阅读说明：本技术 包括结构弹性电气瞬态材料的电路保护设备及其制造方法 (Circuit protection device including structurally resilient electrical transient material and method of making same ) 是由 陈建华 曾俊昆 成浩 D·纳亚尔 于 2017-03-31 设计创作，主要内容包括：公开了结构支撑的电气瞬态材料。此外,本发明还公开了提供结构支撑的电气瞬态材料的方法。在一个具体实施中,结构支撑的电气瞬态材料包括被电气瞬态材料至少部分地覆盖的支撑结构。在一个示例中,支撑结构为至少部分地集成在电气瞬态材料中的网状材料。(structurally supported electrical transient materials are disclosed. In addition, methods of providing structurally supported electrical transient materials are also disclosed. In one implementation, the structurally supported electrical transient material includes a support structure at least partially covered by the electrical transient material. In one example, the support structure is a mesh material at least partially integrated in the electrical transient material.)

1. An apparatus, comprising:

a support structure; and

An electrical transient material at least partially covering the support structure, thereby providing the support structure at least partially integrated in the electrical transient material.

2. The apparatus of claim 1, wherein the support structure comprises a mesh material, a porous spacer, or a plurality of single-pore spacers.

3. The apparatus of claim 1, wherein the support structure comprises at least one non-conductive material.

4. The device of claim 1, wherein the electrically transient material comprises a polymer resin comprising conductive particles and non-conductive particles.

5. The apparatus of claim 1, wherein the support structure comprises glass, kevlar, polymer, ceramic, carbon fiber, insulated metal, non-conductive material, or fabric.

6. The apparatus of claim 1, wherein the support structure comprises a mesh material comprising a plurality of openings and a plurality of strands defining the plurality of openings, the electrically transient material at least partially filling one or more of the plurality of openings and at least partially covering one or more of the plurality of strands.

7. The apparatus of claim 6, wherein each strand of the plurality of strands has a diameter of at least 6 μm.

8. The apparatus of claim 6, wherein the mesh material comprises a free open area of about 55% and a thermal stability of about 250 degrees Celsius.

9. The apparatus of claim 1, wherein the support structure is at most about 150kg/cm²Is structurally stable under the force ofAnd is thermally stable at about 250 degrees celsius.

10. The apparatus of claim 1, wherein the electrically transient material at least partially covering the support structure comprises first and second opposing surfaces, and comprises an electrically conductive layer disposed on at least one of the first and second opposing surfaces.

11. The apparatus of claim 1, wherein the electrically transient material is a Voltage Variable Material (VVM).

12. A method, comprising:

Providing a support structure; and

At least partially covering the support structure with an electrical transient material, thereby providing the support structure at least partially integrated in the electrical transient material.

13. The method of claim 12, wherein the support structure comprises a mesh material, a porous spacer, or a plurality of single-pore spacers.

14. The method of claim 12, wherein the support structure comprises glass, kevlar, polymer, ceramic, carbon fiber, insulated metal, non-conductive material, or fabric.

15. the method of claim 12, wherein the support structure comprises a mesh material comprising a plurality of openings and a plurality of strands defining the plurality of openings, the electrically transient material at least partially filling one or more of the plurality of openings and at least partially covering one or more of the plurality of strands.

16. A circuit protection device comprising:

A support structure;

An electrical transient material at least partially covering the support structure, thereby providing the support structure at least partially integrated in the electrical transient material;

A first electrically conductive layer disposed on a first surface of the electrically transient material; and

A second conductive layer disposed on a second surface of the electrically transient material.

17. The circuit protection device of claim 16, wherein the electrically transient material is a Voltage Variable Material (VVM).

18. the circuit protection device of claim 16 wherein said support structure comprises a mesh material, a porous spacer, or a plurality of single-pore spacers.

19. The circuit protection device of claim 16 wherein the support structure comprises a mesh material comprising a plurality of openings and a plurality of strands defining the plurality of openings, the electrically transient material at least partially filling one or more of the plurality of openings and at least partially covering one or more of the plurality of strands.

Technical Field

The present invention generally relates to circuit protection devices and methods for manufacturing circuit protection devices. More particularly, the present invention relates to circuit protection devices and methods of making the same, wherein the circuit protection devices include electrically transient materials, such as Voltage Variable Materials (VVMs).

Description of the related Art

Electrical transients can generate high electric fields and often high peak powers that can temporarily or permanently deactivate an electrical circuit or highly sensitive electrical components in the electrical circuit. Electrical transients may include transient voltages that can interrupt circuit operation or destroy the circuit altogether. Electrical transients may be caused, for example, by electromagnetic pulses, electrostatic discharges, lightning, electrostatic buildup, or by operation of other electronic or electrical components. The electrical transient may rise to its maximum amplitude in sub-nanosecond to microsecond time and have repetitive amplitude peaks.

