阅读说明：本技术 一种二层结构的ptfe玻纤布智能卡标签模块载带的加工方法 (Processing method of PTFE glass fiber cloth intelligent card label module carrier tape with two-layer structure ) 是由 周宗涛 于 2019-09-11 设计创作，主要内容包括：本发明公开了一种二层结构的PTFE玻纤布智能卡标签模块载带的加工方法,包括PTFE玻璃纤维布带基制备步骤、表面活化处理步骤、化学沉铜步骤、电镀铜层增厚步骤、机械刷洗步骤以及载带成型步骤。采用本发明的加工方法制成的二层结构的PTFE玻纤布智能卡标签模块载带具有良好的抗潮湿性能、抗腐蚀性能以及优良的化学稳定性,用PTFE玻纤布复合铜层载带制成的标签模块可以应用在长期高温潮湿等恶劣的环境中。(The invention discloses a processing method of a PTFE glass fiber cloth intelligent card label module carrier tape with a two-layer structure, which comprises a PTFE glass fiber cloth tape base preparation step, a surface activation treatment step, a chemical copper deposition step, an electroplating copper layer thickening step, a mechanical brushing step and a carrier tape forming step. The PTFE glass fiber cloth intelligent card label module carrier tape with the two-layer structure manufactured by the processing method has good moisture resistance, corrosion resistance and excellent chemical stability, and the label module manufactured by the PTFE glass fiber cloth composite copper layer carrier tape can be applied to severe environments such as long-term high temperature and humidity.)

1. A processing method of a PTFE fiberglass fabric intelligent card tag module carrier tape with a two-layer structure is characterized by comprising the following steps:

s1, preparing a PTFE glass fiber cloth tape base: the method comprises the steps of firstly, soaking conventional glass fiber cloth for the intelligent card carrier tape in PTFE emulsion, enabling the glass fiber cloth to pass through the PTFE emulsion at a constant speed, and then curing and sintering the glass fiber cloth in an oven to form a PTFE glass fiber cloth tape base, wherein the thickness of the PTFE glass fiber cloth tape base is 100-120 microns;

s2, surface activation treatment of the PTFE glass fiber cloth tape copper surface: activating the copper-treated surface of the PTFE glass fiber cloth tape base by adopting low-temperature plasma surface treatment or high-frequency electrochemical treatment, wherein the activated surface is formed;

s3, chemical copper deposition: depositing titanium powder or carbon black powder on the activated surface of the PTFE glass fiber cloth tape base by adopting a black hole technology in chemical copper plating; and chemically depositing copper on the titanium powder or the carbon black powder to form a chemical copper deposition layer; the surface of the PTFE glass fiber cloth tape base which is not subjected to activation treatment has good chemical stability and cannot be deposited with titanium atoms, carbon atoms or copper;

s4, a copper electroplating layer thickening step: after chemical copper deposition treatment, uniformly electroplating a copper foil layer on the surface of a chemical copper deposition layer of the PTFE glass fiber cloth tape base, wherein the thickness of the copper foil layer is 15-35 microns; the surface of the PTFE glass fiber cloth tape base which is not subjected to activation treatment is not deposited with titanium atoms or carbon atoms, and a chemical copper deposition layer and a copper foil layer are not deposited;

s5, mechanical brushing: removing copper spots floating on the surface of the PTFE glass fiber cloth tape base without activation treatment by brushing to obtain a PTFE glass fiber cloth composite copper layer carrier tape with a two-layer structure;

s6, carrying belt forming: and manufacturing an etched antenna pattern on the copper layer surface of the PTFE fiberglass cloth composite copper layer carrier tape with the two-layer structure, electroplating gold on the surface of the antenna pattern to form a gold-plated copper foil antenna layer, punching a transmission tooth hole on the carrier tape, and cutting the PTFE fiberglass cloth composite copper layer carrier tape into PTFE fiberglass cloth intelligent card label module carrier tapes which are rolled into the two-layer structure.

