阅读说明：本技术 一种多层电路板及生产方法 (Multilayer circuit board and production method ) 是由 李清华 牟玉贵 张仁军 邓岚 杨海军 于 2021-09-22 设计创作，主要内容包括：本申请提供一种多层电路板及生产方法,多层电路板包括：内层板,内层板至少包括两张芯板,芯板之间设有粘接片；内层板两面均设有覆铜层,覆铜层的表面设有布线图。芯板两面的中部均为线路区域,线路区域周边具有工艺边框。芯板的顶面相同的位置均设有条码区和标识区,条码区设有识别码,识别码包含有芯板的产品信息,产品信息至少包括芯板属于内层板的第几层；标识区设有层数标志；芯板的两面均设有多处热熔块。条码区、标识区以及热熔块均位于工艺边框内。多层电路板生产方法,包括步骤：准备芯板、钻孔、制作布线图、棕化、叠合、预热、热熔、制备覆铜层。可保证芯板叠合的正确性,可提高生产效率,避免影响交货期。(The application provides a multilayer circuit board and a production method, the multilayer circuit board comprises: the inner layer plate at least comprises two core plates, and an adhesive sheet is arranged between the core plates; copper-clad layers are arranged on both sides of the inner layer board, and wiring patterns are arranged on the surfaces of the copper-clad layers. The middle parts of the two surfaces of the core board are both circuit areas, and the peripheries of the circuit areas are provided with process frames. The top surfaces of the core plates are provided with a bar code area and an identification area at the same position, the bar code area is provided with an identification code, the identification code comprises product information of the core plates, and the product information at least comprises the core plates belonging to the second layer of the inner layer plate; the identification area is provided with a layer number mark; the two surfaces of the core plate are provided with a plurality of hot frits. The bar code area, the identification area and the hot melt block are all located in the process frame. A method for producing a multilayer circuit board, comprising the steps of: preparing a core plate, drilling holes, manufacturing a wiring diagram, browning, superposing, preheating, carrying out hot melting and preparing a copper-clad layer. Can ensure the accuracy of core plate superposition, improve production efficiency and avoid influencing delivery date.)

1. A multilayer circuit board having at least six layers of wiring patterns, comprising: the inner-layer plate at least comprises two overlapped core plates (1), and an adhesive sheet (2) is arranged between the core plates (1); copper-clad layers (3) are arranged on two sides of the inner layer plate, and wiring patterns are arranged on the surfaces of the copper-clad layers (3);

the middle parts of two surfaces of the core board (1) are both circuit areas (11) for arranging wiring diagrams of the circuit board, and the periphery of each circuit area (11) is provided with a process frame (12);

the top surfaces of the core boards (1) are provided with bar code areas (121) and identification areas (122) at the same positions, the bar code areas (121) are provided with identification codes, the identification codes comprise product information of the core boards (1), and the product information at least comprises the core boards (1) belonging to the second layer of the inner layer board; the identification area (122) is provided with a layer number mark; two sides of the core plate (1) are provided with a plurality of hot melting blocks (123), and the hot melting blocks (123) are made of copper;

the barcode region (121), the logo region (122), and the hot frit (123) are all located within the process frame (12).

2. A multilayer circuit board according to claim 1, wherein the copper-clad layer (3) is formed by electroplating a copper film or attaching a copper foil.

3. A multilayer circuit board according to claim 1, characterized in that a cutting area (13) is reserved between the line area (11) and the process frame (12).

4. A multilayer circuit board according to claim 1, characterized in that the four corners of the process frame (12) are provided with hot frits (123) for preheating the inner layer around it.

