阅读说明：本技术 包括功率半导体模块和至少一个电容器的电气设备 (Electrical device comprising a power semiconductor module and at least one capacitor ) 是由 J·阿法诺 O·威莱恩 于 2019-03-19 设计创作，主要内容包括：本发明涉及一种电气设备,其具有:功率半导体模块(4)；至少一个电容器(8)；电路载体(2)和第一散热片(1)。功率半导体模块(4)和电路载体(2)布置在第一散热片(1)上,该电气设备包括布置在功率半导体模块(4)上并连接到第一散热片(1)的第二散热片(5)。(The invention relates to an electrical device comprising a power semiconductor module (4); at least one capacitor (8); a circuit carrier (2) and a first heat sink (1). The power semiconductor module (4) and the circuit carrier (2) are arranged on a first heat sink (1), and the electrical device comprises a second heat sink (5) arranged on the power semiconductor module (4) and connected to the first heat sink (1).)

1. An electrical device having

-a power semiconductor module (4),

-at least one capacitor (8),

-a circuit carrier (2), and

-a first heat sink (1),

the power semiconductor module (4) and the circuit carrier (2) are arranged on the first heat sink (1),

it is characterized in that the preparation method is characterized in that,

the electrical apparatus includes a second heat sink (5) provided on the power semiconductor module (4) and connected to the first heat sink (1).

2. An electric device as claimed in claim 1, characterized in that the capacitor (8) is arranged on the second heat sink (5).

3. The electrical apparatus according to claim 1 or 2, characterized in that the second heat sink (5) has at least one side wall (52), which is preferably substantially perpendicular to the first heat sink (1).

4. An electrical device according to claim 3, characterized in that the side wall (52) is in contact with a power semiconductor module (4).

5. The electrical apparatus according to claim 3 or 4, characterized in that the side wall (52) is placed on the first heat sink (1).

6. The electrical apparatus according to any one of claims 3 to 5, characterized in that the side wall (52) has a flange portion (53) placed on the first heat sink (1).

7. The electrical apparatus of claim 6, wherein the flange portion (53) is attached to the first heat sink (1).

8. An electric device according to any one of claims 1-7, characterized in that the capacitor (8) is a stacked capacitor or a stacked capacitor.

9. An electric device according to any one of claims 1-8, characterised in that the capacitor (8) has contact pins (81) which pass through recesses of the second heat sink (5) and are connected to the power semiconductor module (4).

Technical Field

The present invention relates to an electrical device having:

-a power semiconductor module;

-at least one capacitor;

-a circuit carrier, and

-a first heat sink fin having a first heat sink face,

wherein the power semiconductor module and the circuit carrier are arranged on the first heat sink.

Background

Various electrical devices having semiconductor power modules of the aforementioned type are known in the prior art. In one of these electrical devices, capacitors and various other power components (e.g., chokes) are disposed on a circuit carrier adjacent to a power module. The remaining area of the circuit carrier can be used for arranging further components, which are necessary for example for the control of the power semiconductor module. The power semiconductor module is connected to the conductor and the component on the circuit carrier.

Such electrical devices are also used in motor vehicles. The circuit arrangements used in motor vehicles generally require compact and take up little installation space for the electrical equipment.

Disclosure of Invention

Another problem with electrical devices having a power stage is that heat is generated in the power stage, for example in the power semiconductor module, which heat has to be dissipated to prevent damage to the power semiconductor module. In compact electrical devices with densely packed components, heat dissipation is more difficult than in circuit arrangements with components at greater distances, since the latter usually have a larger area available for heat dissipation to the environment by convection or radiation. The invention is therefore based on the object of improving the heat dissipation of an electrical device of the type described above.