There are materials for preventing electrical transients that are designed to respond very quickly (ideally before the transient wave reaches its peak) to reduce the transmitted voltage to a much lower value for the duration of the electrical transient. Electrical transient materials are characterized by high resistance values at low or normal operating voltages. In response to an electrical transient, the material switches to a low resistance state very quickly. These materials return to their high resistance state when the electrical transient dissipates. After the electrical transient dissipates, the electrical transient materials also quickly recover to their original high resistance values.

Circuits, devices, and equipment that employ electrical transient materials, such as surge protection devices, may shunt a portion of the excess voltage or current due to the electrical transient to ground, thereby protecting the circuit and its components. The VVM can be used as an electrical transient material in conventional circuit protection devices. Conventional VVMs typically have the consistency and composition of some form of enclosure or packaging that is required to cover the VVM. The housing or enclosure serves to prevent malfunction of the VVM that may be caused by ambient humidity and/or contaminants (e.g., dust). However, the use of a housing or enclosure can increase the cost of manufacturing conventional surge protection devices that use VVMs. Further, the housing or package may restrict the manufacture of miniaturized surge protection devices that use VVMs.

Other problems with conventional surge protection devices will be apparent from the disclosure below.

Background

Disclosure of Invention

The invention discloses a circuit protection device and equipment adopting structural elastic electric transient materials. Methods for providing such circuit protection devices and apparatus are also disclosed. In some implementations, the structural elastic electrical transient material is a structural elastic Voltage Variable Material (VVM).

In some implementations, an apparatus may include a support structure, and an electrical transient material at least partially covering the support structure, thereby providing the support structure at least partially integrated in the electrical transient material.

In further implementations, a method may include providing a support structure, and at least partially covering the support structure with an electrical transient material, thereby providing a support structure at least partially integrated in the electrical transient material.

In yet another implementation, a circuit protection device may include: a support structure; an electrical transient material at least partially covering the support structure, thereby providing a support structure at least partially integrated in the electrical transient material; a first conductive layer disposed on a first surface of an electrically transient material; and a second conductive layer disposed on a second surface of the electrically transient material.

Drawings

fig. 1 illustrates a specific implementation of a structural elastic transient material according to an embodiment of the present disclosure.

Fig. 2 illustrates a cross-sectional view of a structural elastic electrical transient material from the perspective of line I-I shown in fig. 1, according to an embodiment of the present disclosure.

Fig. 3 illustrates an exemplary support structure that may be used to provide structural stability in an electrical transient material according to embodiments of the present disclosure.

Fig. 4 illustrates another cross-sectional view of the structural elastic electrical transient material from the perspective of line I-I shown in fig. 1, according to an embodiment of the present disclosure.

Fig. 5 illustrates a circuit protection device or apparatus including a structurally resilient electrical transient material according to an embodiment of the present disclosure.

Fig. 6 illustrates another circuit protection device or apparatus including a structurally resilient electrical transient material according to an embodiment of the present disclosure.

Fig. 7 illustrates an exemplary set of operations for fabricating a circuit protection device or apparatus including a structurally resilient electrical transient material according to an embodiment of the present disclosure.

Detailed Description

Circuit protection devices and apparatus employing structurally resilient electrical transient materials are disclosed. Further, methods for providing circuit protection devices and apparatus employing structurally resilient electrical transient materials are disclosed herein. In some implementations, circuit protection devices and apparatus employ a structurally resilient electrical transient material that includes a support structure at least partially covered by the electrical transient material. In some implementations, the electrical transient material includes a binder material. The binder material may include a mixture of conductive particles and semiconductive particles therein. Further, the binder material may include a mixture of insulating particles or non-conductive particles therein. In another example, the electrical transient material includes a binder material that includes conductive particles and semiconductive particles. At least some of the conductive particles and the semiconductive particles may be coated with an insulating oxide film.

In some implementations, the electrical transient material is a Voltage Variable Material (VVM). In one example, the VVM includes an epoxy or resin material. The epoxy material may be a polymer-based material. The epoxy material may include particles. The particles may include: conductive particles (including core and shell conductive particles), insulating particles, semiconductive particles, doped semiconductive particles (including core and shell doped semiconductive particles), and any combination thereof.