5. A multilayer circuit board production method for producing the multilayer circuit board of any one of claims 1 to 4, comprising the steps of:

s1: preparing a core plate (1), and cutting the base material into the size same as that of the core plate (1);

s2: drilling, namely, arranging rivet holes (14) within the range of the process frame (12);

s3: manufacturing a wiring diagram, wherein the wiring diagram is manufactured in a circuit area (11) of the core board (1);

s4: browning, namely performing micro-etching, cleaning and drying treatment on two surfaces of the core plate (1);

s5: superposing, namely utilizing a superposing device to carry out contraposition superposition on the multi-layer core plate (1) and the bonding sheet (2) so as to enable the hot frits (123) of the core plate (1) to be mutually contacted;

s6: preheating, namely, utilizing a contact of a hot melting device to contact with hot melt (123), and heating the area of the hot melt (123) to solidify the periphery of the inner layer plate;

s7: hot melting, namely performing integral induction heating on the inner-layer plate by using a heating device to melt the bonding sheets (2) so as to realize integral connection between the core plates (1);

s8: preparing a copper-clad layer (3), and carrying out copper film electroplating or copper foil pasting processing on two sides of the inner-layer plate; then, the wiring pattern of the outermost layer is processed on the basis of the copper film or the copper foil.

6. A method for producing a multilayer circuit board according to claim 5, wherein when the copper plating process is applied to both surfaces of the inner layer board, after the step of heat-fusing and before the step of copper plating, a target hole processing step is further included, at least three target holes (15) are processed within the process frame (12), and when the target holes (15) are processed, the wiring pattern of the inner layer board is irradiated with X-rays, and the wiring pattern is used as a reference for processing the target holes (15).

7. A method for producing a multi-layer circuit board according to claim 5, characterized in that, the four sides of the core plate (1) are respectively provided with a rivet hole (14), wherein three rivet holes (14) are respectively positioned on the transverse and longitudinal axes of the core plate (1), and the other rivet hole is arranged off the axes;

the laminating device comprises a transfer mechanism (210), a positioning clamp (220) and a hot melting device (230); when the core plate positioning device works, the core plate (1) is placed on the positioning clamp (220) through the transfer mechanism (210); the positioning clamps (220) are provided with positioning pins (221) corresponding to the rivet holes (14) and used for connecting the rivet holes (14); the positioning fixture (220) moves the superposed product to the lower part of the hot melting device (230) for preheating and hot melting.

8. The method for producing a multilayer circuit board according to claim 5, wherein the laminating device is provided with a code scanning device, when the core boards are laminated, the code scanning device is used for identifying information contained in the identification codes in the bar code area (121), the laminating device is further provided with an upper computer, the code scanning device transmits the identified information to the upper computer, and the upper computer judges whether the current core boards (1) are laminated according to a set sequence through a preset program.

Technical Field

The invention belongs to the technical field of circuit boards and circuit board production, and particularly relates to a multilayer circuit board and a production method thereof.

Background

In general, a multi-layer circuit board is formed by bonding a plurality of core boards, and the core boards need to be stacked before bonding. Most of the existing laminating modes rely on operators to stack the core plates in a layered mode, and the situation that the positions of the core plates are misplaced frequently occurs in the production process, so that the products are directly scrapped, the production cost is greatly increased, and the delivery cycle is seriously influenced.

Disclosure of Invention

In order to solve the defects of the prior art, the invention provides a multilayer circuit board which is provided with a bar code area and an identification area and can simultaneously ensure the accuracy of the superposition of core boards through two modes of visual observation and code scanning. The application also provides a circuit board production method, whether the superposition position of the core board is correct or not is judged by utilizing the rivet hole, the position misplacement of the core board can be further avoided, the core board is automatically superposed by utilizing the superposition device, the production efficiency can be improved, and the delivery date is prevented from being influenced.

In order to realize the purpose of the invention, the following scheme is adopted:

a multilayer circuit board has at least six layers of wiring patterns. The method comprises the following steps: the inner layer plate at least comprises two overlapped core plates, and an adhesive sheet is arranged between the core plates; copper-clad layers are arranged on two sides of the inner layer plate, and wiring patterns are arranged on the surfaces of the copper-clad layers.

The middle parts of the two surfaces of the core board are both circuit areas for arranging wiring diagrams of the circuit board, and the peripheries of the circuit areas are provided with process frames.

The top surfaces of the core plates are provided with a bar code area and an identification area at the same position, the bar code area is provided with an identification code, the identification code comprises product information of the core plates, and the product information at least comprises the core plates belonging to the second layer of the inner layer plate; the identification area is provided with a layer number mark; a plurality of hot frits are arranged on the two surfaces of the core plate, and the hot frits are made of copper.

The bar code area, the identification area and the hot melt block are all located in the process frame.

