阅读说明：本技术 一种抛光模修盘周期的检测装置及检测方法 (Detection device and detection method for polishing die repair disc period ) 是由 陈军 邵建达 张慧方 吴伦哲 杨明红 吴福林 秦豪杰 于 2019-09-26 设计创作，主要内容包括：一种抛光模修盘周期的检测装置及检测方法,该装置包括光学检测组件、处理器、水平度测量组件。该装置的光学检测组件使用结构光对抛光模表面形貌进行探测,处理器通过接收的包含抛光模表面形貌信息的探测光,计算处理得到抛光模表面沟槽的深度和宽度信息,从而确定抛光模的修复周期,监测抛光模的维护时间节点。本发明具有结构简单,测量准确,反应迅速,实现对抛光模修盘周期的原位检测,保证抛光模表面的磨削活跃度,提高加工效率和加工质量。(A detection device and a detection method for polishing mould repair disc period are provided, the device comprises an optical detection component, a processor and a levelness measurement component. The optical detection assembly of the device detects the surface topography of the polishing die by using structured light, and the processor calculates and processes the received detection light containing the surface topography information of the polishing die to obtain the depth and width information of the groove on the surface of the polishing die, so that the repair period of the polishing die is determined, and the maintenance time node of the polishing die is monitored. The invention has the advantages of simple structure, accurate measurement and quick response, realizes the in-situ detection of the polishing die repairing disc period, ensures the grinding activity of the surface of the polishing die, and improves the processing efficiency and the processing quality.)

1. A polishing mold repair cycle detection device comprises: the polishing device comprises a polishing disc (2), wherein the polishing disc (2) is a disc or an annular disc, a polishing die (21) which is cast or stuck on the surface of the polishing disc (2) is positioned, and a groove (22) is formed in the surface of the polishing die (21); the frame (1) is positioned above the polishing disk (2) and is fixedly connected with the ground; the polishing device is characterized by further comprising an optical detection component (3) for detecting the surface topography of the polishing die (21), a processor (4) and a levelness measurement component (5) for measuring the horizontal installation error of the light source (31);

the levelness measuring assembly (5) comprises: the device comprises a laser displacement sensor (51), a connecting seat (52) and a water tank (53) positioned right below the laser displacement sensor (51);

the optical detection assembly (3) comprises: the polishing device comprises a light source (31) and a detection device (32), wherein the light source (31) is fixedly connected with a rack (1) through a connecting seat (52) and is used for emitting detection light to a polishing die (21), and the detection device (32) is fixedly connected with the rack (1) and is used for receiving the detection light reflected by the polishing die (21); the processor (4) is respectively connected with the laser displacement sensor (51) and the detection device (32), and is used for processing the obtained surface topography of the polishing die (21) and determining the repair cycle of the polishing die (21).

2. The apparatus for detecting the cycle of polishing platen according to claim 1, wherein the number of the laser displacement sensors (51) is two and the laser displacement sensors are installed on the same plane as the light source.

3. The apparatus for detecting the conditioning cycle of a polishing platen as claimed in claim 1, wherein the water tank is filled with water (54) and is disposed on the surface of the polishing platen (21).

4. The apparatus for detecting the cycle time of a polishing platen as claimed in claim 1, wherein the light source (31) is a structured light source comprising a laser and a pattern member, the surface of the pattern member having a stripe pattern; alternatively, the structured light source is a display for projecting a fringe pattern.

5. The apparatus for detecting the cycle time of a polishing platen according to claim 1, wherein the detecting means (32) is a 3D camera.

6. The apparatus for detecting the polishing platen cycle according to claim 1, wherein the optical axis of the probe light emitted from the light source (31) is perpendicular to the surface of the polishing platen (21); the included angle between the optical axis of the detection device (32) and the surface of the polishing die (21) is 40-60 degrees.

7. The apparatus for detecting the cycle time of a polishing platen according to claim 1, wherein the field of view of the detecting means (32) covers a detection area of the surface of the polishing platen (21),

when the polishing disk is a circular disk, the radius of the detection area is not less than that of the polishing disk (2);

when the polishing disk (2) is an annular disk, the diameter of the detection area is not less than the annular width of the polishing disk (2).