The VVM may at least partially cover the support structure. In one example, the support structure is a mesh or lattice material. In another example, the support structure is at least one spacer material comprising a plurality of through holes, openings or channels. In another example, the support structure is a plurality of single-hole spacers. The apertures or channels of the aforementioned support structures may be square, circular, rectangular, tetrahedral, pyramidal, triangular, hexagonal, and the like.

Fig. 1 shows an implementation of a structural elastic electrical transient material 100. The structural elastic electrical transient material 100 includes an electrical transient material 102 at least partially covering a support structure 104. In some implementations, the electrical transient material 102 is a VVM. At least partially covering the support structure 104 with the electrical transient material 102 provides an at least partially integrated structure. That is, the electrical transient material 102 may at least partially cover the top and bottom surfaces of the support structure 104. In the example shown in fig. 1, the support structure 104 is a mesh or lattice-like material. The support structure 104 may include strands 106 that define a mesh or lattice of material for the support structure 104. More specifically, the strands 106 of the support structure 104 define a plurality of apertures or openings 108 of the support structure 104. The support structure 104 may alternatively be at least one spacer material comprising a plurality of through holes, apertures or channels (see fig. 3), or the support structure 104 may be comprised of a plurality of single hole spacers. The pores or channels of the aforementioned support structure materials may be square, circular, rectangular, tetrahedral, pyramidal, triangular, hexagonal, and the like. The support structure 104 may alternatively have different sizes and/or shapes than shown and described herein. The structural elastic electrical transient material 100 shown in fig. 1 is shown as a sheet or film. However, the structural elastic electrical transient material 100 may be provided in other shapes and sizes than that shown in fig. 1.

The support structure 104 may be a non-conductive material. For example, the support structure 104 may be glass, Kevlar, polymer, ceramic, carbon fiber, insulated metal, non-conductive material fabric, or the like. Similarly, as discussed above, the support structure 104 may include at least one spacer material (see fig. 3) that includes a plurality of vias, openings, or channels, or the support structure 104 may be structured by a plurality of single-hole spacers. The spacers defining the support structure 104 may comprise a non-conductive material.

The strands 106 of the support structure 104 may have a diameter of about 6 μm. However, the diameter of the strands 106 may be less than or greater than 6 μm. For example, the diameter of the strands 106 may be 1 mi. OrThe diameter of the strand 106 may be 6 mi. The aperture 108 of the support structure 104 may have a width and/or length of at least 115 μm. In one example, at least one of the apertures 108 is defined by a 115 x 145 μm opening. The size of the openings 108 may be less than or greater than 115 μm. In one particular implementation, the support structure 104 has a material free open area of about 55% and a thermal stability of about 250 ℃. In some implementations, the free open area is between 1-95%. Furthermore, in some implementations, the support structure 104 is thermally stable at least up to the hardening temperature of the electrical transient material 102. Thus, in one implementation, the support structure 104 resists melting, softening, etc. up to about 250 ℃. In one implementation, the support structure 104 is inert to organic solvents. Further, the support structure 104 may have a length capable of withstanding approximately 150kg/cm²Compressive strength under force of (a). In particular, the support structure 104 may be up to at least about 150kg/cm²Is structurally stable under the forces of (a). Thus, the support structure 104 resists up to about 150kg/cm²fracture, crack, deform, etc. under the force of (a). The support structure 104 may have a length that is capable of withstanding less than or greater than 150kg/cm²Compressive strength under force of (a).

Fig. 2 shows a cross-sectional view of the structural elastic electrical transient material 100 from the perspective of line I-I shown in fig. 100. As shown, the electrical transient material 102 at least partially covers one or more of the strands 106 associated with the support structure 104. Specifically, the electrical transient material 102 may not completely cover each of the strands 106. For example, an upper portion of one or more of the strands 106 may not be completely covered by the electrical transient material 102. Further, the lower and/or side portions of the strands 106 may not be completely covered by the electrical transient material 102. In one example, the electrical transient material 102 completely covers all of the strands 106 or a majority of the strands 106. The strands 106 shown in fig. 2 have a circular cross-section. However, other cross-sectional shapes, such as square or rectangular, may be associated with the strands 106.

fig. 3 illustrates an exemplary support structure 302 that may be used to provide structural stability in the electrical transient material 102. The support structure 302 is an example of a spacer material that includes a plurality of vias, openings, or channels 304. The support structure 302 is shown with three apertures 304. However, the number of apertures 304 shown is purely exemplary. The support structure 302 may be provided as a sheet or film comprising a number of apertures 304. Such sheets or films may be integrated with the electrical transient material 102 to provide structural stability to the electrical transient material 102. Alternatively, multiple separate support structures 302 may be combined together and integrated with the electrical transient material 102 to provide structural stability.

