first liquid branch pipe is connected with the upper end of the right side of the evaporator and is communicated with the liquid storage cavity in the evaporator; the liquid outlet end of the second liquid branch pipe is communicated with the liquid separator, and the liquid inlet end of the second liquid branch pipe is connected with the lower end of the right side of the evaporator and communicated with a liquid storage cavity in the evaporator; the liquid outlet end of the liquid branch pipe III is communicated with the liquid separator, and the liquid inlet end of the liquid branch pipe III is connected with the lower end of the left side of the evaporator and communicated with a liquid storage cavity in the evaporator; and the liquid outlet end of the liquid branch pipe IV is communicated with the liquid separator, and the liquid inlet end of the liquid branch pipe IV is connected with the upper end of the left side of the evaporator and is communicated with a liquid storage cavity in the evaporator.

6. A loop heat pipe using a liquid storage cavity as claimed in claim 1 or 2, wherein the evaporator is a cavity with one side open and the other side closed, the side of the evaporator is provided with a cover plate, the side of the cover plate connected with the evaporator is provided with a sealing ring, the cover plate is further provided with a steam outlet, and the steam inlet end of the gas pipe body passes through the steam outlet on the cover plate to correspond to the capillary wick heat transfer structure.

7. A loop heat pipe using a liquid storage chamber as claimed in claim 1 or 2, wherein a secondary heat source heat conducting structure is further disposed on the gas line between the condenser and the liquid separator, the secondary heat source heat conducting structure is snap-fit, and the gas line two is snap-fit with the secondary heat source heat conducting structure. The secondary heat source heat conduction structure is arranged, so that the heat of the low-power chip can be transferred into the liquid working medium, and the effect of fixing the gas pipeline can be achieved.

8. A loop heat pipe using a surrounding liquid storage chamber as claimed in claim 1 or 2, wherein the capillary wick heat transfer structure is made of porous water-absorbing material.

Technical Field

The invention relates to the field of server heat dissipation, in particular to a loop heat pipe adopting a surrounding type liquid storage cavity.

Background

The domestic server heat dissipation technical route mainly focuses on air cooling and liquid cooling. The two heat dissipation technologies are single-phase working medium heat exchange, and the heat exchange quantity depends on the flow speed and the physical property of the working medium. With the development of electronic chip technology, air cooling cannot meet the heat dissipation requirement of high-end electronic chips. The liquid cooling system has high cost due to the special working medium type, complex circulation pipeline, strict requirement on later maintenance and the like. It is necessary to have a design scheme of a heat dissipation system with high efficiency, low cost, safety, reliability, simplicity and easy maintenance.

The loop heat pipe mainly comprises an evaporator, a capillary core, a liquid storage chamber, a liquid pipeline, a steam pipeline and a condensing section. The evaporator of the flat-plate loop heat pipe is a flat plate, has large heating area and small occupied space height, and is particularly suitable for heat dissipation of electronic devices with limited internal space, large heat productivity and high heat flux density. With the rapid development of computer technology, the volume of electronic components is smaller and smaller, and the integration level is higher and higher, so that the heat flux density on the electronic components is higher and higher; sometimes, in order to reduce the size, the electronic components are arranged even in a stacked structure, which provides higher requirements for heat dissipation inside the electronic components. The evaporator of the conventional flat-plate loop heat pipe is generally in a flat-plate cavity structure, wherein one surface of the evaporator is used as a heating surface of the evaporator, the other surface of the evaporator is provided with a liquid storage chamber, and the middle of the evaporator is separated by a capillary core. The liquid working medium in the liquid storage chamber is absorbed by the capillary force of the capillary core, enters the evaporation chamber, is heated and evaporated by the heat from the heating surface, and the generated steam enters the steam pipeline at one side through the steam channel on the heating surface and is cooled into the liquid working medium in the condenser; the liquid working medium enters the liquid storage chamber through the liquid pipeline and the pipeline positioned on the other side of the evaporation chamber, thereby completing a cycle. A significant drawback of the conventional loop heat pipe configuration occurs when the power is gradually increased to the limit of the rate at which the capillary wick absorbs liquid. High power and low temperature difference require that the circulation rate of working medium in the loop heat pipe is fast enough, and the capillary force of the capillary core cannot absorb the working medium at an ideal rate to form circulation. This results in a higher steam temperature after evaporation of the working medium and a failure to suppress the temperature of the chip.

The replacement requirements of narrow space distribution and rapid plugging in a server are not considered in the design of the existing loop heat pipe, a condenser is often designed outside the server, the size is large, and the condenser cannot support hot plugging outside. The parallel design is usually adopted for the working condition of multiple heat sources in the server, and the actual situation that the heating power of chips in the server is different is not considered.