8. The method for detecting the period of the polishing mold trimming by using the device for detecting the period of the polishing mold trimming as claimed in any one of claims 1 to 7, characterized by comprising the steps of:

1) two laser displacement sensors (51) measure the height h between each and the water surface (54)₁,h₂And calculating the installation error theta of the light source along the direction of the rack (h)₂-h₁) L, wherein l is the link distance between the two laser displacement sensors (51);

2) the light source (31) emits detection light to the polishing mold (21), and the detection device (32) receives the detection light reflected by the polishing mold (21) in a coverage area in real time;

3) the processor (4) calculates the surface topography s of the polishing mold (21) in the field of view according to the received detection light₁(x,y,z)＝s₁(x₁,x₂,...x_n；y₁,y₂,...y_n；z₁,z₂,...z_n) N is the number of sampling points of the probe light received by the processor in the x, y and z directions, 100-150) are taken, and the probe light is processed by de-tilting, namely s₁'(x,y,z)＝s₁(xcos θ, y, z), the surface topography of the bore internal polishing mold is

s₁'(x,y,z)＝s₁(x₁cosθ,x₂cosθ,...x_ncosθ；y₁,y₂,...y_n；z₁,z₂,...z_n)；

4) Enabling the polishing disk (2) to drive the polishing die (21) to rotate 360 DEG/N around the central axis, wherein N is the number of equal parts of the circumference of the correction disk, scanning the surface of the polishing die (21) by the probe light, repeating the steps 1) to 3), and obtaining the surface topography s of the polishing die in the view field₂' (x, y, z) until (N-1) rotations are completed, to give s₃'(x,y,z),...,s_N'(x,y,z)。

5) The surface appearance of the whole polishing die (21) is obtained by a sub-aperture splicing technology

6) Obtaining the width W and the depth D of the groove on the polishing die according to the surface appearance of the whole polishing die, and repairing or replacing the polishing die when the width depth of the groove is smaller than a set threshold value, namely the width W is smaller than W and the depth D is smaller than D; otherwise, the polishing of the element is continued while maintaining the existing state of the polishing pattern.

9. The method as claimed in claim 8, wherein the threshold value is an empirical value, and the width W is 3-5 mm and the depth D is 1-2 mm.

10. The method for detecting a polishing pattern of a polishing apparatus according to claim 8, wherein the number of circumferential aliquots N of the calibration disk is 6 to 12, and the area of the overlapping region of the polishing patterns between two rotations is not less than one third of the area of the field coverage region of the detecting means.

Technical Field

The invention relates to an auxiliary device for optical element ring polishing, in particular to a disc repairing period and a working life of a polishing die, and belongs to the technical field of optical element processing.

Background

Optical element polishing typically involves attaching or casting a polishing mold onto a polishing platen driven by a motor, placing one or more elements to be processed on the polishing mold, and rotating the elements at a specified angular velocity. Meanwhile, polishing liquid is dripped into the polishing die, and the surface shape of the polishing die is transferred and copied to the element through the mechanochemical action of the optical element and the polishing powder particles on the polishing die, so that a globally smooth planar element is obtained, and the polishing of the element is completed.

The polishing mold material commonly used for polishing is generally asphalt or polyurethane, an asphalt polishing mold is poured on a polishing machine or a polyurethane polishing mold is bonded on the polishing machine, and a plurality of grooves are arranged on the surface of the polishing mold so as to increase the fluidity of polishing liquid and take away heat generated by polishing. With the progress of annular polishing, under the effect of work piece, work piece ring, correction dish, the polishing mould can become smooth gradually for its frictional action to the work piece weakens, leads to polishing efficiency to descend. Therefore, at intervals, the craft personnel need to perform widening deepening and roughening treatment on the polishing die, and recover the flow guiding effect and the grinding effect of the polishing die so as to improve the friction characteristic of the polishing die to the workpiece. The traditional method for judging the period and the service life of the polishing mould repair disc comprises the following steps: (1) recording the working time of the polishing die; (2) stopping the machine to measure the depth and width of the groove;