2. The method for processing the two-layer structure PTFE fiberglass fabric smart card tag module carrier tape according to claim 1, wherein in the PTFE fiberglass fabric tape base preparation step, the solid content of the PTFE emulsion is 60%, the PTFE emulsion is contained in an impregnation tank, and 50-90 Kg of PTFE emulsion is contained in the impregnation tank.

3. The method for processing the two-layer structure PTFE glass fiber cloth smart card tag module carrier tape according to claim 2, wherein a discharging reel and a receiving reel are arranged outside the dipping tank, the discharging reel, the dipping tank, the oven and the receiving reel are sequentially arranged along the advancing direction of the glass fiber cloth, a plurality of driving rollers are respectively arranged in the dipping tank and the oven, the rolled glass fiber cloth is arranged on the discharging reel, and the glass fiber cloth is sequentially and continuously passed through the driving rollers in the dipping tank and the driving rollers in the oven and then wound up by the receiving reel.

4. The processing method of the two-layer structure PTFE fiberglass cloth smart card tag module carrier tape of claim 2, wherein the PTFE emulsion is passed through the fiberglass cloth at a speed of 6 m/h, and then the fiberglass cloth is baked and cured sequentially through an oven with a temperature of 50 ℃, an oven with a temperature of 120 ℃, an oven with a temperature of 250 ℃ and an oven with a temperature of 360 ℃ at a speed of 6 m/h to prepare the PTFE fiberglass cloth tape base.

5. The processing method of the two-layer structure PTFE fiberglass cloth smart card tag module carrier tape of claim 1, wherein the width of the fiberglass cloth is less than or equal to 1.2 m, the length is less than or equal to 250 m, and the thickness is 80-150 μm, after the gold-plated copper foil antenna layer is manufactured, the PTFE fiberglass cloth composite copper layer carrier tape is finally cut into the standard 35mm width PTFE fiberglass cloth smart card tag module carrier tape.

Technical Field

The invention relates to a processing method of a PTFE glass fiber cloth intelligent card label module carrier tape with a two-layer structure.

Background

Referring to fig. 1 and 2, a smart card label module carrier tape 10' has been used to date for smart card modules. Currently, in the smart card module packaging industry, one of the most important raw materials is a smart card module carrier tape. The antenna is formed by bonding and compounding an epoxy glass cloth insulating tape base and an electrolytic copper layer, manufacturing an antenna pattern, and then corroding and plating gold, and generally has a 3-layer structure, and comprises an epoxy glass cloth insulating tape base layer 11 ', a bonding layer 12 ' and an electrolytic copper layer 13 '. The tape base materials of carrier tapes for packaging smart card modules so far have been generally epoxy glass cloth tape base-G10 (FR4), and also PET tape base and PI tape base. Most of them adopt epoxy glass cloth G10(FR4) tape base. In addition to the G10 carrier tape used in most smart card module packaging on the market, the module packaging industry has used very few earlier PET carrier tape based, and polyimide PI tape based, carriers.

The smart card module carries 3 different tape bases, G10 (epoxy glass fiber cloth) tape base, PET (polyethylene terephthalate) tape base and PI (polyimide) tape base carrier tape. The intelligent card module carrier tape with the G10 epoxy glass fiber cloth tape base has good matching performance and good curling performance with the base material (PET or PVC plastic) used in the common card manufacturing, has excellent distortion resistance and bending performance, is wear-resistant and high-temperature-resistant, and is widely used as an excellent intelligent card module packaging material by decades of market tests, wherein the G10 epoxy glass fiber cloth tape base is widely used. PET tape base also has a small market share due to its low cost. However, because of the poor temperature resistance of PET materials, it is greatly limited in many applications and production situations. Therefore, PET is used as a carrier tape base of a smart card module, and although the cost is low, the application market of PET is greatly limited. PI (polyimide) tape base, which can withstand high temperature and has certain chemical stability. Carrier tape manufacturing is not widely used because of restrictions on the production of smart card module packaging, subsequent punching, and the like.

