阅读说明：本技术 物体交换装置、物体处理装置、平板显示器的制造方法、元件制造方法、物体交换方法、以及物体处理方法 (Object switch, object processing apparatus, the manufacturing method of flat-panel monitor, manufacturing method, object exchange method and object processing method ) 是由 青木保夫 牛島康之 于 2018-03-23 设计创作，主要内容包括：为了缩短基板交换所耗费的时间,物体交换装置具备：第一支承部(68),其支承物体(P1)的第一面；第二支承部(152),其从所述第一支承部接收所述物体,并支承所述物体的与所述第一面不同的第二面；以及驱动部(43),其对将所述物体交接到了所述第二支承部的所述第一支承部(68),向与所述物体不同的其他物体(P2)被搬入至所述第一支承部的物体交换位置进行驱动。(In order to shorten the time spent by substrate exchange, object switch has: the first supporting part (68), the first face of bearing objects (P1)；Second supporting part (152) receives the object from first supporting part, and supports second faces different from first face of the object；And driving portion (43), it is moved to the object exchange position of first supporting part to other objects (P2) different from the object and is driven to first supporting part (68) that the object has been handed off to second supporting part.)

1. a kind of object switch, wherein have:

First supporting part, the first face of bearing objects；

Second supporting part receives the object from first supporting part, and support the object with first face not The second same face；And

Driving portion, to first supporting part that the object has been handed off to second supporting part, to confession and the object Other different objects of body are moved to the object exchange position of first supporting part and are driven.

2. object switch according to claim 1, wherein

Second supporting part is exchanging position driving process to the object to first supporting part by the driving portion In, the object is received from first supporting part.

3. object switch according to claim 1 or 2, wherein

Second supporting part is from the one end side for the object for being located at object exchange position side to the other end side Sequence support the object.

4. object switch described according to claim 1~any one of 3, wherein

Second supporting part includes maintaining part, keeps a part of the object；And driving part, with the object A part the maintaining part is driven by the mode that second supporting part supports.

5. object switch according to claim 4, wherein

The driving part is in such a way that another part of the object is by second supporting part bearing, to the holding object A part the maintaining part to the object exchange position side driven.

6. object switch described according to claim 1~any one of 5, wherein

First supporting part assigns first face and suspends in such a way that the object is by second supporting part bearing Power.

7. object switch according to claim 6, wherein

First supporting part is in such a way that the distance between first face and first supporting part are widened, to the object Assign the suspending power.

8. object switch described according to claim 1~any one of 7, wherein

It is also equipped with and moves in device, it is described to move in device for other described objects along described first opposed with first face Mounting surface in bearing portion is moved in first supporting part.

9. object switch according to claim 8, wherein

The device of moving in is moved in other described objects to first bearing in a manner of by first supporting part bearing Between portion and the object.

10. object switch according to claim 8 or claim 9, wherein

It is described to move in device and move in other described objects to first supporting part of a part for being supported with the object.

11. the object switch according to any one of claim 8~10, wherein

The device of moving in is moved in other described objects to first supporting part with one side, and the object is handover on one side The mode of second supporting part assigns power to first face.

12. object switch described according to claim 1~any one of 7, wherein

It is also equipped with and moves in device, it is described to move in device for other described objects along described first opposed with first face Mounting surface in bearing portion is moved in first supporting part,

It is another described in the lateral-supporting for moving in the one end that device supports the object from first supporting part Other described objects are moved in the side of end.

13. the object switch according to any one of claim 8~12, wherein

First supporting part assigns the power for capableing of object or other objects described in suspension bearing,

It is described move in device and will be suspended other objects described in bearing move in first supporting part.

14. the object switch according to any one of claim 8~13, wherein

Other described objects have been moved to described in first supporting part and have moved in device for the object from described second Bearing portion moves out.

15. the object switch according to any one of claim 8~14, wherein

Holding meanss are also equipped with, the holding meanss holding is moved in device described in and moved in first supporting part and by institute Other described objects of the first supporting part suspension bearing are stated, and make other described objects relative to the opposite drive of first supporting part It is dynamic.

16. object switch according to claim 15, wherein

The second supporting part bearing has been released from the object of the holding based on the holding meanss.

17. object switch described according to claim 1~any one of 16, wherein

The object supported by second supporting part is supported by the self weight and gravity of the object from described second Portion moves out.

18. object switch described according to claim 1~any one of 16, wherein

Second supporting part moves out the object in the state of supporting second face.

19. object switch described according to claim 1~any one of 18, wherein

Second supporting part controls the gas between second face and second supporting part, the non-contact bearing object Second face.

20. object switch described according to claim 1~any one of 19, wherein

First supporting part to the object exchange position drive direction on, first supporting part with described second The distance between bearing portion continuously changes.

21. object switch described in 9 or 20 according to claim 1, wherein

Second supporting part, which has, falls preventing portion, it is described fall preventing portion so that the object of the non-contact bearing not The mode fallen keeps first surface side.

22. object switch described according to claim 1~any one of 21, wherein

Be also equipped with driving device, the driving device with by the object from first supporting part to second supporting part On the direction of handover, the mode that the relative distance of first supporting part and second supporting part shortens, to described first Any one supporting part in bearing portion and second supporting part is driven.

23. a kind of object processing apparatus, wherein have:

Object switch described in any one of claim 1~22；With

Processing unit, in the processing position different from object exchange position, to the object on first supporting part Or second face of other objects carries out predetermined processing.

24. object processing apparatus according to claim 23, wherein

The driving portion has carried out first supporting part of the object of the predetermined processing to bearing, from the processing position It sets to object exchange position and is driven.

25. the object processing apparatus according to claim 23 or 24, wherein

The processing unit is to be scanned exposure to second face of the object using energy beam, by predetermined pattern shape At the patterning device on second face.

26. object processing apparatus according to claim 25, wherein

The driving portion drives the object on first supporting part in the scan exposure.

27. object processing apparatus according to claim 25, wherein

The driving portion drives other objects described in being moved on first supporting part in the scan exposure It is dynamic.

28. a kind of object processing apparatus, wherein have:

Object switch described in claim 15 or 16；With

Processing unit, from the different processing position in object exchange position, using energy beam come to being held in the guarantor Second face of the object or other objects of holding device is scanned exposure, and predetermined pattern is formed in described On two faces,

The holding meanss are driven in the scan exposure relative to first supporting part relatively.

29. the object processing apparatus according to claim 23 or 24, wherein

The processing unit is the check device checked the second face of the object.

30. the object processing apparatus according to any one of claim 23~28, wherein

The object and other described objects are substrates used in the display panel of display equipment.

31. object processing apparatus according to claim 30, wherein

The object and other described objects are the substrates having a size of 500mm or more.

32. a kind of manufacturing method of flat-panel monitor, wherein include:

Using object processing apparatus described in claim 30 or 31 come the step of being exposed to the object；With

The step of developing to the object exposed.

33. a kind of manufacturing method, wherein include:

Using object processing apparatus described in claim 30 or 31 come the step of being exposed to the object；With

The step of developing to the object exposed.

34. a kind of object exchange method, wherein include:

Receive and the object in the first face supported by the first supporting part, and the object is supported by the second supporting part with it is described The step of different the second face in first face；With

To first supporting part that the object has been handed off to second supporting part, to for its different from the object His object is moved to the object exchange position of first supporting part the step of driving.

35. object exchange method according to claim 34, wherein

When carrying out the bearing, during first supporting part drives to object exchange position, from described first Supporting part receives the object.

36. the object exchange method according to claim 34 or 35, wherein

When carrying out the bearing, from the one end side for the object for being located at object exchange position side to the other end The sequence of side supports the object.

37. the object exchange method according to any one of claim 34~36, wherein

It is described that further include a part to be held in the object of maintaining part driven in a manner of second supporting part bearing Maintaining part.

38. the object exchange method according to claim 37, wherein

When carrying out the driving, in such a way that another part of the object is by second supporting part bearing, to the guarantor Portion is held to be driven to object exchange position side.

39. the object exchange method according to any one of claim 34~38, wherein

It further include in such a way that the object on first supporting part is by second supporting part bearing, to first face The step of assigning suspending power.

40. object exchange method according to claim 39, wherein

When carrying out the imparting, in such a way that the distance between first face and first supporting part are widened, to described Object assigns the suspending power.

41. the object exchange method according to any one of claim 34~40, wherein

It further include by moving in device for other described objects along on first supporting part opposed with first face The step of mounting surface is moved in first supporting part.

42. object exchange method according to claim 41, wherein

When moving in described in the progress, by other described objects in a manner of by first supporting part bearing, move in described the Between one supporting part and the object.

43. the object exchange method according to claim 41 or 42, wherein

When moving in described in the progress, other described objects are removed to first supporting part of a part for being supported with the object Enter.

44. the object exchange method according to any one of claim 41~43, wherein

When moving in described in the progress, other described objects are moved in first supporting part with one side, on one side the object quilt The mode for being handover to second supporting part assigns power to first face.

45. the object exchange method according to any one of claim 41~44, wherein

It further include keeping being moved in first supporting part and being supported by described first by the device of moving in by holding meanss Other described objects of portion's suspension bearing, and make other described objects relative to first supporting part opposite the step of driving.