Further, the copper-clad layer is formed by adopting a copper film electroplating mode or a copper foil pasting mode.

Furthermore, a cutting area is reserved between the circuit area and the process frame.

Furthermore, four corners of the process frame are provided with hot frits for preheating the periphery of the inner plate.

A multilayer circuit board production method is used for producing the multilayer circuit board and comprises the following steps:

s1: preparing a core plate, and cutting the base material into the size same as that of the core plate;

s2: drilling, namely, arranging rivet holes in the range of the process frame;

s3: manufacturing a wiring diagram, namely manufacturing the wiring diagram in a circuit area of the core board;

s4: browning, namely performing micro-etching, cleaning and drying treatment on two surfaces of the core plate;

s5: overlapping, namely performing alignment overlapping on the multilayer core board and the bonding sheets by using an overlapping device to enable the hot melting blocks of the core boards to be mutually contacted;

s6: preheating, namely, utilizing a contact of a hot melting device to be in contact with a hot melting block to heat the area of the hot melting block so as to solidify the periphery of the inner layer plate;

s7: hot melting, namely performing integral induction heating on the inner-layer plate by using a heating device to melt the bonding sheets so as to realize integral connection between the core plates;

s8: preparing a copper-clad layer, and processing the two surfaces of the inner-layer plate by electroplating copper films or pasting copper foils; then, the wiring pattern of the outermost layer is processed on the basis of the copper film or the copper foil.

Further, when the two sides of the inner layer plate adopt the copper film electroplating process, after the hot melting step and before the copper film electroplating, the method also comprises a target hole processing procedure, at least three target holes are processed in the process frame range, during the target hole processing, the wiring pattern of the inner layer plate is irradiated by X-rays, and the wiring pattern is used as the reference standard for the target hole processing.

Furthermore, four sides of the core plate are respectively provided with a rivet hole, wherein three rivet holes are respectively positioned on the transverse axis and the longitudinal axis of the core plate, and the other rivet hole is arranged in a way of deviating from the axis;

the laminating device comprises a transfer mechanism, a positioning clamp and a hot melting device; when the core plate positioning device works, the core plate is placed on the positioning fixture through the transfer mechanism; positioning pins are arranged on the positioning clamps corresponding to the rivet holes and used for connecting the rivet holes; and the positioning clamp moves the superposed product to the lower part of the hot melting device for preheating and hot melting.

Further, the superposition device is provided with a code scanning device, when a core plate is superposed, the code scanning device is used for identifying information contained by the identification codes in the bar code area, the superposition device is further provided with an upper computer, the code scanning device transmits the identified information to the upper computer, and the upper computer judges whether the current core plate is superposed according to a set sequence through a preset program.

The invention has the beneficial effects that:

1. the multilayer circuit board is provided with a bar code area and an identification area, and an operator can visually judge the position of the core board on the layer number of the multilayer board through the layer number identification of the identification area; meanwhile, the number of layers contained in the bar code or the two-dimensional code in the bar code area is identified by using a code scanning device, and whether the current core board belongs to the correct superposition sequence is judged by an upper computer. Through man-machine cooperation, the double pipes are arranged together, and the correct and correct mounting layer number position of the core board is ensured.

2. Rivet holes are formed in the core plate, three of the rivet holes are located on the axis of the core plate, the other rivet hole is arranged in a mode of deviating from the axis, through the cooperation of the rivet holes and the positioning pins of the positioning clamps, the errors of placement of the front side and the back side of the core plate and the errors of placement of the front side, the back side, the left side and the right side of the core plate can be prevented, and the correctness of the placement positions of the core plate is further improved.

3. This application utilizes the coincide device to carry out coincide, preheat and hot melt processing to the core is automatic, can improve production efficiency greatly, guarantees the delivery date.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

Fig. 1 shows a block flow diagram of a circuit board production method in the present application.

Fig. 2 shows an embodiment of a core plate structure.

FIG. 3 illustrates a cross-sectional partial cut-away view of one embodiment of the inner panel of the present application.

Fig. 4 shows an embodiment of the folding device.

Fig. 5 shows a structural view of the operation mechanism.

Fig. 6 shows a top view of the core plate being gripped by the positioning mechanism.

Fig. 7 shows a mounting structure of the positioning pin.

