阅读说明：本技术 一种纹理加工方法 (Texture processing method ) 是由 裴立志 杨鹏 时庆文 周伟杰 于 2018-06-27 设计创作，主要内容包括：本发明公开了一种纹理加工方法,所述纹理加工方法包括：提供一盖板；在所述盖板上形成一层保护层,所述保护层具有贯穿所述保护层的预设图案的凹槽；对所述盖板进行蚀刻处理,以形成所述预设图案的纹理；去除所述保护层。该纹理加工方法简单且可以实现曲面盖板的纹理加工。(The invention discloses a texture processing method, which comprises the following steps: providing a cover plate; forming a protective layer on the cover plate, wherein the protective layer is provided with a groove penetrating through a preset pattern of the protective layer; etching the cover plate to form the texture of the preset pattern; and removing the protective layer. The texture processing method is simple and can realize the texture processing of the curved surface cover plate.)

1. A texture processing method, characterized by comprising:

providing a cover plate;

forming a protective layer on the cover plate, wherein the protective layer is provided with a groove penetrating through a preset pattern of the protective layer;

etching the cover plate to form the texture of the preset pattern;

and removing the protective layer.

2. The texturing method according to claim 1, wherein the cover plate is a glass cover plate.

3. The texturing method of claim 1, wherein the forming a protective layer on the cover plate, the protective layer having a predetermined pattern of grooves penetrating the protective layer comprises:

and using a mask plate with the preset pattern to evaporate and plate the protective layer on the cover plate.

4. The texturing method of claim 1, wherein the protective layer is made of a silicon material.

5. The texturing method according to claim 1, wherein the etching the cover plate includes:

and etching the cover plate by adopting an HF solution.

6. The texturing method according to claim 5, wherein the HF solution has a concentration in the range of 1% to 15%, inclusive.

7. The texturing method according to claim 1, wherein the removing the protective layer comprises:

and removing the protective layer by using an alkali solution, wherein the alkali solution is a NaOH solution or a KOH solution.

8. A texturing process according to claim 7, wherein the alkali solution is present in a concentration range of 5% to 40%, inclusive.

9. The texturing method according to claim 1, wherein the protective layer has a thickness of 10nm to 1000nm, inclusive.

Technical Field

The invention relates to the technical field of electronic products, in particular to a texture processing method.

Background

With the continuous development of science and technology, various display devices have been widely applied to daily life, work and industry of people, and bring great convenience to the life of people.

The manufacturing method mainly comprises the steps of photoresist spraying, exposure and development, etching, photoresist removal and the like, the manufacturing method uses more process equipment and has complicated steps, and the manufacturing method cannot manufacture the texture on the curved cover plate due to the limitation of the exposure and development process.

Therefore, it is an urgent need to solve the problem of the art to provide a method that is simple and can implement the texture processing of a curved cover plate.

Disclosure of Invention

In order to solve the problems, the invention provides a texture processing method which is simple and can realize texture processing of a curved surface cover plate.

In order to achieve the purpose, the invention provides the following technical scheme:

a texture processing method, comprising:

providing a cover plate;

forming a protective layer on the cover plate, wherein the protective layer is provided with a groove penetrating through a preset pattern of the protective layer;

etching the cover plate to form the texture of the preset pattern;

and removing the protective layer.

Preferably, in the above texture processing method, the cover plate is a glass cover plate.

Preferably, in the texture processing method, the forming a protective layer on the cover plate, the protective layer having a groove with a predetermined pattern penetrating through the protective layer includes:

and using a mask plate with the preset pattern to evaporate and plate the protective layer on the cover plate.

Preferably, in the texture processing method, the material of the protective layer is a silicon material.

Preferably, in the texture processing method, the etching process of the cover plate includes:

and etching the cover plate by adopting an HF solution.

Preferably, in the above texture processing method, the concentration of the HF solution ranges from 1% to 15%, inclusive.

Preferably, in the above texture processing method, the removing the protective layer includes:

and removing the protective layer by using an alkali solution, wherein the alkali solution is a NaOH solution or a KOH solution.

Preferably, in the above texture processing method, the alkali solution has a concentration ranging from 5% to 40%, inclusive.

Preferably, in the above texturing method, the protective layer has a thickness of 10nm to 1000nm, inclusive.

As can be seen from the above description, the texture processing method provided by the present invention includes: providing a cover plate; forming a protective layer on the cover plate, wherein the protective layer is provided with a groove penetrating through a preset pattern of the protective layer; etching the cover plate to form the texture of the preset pattern; and removing the protective layer.

The manufacturing method is simple, does not need an exposure and development process, and is suitable for texture processing and manufacturing of the curved-surface cover plate.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic flow chart of a texture processing method according to an embodiment of the present invention;

fig. 2 is a schematic diagram illustrating a principle of manufacturing a protection layer according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.

Referring to fig. 1, fig. 1 is a schematic flow chart of a texture processing method according to an embodiment of the present invention, where the texture processing method includes:

s101: a cover plate is provided.

Specifically, the cover plate includes, but is not limited to, a glass cover plate.

S102: and forming a protective layer on the cover plate, wherein the protective layer is provided with a groove penetrating through the preset pattern of the protective layer.

Specifically, as shown in fig. 2, the protective layer 23 is vapor-deposited on the cover plate 21 by using a mask plate 22 having the predetermined pattern.

That is to say, a mask 22 with a preset pattern is placed on one side of the cover plate 21 to be subjected to evaporation, and then the protective layer 23 is subjected to evaporation so as to form the protective layer 23 with the preset pattern.

Optionally, the thickness of the protective layer is 10nm to 1000nm, inclusive, for example, the thickness of the protective layer is 100nm or 500nm or 750 nm.

Optionally, the material of the protective layer includes, but is not limited to, a silicon material.

Obviously, texture manufacturing can be performed on the curved surface cover plate by the method of arranging the protective layer.

S103: and etching the cover plate to form the texture of the preset pattern.

Specifically, the cover plate is etched by using an HF solution.

Optionally, the concentration of the HF solution ranges from 1% to 15%, inclusive, and the cover plate is etched with, for example, a 2% HF solution, or a 5% HF solution, or a 10% HF solution.

The HF solution has a good etching effect on the glass cover plate, the silicon protection layer has a slow reaction in the HF solution, and the cost is low.

S104: and removing the protective layer.

Specifically, the protective layer is removed by using an alkaline solution, including but not limited to a NaOH solution or a KOH solution.

Optionally, the concentration of the alkali solution is in a range of 5% to 40%, inclusive, for example, the concentration of the alkali solution is 10%, or the concentration of the alkali solution is 30%, or the concentration of the alkali solution is 38%, etc.

According to the texture processing method provided by the invention, steps such as photoresist spraying, exposure and development are not needed, the required texture can be formed only by forming the protective layer with the groove with the preset pattern on the surface of the cover plate and etching the cover plate, the processing method is simple, and the protective layer can be evaporated on the curved cover plate, so that the purpose of processing the texture of the curved cover plate is realized, and the cost is low.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.