46. the object exchange method according to any one of claim 34~45, wherein

When carrying out the bearing, the gas between second face and second supporting part is controlled, described in non-contact bearing Second face of object.

47. a kind of object processing method, wherein include:

Object exchange method described in any one of claim 34~45；With

From the different processing position in object exchange position, on first supporting part the object or it is described other Second face of object carries out the step of predetermined processing.

48. object processing method according to claim 47, wherein

When carrying out the driving, first supporting part of the object of the predetermined processing is carried out to bearing, from institute Processing position is stated to be driven to object exchange position.

49. the object processing method according to claim 47 or 48, wherein

When carrying out the predetermined processing, exposure is scanned to second face of the object using energy beam, it will Predetermined pattern is formed on second face.

50. a kind of object processing method, wherein include:

Object exchange method described in claim 45；With

In the processing position different from object exchange position, using energy beam come to the institute for being held in the holding meanss Second face for stating object or other objects is scanned exposure, and predetermined pattern is formed in the step on second face Suddenly,

When carrying out the opposite driving, in the scan exposure, relative to first supporting part to other described objects Carry out opposite driving.

Technical field

The present invention relates to object switch, object processing apparatus, the manufacturing method of flat-panel monitor, element manufacturers Method, object exchange method and object processing method.

Background technique

Manufacture liquid crystal display element, the electronic components such as semiconductor element photo-mask process in, using utilizing energy beam The pattern that will be formed in exposure mask (or graticule) is transferred to exposure device on glass substrate (or wafer).

As this exposure device, it is known to following exposure device: being carried substrate using defined base board delivery device On platform device completion exposure glass substrate move out after, using aforesaid substrate carrying device by other glass substrates move in On baseplate carrier device, the glass substrate for being held in baseplate carrier device is thus successively exchanged, and continuous to multiple glass substrates Ground is exposed processing (for example, referring to patent document 1).When being continuously exposed to multiple glass substrates, also for mentioning Whole production capacity is risen, the glass substrate on baseplate carrier device is preferably rapidly exchanged.

Patent document 1: No. 2010/0266961 specification of U.S. Patent Application Publication No..

Summary of the invention

According to first method, a kind of object switch is provided, is had: the first supporting part, the first of bearing objects Face；Second supporting part receives the object from first supporting part, and supports the different from first face of the object The second face；And driving portion, to first supporting part that the object has been handed off to second supporting part, to confession Other objects different from the object are moved to the object exchange position of first supporting part and are driven.

According to second method, a kind of object processing apparatus is provided, is had: above-mentioned object switch；And processing unit, It is in the processing position different from object exchange position, to the object or other described objects on first supporting part Second face of body carries out predetermined processing.

According to Third Way, a kind of manufacturing method of flat-panel monitor is provided comprising: dress is handled using above-mentioned object The step of setting to be exposed to object；With the step of developing to the object exposed.

According to fourth way, a kind of manufacturing method is provided comprising: using above-mentioned object processing apparatus come to object The step of body is exposed；With the step of developing to the object exposed.

According to the 5th mode, a kind of object exchange method is provided comprising: it receives and supports first by the first supporting part The object in face, and the step of supporting by the second supporting part second faces different from first face of the object；With to will The object has been handed off to first supporting part of second supporting part, to for other object quilts different from the object The step of object exchange position moved in first supporting part is driven.

According to the 6th mode, a kind of object processing method is provided comprising: above-mentioned object exchange method；With with institute The different processing position in object exchange position is stated, to described in the object or other described objects on first supporting part Second face carries out the step of predetermined processing.

In addition it is also possible to suitably be improved to the structure of aftermentioned embodiment, alternatively, it is also possible to incite somebody to action at least part Instead of other constructs.Further, the constitutive requirements being not particularly limited about its configuration are not limited in embodiments Disclosed configuration, and the position that its function may be implemented can be configured at.

Detailed description of the invention

Fig. 1 is the figure for schematically showing the structure of liquid crystal exposure apparatus involved in first embodiment.

Fig. 2 is the top view of the liquid crystal exposure apparatus (omitting part) of Fig. 1.

(a) of Fig. 3~Fig. 3 (c) is that substrate possessed by liquid crystal exposure apparatus for explanatory diagram 1 moves in the dynamic of device The figure of work.

(a) of Fig. 4~Fig. 4 (c) is the figure (its 1) for illustrating the movement of the substrate exchange in first embodiment.

(a) of Fig. 5~Fig. 5 (c) is the figure (its 2) for illustrating the movement of the substrate exchange in first embodiment.

(a) of Fig. 6 and (b) of Fig. 6 are for illustrating that the substrate exchange in the variation 1 of first embodiment acts Figure.

(a) of Fig. 7 is the structure for schematically showing liquid crystal exposure apparatus involved in the variation 2 of first embodiment Figure, (b) of Fig. 7 is the top view of the liquid crystal exposure apparatus (part omit) of Fig. 7 (a) from the side-Z.

Fig. 8 is the figure for schematically showing the structure of liquid crystal exposure apparatus involved in the variation 3 of first embodiment.

(a) of Fig. 9 is the figure for schematically showing the structure of liquid crystal exposure apparatus involved in second embodiment, Fig. 9 (b) and Fig. 9 (c) be for illustrate the substrate exchange in second embodiment movement figure.

(a) of Figure 10 is the figure for schematically showing the structure of liquid crystal exposure apparatus involved in third embodiment, figure 10 (b) is the figure (its 1) for illustrating the movement of the substrate exchange in third embodiment.

(a) of Figure 11 and (b) of Figure 11 are the figures (its 2) for illustrating the movement of the substrate exchange in third embodiment.

Figure 12 is the figure for schematically showing the structure of liquid crystal exposure apparatus involved in the 4th embodiment.

(a) of Figure 13 and (b) of Figure 13 are for illustrating that the substrate exchange in the variation 1 of the 4th embodiment acts Figure.

Specific embodiment

" first embodiment "

Firstly, (c) based on FIG. 1 to FIG. 5 is illustrated first embodiment.

In Fig. 1, it is schematically shown the structure of liquid crystal exposure apparatus 10 involved in first embodiment.In addition, In In Fig. 2, the top view (omitting part) of liquid crystal exposure apparatus 10 involved in first embodiment is shown.Liquid crystal exposure apparatus 10 E.g. by glass substrate P (the hreinafter referred to as base of rectangle (rectangular) used in liquid crystal display device (flat-panel monitor) etc. Plate P) as exposure object object step-scan mode projection aligner, i.e. so-called scanner.

Liquid crystal exposure apparatus 10 includes lighting system 12, the exposure mask for being formed with the exposure mask M of the patterns such as circuit pattern is kept to carry Platform 14, a pair of of microscope carrier pedestal 18, keeps surface (towards the face of the side+Z in Fig. 1) to be coated with photoresist (induction at projection optical system 16 Agent) baseplate carrier device 20, pendency supporting arrangement 150, the substrate of substrate P move in device 130 and their control system Deng.Hereinafter, the direction that the exposure mask M in exposure and substrate P are carried out to relative scanning respectively relative to projection optical system 16 is set as X Axis direction, is set as Y direction for direction orthogonal to X-axis in the horizontal plane, and the direction orthogonal with X-axis and Y-axis is set as Z axis side Always be illustrated, and θ x, θ y will be set to around the rotation of X-axis, Y-axis and Z axis (inclination) direction and the direction θ z come into Row explanation.In addition, position relevant to X-axis, Y-axis and Z-direction is set to X position, Y location and Z location to carry out Explanation.

Structure in the same manner as lighting system of the lighting system 12 such as disclosed in No. 5,729,331 specifications of U.S. Patent No. At.The light that lighting system 12 will be projected from light source (not shown) (such as mercury vapor lamp) is as exposure illumination light (illumination light) IL points Exposure mask M is not irradiated in through not shown reflecting mirror, dichronic mirror, shutter, wavelength selective filters, various lens etc..As The light such as illumination light IL, such as usable i line (wavelength 365nm), g line (wavelength 436nm), h line (wavelength 405nm) (or above-mentioned i Line, g line, h line synthesis light).

The exposure mask M of the holding light transmission type of exposure mask microscope carrier 14.Exposure mask microscope carrier 14 is for example via the driving system comprising linear motor It unites (not shown), relative to lighting system 12 (illumination light IL) with the drive of defined long stroke on X-direction (scanning direction) Dynamic exposure mask M, and driven a little in Y direction and the direction θ z.Location information in the horizontal plane of exposure mask M for example passes through Exposure mask microscope carrier position measuring system (not shown) comprising laser interferometer or encoder is found out.

Projection optical system 16 is configured in the lower section of exposure mask microscope carrier 14.Projection optical system 16 be, for example, and U.S. Patent No. The projection optical system of the so-called poly-lens type of the same structure of projection optical system disclosed in 6,552, No. 775 specifications etc., Such as have the multiple optical systems for the bilateral telecentricity to form upright erect image.