Disclosure of Invention

The invention aims to provide a loop heat pipe adopting a surrounding liquid storage cavity, and the heat pipe device has a compact and reasonable structure, meets the heat transfer requirements of high power and high flow rate, reduces the cost and improves the heat dissipation efficiency.

The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides an adopt loop heat pipe in enclosed liquid storage chamber, includes evaporimeter, gas pipeline, condenser, liquid pipeline, capillary core heat transfer structure, knockout and a plurality of liquid branch pipe, capillary core heat transfer structure locates the evaporimeter inner chamber, the one end of gas pipeline communicates with each other with the evaporimeter inner chamber, and the other end and the condenser of gas pipeline UNICOM, the delivery port of condenser passes through gas pipeline and knockout looks UNICOM, be equipped with a plurality of liquid branch pipes between knockout and the evaporimeter.

Further, the capillary core heat transfer structure is in close contact with the side wall of the inner cavity of the evaporator, the capillary core heat transfer structure comprises an annular sealing structure, a heat absorption part and an evaporation cavity, the annular sealing structure is connected with the inner side wall of the evaporator, a liquid storage cavity is formed between the periphery of the annular sealing structure and the periphery of the inner cavity of the evaporator, a grid-shaped heat absorption part for absorbing heat generated by the high-power chip is arranged in the annular sealing structure, and a plurality of evaporation cavities are arranged in the grid-shaped heat absorption part.

Furthermore, a sealing ring for preventing steam leakage is arranged on one surface of the capillary core heat transfer structure, which is in contact with the evaporator cover plate.

Further, the capillary core heat transfer structure comprises an annular sealing structure and a heat absorption part, the annular sealing structure is connected with the inner side wall of the evaporator, a liquid storage cavity is formed between the periphery of the annular sealing structure and the periphery of the inner cavity of the evaporator, and the heat absorption part comprises a heat absorption section and a plurality of evaporation cavities, wherein the heat absorption section is transversely arranged, and the evaporation cavities are vertically connected with the heat absorption section.

Further, the liquid branch pipe comprises a first liquid branch pipe, a second liquid branch pipe, a third liquid branch pipe and a fourth liquid branch pipe, the liquid outlet end of the first liquid branch pipe is communicated with the liquid distributor, and the liquid inlet end of the first liquid branch pipe is connected with the upper end of the right side of the evaporator and communicated with the liquid storage cavity in the evaporator; the liquid outlet end of the second liquid branch pipe is communicated with the liquid separator, and the liquid inlet end of the second liquid branch pipe is connected with the lower end of the right side of the evaporator and communicated with a liquid storage cavity in the evaporator; the liquid outlet end of the liquid branch pipe III is communicated with the liquid separator, and the liquid inlet end of the liquid branch pipe III is connected with the lower end of the left side of the evaporator and communicated with a liquid storage cavity in the evaporator; and the liquid outlet end of the liquid branch pipe IV is communicated with the liquid separator, and the liquid inlet end of the liquid branch pipe IV is connected with the upper end of the left side of the evaporator and is communicated with a liquid storage cavity in the evaporator.

Furthermore, the evaporator is a cavity with an opening on one side and the other sides being closed, a cover plate is arranged on the opening side of the evaporator, a sealing ring is arranged on the connecting side of the cover plate and the evaporator, a steam outlet is further arranged on the cover plate, and the steam inlet end of the gas pipe body penetrates through the steam outlet on the cover plate to correspond to the capillary core heat transfer structure.

Further, a secondary heat source heat conduction structure is further arranged on a gas pipeline between the condenser and the liquid distributor, the secondary heat source heat conduction structure is in a buckle shape, and the gas pipeline II is clamped with the secondary heat source heat conduction structure. The secondary heat source heat conduction structure is arranged, so that the heat of the low-power chip can be transferred into the liquid working medium, and the effect of fixing the gas pipeline can be achieved.

Further, the capillary core heat transfer structure is made of a porous water absorption material.

The invention has the beneficial effects that:

1. the size of the capillary core heat transfer structure in the heat pipe device can be customized according to actual conditions, the mesh size and density are not limited, and the height can be adjusted according to the limitation of a heat dissipation space. The condenser is filled with common cooling water, the gas in the pipeline flows into the liquid separator along the liquid pipeline under the drive of gravity and steam pressure after being cooled, and the water outlet of the liquid separator is arranged at the upper position, so that the uniform liquid distribution of four liquid branches can be realized; working medium liquid is divided into four ports to enter an annular liquid storage cavity in the evaporator, and the working medium liquid is absorbed by the capillary core from four directions to enter the evaporation cavity to form a cycle.

2. Because the capillary core heat transfer structure is made of porous water absorption materials, the working medium circulation rate and the transmission threshold value are increased, the heat transfer performance of the loop heat pipe is improved, the traditional plate cooling method which needs an electric pump is omitted, the cost and the failure probability are reduced, and the working efficiency is improved.

