阅读说明：本技术 一种用于厚膜浆料配兑的有机溶剂载体 (Organic solvent carrier for blending thick film paste ) 是由 徐继清 王吉刚 冷正超 于 2019-09-27 设计创作，主要内容包括：本发明提出一种用于厚膜浆料配兑的有机溶剂载体,包括重量百分比为6-10%的粘结剂,2-5%的增塑剂,2-4%的分散剂,0.5-1%的消泡剂,70-80%的沸点在220℃-260℃的溶剂,5-10%的沸点在160℃-175℃的溶剂。采用本发明所涉及的有机溶剂载体制成的厚膜浆料具有较优的印刷浸润性、成膜的韧性以及成膜强度。(The invention provides an organic solvent carrier for blending thick film slurry, which comprises 6-10% of binder, 2-5% of plasticizer, 2-4% of dispersant, 0.5-1% of defoaming agent, 70-80% of solvent with the boiling point of 220-260 ℃ and 5-10% of solvent with the boiling point of 160-175 ℃. The thick film paste prepared by the organic solvent carrier has better printing wettability, filming toughness and filming strength.)

1. An organic solvent vehicle for blending thick film paste, comprising: comprises 6 to 10 weight percent of binder, 2 to 5 weight percent of plasticizer, 2 to 4 weight percent of dispersant, 0.5 to 1 weight percent of defoaming agent, 70 to 80 weight percent of solvent with the boiling point of 220 to 260 ℃ and 5 to 10 weight percent of solvent with the boiling point of 160 to 175 ℃.

2. The organic solvent vehicle for thick film paste formulation of claim 1, wherein: the binder adopts ethyl cellulose.

3. The organic solvent vehicle for thick film paste formulation of claim 1, wherein: the plasticizer adopts glycerol triacetate.

4. The organic solvent vehicle for thick film paste formulation of claim 1, wherein: the dispersant adopts isobutyl benzene.

5. The organic solvent vehicle for thick film paste formulation of claim 1, wherein: the defoaming agent adopts emulsified silicone oil.

6. The organic solvent vehicle for thick film paste formulation of claim 1, wherein: the solvent with the boiling point of 220-260 ℃ adopts terpineol or butyl carbitol acetate.

7. The organic solvent vehicle for thick film paste formulation of claim 1, wherein: the solvent with the boiling point of 160-175 ℃ adopts turpentine.

Technical Field

The invention relates to the technical field of thick film paste preparation, in particular to an organic solvent carrier for blending thick film paste.

Background

The application fields of the existing thick film technology process are more and more extensive, such as the civil industry (such as clothes printing, trademarks and the like) and the industrial field (such as wear-resistant coatings, circuit boards, ceramic industry and the like). However, because printed printing materials have different materials and different functional requirements, the requirements on the wettability between thick film paste and different printing materials, the strength and the toughness of a formed film are higher and higher.

The organic solvent carrier in the existing thick film paste is often not suitable for printing of some substrates such as hydrophobic and oil-repellent substrates, and the phenomena of poor printing stability, incomplete printing or irregular printing shape and the like generally occur. The existing organic solvent carrier is applied to the green printing industry, and phenomena of incomplete peeling or low peeling strength and the like often occur.

Disclosure of Invention

In order to solve the problems in the prior art, the invention provides an organic solvent carrier for blending thick film paste, so that the thick film paste prepared by the organic solvent carrier has excellent printability and wettability among different printing stocks; has good film forming strength and toughness.

In order to achieve the purpose, the invention provides an organic solvent carrier for blending thick film paste, which comprises 6-10% of binder, 2-5% of plasticizer, 2-4% of dispersant, 0.5-1% of defoaming agent, 70-80% of solvent with the boiling point of 220-260 ℃ and 5-10% of solvent with the boiling point of 160-175 ℃.

Preferably, the binder is ethyl cellulose.

Preferably, the plasticizer is glycerol triacetate.

Preferably, the dispersant is isobutylbenzene.

Preferably, the defoaming agent adopts emulsified silicone oil.

Preferably, the solvent with the boiling point of 220-260 ℃ adopts terpineol or butyl carbitol acetate.

Preferably, the solvent with the boiling point of 160-175 ℃ adopts turpentine.

The scheme of the invention has the beneficial effects that the thick film paste prepared by adopting the organic solvent carrier has better printing wettability, filming toughness and filming strength.

Detailed Description

The following examples further illustrate embodiments of the present invention.

The organic solvent carrier for blending thick film paste comprises 6-10 wt% of binder, 2-5 wt% of plasticizer, 2-4 wt% of dispersant, 0.5-1 wt% of defoaming agent, 70-80 wt% of solvent with boiling point of 220-260 deg.C and 5-10 wt% of solvent with boiling point of 160-175 deg.C.

The binder may be ethyl cellulose, the plasticizer may be triacetin, the dispersant may be isobutylbenzene, the defoaming agent may be silicone emulsion, the solvent with a boiling point of 220-260 ℃ may be terpineol or butyl carbitol acetate, and the solvent with a boiling point of 160-175 ℃ may be turpentine.

In order to ensure good wettability between thick film paste prepared by the organic solvent carrier and printing stocks made of different materials, the solvent in the organic solvent carrier consists of a low-boiling-point solvent with a boiling point of 160-175 ℃, such as turpentine and the like, and the weight percentage of the low-boiling-point solvent accounts for 5-10% of the weight percentage of the organic solvent carrier; and a high boiling point solvent with a boiling point of 220-260 ℃, such as terpineol and the like, wherein the weight percentage of the high boiling point solvent accounts for 70-80% of the organic solvent carrier.

In order to ensure the printing leveling property and the adhesion strength of a formed film, the weight percentage of the binder is 6-10%; in order to ensure the toughness of the printed film, the weight percentage of the plasticizer is 2-5%.

The thick film paste prepared by the organic solvent carrier has better printing wettability, filming toughness and filming strength.