阅读说明：本技术 一种斜齿图形光栅板的制作方法及光栅板 (Manufacturing method of helical tooth pattern grating plate and grating plate ) 是由 岳力挽 毛智彪 顾大公 马潇 许从应 于 2019-09-11 设计创作，主要内容包括：本发明适用于光学全息成像技术领域,提供了一种斜齿图形光栅板的制作方法及光栅板,其中,方法包括：对衬底进行直角刻蚀形成凹槽；对所述凹槽的一侧进行斜角刻蚀形成第一斜角；在形成所述第一斜角的衬底设置介质膜并进行晶圆键合形成倒斜角；对形成所述倒斜角的衬底进行斜角刻蚀形成第二斜角。本发明能够通过投影式光刻制造出一种斜齿图形光栅板,加快了光栅板的制作速度,提高了生产效率。(The invention is suitable for the technical field of optical holographic imaging, and provides a manufacturing method of a helical tooth pattern grating plate and the grating plate, wherein the method comprises the following steps: carrying out right-angle etching on the substrate to form a groove; performing bevel etching on one side of the groove to form a first bevel; arranging a dielectric film on the substrate with the first bevel angle and bonding wafers to form a bevel angle; and performing bevel angle etching on the substrate with the bevel angle formed to form a second bevel angle. The invention can manufacture the grating plate with the helical tooth pattern through projection type photoetching, quickens the manufacturing speed of the grating plate and improves the production efficiency.)

1. A manufacturing method of a skewed tooth graph grating plate is characterized by comprising the following steps:

carrying out right-angle etching on the substrate to form a groove;

performing bevel etching on one side of the groove to form a first bevel;

arranging a dielectric film on the substrate with the first bevel angle and bonding wafers to form a bevel angle;

and performing bevel angle etching on the substrate with the bevel angle formed to form a second bevel angle.

2. The method for manufacturing a grating plate with a slanted tooth pattern according to claim 1, wherein said step of performing bevel etching on one side of said groove to form a first bevel comprises:

deviating the position of the photomask plate corresponding to the groove from the first side of the groove;

photoetching the photoresist formed on the substrate etched with the groove, and etching the middle layer to expose a first side right-angle area of the groove and reserve the coverage of the photoresist in a second side right-angle area;

and etching the right-angle area at the first side of the groove to form the first bevel angle.

3. The method for manufacturing a grating plate with a slanted tooth pattern according to claim 1, wherein the step of forming a bevel angle by providing a dielectric film on the substrate with the first bevel angle and bonding the substrate with a wafer comprises:

arranging the dielectric film in a groove of the substrate forming the first bevel to form a dielectric film groove;

grinding and wafer bonding are carried out on the substrate with the dielectric film groove;

turning over the substrate subjected to wafer bonding, and grinding the substrate on the upper layer of the groove of the dielectric film;

and etching the ground substrate, and removing the dielectric film in the dielectric film groove to form a chamfer angle.

4. The method for manufacturing a grating plate with a slanted tooth pattern according to claim 1, wherein the step of performing bevel etching on the substrate with the beveled corner to form a second beveled corner specifically comprises:

deviating the position of the photomask plate corresponding to the substrate with the chamfer angle towards the first side of the substrate;

photoetching the photoresist formed on the substrate etched with the chamfer angle, and etching the middle layer to expose a first side right-angle area of the groove formed with the chamfer angle and reserve the coverage of the photoresist in a second side chamfer angle area;

and etching the right-angle area of the first side of the groove for forming the chamfer angle to form the second chamfer angle.

5. The method for manufacturing a grating plate with a slanted tooth pattern as claimed in claim 1, wherein the step of performing a right-angle etching on the substrate to form the groove specifically comprises:

arranging the photomask plate right above the substrate;

photoetching the photoresist formed on the substrate, and etching the intermediate layer;

and carrying out the right-angle etching on the substrate to form a groove.

6. The method for manufacturing a grating plate with slanted teeth as claimed in claim 2, wherein before the step of disposing the position of said photomask corresponding to said grooves to be offset to the first sides of said grooves, the method further comprises the steps of:

removing the photoresist and the intermediate layer formed on the substrate etched with the groove;

and (4) completely covering the substrate on which the groove is formed by spin-coating photoresist and the intermediate layer.

7. The method for manufacturing a grating plate with a slanted tooth pattern as claimed in claim 2, wherein before the step of disposing a dielectric film on the substrate for forming said first slanted angle, further comprising the steps of:

and removing the photoresist and the intermediate layer formed on the substrate etched with the first bevel angle.

