阅读说明：本技术 一种并列式斜孔结构光栅板的制作方法及光栅板 (Manufacturing method of parallel inclined hole structure grating plate and grating plate ) 是由 岳力挽 毛智彪 顾大公 马潇 许从应 于 2019-09-16 设计创作，主要内容包括：本发明适用于光学全息成像技术领域,提供了一种并列式斜孔结构光栅板的制作方法及光栅板,其中,方法包括：对衬底进行直角刻蚀形成凹槽；对所述凹槽的一侧进行斜角刻蚀形成第一斜角；在形成所述第一斜角的衬底上设置第一介质膜并进行晶圆键合形成倒斜角；对形成所述倒斜角的衬底进行斜角刻蚀形成第二斜角；将光刻图形与形成所述第二斜角的衬底结合进行光刻,形成并列式斜台光栅板；在所述并列式斜台光栅板上设置第二介质膜,通过刻蚀形成并列式斜孔结构光栅板。本发明通过投影式光刻方式制作一种并列式斜孔结构光栅板,能够增强光学全息成像效果,且有利于加快制作速度。(The invention is suitable for the technical field of optical holographic imaging, and provides a method for manufacturing a parallel inclined-hole structured grating plate and the grating plate, wherein the method comprises the following steps: carrying out right-angle etching on the substrate to form a groove; performing bevel etching on one side of the groove to form a first bevel; arranging a first dielectric film on the substrate on which the first bevel is formed and bonding wafers to form a bevel; performing bevel etching on the substrate with the chamfer angle to form a second bevel angle; combining the photoetching pattern with the substrate forming the second bevel angle for photoetching to form a parallel inclined platform grating plate; and arranging a second dielectric film on the parallel inclined platform grating plate, and forming the parallel inclined hole structure grating plate by etching. The parallel inclined hole structure grating plate is manufactured in a projection type photoetching mode, the optical holographic imaging effect can be enhanced, and the manufacturing speed is accelerated.)

1. A method for manufacturing a parallel inclined hole structure grating plate is characterized by comprising the following steps:

carrying out right-angle etching on the substrate to form a groove;

performing bevel etching on one side of the groove to form a first bevel;

arranging a first dielectric film on the substrate on which the first bevel is formed and bonding wafers to form a bevel;

performing bevel etching on the substrate with the chamfer angle to form a second bevel angle;

combining the photoetching pattern with the substrate forming the second bevel angle for photoetching to form a parallel inclined platform grating plate;

and arranging a second dielectric film on the parallel inclined platform grating plate, and forming the parallel inclined hole structure grating plate by etching.

2. The method for manufacturing a grating plate with a side-by-side inclined-hole structure according to claim 1, wherein the step of performing bevel etching on one side of the groove to form a first bevel specifically comprises:

deviating the position of the photomask plate corresponding to the groove from the first side of the groove;

photoetching the photoresist on the substrate with the groove formed, and etching the middle layer to expose a first side right-angle area of the groove and reserve the coverage of the photoresist in a second side right-angle area;

and etching the right-angle area at the first side of the groove to form the first bevel angle.

3. The method for manufacturing a grating plate with a parallel inclined hole structure according to claim 1, wherein the step of forming the chamfer angle by providing a first dielectric film on the substrate on which the first chamfer angle is formed and wafer bonding comprises:

arranging a first dielectric film forming dielectric film groove in the groove of the substrate forming the first bevel;

grinding and wafer bonding are carried out on the substrate with the dielectric film groove;

turning over the substrate subjected to wafer bonding, and grinding the substrate on the upper layer of the groove of the dielectric film;

and etching the ground substrate, and removing the first dielectric film in the dielectric film groove to form a chamfer angle.

4. The method for manufacturing a grating plate with a side-by-side inclined-hole structure according to claim 2, wherein the step of performing bevel etching on the substrate with the bevel angle formed thereon to form a second bevel angle specifically comprises:

deviating the position of the photomask plate corresponding to the substrate with the chamfer angle towards the first side of the substrate;

photoetching the photoresist on the substrate with the chamfer angle, and etching the intermediate layer to expose a right-angle area at the first side of the groove for forming the chamfer angle and reserve the coverage of the photoresist in a chamfer angle area at the second side;

and etching the right-angle area of the first side of the groove for forming the chamfer angle to form the second chamfer angle.