In liquid crystal exposure apparatus 10, if to positioned at defined lighting area and the illumination light IL from lighting system 12 Exposure mask M in domain is illuminated, then by passing through the illumination light of exposure mask M, and via projection optical system 16 and in substrate P Exposure area forms projection image's (picture of the pattern of part) of the pattern of the exposure mask M in the illumination region.Moreover, exposure mask M is opposite It is relatively moved in illumination region (illumination light IL) along scanning direction, and substrate P is swept relative to the edge exposure area (illumination light IL) Direction relative movement is retouched, the scan exposure of an irradiation area in substrate P is thus carried out, and will be formed in the pattern of exposure mask M (pattern corresponding with the scanning range of exposure mask M is whole) is transferred to the irradiation area.Here, the illumination region and base on exposure mask M Exposure area (irradiation area of illumination light) on plate P mutually becomes the relationship of optical conjugate by projection optical system 16.

A pair of of microscope carrier pedestal 18 is made of the component extended along the y axis respectively, and in X-direction configured separate.Microscope carrier Pedestal 18 is arranged on the floor 11 of dust free room via multiple antihunting devices 17.

(baseplate carrier device 20)

Baseplate carrier device 20 for example with International Publication No. 2016/169176 disclosed in the same manner as baseplate carrier device It constitutes.Baseplate carrier device 20 moves roughly microscope carrier 40, Y with X and moves microscope carrier 30, weight canceller 50, Substrate table roughly 60, substrate holder 68 and substrate carrier 70.

It is for dividing in X-direction and Y direction Substrate table 60 that X, which moves roughly microscope carrier 40 and Y and moves microscope carrier 30 roughly, The device not driven with defined long stroke.X moves roughly microscope carrier 40 and passes through X driving mechanism 43 in X-direction to provide Stroke driven.It is driven in addition, Y moves roughly microscope carrier 30 by Y driving mechanism 33 in Y direction with defined stroke.

Weight canceller 50 generates gravity direction power upward to support comprising Substrate table 60 and substrate holder 68 The self weight of system.As the structure of weight canceller 50, such as it is able to use and U.S. Patent Application Publication No. 2010/ The same structure of weight canceller disclosed in No. 0018950 specification.

It is constituted when Substrate table 60 is by using X-direction as the vertical view of longitudinal direction for the component of rectangle.The center of Substrate table 60 Portion is supported via spherical bearing arrangement (not shown) by weight canceller 50 from below.

Substrate table 60 moves roughly microscope carrier 40 with X and mechanically connect via multiple bending parts (flexure).Substrate table 60 by multiple bending part, and moves microscope carrier 40 roughly relative to X in direction (X-axis, Y-axis, the θ z side parallel with X/Y plane To) on be restricted, and move microscope carrier 40 roughly on the direction (Z axis, θ x, the direction θ y) intersected with X/Y plane relative to X Become the state that can be relatively moved in micro- a small range.Substrate table 60 is for example via any of four bending parts and by X Rough mobile microscope carrier 40 pulls, and thus moves at least one party of the microscope carrier 40 integrally in X-axis and Y direction roughly with the X and moves It is dynamic.

Substrate table 60 moves roughly microscope carrier 40 relative to X via multiple Z voice coil motors (voice coil motor) 64 It is driven a little in Z-direction, the direction θ x and the direction θ y (hereinafter referred to as Z inclined direction).Z voice coil motor 64 can be with base Accordingly, such as there are four settings, but it is not limited to this, as long as being at least set to not on the same line in four corners of pallet 60 Three at.The location information of the Z inclined direction of Substrate table 60 is using the lower surface comprising being fixed on Substrate table 60 Probe (probe) and be fixed on weight canceller 50 object multiple Z sensors and filled by main control (not shown) It sets to find out.Z sensor is around the axis parallel with Z axis and at predetermined intervals there are four such as configurations (at least three).Do not scheme Output of the main control unit shown based on above-mentioned multiple Z sensors carries out the Z obliquity control of Substrate table 60 (i.e. substrate P) System.

Multiple (such as four) guide plates 66 are fixed with cantilever support state in the lower surface of Substrate table 60.Such as four led Plate 66 is radial from the outside of the side+X of Substrate table 60, the side-X, the side+Y and the side-Y respective end towards Substrate table 60 respectively (+font) highlightedly configure.The flatness of the upper surface of guide plate 66 is finished very high.

It is the portion of the plate of rectangle when the substrate holder 68 of supporting substrates P is by using X-direction as the vertical view of longitudinal direction Part is constituted, and is fixed on the upper surface of Substrate table 60.The respective size of longitudinal direction and width direction of substrate holder 68 Size more respective than the longitudinal direction and width direction of Substrate table 60 is long, and is set to and the longitudinal direction of substrate P and width side To respective size same degree (actually slightly short).Substrate P is positioned on the upper surface of substrate holder 68.It is kept in substrate The upper surface of part 68 is formed with multiple small hole portions (not shown).

The pressurized gas supply device of supply gas-pressurized (such as air) is connected in substrate holder 68 and vacuum is taken out It inhales device (not shown).Substrate holder 68 sprays the lower surface of substrate P via a part of multiple small hole portions From the gas-pressurized (compressed air) of pressurized gas supply unit feeding, thus make lower surface and substrate of the gas between substrate P Between the upper surface of holder 68 (that is, forming gas film).In addition, substrate holder 68 uses vacuum suction apparatus, via surplus Remaining small hole portion and aspirate the gas between the upper surface of substrate holder 68 and the lower surface of substrate P, and to substrate P make With gravity direction power directed downwardly (preload), the rigidity of gravity direction is thus assigned to above-mentioned gas film.

Moreover, substrate holder 68 passes through the pressure of gas-pressurized and the balance of flow and vacuum force on one side, in weight So that substrate P is suspended to support in a non contact fashion on power direction (Z-direction) via small gap, substrate P is made on one side With the power (such as correction or the power for correcting flatness) for controlling its flatness.Therefore, substrate holder 68 is limited in Z inclined direction Substrate P processed, and three degree of freedom direction in the horizontal plane does not limit substrate P.In addition, in substrate holder 68, Neng Goutong It is overpressurized the ejection (gas supply) of gas and is sucked by vacuum the balanced adjustment (hereinafter referred to as air adjustment) of (air-breathing), and control base board The interval of P and substrate holder 68.In addition, air adjustment can with the position of the upper surface of substrate holder 68 accordingly into Row control.In addition, substrate holder 68 with can in the lower surface of supporting substrates P, at least with the irradiation area in substrate P The mode of (that is, region that the pattern of exposure mask M is transferred) corresponding part configures.Therefore, it is kept for the substrate of supporting substrates P The upper surface of part 68 is preferably set at least support the size for an irradiation area being formed in substrate P.In addition, in this reality It applies in mode, passes through spraying with vacuum suction and being used to that gravity direction power directed downwardly is made to act on substrate for gas-pressurized on one side P, the non-contact bearing substrate P in one side, but not limited to this, such as gas can also be made to keep in substrate P and substrate on one side To pass through at a high speed between part 68, act on gravity direction power directed downwardly using Bernoulli effect (Bernoulli effect) Substrate P, the non-contact bearing substrate P in one side.

Substrate carrier 70 has pedestal 72 and carrier element 74.As shown in Fig. 2, when pedestal 72 is by overlooking (from the side+Z) Component for the frame-shaped of rectangle is constituted.When being formed in the vertical view of pedestal 72 in the opening portion of rectangle be configured with Substrate table 60.

In the lower surface of pedestal 72, accordingly, four are fixed with such as four guide plates 66 for being fixed on aforesaid substrate platform 60 A air bearing 78.Such as four air bearing 78 upper surface with guide plate 66 corresponding to bearing surface (gas discharging surface) respectively It is arranged opposite, and gas-pressurized (such as compressed air) is ejected to the upper surface of corresponding guide plate 66 from above-mentioned bearing surface.Base Seat 72 by being ejected to the static pressure of the gas-pressurized of corresponding guide plate 66 from such as four air bearing 78 respectively, and via small Gap and be suspended on above-mentioned such as four guide plates 66.

Wall surface in the opening portion of regulation pedestal 72, for example, being equipped with along the x axis and Y direction drive substrate carrier 70 driving mechanism (for example, voice coil motor of electromagnetic force driving method).

As shown in Fig. 2, being constituted when such as vertical view open by the side+X of carrier element 74 for the component of U-shaped.Carrier element 74 are positioned on the upper surface of pedestal 72, and are fixed on the pedestal 72.Substrate holder is configured in the inside of carrier element 74 68.In addition, being formed with opposite even if substrate carrier 70 between the inner wall of carrier element 74 and the side of substrate holder 68 It is driven in the three degree of freedom direction (X-axis, Y-axis, the direction θ z) of Substrate table 60 in the horizontal plane, is not also contacted with each other a little The gap of degree.

As shown in Figure 1, loading substrate P on carrier element 74.The side+X of substrate P, the side-X, the side+Y and the side-Y are respective End is nearby set as the region (hereinafter referred to as white space) of not transfer mask pattern, is positioned on carrier element 74 in substrate P In the state of, above-mentioned white space is supported from below by carrier element 74.In addition, being formed in the upper surface of carrier element 74 more A small hole portion (not shown).Carrier element 74 is connect with vacuum suction apparatus (not shown), can be via above-mentioned multiple holes Portion and adsorb keep substrate P white space.