3. The pipeline has the characteristics of arbitrary bending arrangement and the function of additionally arranging the heat-conducting fins, and can realize heat dissipation of the secondary heat source along the way when the liquid working medium flows.

Drawings

FIG. 1 is an overall block diagram of the present invention;

FIG. 2 is a view showing the internal structure of the evaporator shown in FIG. 1;

fig. 3 is a mounting structure view of a wick heat transfer structure and an evaporator;

FIG. 4 is a rear view of the evaporator;

fig. 5 is a front view of a first form of a capillary wick heat transfer structure;

fig. 6 is a front view of a second form of capillary wick heat transfer structure;

in the figure:

1 evaporator, 101 evaporator body, 102 liquid storage cavity, 2 cover plates, 3 gas pipelines, 4 condensers, 5 secondary heat source heat conduction structures, 6 liquid pipelines, 7 liquid distributors, 8 liquid branch pipes I, 9 liquid branch pipes II, 10 liquid branch pipes III, 11 liquid branch pipes IV, 12 capillary core heat transfer structures, 121 annular sealing structures, 122 heat absorption parts and 123 evaporation cavity

Detailed Description

A loop heat pipe employing a surrounding reservoir according to the present invention is described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 4, the loop heat pipe using a surrounding liquid storage cavity of the present invention includes an evaporator 1, a gas line, a condenser 4, a liquid line, a capillary wick heat transfer structure, a liquid separator, and a plurality of liquid branch lines, wherein the capillary wick heat transfer structure is disposed in an inner cavity of the evaporator, a bottom of the capillary wick heat transfer structure 12 is tightly attached to one side of the high power chip, the capillary wick heat transfer structure 12 absorbs heat of the chip, one end of the gas line is communicated with the inner cavity of the evaporator 1, the other end of the gas line 3 is communicated with the condenser 4, a water outlet of the condenser 4 is communicated with the liquid separator 7 through the liquid line 6, the plurality of liquid branch lines are disposed between the liquid separator 7 and the evaporator 1, and the specific number of the liquid branch lines can be set to different numbers according to the amount of liquid to be replenished. The capillary core heat transfer structure 12 is made of porous water absorption materials, liquid in the liquid storage cavity 102 in the evaporator 1 can be absorbed and then evaporated through heat of the absorption chip, steam generated by evaporation is discharged through the gas pipeline, and the discharged steam is conveyed into the liquid storage cavity of the evaporator after being condensed for recycling.

The evaporator 1 is a cavity with an opening on one side and a closed other side, a cover plate 2 is arranged on the opening side of the evaporator, a sealing ring is arranged on the connecting side of the cover plate 2 and the evaporator 1, a steam outlet is further arranged on the cover plate 2, the steam inlet end of the gas pipeline 3 penetrates through the steam outlet on the cover plate 2 to correspond to the capillary core heat transfer structure 12, and steam generated by heat absorption of the capillary core heat transfer structure is discharged through the gas pipeline.

The liquid branch pipes comprise a first liquid branch pipe 8, a second liquid branch pipe 9, a third liquid branch pipe 10 and a fourth liquid branch pipe 11, the liquid outlet ends of the first liquid branch pipes 8 are communicated with the liquid distributor 7, and the liquid inlet ends of the first liquid branch pipes 8 are connected with the upper end of the right side of the evaporator 1 and communicated with the liquid storage cavity 102 in the evaporator; the liquid outlet end of the second liquid branch pipe 9 is communicated with the liquid distributor 7, and the liquid inlet end of the second liquid branch pipe is connected with the lower end of the right side of the evaporator and communicated with the liquid storage cavity 102 in the evaporator; the liquid outlet end of the liquid branch pipe III 10 is communicated with the liquid separator, and the liquid inlet end of the liquid branch pipe III is connected with the lower end of the left side of the evaporator 1 and communicated with the liquid storage cavity 102 in the evaporator; and the liquid outlet end of the liquid branch pipe IV 11 is communicated with the liquid separator, and the liquid inlet end of the liquid branch pipe IV is connected with the upper end of the left side of the evaporator and is communicated with a liquid storage cavity in the evaporator.

Wherein the wick heat-transfer structure 12 can be in a grid shape, a comb shape, a corrugated shape, etc., as long as the structure capable of achieving the purpose of absorbing water is deformed into the protection range. The capillary core heat transfer structure is made of porous water absorbing media such as carbon fiber, sintered metal powder, natural felt and the like.