Because the G10 epoxy glass fiber cloth tape base intelligent card module carrier tape has good matching performance and good curling performance with the base material (PET or PVC plastic) commonly used for card making, excellent anti-twisting and bending performance, wear resistance and certain temperature resistance, the G10 glass fiber cloth tape base widely used up to now is an excellent intelligent card module carrier tape material. However, under many high temperature and harsh environments, such tape-based materials are inadequate.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a processing method of a PTFE fiberglass fabric intelligent card tag module carrier tape with a two-layer structure, wherein no adhesive or other organic materials are adopted between a PTFE fiberglass fabric tape base and a gold-plated copper foil antenna layer, and the PTFE fiberglass fabric intelligent card tag module carrier tape with the two-layer structure has high temperature resistance stability (can stably work at 200 ℃ for a long time) and extremely excellent chemical stability because no other organic materials exist.

One technical scheme for achieving the purpose is as follows: a processing method of a PTFE fiberglass cloth (PTFE fiberglass cloth is abbreviated as PTFE fiberglass cloth) intelligent card tag module carrier tape with a two-layer structure is characterized by comprising the following steps:

s1, preparing a PTFE glass fiber cloth tape base: the method comprises the steps of firstly, soaking conventional glass fiber cloth for the intelligent card carrier tape in PTFE emulsion, enabling the glass fiber cloth to pass through the PTFE emulsion at a constant speed, and then curing and sintering the glass fiber cloth in an oven to form a PTFE glass fiber cloth tape base, wherein the thickness of the PTFE glass fiber cloth tape base is 100-120 microns;

s2, surface activation treatment of the PTFE glass fiber cloth tape copper surface: activating the copper-treated surface of the PTFE glass fiber cloth tape base by adopting low-temperature plasma surface treatment or high-frequency electrochemical treatment, wherein the activated surface is formed;

s3, chemical copper deposition: depositing titanium powder or carbon black powder on the activated surface of the PTFE glass fiber cloth tape base by adopting a black hole technology in chemical copper plating; and chemically depositing copper on the titanium powder or the carbon black powder to form a chemical copper deposition layer; the surface of the PTFE glass fiber cloth tape base which is not subjected to activation treatment has good chemical stability and cannot be deposited with titanium atoms, carbon atoms or copper;

s4, a copper electroplating layer thickening step: after chemical copper deposition treatment, uniformly electroplating a copper foil layer on the surface of a chemical copper deposition layer of the PTFE glass fiber cloth tape base, wherein the thickness of the copper foil layer is 15-35 microns; the surface of the PTFE glass fiber cloth tape base which is not subjected to activation treatment is not deposited with titanium atoms or carbon atoms, and a chemical copper deposition layer and a copper foil layer are not deposited;

s5, mechanical brushing: removing copper spots floating on the surface of the PTFE glass fiber cloth tape base without activation treatment by brushing to obtain a PTFE glass fiber cloth composite copper layer carrier tape with a two-layer structure;

s6, carrying belt forming: and manufacturing an etched antenna pattern on the copper layer surface of the PTFE fiberglass cloth composite copper layer carrier tape with the two-layer structure, electroplating gold on the surface of the antenna pattern to form a gold-plated copper foil antenna layer, punching a transmission tooth hole on the carrier tape, and cutting the PTFE fiberglass cloth composite copper layer carrier tape into PTFE fiberglass cloth intelligent card label module carrier tapes which are rolled into the two-layer structure.

In the processing method of the two-layer structure PTFE glass fiber cloth intelligent card label module carrier tape, in the step of preparing the PTFE glass fiber cloth tape base, the solid content of the PTFE emulsion is 60%, the PTFE emulsion is contained in a dipping tank, and 50-90 Kg of PTFE emulsion is filled in the dipping tank.

The processing method of the PTFE glass fiber cloth intelligent card label module carrier tape with the two-layer structure comprises the steps that a discharging reel and a receiving reel are arranged outside a soaking groove, the discharging reel, the soaking groove, an oven and the receiving reel are sequentially arranged along the advancing direction of glass fiber cloth, a plurality of driving rollers are respectively arranged in the soaking groove and the oven, the rolled glass fiber cloth is arranged on the discharging reel, and the glass fiber cloth sequentially and continuously penetrates through the driving rollers in the soaking groove and the driving rollers in the oven and then is rolled through the receiving reel.