5. The method for manufacturing a parallel inclined hole structure grating plate according to claim 1, wherein the step of forming the parallel inclined stage grating plate by combining the lithography pattern with the substrate forming the second bevel angle for lithography specifically comprises:

arranging a photoetching pattern right above the substrate with the second bevel angle, enabling the photoetching pattern to be perpendicular to the pattern direction on the substrate, and photoetching the upper layer of photoresist and the middle layer;

developing the graph after photoetching is finished, removing the photoresist and the middle layer of the upper layer which are not photoetched, and removing the convex part which is not covered by the photoresist and the middle layer by etching to form the side-by-side inclined stage grating plate;

and removing the photoresist and the intermediate layer formed on the side-by-side inclined stage grating plate.

6. The method for manufacturing a parallel inclined-hole grating plate according to claim 1, wherein the step of forming the parallel inclined-hole grating plate by etching, by disposing a second dielectric film on the parallel inclined-stage grating plate, comprises:

arranging the second dielectric film on the parallel inclined table grating plate for full coverage;

grinding the upper surface of the grating plate of the parallel inclined table, and removing the second dielectric film arranged on the upper surface of the parallel inclined table;

and etching the ground parallel inclined platform grating plate, removing the parallel inclined platform and forming the parallel inclined hole structure grating plate.

7. The method for manufacturing a grating plate with a parallel inclined hole structure according to claim 1, wherein the step of performing right-angle etching on the substrate to form the groove specifically comprises:

arranging the photomask plate right above the substrate;

photoetching the photoresist formed on the substrate, and etching the intermediate layer;

and carrying out the right-angle etching on the substrate to form a groove.

8. The method for manufacturing a grating plate with a side-by-side inclined hole structure according to claim 2, wherein before the step of disposing the position of the photomask corresponding to the grooves to be offset from the first side of the grooves, the method further comprises the steps of:

removing the photoresist and the intermediate layer on the substrate on which the groove is formed;

and spin-coating the photoresist and the intermediate layer on the substrate with the groove to completely cover the substrate.

9. A grating plate is characterized by comprising a substrate and a second dielectric film arranged on the substrate, wherein a plurality of parallel inclined holes are formed in the second dielectric film.

10. A grating plate comprising the method for manufacturing a grating plate with a side-by-side inclined-hole structure as claimed in any one of claims 1 to 8.

Technical Field

The invention belongs to the technical field of optical holographic imaging, and particularly relates to a manufacturing method of a parallel inclined-hole structured grating plate and the grating plate.

Background

A grating plate is a precision optical element with a spatially periodic structure. Can be freely colored, odorless, tasteless and nontoxic, and has the advantages of good rigidity, insulation and printability, etc. The conversion of the phase and amplitude of the object to be shot is realized by decomposing the polychromatic light by using the principle of light diffraction, and the human brain processes several pictures at different angles through the visual difference of two eyes to form an image with depth. The product can be widely used in indoor advertising lamp boxes such as hotels, shopping malls, gymnasiums, airport lounges, waiting kiosks and the like, and wedding buildings, figure portraits and decorative paintings.

In the prior art, in the fabrication of an integrated circuit chip, an immersion lithography machine is used for lithography, and after exposure processing is performed on a photoresist, a portion to be removed by etching processing is combined, so that a symmetric tooth-shaped grating plate, such as a right-angle type grating plate, a reverse-oblique-angle type grating plate or an oblique-angle type grating plate, can be fabricated. For asymmetric inclined hole or inclined tooth-shaped grating, the prior art adopts an electron beam direct writing method, and 2-3 hours are generally needed for writing an 8-inch wafer. Therefore, in the prior art, the asymmetric grating plate is slow in manufacturing speed, and the symmetric grating plate has poor imaging effect when optical holographic imaging is performed.

Disclosure of Invention

The embodiment of the invention provides a method for manufacturing a grating plate with a parallel inclined hole structure by using a projection photoetching machine, aiming at solving the problems that an asymmetric grating plate is low in manufacturing speed, and a symmetric grating plate is poor in imaging effect when optical holographic imaging is carried out.

The embodiment of the invention is realized in such a way, and provides a method for manufacturing a parallel inclined hole structure grating plate, which comprises the following steps:

carrying out right-angle etching on the substrate to form a groove;

performing bevel etching on one side of the groove to form a first bevel;

arranging a first dielectric film on the substrate on which the first bevel is formed and bonding wafers to form a bevel;

performing bevel etching on the substrate with the chamfer angle to form a second bevel angle;

combining the photoetching pattern with the substrate forming the second bevel angle for photoetching to form a parallel inclined platform grating plate;

and arranging a second dielectric film on the parallel inclined platform grating plate, and forming the parallel inclined hole structure grating plate by etching.

