阅读说明：本技术 一种单晶硅晶圆切片设备 (Monocrystalline silicon wafer slicing equipment ) 是由 沙鸿辉 于 2019-10-21 设计创作，主要内容包括：本发明提供一种单晶硅晶圆切片设备,其结构包括支撑架、过滤网板、遮挡块、收集腔、底座支撑架、控制面板、工作平台、切割刀片、刀片稳定机构、驱动器,驱动器固定安装于支撑架前端,本发明通过设置冷却辅助固定机构,切割刀片在快速的与滑板进行摩擦滑动时,将会产生高温,而滑板在制冷片作用下,将会产生冷气,对切割刀片刀片进行降温,在滑板的辅助平衡的作用下,能够保证切割刀片在对硅晶棒进行切割时,不发生扭转,左右平动的现象,且能够实时的对切割刀片进行降温,避免切割刀片在高速的摩擦运作下,产生高温,而致使切割刀片发生变形,同时能够有效的保证了,切割刀片能够平稳的对硅晶棒进行切片,使得切割刀片能够水平的对硅晶棒切割。(The invention provides a monocrystalline silicon wafer slicing device, which structurally comprises a supporting frame, a filter screen plate, a blocking block, a collecting cavity, a base supporting frame, a control panel, a working platform, a cutting blade, a blade stabilizing mechanism and a driver, wherein the driver is fixedly arranged at the front end of the supporting frame, the invention is provided with a cooling auxiliary fixing mechanism, the cutting blade can generate high temperature when rapidly performing frictional sliding with a sliding plate, the sliding plate can generate cold air under the action of the cooling plate to cool the cutting blade, under the action of auxiliary balance of the sliding plate, the phenomena of torsion and horizontal translation of the cutting blade when cutting a silicon crystal bar can be ensured, the cutting blade can be cooled in real time, the high temperature generated by the high-speed frictional operation of the cutting blade can be avoided, so that the cutting blade is deformed, and meanwhile, the invention can effectively ensure, the cutting blade can slice the silicon crystal bar smoothly, so that the cutting blade can cut the silicon crystal bar horizontally.)

1. A monocrystalline silicon wafer slicing device structurally comprises a support frame (1), a filter screen plate (2), a shielding block (3), a collecting cavity (4), a base support frame (5), a control panel (6), a working platform (7), a cutting blade (8), a blade stabilizing mechanism (9) and a driver (10), wherein the driver (10) is fixedly installed at the front end of the support frame (1), the shielding block (3) is installed above the working platform (7), the filter screen plate (2) is embedded above the working platform (7), the upper part of the collecting cavity (4) is in sliding connection with the lower part of the working platform (7), the upper end of the base support frame (5) is fixedly connected with the lower end of the working platform (7), the control panel (6) is electrically connected with the base support frame (5), and the cutting blade (8) is mechanically connected with the driver (10), blade stabilizing mean (9) is installed on driver (10), cutting blade (8) run through in blade stabilizing mean (9) left side, its characterized in that:

blade stabilizing mean (9) includes screw thread support wire post (91), drive small motor (92), fixed rotary mechanism (93), cooling auxiliary fixing mechanism (94), screw thread support wire post (91) and fixed rotary mechanism (93) threaded connection, install on fixed rotary mechanism (93) drive small motor (92), screw thread support wire post (91) lower extreme and cooling auxiliary fixing mechanism (94) upper end weld mutually.

2. The apparatus of claim 1, wherein: fixed rotary mechanism (93) include driving gear (931), driven swiveling wheel mechanism (932), fixed ring seat (933), driving gear (931) and driven swiveling wheel mechanism (932) mesh mutually, driven swiveling wheel mechanism (932) are installed on fixed ring seat (933) and swing joint.

3. The apparatus of claim 2, wherein: driven swiveling wheel mechanism (932) include internal thread (321), gear post (322), lower go-between (323), solid fixed ring (324), internal thread (321) and gear post (322) inside are integrative casting moulding, gear post (322) lower extreme welds with go-between (323) upper end down mutually, go-between (323) and solid fixed ring (324) structure as an organic whole down.