The processing method of the two-layer structure PTFE glass fiber cloth intelligent card label module carrier tape comprises the steps of enabling the glass fiber cloth to pass through the PTFE emulsion at the speed of 6 m/h, and then sequentially enabling the glass fiber cloth to pass through an oven with the temperature of 50 ℃, an oven with the temperature of 120 ℃, an oven with the temperature of 250 ℃ and an oven with the temperature of 360 ℃ at the speed of 6 m/h for baking and curing, so that the PTFE glass fiber cloth tape base is prepared.

The processing method of the two-layer structure PTFE fiberglass fabric intelligent card tag module carrier tape comprises the steps that the width of the fiberglass fabric is less than or equal to 1.2 meters, the length of the fiberglass fabric is less than or equal to 250 meters, the thickness of the fiberglass fabric is 80-150 micrometers, and after the gold-plated copper foil antenna layer is manufactured, the PTFE fiberglass fabric composite copper layer carrier tape is finally cut into standard 35mm width PTFE fiberglass fabric intelligent card tag module carrier tapes.

The technical scheme of the processing method of the PTFE glass fiber cloth intelligent card tag module carrier tape with the two-layer structure is adopted, no adhesive or other organic materials are adopted between the PTFE glass fiber cloth tape base and the gold-plated copper foil antenna layer, and the PTFE glass fiber cloth intelligent card tag module with the two-layer structure has extremely excellent high temperature resistance stability (can stably work at 200 ℃) and chemical stability because no other organic materials exist.

Drawings

FIG. 1 is a schematic structural diagram of a conventional smart card label module carrier tape;

FIG. 2 is a schematic structural diagram of a conventional G10 epoxy glass fiber cloth tape base;

FIG. 3 is a structural diagram of a two-layer PTFE fiberglass fabric smart card label module carrier tape of the present invention;

FIG. 4 is a flow chart of a processing method of a two-layer PTFE fiberglass fabric smart card label module carrier tape of the present invention;

FIG. 5 is a flow chart of the steps for preparing the PTFE glass fiber tape base.

Detailed Description

In order that those skilled in the art will better understand the technical solution of the present invention, the following detailed description is given with reference to the accompanying drawings:

referring to fig. 3, the two-layer PTFE fiberglass smart card tag module carrier tape includes a PTFE fiberglass tape base 10 and a gold-plated copper foil antenna layer 20.

Referring to fig. 4 and 5, in an embodiment of the present invention, a method for processing a two-layer PTFE fiberglass fabric smart card label module carrier tape includes the following steps:

s1, preparing a PTFE glass fiber cloth tape base: the method comprises the steps that conventional glass fiber cloth for the smart card carrier tape is soaked in PTFE emulsion, the glass fiber cloth passes through the PTFE emulsion at a constant speed, and then is solidified in an oven to form a PTFE glass fiber cloth tape base, wherein the thickness of the PTFE glass fiber cloth tape base can be 80-120 micrometers; the width of the glass fiber cloth can reach 1.2 meters (customized), and the length can reach 250 meters (customized). The solid content of the PTFE emulsion 1 is 60%, the PTFE emulsion 1 is placed in a dipping tank 2, 50-90 Kg of PTFE emulsion 1 is filled in the dipping tank 2, the glass fiber cloth 3 passes through the PTFE emulsion 1 at the speed of 6 m/h, and then is baked and cured by sequentially passing through an oven 41 with the temperature of 50 ℃, an oven 42 with the temperature of 120 ℃, an oven 43 with the temperature of 250 ℃ and an oven 44 with the temperature of 360 ℃ at the speed of 6 m/h to prepare the PTFE glass fiber cloth tape base 10; blowing spool 5, impregnating bath 2, 41 ~ 44 of oven and receipts material spool 6 set gradually along the advancing direction of glass fiber cloth, be provided with a plurality of driving rollers in impregnating bath 2 and each oven respectively, the glass fiber cloth 3 with the lapping sets up on blowing spool 5, after glass fiber cloth 3 passed driving roller 7 in impregnating bath 2 and the driving roller 7 in each oven in proper order in succession, through receiving the rolling of material spool 6, the rolling of PTFE glass fiber cloth tape base like this, this kind can realize the automated production of PTFE glass fiber cloth tape base.

