阅读说明：本技术 一种acf导电胶带及其制备工艺和应用 (ACF conductive adhesive tape and preparation process and application thereof ) 是由 韩贵麟 于 2019-09-12 设计创作，主要内容包括：本发明涉及一种ACF导电胶带及其制备工艺和应用,该ACF导电胶带包括离型层和胶膜层；离型层上表面涂覆胶膜层,胶膜包括以下重量份组分：聚酰胺树脂60-70、聚氨酯树脂3-7、导电粒子10-25、增粘树脂4-6、导热填料0.4-0.6、触变剂4-7；其制备工艺包括如下步骤：S1、将聚酰胺树脂、聚氨酯树脂与导电粒子进行双螺杆挤出机共混；S2、再将S1中添加了导电粒子的胶粒与增粘树脂、导热填料、触变剂进行挤出共混；S3、将共混后的胶粒放进涂布机中,进行加热熔融涂布,熔融胶膜涂布在离型纸上,在水冷却辊上冷却干燥,得到ACF导电胶带。本发明胶带具有单向导电能力,用于制卡不会对卡体背面造成热损伤。(the invention relates to an ACF conductive adhesive tape and a preparation process and application thereof, wherein the ACF conductive adhesive tape comprises a release layer and an adhesive film layer; coating an adhesive film layer on the upper surface of the release layer, wherein the adhesive film comprises the following components in parts by weight: 60-70 parts of polyamide resin, 3-7 parts of polyurethane resin, 10-25 parts of conductive particles, 4-6 parts of tackifying resin, 0.4-0.6 part of heat-conducting filler and 4-7 parts of thixotropic agent; the preparation process comprises the following steps: s1, blending the polyamide resin, the polyurethane resin and the conductive particles by a double-screw extruder; s2, extruding and blending the colloidal particles added with the conductive particles in the S1, tackifying resin, heat-conducting filler and thixotropic agent; and S3, putting the blended colloidal particles into a coating machine, heating and melting for coating, coating a molten adhesive film on release paper, and cooling and drying on a water cooling roller to obtain the ACF conductive adhesive tape. The adhesive tape has unidirectional conductive capability, and can not cause thermal damage to the back of the card body when used for card manufacturing.)

1. An ACF conductive adhesive tape is characterized by comprising a release layer and an adhesive film layer; an adhesive film layer is coated on the upper surface of the release layer, the thickness of the adhesive film layer is 40-80 μm, and the adhesive film comprises the following components in parts by weight:

2. The ACF conductive tape of claim 1, wherein the adhesive film comprises the following components in parts by weight:

3. The ACF conductive tape according to claim 1, wherein the conductive particles are any one of silver-plated copper particles, silver-plated aluminum particles, silver-plated glass beads or gold-nickel coated styrene particles, and the particle size of the conductive particles is 20-50 μm.

4. The ACF conductive tape of claim 1, wherein the heat conductive filler is a mixture of one or more of calcium carbonate, talc, quartz, zinc oxide, barium oxide, clay, and barium sulfate.

5. the ACF conductive tape as claimed in claim 1, wherein the thixotropic agent is composed of a mixture of one or more of fumed silica, clay, talc, paraffin, rosin resin and petroleum resin.

6. a process for preparing the ACF conductive adhesive tape of any one of claims 1-5, comprising the following steps:

s1, blending the polyamide resin, the polyurethane resin and the conductive particles by a double-screw extruder to uniformly disperse the conductive particles in a colloidal particle system;

S2, carrying out double-screw extrusion blending on the colloidal particles added with the conductive particles in the S1, tackifying resin, heat-conducting filler and thixotropic agent;

And S3, putting the blended colloidal particles into a coating machine, heating and melting for coating, coating the molten adhesive film on release paper, and cooling and drying on a water cooling roller to obtain the ACF conductive adhesive tape.

7. the preparation process of the ACF conductive adhesive tape according to claim 6, wherein in the step S1), the extrusion temperature of the double-screw extruder is 140-180 ℃, and the screw rotation speed is 20-40 r/min; in the step S2), the extrusion temperature is 160-180 ℃, and the screw rotation speed is 20-40 r/min; in the step S3), the melting temperature is 100-120 ℃, the viscosity range of the molten adhesive film is 700-1400 Pa.s, the speed of a coating machine is 15-25 m/min, and the water temperature of a water cooling roller is 18-20 ℃.