4. The apparatus of claim 1, wherein: supplementary fixed establishment (94) of cooling includes slide (941), refrigeration piece (942), refrigeration controller (943), cell-shell (944), notch (945), wire chase frame (946), coiling mechanism (947), install in cell-shell (944) left side slide (941), the left side is equipped with refrigeration piece (942) in cell-shell (944), refrigeration piece (942) is connected with refrigeration controller (943) electricity, inside fixed connection of wire chase frame (946) and cell-shell (944), coiling mechanism (947) run through in wire chase frame (946) both sides and install on cell-shell (944), cell-shell (944) and notch (945) are the integrated structure.

5. The apparatus of claim 4, wherein: the winding mechanism (947) comprises a rolling shaft (471), a connecting long plate (472), a retaining ring plate (473), a rotating column (474) and a buffer spring (475), wherein the rolling shaft (471) and the rotating column (474) are of an integrated structure, the connecting long plate (472) is located between the retaining ring plates (473), and the connecting long plate (472) is welded with the rotating column (474) through the buffer spring (475).

Technical Field

The invention relates to the technical field of wafer slicing, in particular to monocrystalline silicon wafer slicing equipment.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, during the wafer slicing process, a silicon crystal bar is sliced to generate a wafer, and then the wafer is applied to the integrated circuit, and when the silicon crystal bar is cut, the silicon crystal bar is usually cut manually or cut by an automatic wafer slicing device, but the prior art has the following defects:

when cutting the silicon crystal bar through automatic wafer slicing equipment, because the thickness of silicon crystal bar differs, and the length of cutting blade is the uniform size, and comparatively soft, lead to when cutting the less silicon crystal bar of thickness, because the length overlength of cutting blade, and the point of contacting with the silicon crystal bar is too little, cause the phenomenon that the cutting blade takes place the deflection easily, cause the silicon wafer surface unevenness that cuts out.

Summary of the invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides monocrystalline silicon wafer slicing equipment, which solves the problem that when an automatic wafer slicing equipment is used for cutting a silicon crystal bar, the silicon crystal bar is different in thickness, the length of a cutting blade is consistent in size and is relatively flexible, so that when the silicon crystal bar with smaller thickness is cut, the cutting blade is easy to deflect due to the fact that the length of the cutting blade is too long and the point of contact with the silicon crystal bar is too small, and the surface of the cut silicon wafer is not flat.

(II) technical scheme

In order to achieve the purpose, the invention is realized by the following technical scheme: a monocrystalline silicon wafer slicing device structurally comprises a support frame, a filter screen plate, a blocking block, a collecting cavity, a base support frame, a control panel, a working platform, a cutting blade, a blade stabilizing mechanism and a driver, wherein the driver is fixedly arranged at the front end of the support frame, the blocking block is arranged above the working platform, the filter screen plate is embedded above the working platform, the upper part of the collecting cavity is in sliding connection with the lower part of the working platform, the upper end of the base support frame is fixedly connected with the lower end of the working platform, the control panel is electrically connected with the base support frame, the cutting blade is mechanically connected with the driver, the blade stabilizing mechanism is arranged on the driver, the cutting blade penetrates through the left side of the blade stabilizing mechanism, the blade stabilizing mechanism comprises a thread support lead column, a small driving motor, a fixed rotating mechanism and, the thread supporting wire column is in threaded connection with the fixed rotating mechanism, the small driving motor is mounted on the fixed rotating mechanism, and the lower end of the thread supporting wire column is welded with the upper end of the cooling auxiliary fixing mechanism.

Preferably, fixed rotary mechanism includes driving gear, driven swiveling wheel mechanism, fixed ring seat, the driving gear meshes with driven swiveling wheel mechanism mutually, driven swiveling wheel mechanism installs on the fixed ring seat and swing joint, the inside ring channel that is equipped with of fixed ring seat.

Preferably, the driven rotating wheel mechanism comprises an internal thread, a gear column, a lower connecting ring and a fixing ring, the internal thread and the inside of the gear column are integrally cast and formed, the lower end of the gear column is welded with the upper end of the lower connecting ring, the lower connecting ring and the fixing ring are of an integrated structure, and the outside of the gear column is of a toothed structure.

Preferably, the auxiliary cooling fixing mechanism comprises a sliding plate, a refrigerating sheet, a refrigerating controller, a groove shell, a notch, a line groove frame and a winding mechanism, the sliding plate is provided with two sheets, the refrigerating sheet is installed on the left side of the groove shell, the refrigerating sheet is arranged on the left side in the groove shell and electrically connected with the refrigerating controller, the line groove frame is fixedly connected with the inside of the groove shell, the winding mechanism runs through the two sides of the line groove frame and is installed on the groove shell, and the groove shell and the notch are of an integrated structure.