S2, surface activation treatment of the PTFE glass fiber cloth tape copper surface: and activating the copper-treated surface of the PTFE glass fiber cloth tape base by adopting low-temperature plasma surface treatment or high-frequency electrochemical treatment, wherein the activated surface is formed.

S3, chemical copper deposition: depositing titanium powder or carbon black powder on the activated surface of the PTFE glass fiber cloth tape base by adopting a black hole technology in chemical copper plating; chemically depositing copper on the titanium powder or the carbon black powder to form a chemical copper deposition layer, and depositing a thin chemical copper deposition layer on the activation processing surface in a chemical copper deposition groove; and the surface of the PTFE glass fiber cloth tape base which is not subjected to activation treatment has good chemical stability and cannot be deposited with titanium atoms, carbon atoms or copper.

S4, a copper electroplating layer thickening step: after chemical copper deposition treatment, uniformly electroplating a copper foil layer on the surface of the chemical copper deposition layer of the PTFE glass fiber cloth tape base by adopting a conventional electroplating copper plating process, wherein the thickness of the copper foil layer is 15-35 microns; the surface of the PTFE glass fiber cloth tape base which is not subjected to activation treatment cannot be deposited with titanium atoms or carbon atoms, cannot be chemically deposited with copper, and cannot be plated with a copper foil layer.

S5, mechanical brushing: removing copper spots floating on the surface of the PTFE glass fiber cloth tape base without activation treatment by brushing to obtain a PTFE glass fiber cloth composite copper layer carrier tape with a two-layer structure;

s6, carrying belt forming: and manufacturing an etched antenna pattern on the copper layer surface of the PTFE fiberglass cloth composite copper layer carrier tape with the two-layer structure, electroplating gold on the surface of the antenna pattern to form a gold-plated copper foil antenna layer 20, punching a transmission tooth hole on the carrier tape, and cutting the PTFE fiberglass cloth composite copper layer carrier tape into PTFE fiberglass cloth intelligent card label module carrier tapes which are rolled into the two-layer structure. The width of PTFE glass fiber cloth smart card label module carrier band is 35 mm.

In step S6, after the PTFE fiberglass cloth and copper layer composite carrier tape is manufactured, the following process is a conventional manufacturing process for an antenna pattern of a smart card carrier tape. Firstly, antenna patterns with different sizes and shapes are manufactured according to different process requirements. The graphic making is also the making method of the industry standard. It can use the photoresist-dry film process to make the pattern, and can also use the liquid photoresist to make the antenna pattern. After the antenna pattern is completed, a gold layer with a proper thickness can be plated on the surface of the antenna and the corresponding 2 pressure welding points of the chip by adopting a conventional gold electroplating process. Alternatively, only the bond pads may be selectively plated with gold. Or the antenna is plated with gold after being electroplated by multiple layers of metals.

The standard specification for PTFE fiberglass cloth smart card label module carrier tapes is 35mm wide, with standard perforations of S35 on both sides of 35mm, as ultimately needed at the label module packaging line and at the end user. Therefore, after the antenna electroplating of the wide PTFE fiberglass cloth composite copper layer carrier tape is completed, a standard S35 transmission perforation needs to be continuously punched in the length direction of the carrier tape according to the relative position required by the design of the tag module antenna. Finally, each of the transfer sprocket holes is cut to a standard width of 35 mm.

PTFE (polytetrafluoroethylene) emulsion is an aqueous fine powder suspension stabilized by a nonionic surfactant after tetrafluoroethylene-ethylene is polymerized in the presence of full FU carbon compound dispersant by taking water as a medium, the appearance is milky white, and the solid content is 60%. The product treated by the dispersion concentrated solution has excellent chemical corrosion resistance, such as strong acid, strong alkali, strong oxidant and the like, has outstanding heat resistance, cold resistance and abrasion resistance, has excellent electrical insulation property within the long-term use temperature range of-200 ℃ to 260 ℃, and is not influenced by temperature and frequency.