As described above, substrate holder 68 is in Z inclined direction restricting substrate P, and three freedom in the horizontal plane Degree direction (X-direction, Y-direction, the direction θ z) does not limit substrate P.Therefore, it using substrate carrier 70, is driven in three degree of freedom direction Dynamic substrate P.Main control unit (not shown) is by along the x axis and Y direction drives the driving machine of above-mentioned substrate carrier 70 Structure (such as voice coil motor of electromagnetic force driving method) respectively carries substrate in X-direction and Y direction relative to Substrate table 60 Body 70 is driven a little.In addition, main control unit (not shown) is by along the x axis or Y direction drive substrate carrier 70 Driving mechanism (such as voice coil motor of electromagnetic force driving method), relative to Substrate table 60 to substrate carrier 70 on the direction θ z It is driven a little.

In above-mentioned baseplate carrier device 20, substrate holder 68 is mutually non-contactly configured with substrate carrier 70, and For the construction of physically (mechanical) separation, can not drive substrate holder 68 and drive substrate carrier 70 and substrate P a little It is dynamic.That is, substrate carrier 70 can make substrate P is opposite to drive relative to substrate holder 68.Even if non-contact holding substrate as a result, P can also be accurately proceed positioning.

(pendency supporting arrangement 150)

Pendency supporting arrangement 150 and substrate move in device 130 together for be held in substrate holder 68 substrate P from Substrate holder 68 moves out movement.Supporting arrangement 150 dangle to make baseplate carrier device 20 be located at substrate exchange position Under state, the mode positioned at the top of substrate holder 68 is configured.

Pendency supporting arrangement 150 has non-contact supporting arrangement 152.In the present first embodiment, non-contact branch installs Set 152 be installed on be equipped with projection optical system 16 benchmark plate 100 it is (not shown in Fig. 1.Referring to (a) etc. of Fig. 4).

Multiple small hole portions (not shown) are formed in the lower surface of non-contact supporting arrangement 152, in non-contact bearing Device 152 is connected with the pressurized gas supply device of supply gas-pressurized (such as air) and vacuum suction apparatus (is not schemed Show).Non-contact supporting arrangement 152 sprays from adding the upper surface of substrate P via a part of above-mentioned multiple small hole portions The gas-pressurized (compressed air) of body feeding of calming the anger supply, and using above-mentioned vacuum suction apparatus via remaining small Hole portion and aspirate the gas between the lower surface of non-contact supporting arrangement 152 and the upper surface of substrate P.In turn, non-contact bearing Device 152 is by the pressure of gas-pressurized and the balance of flow and vacuum force, in gravity direction (Z-direction) via small Gap and supporting substrates P in a non contact fashion.In addition, in the present embodiment, on one side by the ejection of gas-pressurized and very It is that empty pump is inhaled and be used to that the power of gravity direction upward is made to act on substrate P, non-contact bearing substrate P on one side, but be not limited to This, such as gas can also be made, to pass through at a high speed, to imitate using Bernoulli Jacob between substrate P and non-contact supporting arrangement 152 on one side Substrate P should be acted on to make the power of gravity direction upward, on one side non-contact bearing substrate P.As long as that is, with the upper table of substrate P Face is supported with the discontiguous mode of non-contact supporting arrangement 152, then bearing method is unlimited.

In addition, end of the pendency supporting arrangement 150 in the side+X of non-contact supporting arrangement 152, the side-X, the side+Y and the side-Y Nearby have for limiting by the substrate of the casual movement in the court direction parallel with X/Y plane of the substrate P of non-contact bearing Stop device (not shown).This is because non-contact supporting arrangement 152 is in Z inclined direction restricting substrate P, and in horizontal plane Interior three degree of freedom direction (X-direction, Y-direction, the direction θ z) can not restricting substrate P, thus by non-contact bearing substrate P move It is dynamic.Substrate stop device is configured in a manner of the periphery for surrounding substrate P.As long as the quantity of substrate stop device being capable of restricting substrate The casual movement of P, is not specially limited.

In addition, in the present first embodiment, being configured with a non-contact supporting arrangement 152, but non-contact supporting arrangement 152 size, quantity and configuration is not limited to this.As long as non-contact supporting arrangement 152 can be in the substrate and base for completing exposure The space as being moved to substrate holder new substrate P is formed between on plate holder 68, such as being capable of root Size according to substrate P etc. suitably changes.

(substrate moves in device 130)

Substrate moves in device 130 and carries out moving in for the substrate P for being directed to empty (not keeping substrate P) substrate holder 68.Separately Outside, the substrate P that the completion that substrate moves in that device 130 supported by above-mentioned pendency supporting arrangement 150 exposes moves out.Such as figure Shown in 1, substrate moves in the configuration of device 130 in the region of the side+X of baseplate carrier device 20, and is arranged on floor 11.As a result, The vibration that device 130 generates is moved in by substrate and is not passed to baseplate carrier device 20.Baseplate carrier device 20 and substrate move in dress 130 are set to be accommodated in chamber (not shown) possessed by liquid crystal exposure apparatus 10.

Substrate moves in device 130 with substrate moving device 136, gas operated device 138 and gas operated device driving mechanism 133。

Substrate moving device 136 makes to move in object in the switching motion of the substrate P on substrate holder 68 or moves out pair The substrate P of elephant is mobile.Substrate moving device 136 is for example filled with the movement of substrate disclosed in International Publication No. 2014/024483 It sets and similarly constitutes.Substrate moving device 136 has X driving mechanism 140, pillar 142 and absorption layer 144.X driving mechanism 140 in the X-axis direction, such as carries out straight line to absorption layer 144 with the stroke of the size same degree of the X-direction with substrate P Driving.As X driving mechanism 140, as long as such as using linear motor, feed screw device, with driving device etc..

Absorption layer 144 is that inverted L-shaped component is constituted by the section XZ, the square when part parallel with X/Y plane is formed as overlooking The plate of shape.Absorption layer 144 is connect with vacuum plant (not shown), and the upper surface of the part parallel with above-mentioned X/Y plane is as base Plate adsorption plane functions.The one side of the part parallel with YZ plane of absorption layer 144 and one near the upper end of pillar 142 Face (towards the face of the side-X) is opposed.Absorption layer 144 is mounted to via the one side (side-X) for being fixed on above-mentioned pillar 142 Z axis driving mechanism 146 and it is mobile in Z-direction relative to pillar 142.In addition, absorption layer 144 passes through 148 (example of Z actuator Such as cylinder), upper surface (substrate adsorption face) than substrate holder 68 and two respective upper surfaces of gas operated device 138 to+Z Along Z-direction between side position outstanding and the position declined than the upper surface of substrate holder 68 and two gas operated devices 138 It is driven.

Gas operated device 138 in present embodiment by the component of the cuboid of longitudinal direction of X-direction by being constituted.Air guide Device 138 is appropriately driven by gas operated device driving mechanism 133 in X-direction with defined stroke.In addition, gas operated device 138 can be driven by Z actuator 137 (such as cylinder etc.) along Z-direction.

As shown in Fig. 2, gas operated device 138 is by can be substantially uniformly in a manner of the lower surface of supporting substrates P, between regulation It is configured every being separated from each other.In the present first embodiment, pass through two gas operated devices 138 supporting substrates P from below.In addition, The shape etc. in size, quantity and the configuration of gas operated device 138 and the substrate-guided face formed by gas operated device 138 for example can It is enough suitably to be changed according to size of substrate P etc..

As shown in Fig. 2, it is formed with the hole portion of multiple pettiness in the upper surface of gas operated device 138, it is optional in gas operated device 138 It is connected with pressurized gas supply device and vacuum suction apparatus (not shown) (not shown) with selecting.Gas operated device 138 can lead to Cross the gas-pressurized supplied from above-mentioned pressurized gas supply device via above-mentioned multiple hole portions, and suspension bearing (non-contact bearing) The substrate P on mounting surface thereon, and can by from above-mentioned vacuum suction apparatus via above-mentioned multiple hole portions (or other holes Portion) supply vacuum force, and adsorb the substrate P for keeping mounting surface thereon.Substrate can also be compared with the size of Y-direction P slightly short size constitutes gas operated device 138, and substrate moving device 136 is set to the both sides of gas operated device 138 in the Y direction. As a result, can be avoided in the case where substrate moving device 136 to be set to the center of gas operated device 138, gas-pressurized Not the case where not blowing to the central portion of the substrate P based on X driving mechanism 140 and being bent substrate P.

Here, using (c) of (a) of Fig. 3~Fig. 3 to used substrate move in device 130 substrate P move in act into Row explanation.In the liquid crystal exposure apparatus 10 involved in first embodiment, move in movement of the substrate P to substrate holder 68 exists Substrate holder 68 carries out in the state of being located at defined substrate exchange position.Substrate exchange position is for example set in X and moves roughly Near the side end+X in the movable domain of dynamic load platform 40.

When moving in device 130 using substrate to move in substrate P to baseplate carrier device 20, with substrate holder 68 The Z location of upper surface and the Z location of the upper surface of two gas operated devices 138 become roughly the same mode (or to be protected with substrate The mode that 68 side of gripping member is slightly lower), the Z location of substrate holder 68 is positioned.Pass through two gas operated devices as a result, 138, which are formed by substrate-guided face and the upper surface of substrate holder 68, forms continuous guide surface.

Substrate move in device 130 along -X direction make absorption keep substrate P the side+X end near in Y direction The absorption layer 144 in centre portion drives.Substrate P is moved along above-mentioned guide surface as a result,.