Further, the step of performing bevel etching on one side of the groove to form a first bevel specifically includes:

deviating the position of the photomask plate corresponding to the groove from the first side of the groove;

photoetching the photoresist on the substrate with the groove formed, and etching the middle layer to expose a first side right-angle area of the groove and reserve the coverage of the photoresist in a second side right-angle area;

and etching the right-angle area at the first side of the groove to form the first bevel angle.

Further, the step of forming a bevel angle by providing a first dielectric film on the substrate on which the first bevel angle is formed and performing wafer bonding specifically includes:

arranging a first dielectric film forming dielectric film groove in the groove of the substrate forming the first bevel;

grinding and wafer bonding are carried out on the substrate with the dielectric film groove;

turning over the substrate subjected to wafer bonding, and grinding the substrate on the upper layer of the groove of the dielectric film;

and etching the ground substrate, and removing the first dielectric film in the dielectric film groove to form a chamfer angle.

Further, the step of performing bevel etching on the substrate with the beveled corners to form the second beveled corners specifically includes:

deviating the position of the photomask plate corresponding to the substrate with the chamfer angle towards the first side of the substrate;

photoetching the photoresist on the substrate with the chamfer angle, and etching the intermediate layer to expose a right-angle area at the first side of the groove for forming the chamfer angle and reserve the coverage of the photoresist in a chamfer angle area at the second side;

and etching the right-angle area of the first side of the groove for forming the chamfer angle to form the second chamfer angle.

Further, the step of forming the side-by-side oblique-stage grating plate by combining the lithography pattern with the substrate on which the second oblique angle is formed for lithography specifically includes:

arranging a photoetching pattern right above the substrate with the second bevel angle, enabling the photoetching pattern to be perpendicular to the pattern direction on the substrate, and photoetching the upper layer of photoresist and the middle layer;

developing the graph after photoetching is finished, removing the photoresist and the middle layer of the upper layer which are not photoetched, and removing the convex part which is not covered by the photoresist and the middle layer by etching to form the side-by-side inclined stage grating plate;

and removing the photoresist and the intermediate layer formed on the side-by-side inclined stage grating plate.

Further, the step of forming the parallel inclined-hole grating plate by etching by disposing the second dielectric film on the parallel inclined-table grating plate includes:

arranging the second dielectric film on the parallel inclined table grating plate for full coverage;

grinding the upper surface of the grating plate of the parallel inclined table, and removing the second dielectric film arranged on the upper surface of the parallel inclined table;

and etching the ground parallel inclined platform grating plate, removing the parallel inclined platform and forming the parallel inclined hole structure grating plate.

Further, the step of performing right-angle etching on the substrate to form the groove specifically includes:

arranging the photomask plate right above the substrate;

photoetching the photoresist formed on the substrate, and etching the intermediate layer;

and carrying out the right-angle etching on the substrate to form a groove.

Further, before the step of disposing the position of the photomask corresponding to the groove to deviate from the first side of the groove, the method further comprises the steps of:

removing the photoresist and the intermediate layer on the substrate on which the groove is formed;

and spin-coating the photoresist and the intermediate layer on the substrate with the groove to completely cover the substrate.

The invention also provides a grating plate which comprises a substrate and a second dielectric film arranged on the substrate, wherein a plurality of parallel inclined holes are formed in the second dielectric film.

The invention also provides a grating plate, which comprises the manufacturing method of the parallel inclined hole structure grating plate in any one of the specific embodiments.

The invention achieves the following beneficial effects: the invention carries out right angle etching on the substrate to obtain the substrate with the groove, then carries out bevel angle etching to form the first bevel angle, carries out wafer bonding after the first dielectric film is arranged on the substrate with the first bevel angle, forms the groove with the bevel angle, then carries out bevel angle etching to form the second bevel angle, carries out photoetching to form the parallel-type sloping platform grating plate by combining the photoetching pattern with the substrate with the second bevel angle, sets the second dielectric film on the parallel-type sloping platform grating plate, converts the sloping platform into the inclined hole by etching, so the substrate can be processed by adopting the photoetching modes of twice bevel angle etching, wafer bonding and photoetching combined with the photoetching pattern, the grating plate with the parallel-type inclined hole structure can be obtained, the effect of optical holographic imaging can be enhanced, and the grating plate with the parallel-type inclined hole structure can be manufactured by the projection photoetching mode, is favorable for accelerating the manufacturing speed.

