阅读说明：本技术 镜头模组及该镜头模组的组装方法 (The assemble method of lens module and the lens module ) 是由 张龙飞 陈信文 李堃 李帅鹏 于 2018-05-22 设计创作，主要内容包括：一种镜头模组,包括一电路板、一感光芯片、一滤光片、一中空的安装支架以及一镜头单元,所述镜头单元包括一镜头以及一镜座,所述镜头安装于所述镜座中,所述感光芯片固定于所述电路板上,所述滤光片固定于所述安装支架的其中一侧,带有所述滤光片的所述安装支架的另一侧固定于所述电路板上,使所述安装支架将所述容置于其中,其中,所述滤光片包括远离所述感光芯片的一表面,所述滤光片的所述表面的边缘形成有一遮盖层,所述安装支架与所述滤光片之间所形成的一第一间隙以及所述安装支架与所述遮盖层之间所形成的一第二间隙的至少一个形成有一防尘胶层,所述镜头单元的所述镜座固定于所述安装支架上。(A kind of lens module, including a circuit board, one sensitive chip, one optical filter, one hollow mounting bracket and a lens unit, the lens unit includes a camera lens and a microscope base, the camera lens is installed in the microscope base, the sensitive chip is fixed on the circuit board, the optical filter is fixed on the wherein side of the mounting bracket, the other side of the mounting bracket with the optical filter is fixed on the circuit board, it is placed in the mounting bracket wherein described, wherein, the optical filter includes the surface far from the sensitive chip, the edge on the surface of the optical filter is formed with a covering layer, it is formed by between the mounting bracket and the optical filter and is formed by least one of one second gap between one first gap and the mounting bracket and the covering layer and is formed with a dust-proof glue-line , the microscope base of the lens unit is fixed in the mounting bracket.)

1. a kind of assemble method of lens module, comprising:

One circuit board, a sensitive chip, an optical filter, a hollow mounting bracket, a camera lens and a hollow microscope base are provided；

The camera lens is installed in the microscope base to form a lens unit；

The sensitive chip is fixed on the circuit board；

The optical filter is fixed on to the wherein side of the mounting bracket, and the mounting bracket that will have the optical filter The other side be fixed on the circuit board, be placed in the mounting bracket sensitive chip wherein and makes the optical filtering Piece is opposite with the sensitive chip, wherein the optical filter includes the surface far from the sensitive chip；

A covering layer is formed at the edge on the surface of the optical filter, and between the mounting bracket and the optical filter It is formed by between one first gap and the mounting bracket and the covering layer and is formed by least the one of one second gap A dust-proof glue of coating, solidifies the dust-proof glue then to form a dust-proof glue-line；And

The microscope base of the lens unit is fixed in the mounting bracket, the camera lens and the sensitive chip phase are made It is right, to obtain the lens module.

2. the assemble method of lens module as described in claim 1, which is characterized in that the covering layer is by coating or printing The mode of brush is formed in the ink layer on the optical filter, and the edge of the covering layer is flushed with the edge of the optical filter.

3. the assemble method of lens module as described in claim 1, which is characterized in that the mounting bracket offers an accommodating Hole, the sensitive chip are placed in the accommodating hole, and the mounting bracket is formed close to the side of accommodating hole recess One stage portion, the optical filter are fixed in the stage portion, flush the optical filter and the surface of the mounting bracket.

4. the assemble method of lens module as described in claim 1, which is characterized in that a wherein surface for the circuit board is set There are multiple electronic components and golden finger, the sensitive chip and the mounting bracket are fixed on the circuit board with described On the surface of electronic component and the golden finger, the mounting bracket for having the optical filter is being fixed on the circuit When on plate, the electronic component and the golden finger position are in the inside of the mounting bracket.

5. the assemble method of lens module as described in claim 1, which is characterized in that the microscope base is voice coil motor.