Moreover, as shown in (b) of Fig. 3, if the end of the side+X of substrate P reaches defined position, such as (c) institute of Fig. 3 Show, the absorption that absorption layer 144 releases substrate P is kept, and is driven along +X direction.In addition it is also possible to shown in (a) of Fig. 3 The absorption that the substrate P carried out using absorption layer 144 is released in the moving process of substrate P is kept, by the absorption layer 144 and substrate P Separation, and keep substrate P mobile by inertia force.

In the liquid crystal exposure apparatus 10 (referring to Fig.1) constituted as described above, in the pipe of main control unit (not shown) Under reason, loading of the exposure mask M on exposure mask microscope carrier 14 is carried out by mask loading machine (not shown) (mask loader), and lead to It crosses substrate and moves in loading of the progress substrate P of device 130 on substrate holder 68.Later, by main control unit, and using not The alignment detection system of diagram is executed to locating tab assembly, after this is to locating tab assembly, in the multiple irradiations being set in substrate P Region successively carries out the exposure actions of step-scan mode.In addition, the exposure actions and the step-scan mode that carries out in the past Exposure actions are identical, therefore omit detail explanation.Moreover, having terminated exposure-processed by the supporting arrangement 150 that dangles Substrate P is kept out of the way from substrate holder 68, and is moved in device 130 by substrate and will be removed followed by other substrate Ps of exposure It send to substrate holder 68.The exchange of the substrate P on substrate holder 68 is carried out as a result, and multiple substrate Ps are continuously carried out Exposure actions etc..

Hereinafter, using Fig. 4 (a)~Fig. 5 (c) to the base in liquid crystal exposure apparatus 10 involved in first embodiment The switching motion of substrate P on plate holder 68 is illustrated.In addition, the substrate of the completion exposure on substrate holder 68 is set For substrate P 1, the new substrate transported on substrate holder 68 is set as substrate P 2.Substrate exchange movement below is not being schemed It is carried out under the management of the main control unit shown.In addition, for simplified illustration, in (c) of (a)~Fig. 5 of Fig. 4, baseplate carrier Device 20, substrate move in device 130 and pendency supporting arrangement 150 is simplified (a part of element is not shown) respectively and shows.

As shown in (a) of Fig. 4, if the baseplate carrier device 20 for having terminated exposure-processed reaches substrate exchange position, base Plate holder 68 weakens vacuum force, and substrate carrier 70 releases the absorption guarantor of the substrate P 1 carried out using carrier element 74 It holds.

Next, substrate holder 68 makes the gas-pressurized from pressurized gas supply unit feeding as shown in (b) of Fig. 4 Pressure and/or flow increase, and in a manner of widened at a distance from the lower surface of substrate P 1 with substrate holder 68, to substrate P 1 Lower surface assign suspending power (levitation force).Substrate P 1 suspends on substrate holder 68 as a result,.It has suspended Substrate P 1 is connect by the vacuum suction of the non-contact supporting arrangement 152 for the supporting arrangement 150 that dangles by pendency supporting arrangement 150 It receives.The lower surface of substrate P 1 is separated from the upper surface of substrate holder 68 as a result,.

On the other hand, it is moved in device 130 in substrate, sprays and add from lower surface of two gas operated devices 138 to substrate P 2 It calms the anger body, and the substrate P 2 is made to suspend on two gas operated devices 138.In addition, the absorption of absorption layer 144 keeps the following table of substrate P 2 Face.

Later, as shown in (c) of Fig. 4, absorption layer 144 is driven along -X direction.Substrate P 2 is along by two air guides as a result, The guide surface that the upper surface of device 138 and the upper surface of substrate holder 68 are formed is mobile.

As shown in (a) of Fig. 5, if the absorption of carrier element 74 is kept after substrate P 2 is moved in substrate holder 68 Substrate P 2, then as shown in (b) of Fig. 5, in order to be directed to the exposure actions of substrate P 2, baseplate carrier device 20 is from substrate exchange position It is mobile towards defined exposure actions starting position.

If baseplate carrier device 20 leaves substrate exchange position, such as shown in (b) of Fig. 5, substrate moves in leading for device 130 Device of air 138 and absorption layer 144 are raised driving.At this point, the upper surface that absorption layer 144 is located in absorption layer 144 can inhale The height (Z location) of the attached lower surface for keeping substrate P 1.

Later, as shown in (c) of Fig. 5, absorption keeps the absorption layer 144 of the lower surface of substrate P 1 to be driven along +X direction, Substrate P 1 is along the guidance formed by the lower surface of non-contact supporting arrangement 152 and the upper surface of two gas operated devices 138 as a result, Face is mobile.That is, substrate, which moves in device 130, can move out substrate P 1.Substrate moves in device 130 and is used as substrate conveyance device as a result, It functions, is further able to moving in for progress substrate and acts and move out movement, therefore can be collectively referred to as base board delivery device.

Later, substrate P 1 is moved out by the hand unit of external conveying machine people (not shown) to liquid crystal exposure apparatus 10 (referring to Fig.1) outside.

As described above in detail, according to this first embodiment, liquid crystal exposure apparatus 10 has: substrate holder 68, the lower surface of supporting substrates P1；It dangles supporting arrangement 150 (non-contact supporting arrangement 152), is connect from substrate holder 68 Receive substrate P 1, and the upper surface of supporting substrates P1；And X driving mechanism 43, substrate holder 68 is moved to substrate P 2 It is driven to the substrate exchange position of substrate holder 68.As a result, in the substrate P 1 for exposing completion in substrate exchange position In the state of standby (next keeping out of the way from the moving-in path of the substrate P of predetermined exposure 2), carry out substrate P 2 moves in movement, In After the handover to baseplate carrier device 20 for carrying out the substrate P 2, substrate P 1 is moved out from above-mentioned position of readiness, therefore for example With moving out after movement completes for the substrate P 1 of completing exposure, start the movement of moving in baseplate carrier device 20 of substrate P 2 Situation is compared, and the time spent by substrate exchange can be shortened.

In addition, in the above description, after baseplate carrier device 20 reaches substrate exchange position, substrate holder 68 subtracts Weak vacuum force, and suspending power is assigned to the lower surface of substrate P 1, but it is not limited to this.Substrate holder 68 can also be in base (for example, reaching non-contact bearing in the side end+X of substrate holder 68 before the arrival of plate bearing table device 20 substrate exchange position In the case where near the center of the X-direction of device 152), weaken vacuum force, and assign and suspending to the lower surface of substrate P 1 Power.Thereby, it is possible to before baseplate carrier device 20 reaches substrate exchange position, start substrate P 1 to non-contact supporting arrangement 152 handover, and can further shorten the time spent by substrate exchange.In addition, substrate holder 68 weakens vacuum suction Power, and the opportunity for assigning suspending power to the lower surface of substrate P 1 can not be with other structures such as benchmark plate 100 in substrate P 1 It is suitably determined in the range of at component contact suitably being received by non-contact supporting arrangement 152.

In addition, substrate holder 68 is supported with substrate P 1 by non-contact supporting arrangement 152 according to this first embodiment Mode assigns suspending power to substrate P 1.Substrate holder 68 is able to use device (the pressurized gas supply dress having had as a result, Set), so that substrate P 1 is moved to non-contact supporting arrangement 152 can be until the position of supporting substrates P1, therefore can simplify substrate The structure of bearing table device 20.

In addition, in the present first embodiment, substrate holder 68 with the lower surface of substrate P 1 and substrate holder 68 it Between the widened mode of distance, to substrate P 1 assign suspending power.If the lower surface of substrate P 1 is separated from substrate holder 68, can New substrate P 2 is enough moved in, therefore can further shorten the time spent by substrate exchange.

In addition, in the present first embodiment, substrate moves in device 130 and moves in substrate P 2 to substrate holder 68 and base Between plate P1, so that substrate P 2 is supported by substrate holder 68.Even if not moving out substrate P 1 as a result, substrate P 2 can also be removed Enter to substrate holder 68, therefore the time spent by substrate exchange can be shortened.

In addition, in the present first embodiment, substrate holder 68 can suspension bearing base to substrate P 1 or the imparting of substrate P 2 The power of plate P1 or substrate P 2, substrate move in device 130 and move in the substrate P 2 for being suspended bearing to substrate holder 68.As a result, It can not swap to wounded substrate P1 and P2.

In addition, in the present first embodiment, substrate moves in device 130 and removes substrate P 1 from non-contact supporting arrangement 152 Out.It does not need that the device that substrate moves out in addition is arranged as a result, the structure of liquid crystal exposure apparatus 10 can be simplified.

In addition, in the present first embodiment, liquid crystal exposure apparatus 10 has a substrate carrier 70, substrate carrier 70 keep by Substrate is moved in device 130 and is moved in substrate holder 68 and by the substrate P 2 of 68 suspension bearing of substrate holder, and makes substrate P 2 Relative to the opposite driving of substrate holder 68.Thereby, it is possible to accurately position to the substrate P 2 for being suspended bearing.

In addition, in the present first embodiment, the non-contact bearing of supporting arrangement 152 has been released from based on substrate carrier 70 The substrate P 1 of holding.Thereby, it is possible to substrate P 1 is handover to non-contact supporting arrangement 152 from substrate holder 68.

