阅读说明：本技术 一种光伏硅片水性切削液及其制备方法 (A kind of photovoltaic silicon wafer aqueous cutting fluid and preparation method thereof ) 是由 曾磊 张乃文 张玉玉 纪杨 于 2019-08-20 设计创作，主要内容包括：本发明公开了一种光伏材料硅片水性切削液,按质量百分比计包括以下组分：阴离子增稠剂1％-2％、醇胺1％-2％、分子量为400-1000的聚烷二醇30％-45％、醇醚5％-10％、烷基酚聚氧乙烯醚1％-5％、三乙醇胺油酸皂0.1％-0.3％、消泡剂0.1％-0.2％及水40％-60％。本发明引入了阴离子型增稠剂,增加了切削液粘度,可有效提高磨料在切削液中的悬浮性和分散性,得到一款高磨料分散性、高切割成品率的环境友好型水性切削液,硅片切割成品率可达98％。本发明含有大量的水,不但具备优异的导热性和易清洗特点,还能大大降低生产成本。(The invention discloses a kind of photovoltaic material silicon wafer aqueous cutting fluids, by mass percentage include following components: anionic thickener 1%-2%, hydramine 1%-2%, poly- alkane glycol 30%-45%, alcohol ether 5%-10%, alkyl phenol polyoxyethylene ether 1%-5%, trihydroxy ethylamine oleate soap 0.1%-0.3%, defoaming agent 0.1%-0.2% and the water 40%-60% that molecular weight is 400-1000.Invention introduces anion thickeners, increase cutting fluid viscosity, suspension and dispersibility of the abrasive material in cutting fluid can be effectively improved, a high abrasive material dispersibility, the environment-friendly aqueous cutting fluid of high cutting yield rate are obtained, silicon wafer cuts yield rate up to 98%.The present invention contains a large amount of water, not only has excellent thermal conductivity and easy cleaning feature, moreover it is possible to substantially reduce production cost.)

1. a kind of photovoltaic material silicon wafer aqueous cutting fluid, it is characterised in that including following components: anionic thickener, divides hydramine Poly- alkane glycol, alcohol ether, alkyl phenol polyoxyethylene ether, trihydroxy ethylamine oleate soap, defoaming agent and the water that son amount is 400-1000；It is described Anionic thickener, hydramine, the poly- alkane glycol that molecular weight is 400-1000, alcohol ether, alkyl phenol polyoxyethylene ether, triethanolamine oil Sour soap, defoaming agent and water are respectively as follows: 1%-2%, 1%-2%, 30%-45%, 5%-10%, 1%- by weight percentage 5%, 0.1%-0.3%, 0.1%-0.2%, 40%-60%；

The anionic thickener is polyacrylic acid anion alkali swellability thickener；

The hydramine is at least one of diethanol amine or triethanolamine；

The poly- alkane glycol that the molecular weight is 400-1000 is at least one of polyethylene glycol and polypropylene glycol；

The alcohol ether is at least one of butyl glycol ether, diethylene glycol ether or butyl；

The alkyl phenol polyoxyethylene ether is at least one of OP-10, OP-7, TX-10；

The defoaming agent be organic silicon defoamer AT-930, organic silicon defoamer AT-889 or organic silicon defoamer AT-470 in extremely Few one kind；

The water is deionized water.

2. a kind of preparation method of photovoltaic silicon wafer aqueous cutting fluid as described in claim 1, it is characterised in that steps are as follows:

S1,1-2 parts of anionic thickener are taken, is dissolved in 40-60 parts of deionized waters, is uniformly mixing to obtain mixing thickening solution；

S2,7.5 are adjusted to by thickening solution pH value is mixed with 1-2 parts of diethanol amine or triethanolamine；

S3,30-45 parts of poly- alkane glycol, 5-10 parts of alcohol ethers, 1-5 parts of alkyl phenol polyoxyethylene ether, three second of 0.1-0.3 part are sequentially added Hydramine oleate soap, is mixed evenly；

S4,0.1-0.2 parts of defoaming agents are added, obtain and is used for photovoltaic silicon wafer aqueous cutting fluid.

Technical field

The invention belongs to silicon chip cutting fields, are related to a kind of cutting fluid, and in particular to one kind is used for photovoltaic material silicon wafer system Aqueous cutting fluid made and preparation method thereof.

Background technique

As science and technology is constantly progressive, the production and use of photovoltaic material enter swift and violent build phase, along with photovoltaic material The rapid development of material, higher requirements are also raised for manufacture of the people to its upstream silicon wafer.Major diameter, thin thickness and high surface The inexorable trend that the silicon wafer cutting of precision has become current silicon wafer cutting market development is cut under this trend for silicon wafer The cutting fluid cut is also required to further increase its performance, to meet further cutting demand.High performance cutting fluid, both may be used To guarantee the quality of gained silicon chip product, and the yield rate of silicon wafer cutting can be improved, the consumption of the energy is reduced, to reduce enterprise Industry production cost improves the market competitiveness of enterprise.