6. a kind of lens module, including a circuit board, a sensitive chip, an optical filter, a hollow mounting bracket and a mirror Head unit, the lens unit include that a camera lens and a hollow microscope base, the camera lens are installed in the microscope base, the sense Optical chip is fixed on the circuit board, and the optical filter is fixed on the wherein side of the mounting bracket, has the optical filtering The other side of the mounting bracket of piece is fixed on the circuit board, is placed in the mounting bracket by the sensitive chip Wherein and keep the optical filter opposite with the sensitive chip, wherein the optical filter includes one far from the sensitive chip Surface, the edge on the surface of the optical filter are formed with a covering layer, institute between the mounting bracket and the optical filter At least one of one second gap is formed by between one first gap formed and the mounting bracket and the covering layer Be formed with a dust-proof glue-line, the microscope base of the lens unit is fixed in the mounting bracket, make the camera lens with it is described Sensitive chip is opposite.

7. lens module as claimed in claim 6, which is characterized in that the covering layer is ink layer, the side of the covering layer Edge is flushed with the edge of the optical filter.

8. lens module as claimed in claim 6, which is characterized in that the mounting bracket offers an accommodating hole, the sense Optical chip is placed in the accommodating hole, and the mounting bracket forms a stage portion close to the side of accommodating hole recess, The optical filter is fixed in the stage portion, flushes the optical filter and the surface of the mounting bracket.

9. lens module as claimed in claim 6, which is characterized in that a wherein surface for the circuit board is equipped with multiple electronics Element and golden finger, the sensitive chip and the mounting bracket be fixed on the circuit board with the electronic component with And on the surface of the golden finger, when the mounting bracket for having the optical filter is fixed on the circuit board, institute Electronic component and the golden finger position are stated in the inside of the mounting bracket.

10. lens module as claimed in claim 6, which is characterized in that the microscope base is voice coil motor.

Technical field

The present invention relates to the assemble methods of field of photography more particularly to a kind of lens module and the lens module.

Background technique

Known lens module generally comprises a circuit board, is fixed on the circuit board a sensitive chip, around institute State a bracket of sensitive chip, be covered on the bracket and an optical filter opposite with the sensitive chip, be fixed on it is described A microscope base on bracket and the camera lens being placed in the microscope base.In practical work process, under strong light when photographed, Strong light may be got on the plain conductor of the sensitive chip and the electronic component of surrounding by the optical filter, and then be reflected To sensitive chip, so that apparent hot spot or stain are formed in image, to influence the quality of imaging.

Summary of the invention

In view of this, being able to solve problem above it is necessary to provide a kind of lens module.

In addition, there is a need to provide a kind of assemble method of above-mentioned lens module.

The embodiment of the present invention provides a kind of assemble method of lens module, comprising: provide a circuit board, a sensitive chip, One optical filter, a hollow mounting bracket, a camera lens and a hollow microscope base；By the camera lens be installed in the microscope base with Form a lens unit；The sensitive chip is fixed on the circuit board；The optical filter is fixed on the installation branch The wherein side of frame, and the other side of the mounting bracket with the optical filter is fixed on the circuit board, make institute It states mounting bracket to be placed in wherein the sensitive chip and keep the optical filter opposite with the sensitive chip, wherein described Optical filter includes the surface far from the sensitive chip；A covering layer is formed at the edge on the surface of the optical filter, And one first gap and the mounting bracket and the covering are formed by between the mounting bracket and the optical filter It is formed by least one the dust-proof glue of coating in one second gap between layer, solidifies the dust-proof glue then to form a dust-proof glue Layer；And the microscope base of the lens unit is fixed in the mounting bracket, make the camera lens and the sensitive chip Relatively, to obtain the lens module.

The embodiment of the present invention also provides a kind of lens module, including a circuit board, a sensitive chip, an optical filter, in one Empty mounting bracket and a lens unit, the lens unit include a camera lens and a hollow microscope base, the camera lens peace Loaded in the microscope base, the sensitive chip is fixed on the circuit board, and the optical filter is fixed on the mounting bracket Another surface on a wherein surface, the mounting bracket with the optical filter is fixed on the circuit board, and the peace is made Dress bracket is placed in wherein by described and keeps the optical filter opposite with the sensitive chip, wherein the optical filter includes far A surface from the sensitive chip, the edge on the surface of the optical filter are formed with a covering layer, the mounting bracket It is formed by between the optical filter between one first gap and the mounting bracket and the covering layer and is formed by one At least one of second gap is formed with a dust-proof glue-line, and the microscope base of the lens unit is fixed on the mounting bracket On, keep the camera lens opposite with the sensitive chip.