the traditional judging method has the defects that the same working time is caused by the factors such as the polishing rotating speed, the polishing liquid adding speed, the temperature and the like, and the abrasion degrees of the polishing dies are inconsistent by adopting the method for recording the working time of the polishing dies. The polishing process is wasted and damaged due to the fact that the polishing die repair disc is prematurely repaired; too late dressing of the polishing platen causes a decrease in polishing efficiency and an increase in polishing cost. The adoption of the method of stopping measurement can cause the pollution of the polishing die and the reduction of the polishing efficiency,

based on the above discussion, if the in-situ quantitative detection of the groove information of the polishing die can be realized, the polishing die can be accurately and effectively repaired, the bad results caused by too early or too late repairing of the polishing die are avoided, the stable performance of the polishing die is maintained, and the element processing efficiency is improved.

Disclosure of Invention

The invention aims to provide a detection device and a detection method for a polishing die disc repairing period.

The polishing mould repair cycle detection device has the advantages of simple structure and quick response, realizes in-situ detection of the repair cycle and the service life of the polishing mould of the polishing machine, ensures the grinding activity of the surface of the polishing mould, and improves the processing efficiency and the processing quality.

The technical solution of the invention is as follows:

a polishing mold repair cycle detection device comprises: the polishing disc is a disc or an annular disc, the polishing mould is positioned on the surface of the polishing disc in a pouring or sticking mode, and the surface of the polishing mould is provided with a groove; the frame is positioned above the polishing disk and fixedly connected with the ground; the polishing device is characterized by also comprising an optical detection component for detecting the surface appearance of the polishing die, a processor and a levelness measurement component for measuring the horizontal installation error of the light source;

the levelness measuring assembly comprises: the device comprises a laser displacement sensor, a connecting seat and a water tank positioned right below the laser displacement sensor;

the optical detection assembly comprises: the detection device is fixedly connected with the rack and used for receiving the detection light reflected by the polishing die; and the processor is respectively connected with the laser displacement sensor and the detection device, processes the surface appearance of the polishing die to obtain the surface appearance of the polishing die, and determines the disc repairing period of the polishing die.

The detection device for the polishing mould repair disc period is characterized in that the number of the laser displacement sensors is two, and the two laser displacement sensors and the light source are arranged on the same plane.

The device for detecting the polishing mould repairing period is characterized in that water is filled in the water tank and is placed on the surface of the polishing mould.

The detection device for the period of the polishing mould repair disc is characterized in that the light source is a structured light source and comprises a laser and a pattern element, and the surface of the pattern element is provided with a stripe pattern; alternatively, the structured light source is a display for projecting a fringe pattern.

The detection device for the polishing mould repair disc period is characterized in that the detection device is a 3D camera;

the detection device for the polishing mould repairing cycle is characterized in that the optical axis of the detection light emitted by the light source is vertical to the surface of the polishing mould; and the included angle between the optical axis of the detection device and the surface of the polishing die is 40-60 degrees.

The device for detecting the period of the polishing mould repairing disc is characterized in that the field of view of the detecting device covers the detecting area of the surface of the polishing mould,

when the polishing disk is a circular disk, the diameter of the detection area is not less than the radius of the polishing disk;

when the polishing disk is an annular disk, the diameter of the detection area is not less than the annular width of the polishing disk.

The method for detecting the period of the polishing die trimming disc by using the device for detecting the period of the polishing die trimming disc is characterized by comprising the following steps of:

1) two laser displacement sensors respectively measure the height h between the two laser displacement sensors and the water surface₁,h₂And calculating the installation error of the light source along the direction of the rack as theta (h)₂-h₁) L (wherein l is twoThe link distance between the laser displacement sensors);

2) the detection device receives the detection light reflected by the polishing mold in a coverage area in real time;

3) the processor calculates the surface topography s of the polishing mold in the view field according to the received detection light₁(x,y,z)＝s₁(x₁,x₂,...x_n；y₁,y₂,...y_n；z₁,z₂,...z_n) (n is the number of sampling points of the probe light received by the processor in the x, y and z directions, generally, n is 100 to 150), and the probe light is processed by de-tilt, i.e., s₁'(x,y,z)＝s₁(xcos θ, y, z), the surface topography of the bore internal polishing mold is s₁'(x,y,z)＝s₁(x₁cosθ,x₂cosθ,...x_ncosθ；y₁,y₂,...y_n；z₁,z₂,...z_n)；