Fig. 4 shows another cross-sectional view of the structural elastic electrical transient material 100 from the perspective of line I-I shown in fig. 1. As shown, the electrical transient material 102 at least partially covers one or more of the strands 106 associated with the support structure 104. In this embodiment, at least one conductive layer 402 is applied on a first surface 404 of the structural elastic electrical transient material 100. In the figure, the conductive layer 402 is shown in contact with the electrical transient material 102. However, one or more layers may be disposed between the electrical transient material 102 and the conductive layer 402. In another embodiment, another conductive layer 406 is applied on the second surface 408 of the structural elastic electrical transient material 100. In fig. 4, the conductive layer 406 is shown in contact with the electrical transient material 102. However, one or more layers may be disposed between the electrical transient material 102 and the conductive layer 406. In some implementations, conductive layer 402 and conductive layer 406 include copper (Cu). In some implementations, layer 410 may be disposed on layer 402. Further, in some implementations, layer 412 may be disposed on layer 406. In some implementations, layers 410 and 412 include tin (Tn). Layer 410 may mitigate oxide formation on conductive layer 402. Similarly, layer 412 may mitigate oxide formation on conductive layer 406. In some implementations, layers 410 and 412 are made of an insulating material.

Fig. 5 illustrates a circuit protection device or apparatus 500 comprising a structurally resilient electrical transient material 100. In some implementations, the circuit protection device 500 is fabricated at least in part by cutting along the dashed line 414 (see fig. 4). As shown in fig. 5, the circuit protection device 500 may be coupled to a Printed Circuit Board (PCB) 502. The PCB502 may include a first conductive pad 504 and a second conductive pad 506. At least the conductive layer 402 may be coupled to a first conductive pad 504. Solder may be used to couple conductive layer 402 to first conductive pad 504. Similarly, at least conductive layer 406 may be coupled to second conductive pad 506. Solder may be used to couple conductive layer 406 to second conductive pad 506.

In some implementations, the circuit protection device 500 is coupled to the PCB502 to protect one or more electrical components (not shown) associated with the PCB502 from transient voltages that can interrupt circuit operation or damage the one or more electrical components. To this end, the structural elastic electrical transient material 100 has a high resistance value at a low or normal operating voltage associated with the PCB 502. However, the structurally elastic electrical transient material 100 is capable of switching to a low resistance state very quickly when a transient voltage occurs. Accordingly, the circuit protection device 500 may be implemented on the PCB502 in a manner that shunts the transient voltage to ground, thereby protecting one or more electrical components associated with the PCB 502.

Fig. 6 illustrates a circuit protection device or apparatus 600 including a structurally resilient electrical transient material 100. The circuit protection device apparatus 600 can include a first substrate 602 and a second substrate 604. The first substrate 602 and the second substrate 604 may be FR-4 substrates, semi-rigid substrates, or flexible substrates. The substrates 602 and 604 may be made of a polyamide material. The first substrate 602 can include a first electrode 606 coupled to at least a portion of a surface associated with the first substrate 602. The second substrate 604 can include a second electrode 608 coupled to at least a portion of a surface associated with the second substrate 604. The first electrode 606 and the second electrode 608 may be separated by a structural elastic electrical transient material. In some implementations, the first electrode 606 and the second electrode 608 are separated by the electrical transient material 102 and the strands 106. The strands 106 may be disposed only between the first and second electrodes 606, 608, or, as shown, the strands 106 may extend beyond the first and second electrodes 606, 608. In some implementations, the gap T2 is about 6 μm. However, the illustrated gap T2 may be less than or greater than 6 μm. For example, the illustrated gap T2 may be 1 mi. Alternatively, the illustrated gap T2 may be 6 mi. In some implementations, the length L5 is shown to be.2 mm. The length L5 shown may be between.15 mm and.25 mm.

In some implementations, the circuit protection device 600 includes a first via 610 and a via 612. Cu may be disposed in the via 610. Cu disposed in via 610 is electrically coupled to electrode 608. Similarly, Cu may be disposed in the via 612. The Cu disposed in the via 612 is electrically coupled to the first electrode 606. Cu layers 614 and 616 may be disposed on a surface of substrate 602. Similarly, Cu layers 618 and 620 may be disposed on a surface of substrate 604. Layers 614 and 618 may be electrically coupled by Cu disposed in via 610. Similarly, layers 616 and 620 may be electrically coupled by Cu disposed in via 612. Tu 622 may be applied to layers 614-620.