The object is achieved by the fact that the electrical device has a second heat sink which is arranged on the power semiconductor module and is connected to the first heat sink. The second heat sink increases the heat transfer from the power semiconductor module, not only the first heat sink on which the power semiconductor module is mounted can be used for heat transfer, but also the second heat sink mounted on the power semiconductor module. For example, by attaching a second heat sink (which is preferably much smaller than the first heat sink and therefore has only a portion of the mass of the first heat sink), heat transferred from the power semiconductor module to the second heat sink can be transferred to the first heat sink.

Another advantage of the second heat sink is that it can be used as a carrier for circuit arrangement elements of the electrical device, such as at least one capacitor. The at least one condenser may be disposed on the second heat sink. It is also possible that the at least one capacitor is arranged above the second heat sink, instead of being firmly connected to the second heat sink. The capacitor may have contact pins, in particular press-fit contacts, which pass through the recess in the second heat sink and are connected to the power semiconductor module. The power semiconductor module may have a receptacle or socket in which the contact pins are electrically contacted and fastened.

A compact design of the electrical device is possible if the capacitor is mounted on or above the second heat sink.

The second heat sink may be connected to the power semiconductor module by screws or other connection means. The second heat sink may also be attached to the first heat sink by screws or other attachment means. Instead of using a connecting means, the connection can also be achieved by gluing. The heat transfer at the joint can be improved by using a thermally conductive paste.

The second fin may have at least one sidewall, which may be substantially perpendicular to the first fin. The side wall may be connected to the power semiconductor module. This allows additional heat to be transferred from the power semiconductor module to the second heat sink.

The sidewall may abut the first heat sink. The side wall may have a flange portion placed on the first fin. The flange portion increases heat transfer from the second fin to the first fin and promotes heat transfer.

The flange portion may be attached to the first fin.

The capacitor may preferably be a stacked capacitor or a stacked capacitor. The capacitor may in particular be a plastic film capacitor.

Drawings

The invention will be explained in more detail below on the basis of the drawings. As shown in the figure:

figure 1 is a simplified top view of an electrical device according to the invention,

figure 2 is a simplified perspective view of the electrical device,

FIG. 3 is a first simplified perspective exploded view of the electrical device, an

Fig. 4 is a second simplified perspective exploded view of the electrical device.

Detailed Description

The simplified view of the electrical device of the invention in the drawings shows a first heat sink 1. The first fin 1 is an aluminum plate.

A circuit carrier, preferably a printed circuit board 2, is mounted on the first heat sink. The printed circuit board 2 contains not shown or not all shown conductor tracks and various components. The figure shows, for example, a choke 3. The circuit carrier almost completely covers one side of the heat sink. There is only one exposed surface in one corner. In this region, power semiconductor modules 4 are arranged, which are connected to the conductor tracks and/or components on printed circuit board 2 by means of contact pins.

The power semiconductor module 4 has a housing which accommodates several power semiconductor elements.

Second heat sinks 5 are provided on the power semiconductor module 4 and on both sides of the power semiconductor module 4. The second heat sink comprises a plate 51 placed on the top side of the power semiconductor module 4. The two side walls 51 of the second heat sink 5 are attached to the outer wall of the power semiconductor module 4. Flange portions 53 can be seen at the ends of the two side walls 51. The second heat sink 5 is firmly connected to the first heat sink 1 by means of screws 6 which are guided through the flange portion 53. Further, the second heat sink 5 is firmly attached to the power semiconductor module 4 with screws 7.

The capacitor 8 is arranged above the second heat sink 5. It is a capacitor module with several capacitors which can be connected to the power semiconductor module via contact pins 81. The contact pins 81 project through recesses in the plate 51 of the second heat sink 5 and are inserted into the insertion holes or sockets of the power semiconductor module 4. The contact pins 81 are electrically contacted and fixed in the insertion hole or the receptacle, whereby the capacitor 8 is integrally secured.

List of reference numerals

1 first heat sink

2 printed circuit board

3 choke

4 power semiconductor module

5 second heat sink

51 plate

52 side wall

53 flange part

6 screw

7 screw

8 capacitor

81 contact pin