Fig. 8 shows a preferred embodiment of the dowel mounting structure.

Fig. 9 shows a bottom view of the heat staking device.

The labels in the figure are: the device comprises a core board-1, a circuit area-11, a process frame-12, a bar code area-121, an identification area-122, a hot melting block-123, a cutting area-13, a rivet hole-14, a target hole-15, an adhesive sheet-2, a copper-clad layer-3, a transfer mechanism-210, a suction cup-211, a clamping plate-212, a groove-2121, a positioning clamp-220, a positioning pin-221, a supporting plate-222, a slider-223, a compression screw-224, a conical surface 2241, a compression bar-225, a hot melting device-230, a contact-231, a connecting plate 232 and a workbench-240.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only for convenience of describing the present invention and simplifying the description. The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; either directly or indirectly through intervening media, or through both elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Example 1

A multilayer circuit board has at least six layers of wiring patterns. As shown in fig. 2 and 3, the method includes: the inner layer board at least comprises two overlapped core boards 1. Adhesive sheets 2 are arranged between the core plates 1. Copper-clad layers 3 are arranged on both sides of the inner-layer plate, and wiring patterns are arranged on the surfaces of the copper-clad layers 3.

As shown in FIG. 2, the core board 1 of the present embodiment has two layers, each of which has wiring patterns on both surfaces thereof, 4 wiring patterns in total, and copper-clad layers 3 on both surfaces thereof, 6 wiring patterns in total.

When the multilayer board needs 8 layers of wiring diagrams, 3 layers of core boards 1 need to be arranged, and bonding sheets 2 are arranged between every two layers of core boards 1.

Specifically, the middle parts of two sides of the core board 1 are both circuit areas 11 for arranging wiring patterns of a circuit board, and the periphery of each circuit area 11 is provided with a process frame 12 for positioning and clamping in the production process so as to ensure the integrity of the circuit areas 11 and avoid the circuit areas 11 from being scratched or crushed.

Specifically, the top surfaces of the core boards 1 are provided with bar code areas 121 and identification areas 122 at the same positions.

More specifically, the barcode area 121 is provided with an identification code, the identification code is a barcode or a two-dimensional code, the identification code includes product information of the core board 1, and the product information at least includes the core board 1 belonging to the second layer of the inner layer board.

Preferably, the product information may further include, date of production, lot of product, customer information, etc. to facilitate production management and quality traceability.

More specifically, the indication area 122 is provided with a layer number mark for visually checking the second layer of the core board 1 belonging to the inner layer board, and the layer number mark may be set to the first layer, the second layer, or L1, L2, and the like indicating the order.

Preferably, the barcode area 121 and the identification area 122 are disposed at the same position of the core board 1, so that information can be acquired and read at the same position, which is convenient for installation and positioning of information acquisition equipment, reduces moving mechanisms, and simplifies equipment structure.

Preferably, the bar code area 121 and the identification area 122 are disposed on the top surface of the core board 1, and also perform an upward identification function.

Specifically, a plurality of hot melts 123 are arranged on both sides of the core plate 1, the hot melts 123 are made of copper, the hot melts 123 are arranged on the bottom surface of the upper core plate 1, and the hot melts 123 are arranged on the top surface of the lower core plate 1; when there are three or more layers of the core boards 1, the heat frits 123 are provided on the upper and lower surfaces of the core board 1 at the middle position.

Further preferably, the four corners of the process frame 12 are provided with thermal frits 123 for preheating the periphery of the inner plate. The core plates 1 are preliminarily fixed, so that the stability of positions among the core plates 1 in the hot melting process is improved, and the product quality is improved.

The barcode region 121, the logo region 122, and the hot frit 123 are all located within the process frame 12.

Example 2

As a preferred embodiment of the present application, the copper clad layer 3 is formed by an electrolytic copper plating.

As another preferred example of the present application, the copper clad layer 3 may be formed by attaching a copper foil.

Example 3

As a preferred embodiment of the present application, as shown in fig. 1, a cutting area 13 is reserved between the circuit area 11 and the process frame 12, and the cutting area 13 is in an annular structure. In order to define the boundary between the line region 11 and the process frame 12, the operator may be prompted to pay attention to protect the line region 11. When the inner layer board is separated from the process frame 12, the routing machine cuts along the track of the cutting area 13, so that the integrity of the circuit area 11 can be effectively protected.