In the embodiment of the present invention, it is described photosensitive that the covering layer can prevent a part of light from being reflexed to by the mounting bracket On chip, and then the formation of hot spot is prevented, improves image quality；The dust-proof glue-line can prevent another part light through the peace It is formed by between second between the first gap or the mounting bracket and the covering layer between dress bracket and the optical filter Gap is got on the sensitive chip, and then further prevents the formation of hot spot, moreover, the dust-proof glue-line has centainly dust-proof Effect can prevent dust or other particles or the camera lens and the clast that the microscope base phase mutual friction generates in air from passing through Gap between the camera lens and the microscope base is fallen on the optical filter, and then prevents occurring stain in image.

Detailed description of the invention

Fig. 1 is the flow chart of the assemble method of the lens module of a better embodiment of the invention.

Fig. 2 is the structural schematic diagram of the lens module of a better embodiment of the invention.

Fig. 3 is the explosive view of lens module shown in Fig. 2.

Fig. 4 is diagrammatic cross-section of the lens module shown in Fig. 2 along the direction IV-IV.

Symbol description

The present invention that the following detailed description will be further explained with reference to the above drawings.

Specific embodiment

Fig. 1 illustrates a kind of assemble method for lens module that a better embodiment of the invention provides.According to different need It asks, sequence can change the step of the assemble method of the lens module, and certain steps can be omitted or merge.Please with reference to The assemble method of Fig. 2 to Fig. 4, the lens module include the following steps:

Step S 1: provide a circuit board 10, a sensitive chip 20, an optical filter 30, one hollow mounting bracket 40, one The hollow microscope base 60 of camera lens 50, one and a protection cap 70.

In the present embodiment, the circuit board 10 is a printed circuit board, such as soft board, hardboard or Rigid Flex, institute It states and a connector 11 is installed on a wherein surface for circuit board 10, another surface is equipped with multiple electronic components 12 and golden hand Refer to 13.

In the present embodiment, the sensitive chip 20 is complementary metal oxide semiconductor (CMOS) chip or charge coupling Close element (CCD) chip.

In the present embodiment, the mounting bracket 40 is generally rectangular shaped, wherein offering an accommodating hole 41.The accommodating The width in hole 41 is greater than the width of the sensitive chip 20.

In the present embodiment, the material of the camera lens 50 can be resin.The microscope base 60 can be a voice coil motor, described A through-hole 61 is equipped in microscope base 60.

Step S2: the camera lens 50 is installed in the microscope base 60 to form a lens unit 51.

Wherein, the camera lens 50 is installed in the through-hole 61 of the microscope base 60.

Step S3: the sensitive chip 20 is pasted on the circuit board 10.

Wherein, the sensitive chip 20 is pasted on the circuit board 10 on the surface of the electronic component 12.

Wherein, the golden finger 13 is located at around the sensitive chip 20, and the sensitive chip 20 is far from the circuit board 10 surface is equipped with plain conductor 21, and the plain conductor 21 is electrically connected with the golden finger 13.The plain conductor 21 can It is made of the higher metal of conductivity, such as gold.

Step S4: the optical filter 30 is pasted on to the wherein side of the mounting bracket 40, and the optical filtering will be had The other side of the mounting bracket 40 of piece 30 is pasted on the circuit board 10, makes the mounting bracket 40 by the photosensitive core Piece 20 is placed in the accommodating hole 41 and keeps the optical filter 30 opposite with the sensitive chip 20.Wherein, the optical filter 30 include the surface 31 far from the sensitive chip 20.

In the present embodiment, another surface mount of the mounting bracket 40 of the optical filter 30 will had in institute When stating on circuit board 10, the electronic component 12 and the golden finger 13 are located at the accommodating hole 41 of the mounting bracket 40 It is interior.

In the present embodiment, the mounting bracket 40 is forming a step close to the side of the accommodating hole 41 recess Portion 42, the optical filter 30 are pasted in the stage portion 42 by an adhesive layer 31, make the optical filter 30 and the installation The surface of bracket 40 is substantially flush.The material of the adhesive layer 31 can be common optical cement

Step S5: a covering layer 80 is formed at the edge on the surface 31 of the optical filter 30, and in installation branch It is formed by between frame 40 and the optical filter 30 between one first gap and the mounting bracket 40 and the covering layer 80 It is formed by least one the dust-proof glue of coating in one second gap, solidifies the dust-proof glue then to form a dust-proof glue-line 90.