Preferably, the winding mechanism comprises a rolling shaft, a connecting long plate, ring blocking plates, rotary columns and buffer springs, wherein the shaft and the rotary columns are of an integrated structure, the connecting long plate is located between the ring blocking plates, the connecting long plate is welded with the rotary columns through the buffer springs, and the ring blocking plates are two in number and are of an annular structure.

(III) advantageous effects

The invention provides monocrystalline silicon wafer slicing equipment. The method has the following beneficial effects:

according to the invention, by arranging the auxiliary cooling fixing mechanism, high temperature can be generated when the cutting blade rapidly slides in friction with the sliding plate, the sliding plate can generate cold air under the action of the cooling blade to cool the cutting blade, the phenomenon of transverse movement and torsion can be avoided when the cutting blade cuts a silicon crystal bar under the action of auxiliary balance of the sliding plate, the cutting blade can be cooled in real time, the cutting blade is prevented from generating high temperature under high-speed friction operation, so that the cutting blade is prevented from deforming, and meanwhile, the cutting blade can be effectively ensured to stably slice the silicon crystal bar, so that the cutting blade can horizontally cut the silicon crystal bar.

Drawings

FIG. 1 is a schematic structural diagram of a single crystal silicon wafer slicing apparatus according to the present invention;

FIG. 2 is a front view of the blade stabilizing mechanism of the present invention;

FIG. 3 is a schematic three-dimensional structure of the fixed rotating mechanism of the present invention;

FIG. 4 is a perspective view of the driven rotating wheel mechanism of the present invention;

FIG. 5 is a schematic top view of the auxiliary cooling fixing mechanism of the present invention;

fig. 6 is a schematic three-dimensional structure of the winding mechanism of the present invention.

In the figure: a support frame-1, a filter screen plate-2, a shielding block-3, a collecting cavity-4, a base support frame-5, a control panel-6, a working platform-7, a cutting blade-8, a blade stabilizing mechanism-9, a driver-10, a thread supporting wire column-91, a small driving motor-92, a fixed rotating mechanism-93, a cooling auxiliary fixing mechanism-94, a driving gear-931, a driven rotating wheel mechanism-932, a fixed ring seat-933, an internal thread-321, a gear column-322, a lower connecting ring-323, a fixed ring-324, a sliding plate-941, a refrigeration sheet-942, a refrigeration controller-943, a groove shell-944, a notch-945, a wire groove rack-946, a wire coiling mechanism-947, a roller-471, a 471-471, Connecting long plate-472, baffle ring plate-473, rotary column-474 and buffer spring-475.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-6, an embodiment of the present invention provides a single crystal silicon wafer slicing apparatus, which includes a support frame 1, a filter screen plate 2, a blocking block 3, a collection chamber 4, a base support frame 5, a control panel 6, a working platform 7, a cutting blade 8, a blade stabilizing mechanism 9, and a driver 10, wherein the driver 10 is fixedly installed at a front end of the support frame 1, the blocking block 3 is installed above the working platform 7, the filter screen plate 2 is embedded above the working platform 7, the upper side of the collection chamber 4 is slidably connected with the lower side of the working platform 7, the upper end of the base support frame 5 is fixedly connected with the lower end of the working platform 7, the control panel 6 is electrically connected with the base support frame 5, the cutting blade 8 is mechanically connected with the driver 10, the blade stabilizing mechanism 9 is installed on the driver 10, the cutting blade 8 penetrates through the left side of the blade stabilizing, the blade stabilizing mechanism 9 comprises a thread supporting wire column 91, a small driving motor 92, a fixed rotating mechanism 93 and an auxiliary cooling fixing mechanism 94, the thread supporting wire column 91 is in threaded connection with the fixed rotating mechanism 93, the small driving motor 92 is installed on the fixed rotating mechanism 93, and the lower end of the thread supporting wire column 91 is welded with the upper end of the auxiliary cooling fixing mechanism 94.

Wherein, fixed rotary mechanism 93 includes driving gear 931, driven swiveling wheel mechanism 932, fixed ring seat 933, driving gear 931 meshes with driven swiveling wheel mechanism 932 mutually, driven swiveling wheel mechanism 932 installs on fixed ring seat 933 and swing joint, the inside annular groove that is equipped with of fixed ring seat 933 drives driven swiveling wheel mechanism 932 through driving gear 931 and rotates, causes driven swiveling wheel mechanism 932 to rotate in fixed ring seat 933 top to can drive screw thread support wire post 91 and carry out displacement from top to bottom.