In addition, in the present first embodiment, the upper surface of non-contact 152 control base board P1 of supporting arrangement and non-contact branch Gas between bearing apparatus 152, and the upper surface of non-contact supporting substrates P1.Thereby, it is possible to not damage the substrate for completing exposure Support substrate P 1 to the plane of exposure of P1.

(variation 1)

In the liquid crystal exposure apparatus 10a involved in the variation 1 of first embodiment, substrate is moved in device 130a and is also had Pressurized gas supply device (not shown) of the available to gas-pressurized (such as air).About other structures and first embodiment Related liquid crystal exposure apparatus 10 is identical, therefore omits detailed description.

Referring to (a) of Fig. 6 and (b) of Fig. 6, the substrate exchange movement in this variation 1 is illustrated.

In liquid crystal exposure apparatus 10a, if baseplate carrier device 20 reaches substrate exchange position, such as (a) institute of Fig. 6 Showing, substrate moves in device 130a and blows gas-pressurized AIR1 to the side+X lower surface of the substrate P 1 on substrate holder 68, Thus upward power is assigned to the lower surface of substrate P 1.The side end+X of substrate P 1 is joined that is, substrate moves in device 130a Operation to non-contact supporting arrangement 152 is assisted.Substrate P 1 is non-with the sequence from the side end+X to the side end-X as a result, Supporting arrangement 152 is contacted to support.

If the lower surface of the side end+X of substrate P 1 is separated from the upper surface of substrate holder 68, such as (b) institute of Fig. 6 Show, substrate moves in device 130 and moves in substrate P 2 to substrate holder 68 from the side+X towards the side-X.Substrate holder 68 is from substrate The position that P1 is handover to non-contact supporting arrangement 152 is risen, and reduces the pressure and/or flow of gas-pressurized, and start gas Suction, and non-contact supporting substrates P2.Thereby, it is possible to be handover to from substrate P 1 non-contact supporting arrangement 152 position (from The position isolated with substrate holder 68 of substrate P 1) it rises, gradually plate P2 is moved in substrate holder 68.Substrate holder 68 The pressure and/or flow of gas-pressurized, In can be reduced from substrate P 1 is handover to the position of non-contact supporting arrangement 152 Substrate P 2 is whole be transported on substrate holder 68 after, start the suction of gas, and non-contact supporting substrates P2.

As being illustrated in detail above, variation 1 according to first embodiment, substrate moves in device 130a Substrate P 2 is moved in the substrate holder 68 of a part (being the side end-X in this variation 1) for being supported with substrate P 1.By This, even if can also start protecting to substrate for substrate P 2 in the state that a part of substrate P 1 is supported by substrate holder 68 Gripping member 68 is moved in, therefore can further shorten the time spent by substrate exchange.

In addition, substrate moves in one end of device 130a supporting substrates P1 from substrate holder 68 in this variation 1 Substrate P 2 is moved in the side of the one lateral-supporting the other end (side end-X) in portion (side end+X).Even if as a result, in substrate P 1 The other end supported in the state of, can also start moving in for substrate P 2, therefore can further shorten substrate exchange institute The time of consuming.

In addition, substrate is moved in device 130a and is moved in substrate P 2 to substrate holder 68 with one side in this variation 1, The mode that one side substrate P 1 is handover to non-contact supporting arrangement 152 assigns power to the lower surface (the first face) of substrate P 1.As a result, Substrate P 1 can be handover to non-contact supporting arrangement 152 on one side, on one side move in substrate P 2 to substrate holder 68, therefore energy It is enough further to shorten the time spent by substrate exchange.

In addition, the substrate in above-mentioned variation 1 is moved in device 130a, gas operated device 138 can also have gas-pressurized Feedway (not shown) blows out the gas-pressurized that power is assigned to the lower surface of substrate P 1.

In addition, substrate moves in device 130a can also reach substrate friendship from baseplate carrier device 20 in above-mentioned variation 1 Before change place, gas-pressurized AIR1 is blowed to the lower surface of substrate P 1.

(variation 2)

The exposure of liquid crystal involved in the variation 2 of above-mentioned first embodiment is shown in (a) of Fig. 7 and (b) of Fig. 7 The structure of device 10b.The pendency supporting arrangement 150a that the liquid crystal exposure apparatus 10b of variation 2 has has multiple (such as four It is a) substrate transfer apparatus 158.It is identical as liquid crystal exposure apparatus 10 involved in first embodiment about other structures, therefore Omit detailed description.

Substrate transfer apparatus 158 has the maintaining part 158a and along the y axis of a part for the lower surface for keeping substrate P 1 And the driving part 158b that Z-direction drives maintaining part 158a.Driving part 158b is installed on benchmark plate 100.Maintaining part 158a is, for example, the absorption layer connecting with vacuum plant (not shown).

In the liquid crystal exposure apparatus 10b of variation 2, if baseplate carrier device 20 reaches substrate exchange position, drive Component 158b drives maintaining part 158a, and the lower surface with the Z location of the upper surface of maintaining part 158a than substrate P 1 along -Z direction The slightly lower mode of Z location aligned.At this point, the Y location of the end of 1 side of substrate P of maintaining part 158a is adjusted to not touch Position as rub substrate P1.

Later, in such a way that maintaining part 158a is able to maintain the lower surface of substrate P 1, by driving part 158b along Y-axis side To after driving maintaining part 158a, maintaining part 158a is driven along +Z direction, and keeps a part of substrate P 1 by maintaining part 158a. A part of substrate P 1 is kept by pendency supporting arrangement 150a as a result,.Later, driving part 158b is with another part of substrate P 1 By the mode of the non-contact bearing of non-contact supporting arrangement 152, along +Z direction (towards substrate exchange position side), further driving is protected Hold portion 158a.As a result, substrate P 1 from substrate holder 68 separate, therefore substrate move in device 130 substrate P 2 can be moved in On substrate holder 68.

Later, the upper surface of substrate P 1 is by non-contact supporting arrangement 152 by non-contact holding.At this point, maintaining part 158a The preventing portion that falls as the lower surface for keeping substrate P 1 functions, so that the non-contact bearing of non-contact supporting arrangement 152 Substrate P 1 is not fallen.

In addition, driving part 158b can also not only along the y axis and Z-direction drives maintaining part 158a, it can also be with Along the x axis drive maintaining part 158a.Before baseplate carrier device 20 reaches substrate exchange position, 158b pairs of driving part Maintaining part 158a is driven along -Z direction, the Z location with the Z location of the upper surface of maintaining part 158a than the lower surface of substrate P 1 Slightly lower mode is aligned, and is driven to maintaining part 158a to Y direction, and a part of substrate P 1 is kept.Later, Substrate holder 68 can be made to drive in a manner of towards substrate exchange position to X-direction on one side, on one side to maintaining substrate The maintaining part 158a of a part of P1 is to +Z direction and +X direction is driven.Alternatively, it is also possible to make the length of maintaining part 158a It is driven with the length with 1 same degree of substrate P, and not to +X direction, and so that substrate P 1 was slided on maintaining part 158a Mode is driven.If substrate holder 68 reaches substrate exchange position as a result, become there is no base on substrate holder 68 The state of plate, therefore substrate P 2 can be moved in.Thereby, it is possible to shorten the time spent by substrate exchange.

As being illustrated in detail above, variation 2 according to first embodiment, dangle supporting arrangement 150a The maintaining part 158a of a part with holding substrate P 1 and the side kept with one of substrate P 1 by pendency supporting arrangement 150a The driving part 158b of formula driving maintaining part 158a.Further, driving part 158b is with another part of substrate P 1 by pendency branch The mode of bearing apparatus 150a (non-contact supporting arrangement 152) bearing, to the maintaining part 158a of a part for keeping substrate P 1 to base Plate exchange position side is driven.Even if increasing as a result, not in substrate holder 68 from pressurized gas supply unit feeding The pressure and flow of gas-pressurized are higher to make substrate P 1 suspend, and substrate P 1 can also separated from substrate holder 68, and make Substrate P 1 is supported by non-contact supporting arrangement 152.

In addition, pendency supporting arrangement 150a, which has, keeps substrate P 1 in a manner of falling the substrate P 1 of non-contact bearing not Lower face side maintaining part 158a.Thereby, it is possible to prevent non-contact supporting arrangement 152 the substrate P 1 of non-contact bearing fall Under, and damage the equal situation of new substrate P 2.

In addition, maintaining part 158a, which has both, falls preventing portion in the variation 2 of above-mentioned first embodiment, but branch of dangling Bearing apparatus 150a, which can also have, keeps base in a manner of falling the substrate P 1 of non-contact bearing not different from maintaining part 158a The lower face side of plate P1 falls anti-locking apparatus.

(variation 3)

In above-mentioned first embodiment and its variation 1,2, in the benchmark plate 100 for being equipped with projection optical system 16 Pendency supporting arrangement is installed, but dangling supporting arrangement can also be with 100 configured separate of benchmark plate.

The knot of liquid crystal exposure apparatus 10c involved in the variation 3 of first embodiment is schematically shown in fig. 8 Structure.In the liquid crystal exposure apparatus 10c involved in variation 3, as shown in figure 8, pendency supporting arrangement 150b has pendency bearing Device installing frame 151, and with 100 configured separate of benchmark plate that is equipped with projection optical system 16.Thereby, it is possible to prevent from coming from The vibration of pendency supporting arrangement 150b is transferred to projection optical system 16.About other structures, and involved by first embodiment Liquid crystal exposure apparatus 10 it is identical, therefore omit detailed description.