8. a process for preparing the ACF conductive adhesive tape of any one of claims 1-5, comprising the following steps:

S1, carrying out double-screw extrusion blending on the polyamide resin, the polyurethane resin, the tackifying resin, the heat-conducting filler and the thixotropic agent;

And S2, putting the colloidal particles blended in the S1 into a coating machine, heating and melting for coating, coating the molten adhesive film on release paper, simultaneously uniformly spraying conductive particles on the adhesive film in a hot-melt state, and finishing coating and rolling after passing through a water cooling roller press roll to obtain the ACF conductive adhesive tape.

9. The process for preparing the ACF conductive adhesive tape according to claim 8, wherein in the step S1), the extrusion temperature is 150-200 ℃, and the screw rotation speed is 20-40 r/min; in the step S2), the melting temperature is 100-120 ℃, the viscosity range of the molten adhesive film is 700-1400 Pa.s, the speed of a coating machine is 15-25 m/min, and the water temperature of a water cooling roller is 18-20 ℃.

10. Use of an ACF conductive tape according to any one of claims 1 to 5 on a two-interface chip card.

Technical Field

The invention relates to the technical field of adhesive tapes, in particular to an ACF conductive adhesive tape and a preparation process and application thereof.

Background

at present, the main packaging processes of the dual-interface bank card include a thread picking process, a tin sheet process, a conductive column process and an ACF conductive adhesive tape process. Wherein: the thread picking process comprises the steps of firstly completing hot-pressing and attaching of a common hot-melt adhesive film and a module carrier tape, picking up two enameled copper wire ends on an antenna layer, performing butt-welding with a contact on the back of an IC module, and finally completing hot-pressing bonding; the tin sheet process comprises the steps of firstly completing hot-pressing and attaching of a common hot-melt adhesive film and a module carrier band, welding two tin sheets on an antenna layer in advance, butt-welding a contact on the back of an IC module and the tin sheets on an antenna through tin wires, and finally completing hot-pressing and bonding; the conductive column process is that hot pressing and jointing common hot melt adhesive film and module carrier band are first completed, and the antenna and the contact behind the module are connected via elastic conductive column and conductive glue. However, the three processes currently have the problems that equipment and consumables such as a tin wire, a tin sheet and tin paste of the corresponding processes need to be input, the input of customer equipment is large, more manpower needs to be input, and the production efficiency is low. The ACF conductive adhesive tape process is characterized in that the conductive adhesive tape and a module carrier tape are subjected to hot-pressing bonding, soldering tin and other operations are not needed, the module and a card body are directly subjected to hot-pressing bonding, special double-interface packaging equipment is not needed, the speed is high, and the performance is stable; however, the particle size of the conductive particles of the conventional ACF conductive adhesive tape is small, because the distance between the contact point at the back of the module of the dual-interface bank card and the antenna layer is about 80-100 μm, and the gap between the contact points is large, when the dual-interface bank card is packaged, a very accurate pressure control system is required to be arranged on dual-interface packaging equipment, high and stable pressure is kept, meanwhile, the hot-pressing time is required to be increased, and the card is scrapped once the hot-pressing is unsuccessful; and the packaging needs to be carried out at the use temperature of 200-220 ℃ during packaging, which can cause thermal damage to the back of the card body and influence the appearance of the card.

disclosure of Invention

One of the objectives of the present invention is to provide an ACF conductive tape and a preparation process thereof, wherein the ACF conductive tape selects conductive particles having a particle size of 20 to 50 μm, and is suitable for an application scenario where a gap between contact points is large in a dual-interface IC card process.

another objective of the present invention is to provide a preparation process of the ACF conductive tape.

another objective of the present invention is to provide an application of the ACF conductive tape.

The ACF conductive adhesive tape comprises a release layer and an adhesive film layer; an adhesive film layer is coated on the upper surface of the release layer, the thickness of the adhesive film layer is 40-80 μm, and the adhesive film comprises the following components in parts by weight:

in the above technical solution, preferably, the adhesive film comprises the following components in parts by weight:

In the technical scheme, preferably, the conductive particles are any one of silver-plated copper particles, silver-plated aluminum particles, silver-plated glass beads or gold-nickel coated styrene particles, the particle size of the conductive particles is 20-50 μm, the particle size distribution is narrow, the shape of the conductive particles is preferably spherical particles, and the regularity is good.

In the above technical solution, preferably, the heat conductive filler is a mixture of one or more of calcium carbonate, talc powder, quartz, zinc oxide, barium oxide, clay, and barium sulfate.