Wherein, driven swiveling wheel mechanism 932 includes internal thread 321, gear post 322, lower go-between 323, fixed ring 324, internal thread 321 is integrative casting moulding with gear post 322 is inside, gear post 322 lower extreme welds with lower go-between 323 upper end mutually, go-between 323 and fixed ring 324 be integral structure down, gear post 322 outside is dentate structure, when gear post 322 external tooth 931 drives down and rotates, will make inboard internal thread 321 carry out the biography certainly, and down the fixed ring 324 and the fixed ring seat 933 back of mutually supporting of go-between 323 lower extreme, can remove the orbit to gear post 322 and restrict.

Wherein, the auxiliary cooling fixing mechanism 94 comprises a sliding plate 941, a refrigerating sheet 942, a refrigerating controller 943, a slot housing 944, a notch 945, a slot frame 946 and a winding mechanism 947, wherein the sliding plate 941 is provided with two sheets and is installed on the left side of the slot housing 944, the refrigerating sheet 942 is arranged on the left side in the slot housing 944, the refrigerating sheet 942 is electrically connected with the refrigerating controller 943, the slot frame 946 is fixedly connected with the inside of the slot housing 944, the winding mechanism 947 penetrates through the two sides of the slot frame 946 and is installed on the slot housing 944, the slot housing 944 and the notch 945 are of an integrated structure, when the monocrystalline silicon wafer is to be cut, the auxiliary cooling fixing mechanism 94 is adjusted to about 5 cm above the monocrystalline silicon wafer of the cutting blade 8, then the driver 10 is started to drive the cutting blade 8 to cut the monocrystalline silicon wafer, so as to effectively avoid the torsion caused by the cutting blade 8, resulting in unevenness of the surface of the cut silicon wafer.

The winding mechanism 947 includes a roller 471, a connecting long plate 472, a ring blocking plate 473, a rotating post 474 and a buffer spring 475, the roller 471 and the rotating post 474 are integrated, the connecting long plate 472 is located between the ring blocking plates 473, the connecting long plate 472 is welded to the rotating post 474 through the buffer spring 475, the ring blocking plates 473 are provided with two ring-shaped plates, when the screw thread supporting wire column 91 moves downwards, the power line is pressed against the connecting long plate 472, the connecting long plate 472 compresses the buffer spring 475, the power line is lengthened, and when the screw thread supporting wire column 91 moves upwards, the connecting long plate 472 pushes the power line to expand under the action of the buffer spring 475, so that the power line is wound.

The specific working process is as follows:

before slicing a monocrystalline silicon wafer, the height of the blade stabilizing mechanism 9 is adjusted according to the size of the silicon ingot, the silicon ingot is placed on the working platform 7, then the small driving motor 92 is started to drive the driving gear 931 to rotate, the gear column 322 is rotated due to the fact that the outer side of the gear column 322 is meshed with the driving gear 931, the internal thread 321 in the gear column 322 drives the threaded supporting wire column 91 to move downwards, when the threaded supporting wire column 91 moves downwards, the auxiliary cooling fixing mechanism 94 moves downwards, the cutting blade 8 slides on the sliding plate 941, when the height of the tank shell 944 is about 5 cm away from the height of the silicon ingot, the motor is stopped to rotate, then the cutting blade 8 is started to operate, the refrigeration controller 943 is operated, the silicon ingot is cut through the cutting blade 8, when the cutting blade 8 performs cutting, will carry out quick slip on slide 941, because cutting blade 8 when quick and slide with slide 941 friction, will produce high temperature, and slide 941 is under the cooling fin 942 effect, will produce air conditioning, cool down cutting blade 8 blade, under the effect of the supplementary balance of slide 941, can guarantee cutting blade 8 when cutting the silicon crystal bar, do not twist reverse, the phenomenon of left and right sides translation, and can real-timely cool down cutting blade 8, avoid cutting blade 8 under the high-speed friction operation, produce high temperature, and cause cutting blade 8 to take place to warp, simultaneously can be effectual assurance, cutting blade 8 can be steady cut into slices to the silicon crystal bar, make cutting blade 8 can the horizontally cut the silicon crystal bar.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.