As a preferable solution of this embodiment, the edge of the adhesive sheet 2 is located in the cutting area 13, so as to facilitate the arrangement of the hot-melt block 123 in the process frame 12 and prevent the adhesive sheet 2 from being cut by the material when the rivet hole is drilled in the process frame 12 by the post-process. Because the size precision of subsequent target hole processing can be influenced after the adhesive sheet 2 is stuck, the processing precision of a via hole of the circuit board is finally influenced, the connectivity among all layers of wiring of the circuit board is influenced, and the circuit board is even scrapped.

Example 4

A multilayer circuit board production method for the above multilayer circuit board, as shown in fig. 1, comprising the steps of:

s1: the core board 1 is prepared, and the base material is cut into the same size as the core board 1.

S2: and (4) drilling, namely, arranging rivet holes 14 in the range of the process frame 12 for positioning during superposition.

S3: a wiring pattern is formed in the wiring region 11 of the core board 1.

S4: browning, and carrying out micro-etching, cleaning and drying treatment on two surfaces of the core plate 1 so as to improve the tidying effect.

S5: and (3) laminating, namely aligning and laminating the multilayer core board 1 and the bonding sheets 2 by utilizing a laminating device so that the hot melting blocks 123 of the core board 1 are contacted with each other.

S6: preheating, utilizing the contact of hot melting device and hot melt piece 123 to contact, heating hot melt piece 123 region, making the inner plating solidify all around, preventing that core 1 from taking place the displacement when the hot melt, improving the precision of every layer of core 1 relative position.

S7: and (4) carrying out hot melting, namely carrying out integral induction heating on the inner-layer plate by using a heating device to melt the bonding sheets 2 so as to realize integral connection between the core plates 1.

S8: preparing a copper-clad layer 3, and processing the two surfaces of the inner-layer plate by electroplating copper films or pasting copper foils; then, the wiring pattern of the outermost layer is processed on the basis of the copper film or the copper foil. And then, the final circuit board is produced through the processes of solder resist ink smearing, exposure, development, slitting and the like.

Example 5

Specifically, when the copper film electroplating process is adopted on two surfaces of the inner layer plate, the target hole machining process is further included after the hot melting step and before the copper film electroplating. Specifically, at least three target holes 15 are processed within the process frame 12, and the target holes 15 are processed.

Preferably, the wiring pattern of the inner layer board is irradiated with X-rays, and the wiring pattern is used as a reference for processing the target hole 15, so as to ensure the positional accuracy of the subsequent processing of the via hole.

Preferably, each of the four sides of the core plate 1 is provided with a rivet hole 14, wherein three rivet holes 14 are respectively located on the transverse and longitudinal axes of the core plate 1, and the other rivet hole is arranged off the axis. The purpose of preventing misassembly is achieved, and the misassembly of the top surface and the bottom surface can be prevented; it is also possible to prevent misloading in the rotational direction, i.e., misloading in which the left and right positions are misplaced, in which the front and rear positions are misplaced, or misloading in which the left or right side is placed in various positions on the front or rear side.

More specifically, as shown in fig. 4 to 9, the laminating apparatus includes a transferring mechanism 210, a positioning jig 220, and a heat-fusing device 230.

Specifically, two sets of positioning fixtures 220 are arranged along a straight line, and the positioning fixtures 220 are arranged in a manner of moving synchronously along the straight line, and the positioning fixtures 220 are arranged on the worktable 240 in a moving manner. Two sets of hot melting devices 230 are arranged along the moving direction of the positioning fixture 220, and the transfer mechanism 210 is arranged above the workbench 240. When one of the positioning jigs 220 is located under one of the heat-melting devices 230, the other positioning jig 220 is located under the transfer mechanism 210. When one of the positioning jigs 220 clamps the inner layer board to preheat and fuse the inner layer board under the fusing device 230, the transfer mechanism 210 simultaneously stacks the core boards 1 on the other positioning jig 220, thereby improving the production efficiency.