8. The method for manufacturing a grating plate with slanted teeth as claimed in claim 3, wherein before the step of disposing the photomask plate with the position corresponding to the substrate on which the beveled corner is formed offset to the first side of the substrate, the method further comprises the steps of:

and (4) completely covering the substrate on which the chamfer angle is formed by spin-coating photoresist and the intermediate layer.

9. A grating plate is characterized by comprising a substrate, wherein a skewed tooth-shaped asymmetric groove is formed in the substrate.

10. A grating plate, comprising the method for manufacturing a grating plate with a skewed tooth pattern as claimed in any one of claims 1 to 8.

Technical Field

The invention belongs to the technical field of optical holographic imaging, and relates to a manufacturing method of a helical tooth pattern grating plate and the grating plate.

Background

A grating plate is a precision optical element with a spatially periodic structure. Can be freely colored, odorless, tasteless and nontoxic, and has the advantages of good rigidity, insulation and printability, etc. The conversion of the phase and amplitude of the object to be shot is realized by decomposing the polychromatic light by using the principle of light diffraction, and the human brain processes several pictures at different angles through the visual difference of two eyes to form an image with depth. The product can be widely used in indoor advertising lamp boxes such as hotels, shopping malls, gymnasiums, airport lounges, waiting kiosks and the like, and wedding buildings, figure portraits and decorative paintings.

In the prior art, in the manufacture of an integrated circuit chip, an immersion lithography machine is used for lithography, photoresist is exposed and then is combined with a part needing to be removed through etching treatment, so that a symmetrical tooth-shaped grid plate, such as a right-angle type, a reverse oblique angle type or an oblique angle type, can be manufactured, the three-dimensional imaging effect of the symmetrical grating plate is poor, an oblique tooth-shaped grating is developed for improving the three-dimensional imaging effect, the existing oblique tooth-shaped grating is in an electron beam direct writing mode, the speed is slow, 2-5 hours are needed for writing an 8-inch wafer, and the depth/width ratio of the written grating is limited. And a 12-inch wafer of the grating plate manufactured by projection lithography only needs 30 seconds. Therefore, in the prior art, the problems of low manufacturing speed and low production efficiency of the grating plate exist.

Disclosure of Invention

The embodiment of the invention provides a manufacturing method of a helical tooth graph grating plate, aiming at solving the problems of low manufacturing speed and low production efficiency of a symmetrical grating plate.

The embodiment of the invention is realized in such a way, and provides a manufacturing method of a skewed tooth graph grating plate, which comprises the following steps:

carrying out right-angle etching on the substrate to form a groove;

performing bevel etching on one side of the groove to form a first bevel;

arranging a dielectric film on the substrate with the first bevel angle and bonding wafers to form a bevel angle;

and performing bevel angle etching on the substrate with the bevel angle formed to form a second bevel angle.

Further, the step of performing bevel etching on one side of the groove to form a first bevel specifically includes:

deviating the position of the photomask plate corresponding to the groove from the first side of the groove;

photoetching the photoresist formed on the substrate etched with the groove, and etching the middle layer to expose a first side right-angle area of the groove and reserve the coverage of the photoresist in a second side right-angle area;

and etching the right-angle area at the first side of the groove to form the first bevel angle.

Further, the step of forming a bevel angle by providing a dielectric film on the substrate with the first bevel angle and performing wafer bonding includes:

arranging the dielectric film in a groove of the substrate forming the first bevel to form a dielectric film groove;

grinding and wafer bonding are carried out on the substrate with the dielectric film groove;

turning over the substrate subjected to wafer bonding, and grinding the substrate on the upper layer of the groove of the dielectric film;

and etching the ground substrate, and removing the dielectric film in the dielectric film groove to form a chamfer angle.

Further, the step of performing bevel etching on the substrate with the beveled corners to form the second beveled corners specifically includes:

deviating the position of the photomask plate corresponding to the substrate with the chamfer angle towards the first side of the substrate;

photoetching the photoresist formed on the substrate etched with the chamfer angle, and etching the middle layer to expose a first side right-angle area of the groove formed with the chamfer angle and reserve the coverage of the photoresist in a second side chamfer angle area;

and etching the right-angle area of the first side of the groove for forming the chamfer angle to form the second chamfer angle.

Further, the step of performing right-angle etching on the substrate to form the groove specifically includes:

arranging the photomask plate right above the substrate;

photoetching the photoresist formed on the substrate, and etching the intermediate layer;

and carrying out the right-angle etching on the substrate to form a groove.

Further, before the step of disposing the position of the photomask corresponding to the groove to deviate from the first side of the groove, the method further comprises the steps of:

removing the photoresist and the intermediate layer formed on the substrate etched with the groove;

and (4) completely covering the substrate on which the groove is formed by spin-coating photoresist and the intermediate layer.