Drawings

Fig. 1 is a flowchart of an embodiment of a method for manufacturing a parallel inclined-hole grating plate according to an embodiment of the present disclosure;

FIG. 2 is a flow diagram of one embodiment of step 102 of FIG. 1;

FIG. 3 is a flow diagram of one embodiment of step 103 of FIG. 1;

FIG. 4 is a flow diagram of one embodiment of step 104 of FIG. 1;

FIG. 5 is a flow diagram of one embodiment of step 105 of FIG. 1;

FIG. 6 is a flow diagram for one embodiment of step 106 of FIG. 1;

FIG. 7 is a flow diagram of one embodiment of step 101 of FIG. 1;

fig. 8 is a flowchart of another specific embodiment of a method for manufacturing a parallel inclined-hole grating plate according to an embodiment of the present disclosure;

FIG. 9 is a schematic structural diagram of a first bevel embodiment provided by an embodiment of the present application;

FIG. 10 is a schematic structural view of another first bevel embodiment provided by an embodiment of the present application;

FIG. 11 is a schematic structural diagram of an embodiment of a chamfer provided by an embodiment of the present application;

FIG. 12 is a schematic structural diagram of another embodiment of a chamfer provided by an embodiment of the present application;

FIG. 13 is a schematic structural diagram of another embodiment of a chamfer provided by an embodiment of the present application;

FIG. 14 is a schematic structural diagram of another embodiment of a chamfer provided by an embodiment of the present application;

FIG. 15 is a schematic structural diagram of another embodiment of a chamfer provided by an embodiment of the present application;

FIG. 16 is a schematic structural view of a second bevel embodiment provided by an embodiment of the present application;

FIG. 17 is a schematic structural view of another second bevel embodiment provided in accordance with an embodiment of the present application;

FIG. 18 is a schematic structural diagram of an embodiment of a side-by-side ramp provided in embodiments of the present application;

FIG. 19 is a schematic structural diagram of another embodiment of a side-by-side ramp provided in accordance with embodiments of the present application;

FIG. 20 is a schematic structural diagram of another embodiment of a side-by-side ramp provided in accordance with embodiments of the present application;

FIG. 21 is a schematic structural diagram of an embodiment of a parallel inclined hole provided in the present application;

FIG. 22 is a schematic structural diagram of another embodiment of a parallel inclined hole provided in the embodiments of the present application;

FIG. 23 is a schematic structural diagram of another embodiment of a parallel inclined hole provided in the embodiments of the present application;

FIG. 24 is a schematic structural diagram of an embodiment of a groove provided in the present application;

fig. 25 is a schematic structural diagram of another embodiment of a groove provided in the present application.

The structure comprises a substrate 1, a substrate 2, a groove 3, a photomask plate 4, a first bevel angle 5, a first dielectric film 6, a chamfer angle 7, photoresist 8, a middle layer 9, a second bevel angle 10, a protrusion 11, a photoetching pattern 12, a parallel inclined table 13, a second dielectric film 14 and a parallel inclined hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the prior art, in the manufacture of an integrated circuit chip, a symmetric tooth-shaped grid plate, such as a right-angle type, a reverse oblique angle type or an oblique angle type, can be manufactured by photoetching a photoresist through an immersion photoetching machine and then combining with a part needing to be removed through etching treatment; the invention obtains the substrate with the groove by carrying out right angle etching on the substrate, then carries out bevel angle etching to form a first bevel angle, carries out wafer bonding after a first dielectric film is arranged on the substrate with the first bevel angle, forms the groove with the bevel angle, then carries out bevel angle etching to form a second bevel angle, carries out photoetching by combining a photoetching pattern and the substrate with the second bevel angle to form a parallel-type sloping table grating plate, and sets a second dielectric film on the parallel-type sloping table grating plate to convert the sloping table into the inclined hole by etching, so that the substrate is processed by adopting a mode of carrying out photoetching by twice bevel angle etching, wafer bonding and combining the photoetching pattern, the grating plate with the parallel-type inclined hole structure can be obtained, and the effect of optical holographic imaging can be enhanced.