In the above technical solution, preferably, the thixotropic agent is composed of a mixture of one or more of fumed silica, clay, talc, paraffin, rosin resin, and petroleum resin.

The preparation process of the ACF conductive adhesive tape comprises the following steps:

S1, blending the polyamide resin, the polyurethane resin and the conductive particles by a double-screw extruder to uniformly disperse the conductive particles in a colloidal particle system;

s2, carrying out double-screw extrusion blending on the colloidal particles added with the conductive particles in the S1, tackifying resin, heat-conducting filler and thixotropic agent;

And S3, putting the blended colloidal particles into a coating machine, heating and melting for coating, coating the molten adhesive film on release paper, and cooling and drying on a water cooling roller to obtain the ACF conductive adhesive tape.

preferably, in the step S1), the extrusion temperature of the double-screw extruder is 140-180 ℃, and the screw rotation speed is 20-40 r/min; in the step S2), the extrusion temperature is 160-180 ℃, and the screw rotation speed is 20-40 r/min; in the step S3), the melting temperature is 100-120 ℃, the viscosity range of the molten adhesive film is 700-1400 Pa.s, the speed of a coating machine is 15-25 m/min, and the water temperature of a water cooling roller is 18-20 ℃.

The other preparation process of the ACF conductive adhesive tape comprises the following steps:

S1, carrying out double-screw extrusion blending on the polyamide resin, the polyurethane resin, the tackifying resin, the heat-conducting filler and the thixotropic agent;

And S2, putting the colloidal particles blended in the S1 into a coating machine, heating and melting for coating, coating the molten adhesive film on release paper, simultaneously uniformly spraying conductive particles on the adhesive film in a hot-melt state, and finishing coating and rolling after passing through a water cooling roller press roll to obtain the ACF conductive adhesive tape.

preferably, in the step S1), the extrusion temperature is 150-200 ℃, and the screw rotation speed is 20-40 r/min; in the step S2), the melting temperature is 100-120 ℃, the viscosity range of the molten adhesive film is 700-1400 Pa.s, the speed of a coating machine is 15-25 m/min, and the water temperature of a water cooling roller is 18-20 ℃.

The ACF conductive adhesive tape is applied to a double-interface chip card.

The ACF adhesive tape with unidirectional conductivity is produced by mixing conductive particles with an adhesive film system in a blending or spraying mode in a hot melt adhesive film system applied to IC card packaging at present.

Compared with the prior art, the invention has the advantages and positive effects that:

1. The ACF conductive adhesive tape selects conductive particles with the particle size of 20-50 microns, is suitable for application scenes with large contact point gaps in a double-interface bank card process, is spherical, has good pressure uniformity when being subjected to hot pressing under the condition of relatively narrow particle size distribution of the conductive particles, avoids the condition that some conductive particles are conducted after hot pressing and some conductive particles are not conducted, and can increase the conductive contact area because the spheres are deformed into an oval or circular sheet after the hot pressing;

2. the hot melt adhesive film of the ACF conductive adhesive tape has low melting temperature, only needs equipment to carry out normal hot pressing during card manufacturing, has the cylinder pressure of 0.3-0.5Mpa, and does not need a high-precision and high-pressure hot-pressing welding head; after hot-pressing bonding, the thermal damage of the hot welding head to the back of the card is small, so that the production yield of the double-interface card is improved, and the production efficiency is improved;

3. the ACF conductive adhesive tape can meet the requirements of the production process of the current double-interface bank card, does not need to adjust and improve equipment, can perform fast and efficient module packaging operation, does not cause thermal damage to the back of the card body, has the overall success rate of packaging of more than 96 percent, reduces the operation cost of enterprises, and has remarkable economic benefit and social benefit.

Detailed Description

in order to further understand the contents, features and effects of the present invention, the following examples are illustrated and described in detail as follows:

First, three resins, namely, a polyamide resin, a polyurethane resin and a tackifier resin, were used in the following examples:

The polyamide resin is obtained from chemical Polymer company (Polymer co., Ltd.), and has a softening point of 105 ℃ and a melt viscosity of 14.5 ten thousand mPa · s at 150 ℃.

The polyurethane resin is derived from China-made cigarette stands and is selected from common Thermoplastic Polyurethane (TPU) resin, so that the functions of toughening and modifying the adhesive film and adjusting the melting point of the adhesive film are achieved.

The tackifying resin is C9 petroleum resin, the softening point is about 120 ℃, the molecular weight is 2000, and the tackifying resin plays a main role in increasing the initial viscosity.