Further, before the step of providing a dielectric film on the substrate where the first bevel is formed, the method further includes the steps of:

and removing the photoresist and the intermediate layer formed on the substrate etched with the first bevel angle.

Further, before the step of disposing the photomask plate so as to be offset toward the first side of the substrate in correspondence with the substrate on which the chamfer angle is formed, the method further includes the steps of:

and (4) completely covering the substrate on which the chamfer angle is formed by spin-coating photoresist and the intermediate layer.

The invention also provides a grating plate which comprises a substrate, wherein the substrate is provided with the skewed tooth-shaped asymmetric groove.

The invention also provides a grating plate, comprising the manufacturing method of the grating plate with the skewed tooth patterns in any specific embodiment.

The invention achieves the following beneficial effects: according to the invention, because the substrate is subjected to right-angle etching firstly to obtain the substrate with the groove, then the bevel angle etching is carried out on one side of the groove, the substrate with the first bevel angle is provided with the dielectric film and then is subjected to wafer bonding to form the groove with the bevel angle, and then the groove with the bevel angle is subjected to bevel angle etching to form the second bevel angle, the substrate (grating plate) with the jagged asymmetric groove can be obtained by processing the substrate in a wafer bonding and twice bevel angle etching mode, the optical holographic imaging effect is enhanced, and the grating plate is manufactured by projection type photoetching, so that the manufacturing speed is accelerated, and the production efficiency is improved.

Drawings

Fig. 1 is a flowchart of an embodiment of a method for manufacturing a grating plate with skewed tooth patterns according to an embodiment of the present disclosure;

FIG. 2 is a flow diagram of one embodiment of step 102 of FIG. 1;

FIG. 3 is a flow diagram of one embodiment of step 103 of FIG. 1;

FIG. 4 is a flow diagram of one embodiment of step 104 of FIG. 1;

FIG. 5 is a flow diagram of one embodiment of step 101 of FIG. 1;

fig. 6 is a flowchart of another specific embodiment of a method for manufacturing a grating plate with skewed tooth patterns according to an embodiment of the present disclosure;

fig. 7 is a flowchart of another specific embodiment of a method for manufacturing a grating plate with skewed tooth patterns according to an embodiment of the present disclosure;

fig. 8 is a flowchart of another specific embodiment of a method for manufacturing a grating plate with skewed tooth patterns according to an embodiment of the present disclosure;

FIG. 9 is a schematic structural diagram of a first bevel embodiment provided by an embodiment of the present application;

FIG. 10 is a schematic structural view of another first bevel embodiment provided by an embodiment of the present application;

FIG. 11 is a schematic structural view of another first bevel embodiment provided in accordance with an embodiment of the present application;

FIG. 12 is a schematic structural diagram of an embodiment of a wafer bonding bevel angle formation provided by an embodiment of the present application;

FIG. 13 is a schematic diagram of another wafer bonding bevel forming embodiment according to the present disclosure;

FIG. 14 is a schematic diagram of another wafer bonding bevel angle embodiment according to the present disclosure;

FIG. 15 is a schematic diagram of another wafer bonding bevel angle embodiment according to the present disclosure;

FIG. 16 is a schematic diagram of another wafer bonding bevel forming embodiment according to the present disclosure;

FIG. 17 is a schematic structural view of a second bevel embodiment provided by an embodiment of the present application;

FIG. 18 is a schematic structural view of another second bevel embodiment provided in accordance with an embodiment of the present application;

FIG. 19 is a schematic structural view of another second bevel embodiment provided in accordance with an embodiment of the present application;

FIG. 20 is a schematic structural diagram of an embodiment of a groove provided in the present application;

FIG. 21 is a schematic structural diagram of another embodiment of a groove provided in the embodiments of the present application;

fig. 22 is a schematic structural diagram of another embodiment of a groove provided in the present application.

The device comprises a substrate 1, a substrate 2, a groove 3, a photomask plate 4, a first oblique angle 5, a dielectric film 6, a chamfer angle 7, a photoresist 8, a middle layer 9 and a second oblique angle.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the prior art, in the manufacture of an integrated circuit chip, a symmetric tooth-shaped grid plate, such as a right-angle type, a reverse oblique angle type or an oblique angle type, can be manufactured by photoetching a photoresist through an immersion photoetching machine and then combining with a part needing to be removed through etching treatment; according to the invention, through multiple offset arrangement of the photomask plate, the substrate is subjected to right angle etching and oblique angle etching to form the substrate with the groove with the first oblique angle, then the dielectric film is arranged on the substrate, the substrate is subjected to wafer bonding and grinding, oblique angle etching is carried out again, and finally the groove with the first oblique angle and the groove with the second oblique angle are formed on the substrate to obtain the substrate with the asymmetric groove with the helical tooth pattern.