" second embodiment "

Next, being illustrated about second embodiment using (c) of (a) of Fig. 9~Fig. 9.In addition, following In the second embodiment being illustrated, for above-mentioned first embodiment and its mutually isostructural element of variation, mark Simultaneously the description thereof will be omitted for the appended drawing reference being the same as the above first embodiment.In addition, in this second embodiment, baseplate carrier Device 20 (substrate holder 68) is driven by X driving mechanism 43 to substrate exchange position.

(a) of Fig. 9 is the figure for schematically showing the structure of liquid crystal exposure apparatus 10d involved in second embodiment. As shown in (a) of Fig. 9, in this second embodiment, pendency supporting arrangement 150c and the benchmark for being equipped with projection optical system 16 Plate 100 discretely configures.Pendency supporting arrangement 150c has the dress of the driving for moving up and down non-contact supporting arrangement 152 Set 153.Driving device 153 is installed on pendency supporting arrangement installing frame 151.

Next, being illustrated referring to (b) of Fig. 9 and (c) of Fig. 9 to the substrate exchange movement in second embodiment.

In the liquid crystal exposure apparatus 10d involved in second embodiment, if keeping completing the substrate of the substrate P 1 of exposure Bearing table device 20 is driven to substrate exchange position, then the decline of the non-contact supporting arrangement 152 based on driving device 153 is opened Begin.In addition, baseplate carrier device 20 is started by the decline on the opportunity and non-contact supporting arrangement 152 that drive to substrate exchange position Opportunity may be the same or different.As long as until baseplate carrier device 20 the side end+X reach substrate exchange position- Until the side end X, non-contact supporting arrangement 152 drops to the position that substrate P 1 is received from substrate holder 68.

Moreover, for example, if the side end-X or non-contact supporting arrangement of the side end+X of substrate P 1 and substrate exchange position 152 side end-X overlapping, then substrate holder 68 weakens vacuum force.As a result, as shown in (b) of Fig. 9 ,+the X of substrate P 1 Side end is handover to the non-contact supporting arrangement 152 declined and is supported.That is, non-contact supporting arrangement 152 is protected in substrate During the positive substrate exchange position of gripping member 68 is mobile, substrate P 1 is received from substrate holder 68.If the side+X of substrate P 1 Portion is supported by non-contact supporting arrangement 152, then begins to ramp up non-contact supporting arrangement 152 by driving device 153, another Aspect, substrate holder 68 continue the movement to substrate exchange position.Therefore, it is driven in substrate holder 68 to substrate exchange position Dynamic direction, the distance between substrate holder 68 and non-contact supporting arrangement 152 continuously change.Moreover, along with substrate Bearing table device 20 is mobile to substrate exchange position, and substrate P 1 is non-contact to be handover to from the side end+X to the sequence of the side end-X Supporting arrangement 152 is simultaneously supported.

By above-mentioned control, when baseplate carrier device 20 reaches substrate exchange position (under pendency supporting arrangement 150c Side) when, as shown in (c) of Fig. 9, substrate P 1 is kept out of the way from baseplate carrier device 20.Thereby, it is possible to immediately remove new substrate P 2 Enter to substrate holder 68, and can further shorten the time spent by substrate exchange.

As being illustrated in detail above, according to second embodiment, liquid crystal exposure apparatus 10d has: substrate Holder 68, the lower surface of supporting substrates P1；It dangles supporting arrangement 150c (non-contact supporting arrangement 152), is protected from substrate Gripping member 68 receives substrate P 1, and the upper surface of supporting substrates P1；And X driving mechanism 43, it is non-to substrate P 1 to be handed off to The substrate holder 68 of contact supporting arrangement 152, which is moved to substrate P 2 to the substrate exchange position of substrate holder 68, to be driven It is dynamic.Thereby, it is possible to make the substrate P 1 on substrate holder 68 retreat to non-contact supporting arrangement 152, and in substrate exchange position On new substrate P 2 is moved in substrate holder 68, therefore compared with the case where moving in new substrate P 2 after substrate P 1 is discharged, The cycle time of substrate exchange can be shortened.

In addition, non-contact supporting arrangement 152 keeps substrate by X driving mechanism 43 in this second embodiment During part 68 drives to substrate exchange position, substrate P 1 is received from substrate holder 68.Thereby, it is possible to until substrate holder Until 68 reach substrate exchange position (lower section of pendency supporting arrangement 150c), move back substrate P 1 to non-contact supporting arrangement 152 It keeps away, after substrate holder 68 reaches substrate exchange position, immediately moves in new substrate P 2 to substrate holder 68.Cause This, can further shorten the time spent by substrate exchange.

In addition, in this second embodiment, non-contact supporting arrangement 152 is with from the substrate for being located at substrate exchange position side The one end (in this second embodiment be the side end+X) of P1 is to the sequence supporting substrates P1 of the other end (side end-X). As a result, non-contact supporting arrangement 152 can the movement with substrate holder 68 to substrate exchange position linkedly swimmingly receive Substrate P 1.

In addition, in this second embodiment, pendency supporting arrangement 150c has a driving device 153, driving device 153 with In the direction (Z-direction) for joining substrate P 1 from plate holder 68 to non-contact supporting arrangement 152, substrate holder 68 connects with non- The mode that the relative distance of touching supporting arrangement 152 shortens, drives non-contact supporting arrangement 152.Thereby, it is possible to steadily Substrate P 1 is handover to non-contact supporting arrangement 152 from substrate holder 68.

Further, in this second embodiment, in the direction that substrate holder 68 drives to substrate exchange position, substrate The distance between holder 68 and non-contact supporting arrangement 152 continuously change.Thereby, it is possible to until substrate holder 68 reaches Until substrate exchange position (lower section of pendency supporting arrangement 150c), as shown in (c) of Fig. 9, make substrate P 1 from substrate holder 68 keep out of the way.Thereby, it is possible to immediately move in new substrate P 2 to substrate holder 68, and it can further shorten substrate exchange institute The time of consuming.

In addition, in the above-described 2nd embodiment, with the relative distance of substrate holder 68 and non-contact supporting arrangement 152 The mode to shorten declines non-contact supporting arrangement 152 by driving device 153, and but it is not limited to this.For example, it is also possible to The mode that the relative distance of substrate holder 68 and non-contact supporting arrangement 152 shortens, makes substrate holder by driving device 68 rise.Alternatively, it is also possible to decline non-contact supporting arrangement 152 by driving device 153, and base is made by driving device Plate holder 68 rises.

In addition, in the above-described 2nd embodiment, can also after baseplate carrier device 20 reaches substrate exchange position, Decline non-contact supporting arrangement 152, and substrate P 1 is handover to non-contact supporting arrangement 152 from substrate holder 68.

In addition, in the above-described 2nd embodiment, driving device 153 can also be installed on benchmark plate 100.

Alternatively, it is also possible to after moving in substrate P 2 to substrate holder 68, for 20 direction of baseplate carrier device Exposure starting position and after being driven to -X direction, in a manner of becoming the height roughly the same with gas operated device 138, lead to Over-driving device 153 drives the substrate P 1 supported by non-contact supporting arrangement 152 to -Z direction.As a result, can Substrate moving device 136 and gas operated device 138 are not driven to +Z direction, and moved out by non-contact supporting arrangement 152 The substrate P 1 held.

" third embodiment "

(a) of Figure 10 is the figure for schematically showing the structure of liquid crystal exposure apparatus 10e involved in third embodiment. As shown in (a) of Figure 10, in the pendency supporting arrangement 150d involved in third embodiment, non-contact supporting arrangement 152a's The Z location of the side+X lower surface becomes lower than the Z location of the side-X lower surface.In addition, in non-contact supporting arrangement 152a The end of the side+X substrate stop device 154 is installed.Further, in this third embodiment, substrate moves in device 130b Has the driving device 145 for moving up and down the end of the side-X of gas operated device 138.Driving device 145 is, for example, cylinder.

0 (b)~Figure 11 (b) is to the substrate in liquid crystal exposure apparatus 10e involved in third embodiment referring to Fig.1 Switching motion is illustrated.

In the liquid crystal exposure apparatus 10e involved in third embodiment, as shown in (b) of Figure 10, if non-contact bearing The substrate P 1 of exposure is completed in device 152a bearing, then moves in device 130b by substrate and move in new substrate P 2 to substrate holding On part 68.At this point, by the substrate P 1 of the non-contact supporting arrangement 152a completion exposure supported by the effect of gravity always towards+ The side X is mobile, and contacts with substrate stop device 154.Therefore, the substrate stop device of the side-X can be omitted.

If moving in new substrate P 2 to substrate holder 68, such as shown in (a) of Figure 11, absorption layer 144 is to the side+X To movement.Moreover, substrate moves in the end rising that device 130b makes the side-X of gas operated device 138 by driving device 145.

Later, as shown in (b) of Figure 11, if opening substrate stop device 154, substrate P 1 by the self weight of substrate P 1 with Gravity and moved out to +X direction.In addition, at this point it is possible to moving substrate P 1 while keeping substrate P 1 using absorption layer 144 It is dynamic, absorption layer 144 can also not used.