4) Enabling the polishing disk to drive the polishing mold to rotate 360 degrees/N (N is equal parts of the circumference of the correction disk) around the central axis, scanning the surface of the polishing mold by the detection light, and repeating the steps 1-3) to obtain the surface topography s of the polishing mold in the view field₂' (x, y, z) until (N-1) rotations are completed, to give s₃'(x,y,z),...,s_N'(x,y,z)。

5) The surface appearance of the whole polishing die is obtained by a sub-aperture splicing technology

6) Obtaining the width W and the depth D of the groove on the polishing die according to the surface appearance of the whole polishing die, and repairing or replacing the polishing die when the width depth of the groove is smaller than a set threshold value, namely the width W is smaller than W and the depth D is smaller than D; otherwise, the polishing of the element is continued while maintaining the existing state of the polishing pattern.

The method for detecting the polishing die of the polishing device is characterized in that the threshold value generally adopts an empirical value, and the width W is 3-5 mm, and the depth D is 1-2 mm.

The detection method of the polishing die of the polishing device is characterized in that the circumferential equal part number N of the correction disc is 6-12, and the overlapping area of the polishing die between every two rotations is not less than one third of the area of the coverage area of the view field of the detection device;

the invention has the following advantages:

the invention uses the liquid plane as the reference of the horizontal installation error of the laser, and is simple and convenient; the invention uses the laser and the receiver to identify the change of the depth width of the groove on the surface of the polishing die, solves the problem that the traditional disc repairing period depends on visual and strong experience, and realizes the in-situ quantitative detection of the polishing die in the polishing process;

the invention has simple structure and quick response, realizes the in-situ detection of the working life of the polishing die of the loop polishing machine, ensures the grinding activity of the surface of the polishing die and improves the processing efficiency and the processing quality.

Drawings

FIG. 1 is a schematic view showing an apparatus structure of a polishing apparatus according to the present invention;

FIG. 2 is a schematic diagram of an exemplary configuration for measuring topography of a polishing pad of a polishing machine according to the present invention;

FIG. 3 is a plan view of an embodiment of the installation of the levelness measuring assembly of the present invention;

FIG. 4 is an elevation view of a measurement used to measure the topography of the polishing mold in accordance with the present invention;

in the figure: 1-frame, 2-polishing disk, 21-polishing mold, 22-groove, 3-optical detection component, 31-light source, 32-detection device, 4-processor, 5-levelness measurement component, 51-laser displacement sensor, 52-structured light projection window, 53-water tank and 54-water tank

Detailed Description

The present invention is further illustrated by the following examples, which should not be construed as limiting the scope of the invention.

Referring to fig. 1, fig. 1 is a device for detecting a polishing platen trimming cycle according to the present invention, including: the polishing device comprises a polishing disc 2, a polishing mould 21 and a polishing head, wherein the polishing disc 2 is a circular disc or an annular disc and is positioned on the surface of the polishing disc 2, the polishing mould 21 is poured or stuck on the surface of the polishing disc, and the surface of the polishing mould 21 is provided with a groove 22; the frame 1 is positioned above the polishing disk 2 and fixedly connected with the ground; the device is characterized by further comprising an optical detection component 3 for detecting the surface topography of the polishing die 21, a processor 4 and a levelness measurement component 5 for measuring the horizontal installation error of the light source 31;

the levelness measuring unit 5 includes: a laser displacement sensor 51, a connecting seat 52, and a water tank 53 located right below the laser displacement sensor 51;

the optical detection assembly 3 comprises: the polishing device comprises a light source 31 and a detection device 32, wherein the light source 31 is fixedly connected with the rack 1 through a connecting seat 52 and is used for emitting detection light to the polishing die 21, and the detection device 32 is fixedly connected with the rack 1 and is used for receiving the detection light reflected by the polishing die 21; the processor 4 is respectively connected with the laser displacement sensor 51 and the detection device 32, and processes the surface topography of the polishing mold 21 to determine the repair cycle of the polishing mold 21.