Specifically, as shown in fig. 6 to 8, the positioning fixture 220 includes supporting plates 222 having a cross structure, and the supporting plates 222 are provided with positioning pins 221 for connecting the rivet holes 14. Three of the positioning pins 221 are located on the axis of the support plate 222, and the other positioning pin 221 is offset from the axis.

Preferably, the positioning pin 221 is provided on the slider 223, and the slider 223 is slidably coupled to the support plate 222 in the axial direction of the support plate 222. The slider 223 is connected to the support plate 222 by a T-shaped block and T-shaped groove connection structure.

It is further preferred that the positioning pin 221 is slidably disposed in the sliding block 223, and the protruding length thereof is adjustable to adapt to positioning circuit boards with different thicknesses. A compression screw 224 is penetrated through the slider 223 in parallel with the positioning pin 221 for fixing the slider 223 to the support plate 222. The slider 223 is provided with a pressing rod 225 in a direction perpendicular to the positioning pin 221, and a front end of the pressing rod 225 presses against a side wall of the positioning pin 221 to press the positioning pin 221 so as to prevent the positioning pin 221 from moving. The rear end of the pressing rod 225 is of a conical structure, the middle section of the corresponding compression screw 224 is provided with a downward conical surface 2241, and the lower section of the compression screw 224 is matched with the sliding block 223 through threads. When the pressing screw 224 fixes the slider 223, the conical surface 2241 is simultaneously brought into contact with the conical structure at the rear end of the pressing rod 225, and the conical surface 2241 applies pressure to the pressing rod 225, thereby pressing the positioning pin 221. The structure can simultaneously adjust the position of the slide block 223 and the extension length of the positioning pin 221 so as to adapt to core plates 1 with different structures.

Further preferably, the lower section of the positioning pin 221 may be a rectangular rod structure to prevent the positioning pin 221 from rotating, and at the same time, the contact surface between the front end surface of the pressing rod 225 and the outer wall of the rectangular rod may be increased to increase the stability of the locking positioning pin 221.

Specifically, as shown in fig. 5, the transfer mechanism 210 includes a suction cup 211 for sucking the core plate 1. Meanwhile, in order to prevent the core plate 1 from falling off during the moving process, the transfer mechanism 210 is further provided with two groups of mutually perpendicular clamping plates 212 for clamping the periphery of the core plate 1 from the side surface. The two groups of clamping plates 212 are adjusted in distance by adopting a screw rod, the screw rod is provided with two sections of threads with opposite rotation directions, the two clamping plates 212 are respectively matched and connected with thread sections with opposite rotation directions of the screw rod, and the two clamping plates 212 can be clamped or loosened simultaneously by rotating the screw rod in the same structure.

It is further preferable that the bottom of the clamping plate 212 is provided with a groove 2121, and when the core plates 1 are stacked, the groove 2121 is matched with the supporting plate 222 for positioning, so as to improve the accuracy of the relative position between the transfer mechanism 210 and the positioning fixture 220, and thus improve the accuracy of the stacking position of the core plates 1.

Specifically, as shown in fig. 9, the periphery of the bottom of the heat fusion device 230 is provided with a contact 231 for contacting with the heat fusion block 123 to preheat the overlapped core board 1.

The bottom is provided with a connecting plate 232 in a sliding manner, and the connecting plate is provided with a strip-shaped hole for mounting the contact 231, so that the contact 231 can be adjusted according to the position of the hot melt block 123 to adapt to different models of core plates 1.

When stacking, the core board 1 is placed on the positioning jig 220 by the transfer mechanism 210. The positioning clamps 220 are provided with positioning pins 221 corresponding to the rivet holes 14, and are used for connecting the rivet holes 14, so that the core plate 1 is positioned during lamination. The positioning fixture 220 moves the overlapped product to the lower part of the hot melting device 230 for preheating and hot melting.

The coincide device is equipped with sweeps a yard equipment, and during the coincide core, sweep a yard equipment and be used for discerning the information that the identification code contained in bar code area 121, the coincide device still is equipped with the host computer, sweeps the information transmission to the host computer after a yard equipment will discern, and the host computer judges core 1 under through presetting the procedure whether stacks according to the order of settlement. If the sequence is correct, the stacking work is finished; if the sequence is wrong, the stacking is stopped and an alarm is given.

The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.