In some implementations, the circuit protection device 600 may protect one or more electrical components (not shown) from transient voltages that can interrupt circuit operation or damage the one or more electrical components. To this end, the structural elastic electrical transient material 100 has a high resistance value at low or normal operating voltages. However, the structurally elastic electrical transient material 100 is capable of switching to a low resistance state very quickly when a transient voltage occurs. Accordingly, the circuit protection device 600 may be implemented on the PCB502 or the like in a manner that shunts the transient voltage to ground, thereby protecting one or more electrical components associated with the PCB.

Fig. 7 illustrates an exemplary set of operations 700 for fabricating a circuit protection device or apparatus 500/600 that includes a structurally resilient electrical transient material 100. At block 702, an electrical transient material may be provided in powder form. Alternatively, the electrical transient material may be provided in liquid form (also referred to as an electrical transient material ink). The electrically transient material may include one or more of conductive and non-conductive particles. Further, in some implementations, the electrical transient material may comprise a polymeric material, including but not limited to an epoxy.

At block 704, a support structure is provided. In one example, the support structure is a mesh or lattice material. In another example, the support structure is at least one spacer material comprising a plurality of through holes, openings or channels. In another example, the support structure is a plurality of single-hole spacers. The pores or channels of the aforementioned support structure materials may be square, circular, rectangular, tetrahedral, pyramidal, triangular, hexagonal, and the like. The support structure may be a non-conductive material. For example, the support structure may be glass, kevlar, polymer, ceramic, carbon fiber, insulated metal, non-conductive material, fabric, or the like. In one example, one or more of the strands of the support structure (e.g., strands 106) may comprise a non-conductive material. Similarly, as discussed above, the support structure may comprise at least one spacer material (see fig. 3) comprising a plurality of through-holes, openings or channels, or the support structure may be structured by a plurality of single-hole spacers. The spacers defining the support structure may comprise a conductive material and/or a non-conductive material.

the strands 106 of the support structure 104 may have a diameter of about 6 μm. However, the diameter of the strands 106 may be less than or greater than 6 μm. For example, the diameter of the strands 106 may be 1 mi. Alternatively, the diameter of the strands 106 may be 6 mi. The openings of the support structure may have a width and/or length of at least 115 μm. In one example, at least one of the apertures is defined by a 115 x 145 μm opening. The size of the openings may be smaller or larger than 115 μm. In one particular implementation, the support structure has a material free open area of about 55% and a thermal stability of about 250 ℃. In some implementations, the free open area is between 1-95%. Furthermore, in some implementations, the support structure 104 is thermally stable at least up to the hardening temperature of the electrical transient material 102. In one implementation, the support structure is inert to organic solvents. Further, the support structure may have a tolerance of about 150kg/cm²The compressive strength of the force. The support structure may have a tolerance of less than or greater than 150kg/cm²The compressive strength of the force.

At block 706, the electrical transient material and the support structure are combined. In one example, combining the electrical transient material and the support structure provides an at least partially integrated structure that includes the electrical transient material and the support structure in the electrical transient material. In one embodiment, a support structure is placed on a rigid surface, such as an electrically conductive substrate or plate, and an electrical transient material is applied to the support structure. The electrical transient material in powder form may be sprayed onto the support structure. The electrical transient material in the form of ink may also be sprayed onto the support structure. Alternatively, the electrically transient material in the form of ink may be applied to the support structure using an application blade. The electrical transient material in powder form may be combined with a support structure by compression using a press or roller press to obtain a desired thickness of structurally supported electrical transient material. The electrically transient material in the form of ink may be combined with a support structure using an application blade (e.g., a doctor blade) to achieve a desired thickness of structurally supported electrically transient material. In one or more embodiments, a method of combining an electrical transient material with a support structure may include providing one or more electrically conductive surfaces on one or more surfaces of the structure supporting the electrical transient material.

At block 708, the combined electrical transient material and support structure providing the structurally supported electrical transient material is allowed to harden by drying, if necessary, as part of the method of forming the structurally supported electrical transient material. In one implementation, the combined electrical transient material and support structure are cured in an oven.

While the structurally reinforced/supported electrical transient material and the method for fabricating the structurally reinforced/supported electrical transient material have been described with reference to certain embodiments, it will be understood by those skilled in the art that various modifications may be made and equivalents may be substituted without departing from the spirit and scope of the claims of the present application. Other modifications may be made to adapt a particular situation or material to the teachings disclosed above without departing from the scope of the claims. Thus, the claims are not intended to be limited to any one of the particular embodiments disclosed, but rather to any embodiment that falls within the scope of the claims.