Cutting fluid domestic at present, is broadly divided into oiliness cutting fluid and aqueous cutting fluid two major classes, oiliness cutting fluid is with mine Object oil is main component, and lubricity is good, but high production cost, poor thermal conductivity, not easy cleaning, and need to be used when cleaning a large amount of Organic solvent causes biggish pollution to environment.Aqueous cutting fluid, thermal conductivity is good, is readily cleaned, and when cleaning uses water, The pollution to environment is greatly reduced, is the Main way of the following cutting fluid development.But there is mill in current aqueous cutting fluid Expect bad dispersibility, cut the problems such as yield rate is low.Therefore, a kind of environment friend of dispersed, the high cutting yield rate of high abrasive material is developed Good type aqueous cutting fluid has important social effect and economic value.

Summary of the invention

Present invention mainly solves above-mentioned deficiencies, provide a kind of the environmentally friendly of dispersed, the high cutting yield rate of high abrasive material Aqueous cutting fluid and preparation method thereof.

The present invention is mainly by anionic thickener, hydramine, poly- alkane glycol, the alcohol ether, alkyl phenol that molecular weight is 400-1000 Polyoxyethylene ether, trihydroxy ethylamine oleate soap, defoaming agent and water composition；The anionic thickener, hydramine, molecular weight 400- 1000 poly- alkane glycol, alcohol ether, alkyl phenol polyoxyethylene ether, trihydroxy ethylamine oleate soap, defoaming agent and water is by weight percentage Be respectively as follows: 1%-2%, 1%-2%, 30%-45%, 5%-10%, 1%-5%, 0.1%-0.3%, 0.1%-0.2%, 40%-60%.

The anionic thickener is polyacrylic acid anion alkali swellability thickener, cutting fluid can be made to have suitable viscous Degree, makes silicon-carbide particle be more evenly distributed when mixing with cutting fluid, to obtain excellent suspended dispersed.

The hydramine is allowed to alkali on the weak side for the pH value of regulation system at least one of diethanol amine or triethanolamine Property.

The poly- alkane glycol that the molecular weight is 400-1000 is at least one of polyethylene glycol and polypropylene glycol, can make to cut Liquid has good suspension, dispersion and refrigerating function.

The alcohol ether is at least one of butyl glycol ether, diethylene glycol ether or butyl.It can substantially reduce The surface tension of cutting fluid enhances the permeability and mobility of cutting fluid, makes it have good cleaning function.

The alkyl phenol polyoxyethylene ether is at least one of OP-10, OP-7, TX-10, and the wetability of cutting fluid can be improved And dispersibility.

The lubrication and crush resistance of cutting fluid can be improved in the trihydroxy ethylamine oleate soap, while there is certain anti-corrosion to make With.

The defoaming agent is organic silicon defoamer AT-930, organic silicon defoamer AT-889 or organic silicon defoamer AT-470 At least one of, for eliminating extra bubble in system, while inhibiting the generation of bubble.

The water is deionized water, contains a large amount of water in system, is greatly improved the thermal conductivity and easy cleaning of cutting fluid Property, while reducing production cost.

A kind of preparation method for photovoltaic silicon wafer cutting fluid, comprising the following steps:

S1,1-2 parts of anionic thickener are taken, be dissolved in 40-60 parts of deionized waters, it is molten to be uniformly mixing to obtain mixing thickening Liquid；

S2,7.5 are adjusted to by thickening solution pH value is mixed with 1-2 parts of diethanol amine or triethanolamine；

S3,30-45 parts of poly- alkane glycol are sequentially added, 5-10 parts of alcohol ethers, 1-5 parts of alkyl phenol polyoxyethylene ether, 0.1-0.3 parts Trihydroxy ethylamine oleate soap is mixed evenly；

S4,0.1-0.2 parts of defoaming agents are added, obtain and is used for photovoltaic silicon wafer aqueous cutting fluid.

The present invention compared with the existing technology, has the advantages that

Using anionic acrylic thickened systems, cutting fluid can be made to have suitable viscosity, make silicon-carbide particle with cut It is more evenly distributed when cutting liquid mixing, to obtain excellent suspended dispersed；Contain a large amount of water in system, is greatly improved and cuts The thermal conductivity and easy cleaning of liquid are cut, while also reducing production cost；Using poly- alkane glycol mixed system, further increase The suspended dispersed and cooling performance of cutting fluid；Due to being added to ethylene glycol monobutyl ether, diethylene glycol ether, diethylene glycol fourth Ether, is greatly reduced the surface tension of cutting fluid, to reduce cutting stress when silicon wafer cutting；Alkyl phenol polyoxyethylene ether Addition, increase the dispersion stabilization and wetability of system；Trihydroxy ethylamine oleate soap can be improved the lubrication of cutting fluid and resist and squeezes Pressure property, while there is certain antisepsis.

Specific embodiment