In the present embodiment, the covering layer 80 is to be formed on the surface 31 by way of coating or printing Ink layer.The edge of the covering layer 80 and the edge of the optical filter 30 are substantially flush.

In the present embodiment, the dust-proof glue can be dustproof silica gel or dust protection rubber.

Step S6: the microscope base 60 of the lens unit 51 is pasted in the mounting bracket 40, the camera lens is made 50 is opposite with the sensitive chip 20, and the protection cap 70 is covered on the microscope base 60 of the lens unit 51, from And obtain the lens module 100.

Please with reference to Fig. 2 to Fig. 4, better embodiment of the present invention also provides a kind of lens module 100, is applied to one In electronic device (not shown).The electronic device can be a smart phone or a tablet computer etc..The lens module 100 is wrapped Include the hollow mounting bracket 40 of a circuit board 10, a sensitive chip 20, an optical filter 30, one, a lens unit 51 and one is protected Protecting cover 70.

The lens unit 51 includes that a camera lens 50 and a hollow microscope base 60, the camera lens 50 are installed on the microscope base In 60.

The sensitive chip 20 is pasted on the circuit board 10.The optical filter 30 is pasted on the mounting bracket 40 Wherein side.The other side of the mounting bracket 40 with the optical filter 30 is pasted on the circuit board 10, is made described Mounting bracket 40 is placed in wherein by described and keeps the optical filter 30 opposite with the sensitive chip 20.Wherein, the optical filtering Piece 30 includes the surface 31 far from the sensitive chip 20.The edge on the surface 31 of the optical filter 30 is formed with a screening Cap rock 80.Be formed by between the mounting bracket 40 and the optical filter 30 one first gap and the mounting bracket 40 with At least one for being formed by one second gap between the covering layer 80 is formed with a dust-proof glue-line 90.

The microscope base 60 is pasted in the mounting bracket 10, keeps the camera lens 50 opposite with the sensitive chip 20.Institute Protection cap 70 is stated to be covered on the microscope base 60.

In use, the optical filter 30 through the camera lens 50 for that will be projected to the filter of the infrared ray in the optical signal on its surface It removes.The sensitive chip 20 is used to the optical signal filtered out after infrared ray for being projected to its surface being converted to electric signal, and will The electric signal is exported by the plain conductor 21 to the circuit board 10, thus, the circuit board 10 can to the electric signal into Row processing is to obtain required image.Wherein, the lens module 100 can be by its of the connector 11 and the electronic device Its component is connected, and the circuit board 10 provides the mechanical support effect of fixation and the assembly of the electronic component 12, realizes Wiring between the electronic component 12.

The surrounding on the surface due to the optical filter 30 far from the sensitive chip 20 has coating covering layer 80, the covering Layer 80 can prevent a part of light from being reflexed on the sensitive chip 20 by the mounting bracket 40 and the electronic component 1, And then the formation of hot spot is prevented, improve image quality.Furthermore due between the mounting bracket 40 and the optical filter 30 and Gap between the mounting bracket 40 and the ink wire mark is coated with dust-proof glue-line 90, and the dust-proof glue-line 90 can prevent separately A part of light is got on the sensitive chip 20 through the gap, and then further prevents the formation of hot spot.Moreover, not formed Before the dust-proof glue-line 90, the viscose glue area of the optical filter 30 is only limitted to the area of the adhesive layer 31, and described dust-proof Glue-line 90 can increase the viscose glue area of the optical filter 30, to improve the reliability and stability of the lens module 100. Finally, the dust-proof glue-line 90 has certain dustproof effect, dust in air or other particles or the mirror can be prevented First 50 clasts generated with the 60 phase mutual friction of microscope base are fallen through the gap between the camera lens 50 and the microscope base 60 in institute It states on optical filter 30, and then prevents occurring stain in image.

Those skilled in the art it should be appreciated that more than embodiment be intended merely to illustrate the present invention, And be not used as limitation of the invention, as long as within spirit of the invention, it is to the above embodiments Appropriate change and variation are all fallen within the scope of protection of present invention.