The PTFE glass fiber cloth tape base is the same as the common epoxy glass fiber cloth tape G10, and is convenient to produce and process in the online production and processing of label module packaging and the subsequent module and card making procedures. And it also has excellent anti-kink characteristics. The thickness of the PTFE glass fiber cloth tape base can be obtained by the conventional glass fiber cloth manufacturing process (dip coating speed, viscosity of PTFE emulsion and the like). The thickness of the glass fiber cloth, the viscosity of the PTFE emulsion, the technological conditions of dip coating and drying can be properly selected to prepare the thickness and uniformity and the coiling processing characteristics required by the intelligent card label module. The PTFE fiberglass tape substrate most commonly produced is typically 100 to 120 microns thick.

The PTFE Teflon material has excellent chemical stability, and can be compounded with the copper foil to form a corresponding antenna pattern to form a carrier tape for packaging in an intelligent card label module packaging production line. Therefore, the PTFE fiberglass tape base is first laminated with the copper foil. This is a very critical and special process in the manufacture of PTFE fiberglass cloth smart card label module carrier tapes. This is because Teflon is excellent in chemical stability and is generally difficult to bond and combine with other materials (including copper). PTFE is one of the Teflon series and is difficult to bond or composite with a copper foil layer.

The prepared PTFE glass fiber cloth tape base is firstly compounded with copper to prepare the PTFE glass fiber cloth composite copper layer carrier tape. On the PTFE glass fiber cloth composite copper layer carrier tape, according to different application product types and different product technical requirements, corresponding patterns required by different products can be manufactured on the copper layer of the PTFE glass fiber cloth composite copper layer carrier tape.

The invention particularly relates to an important process for compounding a PTFE glass fiber cloth tape base and a copper foil. Due to PTFE and its excellent chemical stability, the surface of the PTFE glass fabric on the side to which the copper foil is bonded must be treated. Therefore, the surface activation treatment is performed by a method such as low-temperature plasma treatment or high-frequency electric spark treatment. The surface of the PTFE glass fiber cloth which needs to be combined with the copper foil layer can be subjected to special surface treatment, so that the surface energy of the PTFE composite surface can be reduced, and the surface contact angle is improved. The activated surface thus treated can be densely and firmly deposited (black hole process) with carbon or titanium atoms on the activated surface of the PTFE glass fiber fabric when electroless copper plating is performed. Therefore, electroless copper plating can be smoothly performed on the carbon black layer. Then a uniform electroplated copper layer is electroplated according to different process requirements. Typically the electroplated copper has a thickness of 35 microns.

And electroplating copper on the surface of the PTFE glass fiber cloth on which the carbon black layer is deposited. And electroplating to the required thickness of the antenna copper layer. The thickness of the electroplating is generally 20-35 μm. The side of PTFE fiberglass cloth that has not been activated is generally not coated with carbon or titanium (iv) atoms, and therefore is not coated with copper. Even if minute and extremely thin copper spots may be attached to the surface which has not been subjected to the activation treatment, the copper spots can be easily removed in the subsequent brushing process. The copper layers on the activated side of the antenna pattern to be produced are very strongly bonded together.

The processing method of the PTFE fiberglass cloth intelligent card label module carrier tape with the two-layer structure is not limited to the manufacture of the intelligent card label module carrier tape, and is also suitable for tape products in the field of PTFE/copper foil flexible circuit boards.

The PTFE glass fiber cloth intelligent card label module carrier tape with a two-layer structure is manufactured by the processing method of the invention, and does not need any adhesive, and the label module carrier tape with a Teflon glass fiber cloth tape base with extremely high chemical stability has potential wide application under high temperature, humidity and severe environment because of not adopting any adhesive.

In summary, the processing method of the two-layer structure PTFE fiberglass fabric smart card label module carrier tape of the present invention has the advantages of good moisture resistance, corrosion resistance and chemical stability, and can be applied to long-term high-temperature, humid and severe environments.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that changes and modifications to the above described embodiments are within the scope of the claims of the present invention as long as they are within the spirit and scope of the present invention.