The device for detecting the period of the polishing mold repairing disc is characterized in that the number of the laser displacement sensors 51 is two, and the two laser displacement sensors and the light source are arranged on the same plane.

The device for detecting the polishing mould repairing period is characterized in that water 54 is filled in the water tank and is placed on the surface of the polishing mould 21.

The device for detecting the polishing mold repairing cycle is characterized in that the light source 31 is a structured light source and comprises a laser and a pattern element, and the surface of the pattern element is provided with a stripe pattern; alternatively, the structured light source is a display for projecting a fringe pattern.

The device for detecting the polishing mould repair cycle is characterized in that the detection device 32 is a 3D camera;

the device for detecting the polishing mold repair cycle is characterized in that the optical axis of the detection light emitted by the light source 31 is perpendicular to the surface of the polishing mold 21; the included angle between the optical axis of the detection device 32 and the surface of the polishing die 21 is 40-60 degrees.

The device for detecting the polishing mould repair cycle is characterized in that the field of view of the detecting device 32 covers the detecting area of the surface of the polishing mould 21,

when the polishing disk is a circular disk, the diameter of the detection area is not less than the radius of the polishing disk 2;

when the polishing disk 2 is an annular disk, the diameter of the detection area is not smaller than the annular width of the polishing disk 2.

The detection device for the polishing mould repair disc period detects the polishing mould repair disc period, and comprises the following steps:

1) two laser displacement sensors 51 measure the height h between each and the water surface 54₁,h₂And calculating the installation error of the light source along the direction of the rack as theta (h)₂-h₁) L (wherein l is the connecting line distance between the two laser displacement sensors);

2) the light source 31 emits detection light to the polishing mold 21, and the detection device 32 receives the detection light reflected by the polishing mold 21 in a coverage area in real time;

3) the processor 4 calculates the surface topography s of the polishing mold 21 in the field of view according to the received detection light₁(x,y,z)＝s₁(x₁,x₂,...x_n；y₁,y₂,...y_n；z₁,z₂,...z_n) (n is the number of sampling points of the probe light received by the processor in the x, y and z directions, generally, n is 100 to 150), and the probe light is processed by de-tilt, i.e., s₁'(x,y,z)＝s₁(xcos θ, y, z), the surface topography of the bore internal polishing mold is s₁'(x,y,z)＝s₁(x₁cosθ,x₂cosθ,...x_ncosθ；y₁,y₂,...y_n；z₁,z₂,...z_n)；

4) Enabling the polishing disk 2 to drive the polishing die 21 to rotate 360 degrees/N (N is equal parts of the circumference of the correction disk) around the central axis, scanning the surface of the polishing die 21 by the probe light, and repeating the steps 1-3) to obtain the surface topography s of the polishing die in the view field₂' (x, y, z) until (N-1) rotations are completed, to give s₃'(x,y,z),...,s_N'(x,y,z)。

5) The surface appearance of the whole polishing die 21 is obtained by a sub-aperture splicing technology

6) Obtaining the width W and the depth D of the groove on the polishing die according to the surface appearance of the whole polishing die, and repairing or replacing the polishing die when the width depth of the groove is smaller than a set threshold value, namely the width W is smaller than W and the depth D is smaller than D; otherwise, the polishing of the element is continued while maintaining the existing state of the polishing pattern.

The method for detecting the polishing die of the polishing device is characterized in that the threshold value generally adopts an empirical value, and the width W is 3-5 mm, and the depth D is 1-2 mm.

The detection method of the polishing die of the polishing device is characterized in that the circumferential equal part number N of the correction disc is 6-12, and the overlapping area of the polishing die between every two rotations is not less than one third of the area of the coverage area of the view field of the detection device;

the principle of constructing the surface appearance of the polishing mold by adopting the structured light source, the detection device and the processor is that the structured light source emits a detection light beam with certain space phase coding, the detection light beam is projected to the surface of the polishing mold, and then the detection light beam reflected by the surface of the polishing mold is collected by the detection device. The structured light beam which is sent by the structured light source and has certain space phase coding can form different point cloud models due to different depth width areas of the surface of the polishing mold, and the processor solves the depth width of the groove on the surface of the polishing mold through phase information of surface structure change, so that the appearance of the surface of the polishing mold is constructed.