As being illustrated in detail above, according to third embodiment, by non-contact supporting arrangement 152a bearing Substrate P 1 is moved out by the self weight and gravity of substrate P 1 from non-contact supporting arrangement 152a.Thereby, it is possible to simplify for by base The mechanism that plate P1 is moved out from non-contact supporting arrangement 152a.

In addition, in the above-described 3rd embodiment, non-contact supporting arrangement 152a can also be installed on benchmark plate 100。

In addition it is also possible to when moving in new substrate P 2 on substrate holder 68, to driving device 145 to -Z direction It is driven, thus tilts gas operated device 138.As a result, substrate P 2 can be easy to carry out to substrate using gravity Moving on holder 68.

" the 4th embodiment "

Figure 12 is the figure for schematically showing the structure of liquid crystal exposure apparatus 10f involved in the 4th embodiment.4th Embodiment changes the shape of non-contact supporting arrangement.In the pendency supporting arrangement 150e involved in the 4th embodiment, such as Shown in Figure 12, non-contact supporting arrangement 152b is in curved semi-cylindrical, Y direction central portion become minimum along the y axis (most prominent in-Z-direction).Therefore, begun as shown with arrows by the non-contact supporting arrangement 152b substrate P 1 supported It is intended to eventually close to Y direction center, therefore the substrate stop device of Y direction can be omitted.In addition, in this case, needing X-axis The substrate stop device in direction.

(variation 1)

(a) of Figure 13 is to schematically show liquid crystal exposure apparatus 10g involved in the variation 1 of the 4th embodiment The figure of structure.In the liquid crystal exposure apparatus 10g involved in variation 1, pendency supporting arrangement 150f has to be guided in X-direction The guiding mechanism 159 of non-contact supporting arrangement 152c.In turn, the shape of non-contact supporting arrangement 152c becomes not only in Y-axis side To bending, in a part of the X-direction also big sphere of curved curvature.

The substrate in liquid crystal exposure apparatus 10g involved in the variation 1 is handed over using (a) of Figure 13 and (b) of Figure 13 Move and is illustrated.

If the substrate P 1 of exposure is completed in non-contact supporting arrangement 152c bearing, moving in device 130 by substrate will be new Substrate P 2 is moved in substrate holder 68.At this point, being connect as shown with arrows in (b) of (a) of Figure 13 and Figure 13 by non- The substrate P 1 of touching supporting arrangement 152c bearing is intended to always close to central portion, therefore can omit the substrate of X-direction and Y direction Stop device.

If the substrate P 1 of exposure is completed in non-contact supporting arrangement 152c bearing, such as shown in (b) of Figure 13, substrate moves in dress Set 130 carry out substrate P, 2 moving in substrate holder 68.At this point, non-contact supporting arrangement 152c by guiding mechanism 159 to The top that substrate moves in device 130 is mobile.

As illustrated in detail above, according to the variation 1 of the 4th embodiment, non-contact supporting arrangement 152c exists Substrate P 1 is moved out in the state of the upper surface of supporting substrates P1.Thereby, it is possible to move in device 130 to omit for from non-in substrate Contact supporting arrangement 152c moves out the mechanism of substrate P 1.

In addition, also can be used involved by first and second embodiment in the variation 1 of above-mentioned 4th embodiment Non-contact supporting arrangement 152 replace non-contact supporting arrangement 152c.That is, the lower surface of non-contact supporting arrangement may be Plane.

In addition, in the above-mentioned first~the 4th embodiment and its variation, the bigger (example of the size of substrate P 1 and substrate P 2 Such as 500mm or more), then the effect for shortening the time spent by substrate exchange becomes more significant.

In addition it is also possible to which the above-mentioned first~the 4th embodiment and its variation is appropriately combined.For example, it is also possible to by Two embodiments are combined with the variation 2 of first embodiment, with the supporting arrangement 150b that dangles involved in second embodiment The mode for having substrate transfer apparatus 158 is constituted.In this case, as long as the driving part 158b of substrate transfer apparatus 158 is installed In pendency supporting arrangement installing frame 151.

In addition, for example, it is also possible to combining first embodiment, with third embodiment with the Z location change of the side end+X Obtaining the mode lower than the Z location of the side end-Z tilts the non-contact supporting arrangement 152 of first embodiment.Alternatively, it is also possible to It combines first embodiment with the variation 1 of the 4th embodiment or the 4th embodiment, non-by first embodiment connects The shape of touching supporting arrangement 152 is set as also can be set to and being not only bent in Y direction in the curved semi-cylindrical of Y direction, In A part of the X-direction also big sphere of curved curvature.In addition, also guiding mechanism 159 can be installed on benchmark plate 100, substrate P 2 is moved out in the state of the 152 supporting substrates P2 of non-contact supporting arrangement of first embodiment.

In addition, being said by taking liquid crystal exposure apparatus as an example in the above-mentioned first~the 4th embodiment and its variation Bright, but it is not limited to this.First~the 4th embodiment and its variation can also be applied to the inspection on the surface of detection substrate P Look into device.

In addition, liquid crystal exposure apparatus involved in the above-mentioned first~the 4th embodiment and its variation fills liquid crystal display Glass substrate used in setting is as exposure object object, and but it is not limited to this.Liquid crystal exposure apparatus 10 also can be by semiconductor element Wafer used in part etc. etc. is used as exposure object object.

In addition, liquid crystal exposure apparatus involved in the above-mentioned first~the 4th embodiment and its variation has a substrate Bearing table device, but the structure of the first~the 4th embodiment and its variation can be also applied to have multiple baseplate carriers dresses The exposure device set.

In addition, in the above-mentioned first~the 4th embodiment and its variation, carrier element that substrate carrier 70 has 74 be U-shaped (referring to Fig. 2) when being formed as overlooking, and but it is not limited to this.As long as carrier element 74 being capable of adsorption on it Substrate is kept, then is the frame-shaped of rectangle when can also be formed as overlooking, is the frame-shaped of triangle when may be alternatively formed to overlook.Separately Outside, carrier element 74 for example also may be embodied in X-direction or Y direction a pair for clamping substrate holder 68 and being arranged and cut Face is the component of rectangle, can also be made of a rodlike component, and only absorption keeps base in X-direction or Y direction The near one end of plate P.In addition, substrate carrier 70 for example also can be and the public affairs such as 8,699, No. 001 specifications of U.S. Patent No. The same structure of the substrate carrier opened, or there is the adsorption section of the end of sorbing substrate and be equipped with above-mentioned adsorption section The structure of main part.The quantity of adsorption section is unlimited.In addition, adsorption section also can be set into relative to main part can X-direction, Y-direction, Z-direction are opposite to be driven.

" manufacturing method "

Next, to used in photo-mask process liquid crystal exposure apparatus 10,10a involved in the respective embodiments described above~ The manufacturing method of the micro element of 10g is illustrated.In the liquid crystal exposure apparatus 10,10a~10g of above embodiment, In Pattern (circuit pattern, electrode pattern etc.) as defined in being formed on plate (glass substrate), thus, it is possible to obtain as micro element Liquid crystal display element.

< pattern formation process >

Firstly, execute pattern image being formed in photonasty base using exposure device involved in above-mentioned each embodiment The so-called photo-mask process of plate (glass substrate etc. for being coated with photoresist).By the photo-mask process, the shape on photosensitive substrate At the predetermined pattern comprising many electrodes etc..Later, the substrate being exposed passes through developing procedure, etching work procedure, photoresist lift off Thus each process such as process form defined pattern on substrate.

< colored filter formation process >

Next, formed in it is rectangular be arranged with it is multiple corresponding to R (Red), three points of G (Green), B (Blue) Combined colored filter, or it is formed in the optical filter that three stripeds of multiple R, G, B are arranged on horizontal scanning line direction Combined colored filter.

< unit (cell) assembling procedure >

Next, being formed using the substrate obtained in the pattern formation process with predetermined pattern and in colored filter Colored filter obtained in process etc. assembles liquid crystal display panel (liquid crystal cells).It is formed for example, being injected into liquid crystal in pattern Between substrate and the colored filter obtained in colored filter formation process obtained in process with predetermined pattern, and It manufactures liquid crystal display panel (liquid crystal cells).

< module assembled process >

Later, circuit, the backlight that installation carries out the display movement of the liquid crystal display panel (liquid crystal cells) after assembling etc. is each Component and completed as liquid crystal display element.

In this case, in pattern formation process, using liquid crystal exposure apparatus involved in the respective embodiments described above with height Production capacity and high-precision carry out the exposure of plate, and result is that can be improved the productivity of liquid crystal display element.

In addition, quoting all bulletins quoted in explanation so far, International Publication bulletin, U.S. Patent application The disclosure of prospectus and US Patent specification as the record of this specification a part.

Above-mentioned embodiment is embodiment appropriate of the invention.But it's not limited to that, is not departing from the present invention Purport in the range of can implement various modifications.

Description of symbols

10,10a~10g ... liquid crystal exposure apparatus；43 ... X driving mechanisms；68 ... substrate holders；70 ... substrate carriers； 130,130a, 130b ... substrate move in device；150,150a~150f ... pendency supporting arrangement；152,152a~152c ... is non-connects Touch supporting arrangement；153 ... driving devices；158a ... maintaining part；158b ... driving part；P, P1, P2 ... substrate.