Example one

As shown in fig. 3 and 5, the wick heat transfer structure 12 is in a grid shape, the grid-shaped wick heat transfer structure is in close contact with the side wall of the inner cavity of the evaporator, the wick heat transfer structure includes an annular sealing structure 121, a heat absorption portion 122 and an evaporation cavity 123, the annular sealing structure is connected with the inner side wall of the evaporator, a liquid storage cavity is formed between the periphery of the annular sealing structure and the periphery of the inner cavity of the evaporator, a grid-shaped heat absorption portion for absorbing heat generated by the high-power chip is arranged in the annular sealing structure, the heat of the high-power chip is absorbed by the heat absorption portion, and the grid-shaped heat absorption portion is provided with a plurality of evaporation cavities. And a sealing ring for preventing steam leakage is arranged on one surface of the capillary core heat transfer structure, which is in contact with the evaporator cover plate. The size and density of the meshes of the latticed capillary core heat transfer structure can be adjusted according to the limitations of heat dissipation space and efficiency, the porous design enables liquid to generate more steam after being heated by heat and be convenient for discharging, and the discharged steam is recycled after being condensed, so that the heat transfer requirements of high power and high flow rate are met.

The capillary core heat transfer structure 12 is in contact with a high-power chip through one side of the evaporator 1 and absorbs heat generated by the chip, the capillary core heat transfer structure is a porous water absorption structure, so that the heat absorbed by the capillary core heat transfer structure 12 heats absorbed liquid, the liquid is heated to generate steam, the steam enters the condenser 4 through the gas pipeline 3 to be cooled, the cooled liquid enters the liquid distributor 7 through the liquid pipeline 6, and the liquid in the liquid distributor 7 is stored in the liquid storage cavity 102 through the liquid branch pipe I8, the liquid branch pipe II 9, the liquid branch pipe III 10 and the liquid branch pipe IV 11 from different positions of the evaporator 1 respectively, so that the liquid working medium is recycled. The capillary core heat transfer structure can be porous water-absorbing media such as carbon fibers, sintered metal powder and natural felt, liquid in the capillary core heat transfer structure is evaporated and simultaneously absorbs liquid in the liquid storage cavity, and the requirement of loop heat transfer is met.

Example two

As shown in fig. 6, the capillary wick heat transfer structure 12 includes an annular sealing structure and a heat absorption part 122, the annular sealing structure 121 is connected to the inner sidewall of the evaporator 1, a liquid storage cavity is formed between the periphery of the annular sealing structure and the periphery of the inner cavity of the evaporator, and the heat absorption part includes a heat absorption section arranged horizontally and a plurality of evaporation cavities 123 vertically connected to the heat absorption section. The heat absorption section transversely arranged can increase the contact area with the transversely installed chip, the heat absorption efficiency is improved, and the evaporation efficiency of liquid and the smooth discharge of steam are improved by the plurality of evaporation cavities.

And a secondary heat source heat conduction structure is also arranged on the gas pipeline between the condenser and the liquid separator, the secondary heat source heat conduction structure is in a buckle shape, and the gas pipeline II is clamped with the secondary heat source heat conduction structure. And the heat generated by the low-power chip is absorbed and transferred to the second gas pipeline through the heat conduction structure of the secondary heat source, and the heat is exchanged through the cooling liquid in the second gas pipeline. The secondary heat source heat conduction structure is arranged, so that the heat of the low-power chip can be transferred into the liquid working medium, and the effect of fixing the gas pipeline can be achieved.

The size of the capillary core heat transfer structure can be customized according to actual conditions, the size and the density of meshes are not limited, and the height can be adjusted according to the limitation of a heat dissipation space. The condenser is filled with common cooling water, the gas in the pipeline flows into the liquid separator along the liquid pipeline under the drive of gravity and steam pressure after being cooled, and the water outlet of the liquid separator is arranged at the upper position, so that the uniform liquid distribution of four liquid branches can be realized; working medium liquid is divided into four ports to enter an annular liquid storage cavity in the evaporator, and the working medium liquid is absorbed by the capillary core from four directions to enter the evaporation cavity to form a cycle.

The wiring mode of the liquid pipeline can be designed at will under the working condition of multiple heat sources with different powers facing the server, and a secondary heat source heat conduction structure is added on the liquid pipeline to transfer the heat of the low-power chip into the liquid working medium. The condenser is designed to be as small as possible and is placed in the blade-level server as a whole system, and the external interface of the whole system is only the water service pipe of the condenser, so that the rapid plugging and unplugging can be realized. The whole body adopts a welding process to form a stable integral structure. The working medium can adopt non-corrosive and non-toxic tetrafluoroethane, hexafluoroethane, air-conditioning refrigerant or fire extinguishing agent, etc. The service life length depends on the oxidation resistance of the metal structure, and the whole service life cycle is free from maintenance.

While the foregoing is directed to the principles of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Other technical features than those described in the specification are known to those skilled in the art.